Re iew A icle
The mal Aging o Menzoli BMC 3100
Pa ol Kos ial,
1
Zo a Kos ialo a Janciko a,
1
Ond ej K ejca ,
2
Kamil Kuca ,
2
Oluwaseun Fadeyi,
2
,
3
Adebola O ogun,
4
and Robe F ische
1
,
2
1
VSB-Technical Uni e si y o Os a a, 17. Lis opadu 15/2172, Os a a 708 33, Czech Republic
2
Cen e o Basic and Applied Resea ch, Facul y o In o ma ics and Managemen , Uni e si y o H adec K alo e, Roki anskeho 62,
H adec K alo e 500 03, Czech Republic
3
Depa men o Geology, Facul y o Space and En i onmen al Science, Uni e si y o T ie , T ie , Ge many
4
Adekunle Ajasin Uni e si y, Akungba-Akoko, Nige ia
Co espondence should be add essed o Ond ej K ejca ; [email p o ec ed]
Recei ed 8 July 2019; Accep ed 9 Ma ch 2020; Published 8 May 2020
Academic Edi o : Vic o M. Cas año
Copy igh ©2020 Pa ol Kos ial e al. This is an open access a icle dis ibu ed unde he C ea i e Commons A ibu ion License,
which pe mi s un es ic ed use, dis ibu ion, and ep oduc ion in any medium, p o ided he o iginal wo k is p ope ly ci ed.
This pape deals wi h he influence o he mal aging on physical p ope ies o a composi e ma e ial, Menzoli BMC 3100. Fi s , we
p esen a numbe o analysis, FTIR (in a ed spec oscopy), DSC (diffe en ial scanning calo ime y), TMA ( he momechanical
analysis), TGA ( he mog a ime ic analysis), and HDT (hea deflec ion empe a u e), o unde s and he ma e ial pe o mance
unde hea , and hen, we ca y ou a es o oughness and s eng h using Cha py impac s eng h and B inell ha dness. Finally, we
p esen op ical su ace analysis o he ma e ial unde in es iga ion by ca ying ou aging analysis a inc emen s om oom
empe a u e up o 300°C. I was obse ed ha abo e 200°C, he ma e ial begins o deg ade a he su ace, especially i s o ganic
componen , polyes e esin. This ype o deg ada ion has a nega i e impac on a a ie y o i s physical p ope ies. Exposu e o
empe a u es abo e 200°C educes he ma e ial’s ha dness, oughness, and shape s abili y, likewise, ma e ial deg ada ion was
ound o inc ease wi h highe he mal loads almos linea ly o all he obse ed p ope ies.
1. In oduc ion
Menzoli BMC 3100 is a composi e ma e ial ha is spa sely
desc ibed in he scien ific li e a u e. De ailed e e ence is
only made o he ma e ial when p oduce s gi e p oduc
specifica ions in offe ing he ma e ial as an ad e ised i em.
Such specifica ions a e also limi ed, p o iding only specific
physical alues ha cha ac e ise he ma e ial and a ely
publishing de ails on ma e ial composi ion.
Polyme composi es play e y impo an oles in
mode n indus y, especially he au omo i e sec o [1–8], in
which ligh weigh , high specific modulus, and s eng h a e
c i ical ac o s pu in o conside a ion in p oduc ion and
whe e hese ma e ials find a wide ange o applica ion. This
pape desc ibes he composi ion o polyme composi es, e.g.,
Menzoli BMC 3100, and he unique ad an ages hey offe ,
ela i e o adi ional ma e ials. De ails a e gi en on p e-
ailing ma ke si ua ion o polyme composi es in Eu ope,
and hei special applica ion in he Eu opean au omo i e
indus y. Specific emphasis is also laid on he
manu ac u ing o spa e pa s om he moplas ic, he -
mose ing plas ics, and sho and con inuous fib e- ein-
o ced composi es. In [9–12], he au ho s offe insigh s on
some ecen echnological and en i onmen al applica ions
o ein o ced polyme s. In [13], he au ho no ed ha
Menzoli BMC 3100 is a special ma e ial de eloped o he
au omo i e indus y o p oduce headligh s. This polyme
composi e ma e ial is g adually eplacing adi ional me al
eflec o s, mainly due o i s simplici y and low cos in se ial
p oduc ion. Ne e heless, u u e use o Menzoli BMC 3100
in mode n au omobile ligh ing sys ems pose an unan-
swe ed ques ion, gi en he cu en use o “cold” ligh
emi ing diodes (LEDs) and lase o he same pu pose and
he moplas ic ma e ials (e.g., polyca bona e) sufficing as
hea esis an . Table 1 shows he p ope ies o Menzoli
BMC 3100 (gi en as a e age alues o he es esul s)
de i ed om nonpigmen ed, comp ession moulded panels
a oom empe a u e [13].
Hindawi
Ad ances in Ma e ials Science and Enginee ing
Volume 2020, A icle ID 8575189, 8 pages
h ps://doi.o g/10.1155/2020/8575189
2. Theo e ical Backg ound
Acco ding o [14], composi e p oduce s p o ide a specific
da ase use ul o e e ence pu pose, especially when de-
signing hese ma e ials. Ne e heless, o bes da ase s, a
numbe o expe imen al p ocedu es may be necessa y. One
way is o de e mine a composi e composi ion om he
cha ac e is ics o i s cons i uen s.
While he e seems o be ex ensi e use o polyme ma ix
composi es (pa icula he o m ein o ced wi h fib e) in
ai c a s uc u es [15] and au omobile, accu a e p edic ion
o s eng h o he ma e ials becomes e y impo an
[14, 16, 17]. The au ho s o s udies such as [14] ha e
esea ched how he ein o ced o ms o polyme ma ix a e
impac ed upon ailu e. Failu e analysis is ca ied ou on pa
o a composi e ma e ial made up o polyme ic ma ix as well
as fib e wi h he aim o unde s anding he s ess-s ain
si ua ion o he whole composi e ma e ial (fib e and ma ix
included) [15]. This ela ionship is used o s uc u ally
p edic ma ix o fib e ailu e o he ma e ial. Depending on
he kind o echnique adop ed, he e is he possibili y o
indi idually p edic ing ma ix ailu e and hen fib e ailu e
in a sepa a e se up ia compu a ional me hods [16, 17].
Ne e heless, ad anced composi e cha ac e is ics do no
only depend on he kind o ma ix, bu he ype o ein-
o cemen also plays a i al ole as well as a ea u e ha is no
associa ed o i s composi ion, configu a ion o ein o ce-
men . In some composi e ma e ials, only s eng hening fib e
concen a ion can be con olled, and composi e dimensions
canno be con olled [18]. A ypical example is mouldable
sho fib e- ein o ced he moplas ics. This pape hus offe s
a ela i ely comp ehensi e s udy o he physical pa ame e s
o BMC exposed o hea o e a ela i ely la ge empe a u e
ange om ambien empe a u e o 300°C.
2.1. Fea u es o BMC 3100. Menzoli BMC 3100 is ypically
designed using wo unique kinds o moulding: comp ession
moulding and injec ion moulding [13]. The o me in ol es
moulding Menzoli compounds using hea s eel moulds wi h
shea edges, as high densi y moulds gene ally offe he bes
esul s. Fu he mo e, 20–30 seconds-pe -millime e o wall
hickness is p e e ed o cu ing when using comp ession
mould. This is impo an as in oduc ion o Menzoli
compound o ho mould mus be ollowed by a quick closing
o he p ess o disallow p ecu ing [13]. Injec ion moulding
o en akes place be ween 140°C and 165°C (s anda d
compounds) and 30°C–40°C (injec ion uni ). Back p essu e
is jus needed o assu e cons an dosing, injec ion p essu e
a ies be ween 50 and 250 ba , and injec ion ime should be
as sho as possible bu long enough o ensu e en ila ion. A
small holding p essu e should be applied un il he ga e is
cu ed. A guide o cu ing is 10 seconds pe millime e o wall
hickness [13].
2.2. The moanaly ical Techniques. Acco ding o [19], he -
mal analysis e e s o a numbe o hea measu emen
echniques in which physical p ope ies o a subs ance a e
measu ed wi h espec o ime o empe a u e while he
empe a u e o he ma e ial, in a specified a mosphe e, is
ei he cons an ly hea ed o cooled ( empe a u e p o-
g amme) a a specific desi ed empe a u e. In [20], he
au ho epo ed ha he moanaly ical measu emen gen-
e ally depends on how empe a u e o a ma e ial in e ac s
wi h olume, hea o eac ion, and mass. These me hods find
a wide ange o applica ion in scien ific discou se, anging
om pha maceu icals [21], au omobile, and a ia ion con-
s uc ion ma e ials [22]. A numbe o he moanaly ical
echniques exis in he li e a u e. Howe e , o he pu pose
o his s udy, only in a ed spec ome y, diffe en ial scan-
ning calo ime y, he momechanical analysis, he mog a-
ime ic analysis, and hea deflec ion empe a u e
echniques a e discussed. Diffe en ial scanning calo ime y,
commonly abb e ia ed as DSC, deals wi h effec s om
physiochemical p ocesses o he wise known as phase- an-
si ion eac ions o which specific hea is a majo cons i uen
[23], so ha hea flow a e in o a subs ance is measu ed as a
unc ion o empe a u e while he empe a u e o he sub-
s ance i sel is p og ammed [24]. Via he mocouple, em-
pe a u e diffe ence (be ween sample and e e ence) is hus
measu ed. The mog a ime ic analysis in ol es changes in
mass as a esul o ma e ial/subs ance in e ac ing wi h he
a mosphe e, e apo a ion, and decomposi ion [23, 24]. I
in ol es mass measu emen o a ma e ial as a unc ion o
empe a u e, while subjec ing he ma e ial o some o m o
con olled- empe a u e p og ammes. In [25], he au ho
explained he momechanical analysis as a measu e o
s iffness and damping p ope ies o ma e ials in e ms o
Table 1: P ope ies o Menzoli BMC 3100 (adap ed om [13]).
P ope y Value
Fib e con en (%) 12
Moulding empe a u e (°C) 135–160
4
Moulding p essu e (ba ) 20–80
Densi y (g/cm
3
) 2.0
1,3
Sh inkage (%) −0.03
3
CTE (10∗∗6 m/m·K) 10
HDT (°C) >200
Glass ansi ion empe a u e (°C) 185
2
Con inuous se ice empe a u e (°C) 190
3
Young’s modulus (GPa) 14
3
Tensile s eng h (MPa) 25
3
Flex s eng h (MPa) 79
3
Flex modulus (GPa) 11
3
Impac s eng h (kJ/m
2
) 15
3
Poisson’s a io 0.30
Limi ed oxygen index (%) 22
5
Glow wi e (°C) 750
Fi e e a dancy 12 (le el) —
Volume esis i i y (Ohm ∗cm) 10
15
Su ace esis i i y (Ohm) 10
12
Compa a i e acking index (le el) CT1600
Wa e abso p ion (%) <0.5
(1) nega i e alues show expansion; (2) con inuous se ice empe a u e
wi hou ex e nal loads; (3) i wo figu es a e gi en o one p ope y, he fi s
e e s o he ans e sal di ec ion, while he second ep esen s p incipal
axis; (4) moulding p essu e in comp ession moulding; (5) wall hickness
3 mm; (6) figu es gi en apply o quasi-iso opic 6-laye [0/90/45/-45/90/0]
design; (7) hea conduc i i y is unde s ood pe pendicula o he plane o he
lamina e (ou -o -plane axis).
2Ad ances in Ma e ials Science and Enginee ing
empe a u e, ime, and equency, h ough he applica ion o
sinusoidal load o a specimen and subsequen ly measu ing
he esul an de o ma ion. Du ing his ime, he sample
unde goes con olled empe a u e p og amme. Fo hea
deflec ion empe a u e, he polyme ma ix o Menzoli
BMC 3100 unde goes de o ma ion, subjec o a specified
load. This empe a u e ollows he ASTM D648 guidelines,
wi h he es p ocedu e simila o ISO 75 s anda ds.
3. Me hod
The mog a ime ic analysis was ca ied ou using a quan-
i a i e analysis o BMC composi ion wi h he aid o Hi-Res
TGA TA Ins umen s 2950. Fu he mo e, iso he mal
analysis was used o de e mine he hea load ime o up o
300 minu es. Fo deg ada ion o he su ace laye , he
1147 cm
−1
band co esponding o he C-O-C bond was
closely moni o ed. B inell ha dness ollows expe imen ally
wi h he use o B inell ha dness es e ZWICK/ROELL.
4. Resul s and Discussion
A quan i a i e analysis o BMC composi ion (Figu e 1) can
be pe o med wi h he mog a ime ic analysis (Hi-Res TGA
TA Ins umen s 2950) [26, 27]. Depending on he weigh - o-
empe a u e a io, da a on he amoun (mass) o he indi-
idual componen s in he sample can be ob ained. Fo
p ope e alua ion o he TGA cu e, i is necessa y o know
he chemis y o ongoing decomposi ion eac ions:
(a) 0–200°C: sho -li ed componen s up o 200°C;
weigh loss o he ma e ial’s ola ile componen s,
especially s y ene and mois u e esidues
(b) 200–600°C: decomposi ion o he polyme ic, o ganic
pa o he ma e ial up o 600°C wi h dynamic
hea ing o 20°C/min
(c) 600–800°C: decomposi ion o he CaCO
3
fille
(d) 800°C: esidue a e combus ion in ai CaO + glass
fib e
The esul ing composi ion is as ollows:
(a) 0.4% o sho -li ed componen s up o 200°C, ep-
esen ing mainly mois u e con en and esidual
s y ene
(b) 20.6% o polyme ma ix
(c) 63.6% o ino ganic CaCO
3
fille
(d) 15.4% o glass fib e
This is he pe cen age composi ion o he ma e ial o one
ba ch o BMC. The composi ion may diffe om one ba ch
o ano he .
To de e mine he hea load ime, an iso he mal he mal
analysis o a small amoun o ma e ial was pe o med (up o
300 minu es). Figu e 2 g aphs he mass loss (in %) de-
pendence on empe a u e. Mass loss inc eased abo e 240°C.
Due o he mal deg ada ion, he o ganic ma ix decomposed
in he su ace laye . Decomposi ion is eflec ed by he loss o
specific chemical bonds and he change in in ensi y o he
espec i e bands in he IR spec um (FTIR Nicole iS10
spec opho ome e ).
The FTIR g aph in Figu e 3 shows he g adual dec ease
o bands co esponding o he bonds o he o ganic ma ix o
he polyme . To assess deg ada ion o he su ace laye , he
1147 cm
−1
band co esponding o he C-O-C bond was
obse ed. Wi h inc easing empe a u e and p og essi e
deg ada ion o he su ace laye , he polyme ic ma ix
decomposed, esul ing in a educ ion in he in ensi y o he
C-O-C bonding band. The 1728 cm
−1
band co esponds o
he ib a ional mo emen o he C�O bond, e e ed o as
“s e ching ib a ion” in ac yla e g oups o polyes e esins,
and he 1147 cm
−1
band co esponds o he s e ching i-
b a ion o C-O-C bonds.
The esul s o su ace decomposi ion a e plo ed in
Figu e 4. F om he weigh dependence o he load o he load
empe a u e, he ma e ial was s able up o abou 250°C wi h
a hea load ime o 30 minu es. This co esponds o he
e alua ion o FTIR su ace analysis (see g aph in Figu e 4).
The nex pa o he expe imen desc ibes measu emen
o B inell ha dness (B inell ha dness es e ZWICK/
ROELL). As he empe a u e inc eased, ha dness was ound
o dec eased (Figu e 5). F om 200°C, ha dness dec eased
almos linea ly. Con e sely, he measu emen ime in-
c eased. Wi hou hea s ess, he bulle was c ushed almos
ins an aneously. By con as , a e a 30-minu e load a 300°C,
0.6
200 400 600 8000
40
60
80
100
0.2
0.4
0.8
1.0
0
120
0.3976%
2.713%
17.86%
27.95%
Tempe a u e (°C)
Residue
51.04%
(7.047 mg)
De i . weigh (%/°C)
Figu e 1: TGA decomposi ion cu e o BMC.
0.00 200 220 240 260 280 300 320
1.00
2.00
3.00
4.00
5.00
6.00
7.00
8.00
9.00
Loss o mass (%)
180
Loss o mass a e 20min
Loss o mass a e 30min
Loss o mass a e 60min
Tempe a u e (°C)
Figu e 2: Mass loss dependence on empe a u e.
Ad ances in Ma e ials Science and Enginee ing 3
he specimen ook a bulle o a while be o e he su ace laye
was pie ced. As he empe a u e inc eased, i is likely ha a
“sin e ed” laye o ma e ial o med on he su ace and ha
his ma e ial educed he ha dness o he ma e ial. Fu -
he mo e, he ma e ials we e es ed o Cha py impac
s eng h (CEAST Resil 5.5) e sus loading empe a u e
applied o e 30 min. In his es , we also saw dec easing
alues wi h inc easing empe a u e (Figu e 6). The inc ease
in impac s eng h a 300°C/30 minu es could be due o he
ein o cemen /sin e ing o he sample su ace. The esul s o
he he momechanical analysis (TMA TA Ins umen s 2940)
did no show any isible dependence on deg ada ion (Fig-
u e 7). The only diffe ence is isible be ween he unexposed
sample, which had an addi ional cu e eac ion, and he mos
in ensi ely loaded specimen a 300°C/30 minu es, whe e he
CLTE (linea he mal expansion coefficien ) was almos
linea o e he en i e empe a u e ange.
De e mining he glass ansi ion empe a u e o BMC
ma e ial wi h he DSC me hod (DSC Du Pon Ins umen s
2910) acco ding o ISO 11357-2 was somewha p oblema ic.
The ma e ial da a shee o BMC indica ed a glass ansi ion
empe a u e (Tg) o 185°C (acco ding o ISO 11357-2). The
de e mina ion me hod was se o mee he specified con-
di ions. The signal esponse o BMC was e y poo . No
clea ly iden ifiable ansi ion (p obably Tg) was obse ed
a ound 185°C. Ce ain ansi ions can be e alua ed a
a ound 90°C and 130°C. Howe e , hese we e almos un-
iden ifiable du ing he second hea ing, so i is possible ha
hey may ha e been i e e sible ( empe a u e his o y,
e apo a ion o ola ile componen s, and abso bed mois u e)
(Figu e 8). As he he mal load inc eased, he esponse
diminished. The esul s we e compa ed wi h he measu ed
TA-Ins umen s he mose cu es [28]. The clea glass
ansi ion was no obse able in any ma e ial, as he em-
pe a u e ange wi h he occu ence o glass ansi ion always
o e lapped he cu e eac ion.
1800 1700 1600 1500
Wa enumbe s (cm–1)
1400 1300 1200 1100
0.55
0.50
0.45
0.40
0.35
0.30
0.25
0.20
0.15
0.10
0.05
Abso bance
1728.14
1147.03
BMC 200°C_30min
BMC 250°C_30min
BMC 280°C_30min
BMC 300°C_30min
BMC wi hou he mal load
Figu e 3: De ails o binding zone C-O-C 1147 cm
−1
.
0 100 150 200 250 300 350
14
Ma e ial loss (%)
50
Tempe a u e load (°C/30min)
15
16
17
18
19
20
21
Figu e 4: BMC ma e ial loss in ela ion o empe a u e load.
0 100 150 200 250 300 350
250
B inell ha dness (N/mm2)
50
The mal load (C/30min)
270
290
310
330
350
370
390
Figu e 5: B inell ha dness dependence on he mal loading.
0 100 150 200 250 300 350
6.0
Cha py impac (kJ/m2)
50
Tempe a u e load (C/30min)
7.0
8.0
9.0
10.0
11.0
12.0
13.0
Figu e 6: BMC-Cha py impac s eng h in ela ion o empe a u e
load.
4Ad ances in Ma e ials Science and Enginee ing
The weak signal esponse may ha e been due o he p esence
o a la ge pe cen age o ino ganic fille s (limes one and glass
fib e accoun o abou 80% o he composi e a he expense o
he polyme ma ix, which is only 20%). Fo his eason, hea is
likely o be g ea ly diffused by he sample, and he eac ion o he
polyme ma ix o inc easing cell empe a u e was weak and he
change in hea flow was no de ec able.
Du ing he fi s hea ing (1s s ep), he DSC cu e showed
undefined ansi ions a ound 90°C and 130°C. The ansi ion
s ages we e e y small, so hei in e p e a ion is unce ain.
The second hea ing (2nd s ep) did no show any changes in
hea flow (Figu e 9).
A no iceable change could be seen in he he mal his o y
o he sample exposed o a hea load o 250°C on he DSC
fi s hea ing cu e (1s s ep). Du ing he second hea ing (2nd
s ep), hese effec s we e no longe isible, and he DSC cu e
shows no significan hea flow changes (Figu e 10).
The TMA dimension change cu e eflec s he DSC
eco d o hea flow change [29]. Physical ansi ions caused
nonlinea i y o he s e ch cu e (Figu e 11). The fi s
30
25
20
15
10
5
0
Dimension change (µm)
20 40 60 80 100 120 140 160 180
Tempe a u e (°C) Uni e sal V3.9A TA Ins umen s
BMC 200°C.002
BMC 250°C.004
BMC wi hou he mal load.001 BMC 280°C.005
BMC 300°C.005
Figu e 7: The mal expansion cu es o BMC depending on he mal load.
30 55 80 105 130 155 180 205 230
–0.40
–0.35
–0.30
–0.25
–0.20
–0.15
Tempe a u e (°C)
Hea flow (no malized) (W/g)
Midpoin ype: hal heigh
Midpoin : 87.878 °C
Midpoin ype: hal heigh
Midpoin : 129.883 °C
Figu e 8: Sample wi hou he mal load: 1
s
hea ing.
–0.325
–0.375
Hea flow (W/g)
–0.425
–0.475
Exo up
30 80 130
Tempe a u e (°C)
180 230
Uni e sal V3.9A TA Ins umen s
2nd s ep
1s s ep
92.27°C
79.40°C
87.09°C (I)
124.90°C (I)
130.75°C
117.94°C
Figu e 9: Sample a e load 200°C/30 minu es: 1
s
hea ing (1
s
s ep);
2
nd
hea ing (2
nd
s ep).
–0.30
–0.35
–0.40
–0.45
Hea flow (W/g)
30 80 130 180 230
Exo up Tempe a u e (°C) Uni e sal V3.9A TA Ins umen s
2nd s ep
1s s ep
Figu e 10: Sample a e load 250°C/30 min: 1
s
hea ing (1
s
s ep);
2
nd
hea ing (2
nd
s ep).
Ad ances in Ma e ials Science and Enginee ing 5

ansi ion in he empe a u e ange up o 100°C, co e-
sponding o e apo a ing mois u e and ola ile componen s.
A empe a u es abo e 150°C, e idence o addi ional cu ing
o he BMC on bo h cu es is seen.
HDT (VICAT-HDT CEAST) measu emen was based
on ISO 75 o Plas ics-De e mina ion o deflec ion em-
pe a u e unde load. By de aul , a body o 10 mm hickness
was used. The load was de e mined acco ding o he s an-
da d a 0.45 o 1.82 MPa (me hod A o B). The esul ing
HDT empe a u e, acco ding o he s anda d, indica ed he
empe a u e a which he es body had a deflec ion o
0.32 mm. As he BMC can wi hs and empe a u es abo e
200°C, which is he maximum ope a ing empe a u e o he
HDT, he BMD had o be >200°C o all samples. The es
was he e o e designed o ead deflec ion o he es body
o he selec ed empe a u es, and he dependence o shape
de o ma ion on ising empe a u e was plo ed. Only he
es condi ions om he s anda d we e used, which we e a
hea ing a e o 120°C/h and a load o 1.82 MPa. F om he
esul s o he HDT es , i is clea ha he sample deflec ion
significan ly inc eased wi h he applied hea load (Fig-
u e 12). Op ical su ace analysis showed he ollowing
esul s (KEYENCE digi al 3D mic oscope). As we said
abo e, Menzoli BMC 3100 belongs o he g oup “bulk
moulding compounds” based on unsa u a ed polyes e
esin. The ma e ial is glass fib e ein o ced. Figu e 13 shows
diffe en ly o ien ed glass fib es eaching abou 500 μm in
leng h and a ious CaCO
3
pa icles in he ange o ens o
hund eds o μm.
Figu e 14 shows CaCO
3
pa icles in he ange o ens o
hund eds o μm. All a e connec ed by a c oss-linked
polyes e ma ix. The fille s uc u e is no p e e en ially
o ien ed, bu he fib es a e andomly a anged o o m he
bonded bundles associa ed wi h he mine al fille and he
esin. A a he mal load o 280°C/30 minu es, he su ace
laye o he ma e ial was isibly deg aded o a dep h o
60–70 μm. A e he mal s ess o 300°C/30 minu es, he
su ace laye was al eady damaged o a dep h o abou 90 μm.
A a lowe he mal load, deg ada ion on he c oss sec ion
was no so isible. This co esponds o he esul s o he TGA
and FTIR analysis, whe e mo e deg ada ion occu ed a
empe a u es abo e 250°C. Only a colou change o he
su ace laye occu s below his empe a u e.
5. Limi a ions
Ha ing c i ically examined he s abili y o Menzoli BMC
3100 unde specific he mal condi ions, he glass ansi ion
o he polyme ic ma ix could no be de ec ed p obably due
o he la ge pe cen age o ino ganic fille ; he e o e, i was
no possible o s udy he effec o he mal deg ada ion on i s
–0.2 25
20
15
10
5
–5
0
–0.3
–0.4
Hea flow (W/g)
Dimension change (µm)
25 75 125 175
Exo up Tempe a u e (°C) Uni e sal V3.9A TA Ins umen s
TMA
DSC
BMC wi hou he mal load
Figu e 11: Compa ison o DSC and TMA samples wi hou hea
exposu e.
Tempe a u e (°C)
Deflec ion × 0.01mm
Wi hou he mal load
200 °C/30min
250 °C/30min
280 °C/30min
300 °C/30min
200 2251751501251007550250
0.0
5.0
10.0
15.0
20.0
25.0
30.0
Figu e 12: De e mina ion o shape deflec ion (0.01 mm) plo
acco ding o empe a u e.
Figu e 13: Diffe en ly o ien ed glass fib es.
Figu e 14: Randomly a anged fib es o med by bonded bundles
associa ed wi h mine al fille and esin.
6Ad ances in Ma e ials Science and Enginee ing
alue. The moanaly ical echniques used in his s udy also
ha e specific limi a ions o which each me hod may no be
comple ely effec i e.
6. Conclusions
I is impo an o ake no e o he shape and quali y o
he moanaly ical cu es so a discussed [30]. Fo ex-
ample, o selec ed empe a u es o mass losses as hey
ha e been in e p e ed in line wi h all demons a ed ex-
pe imen al condi ions, conside a ion o he shapes and
quali y o he he moanaly ical cu es helps o ob ain
u he impo an in o ma ion on Menzoli BMC 3100.
The undamen als o he echniques discussed and ana-
lysed in his s udy a e unc ions o changes in he em-
pe a u e p ofiles as a hea flux passes h ough a ma e ial
[31], Menzoli 3100 in his case. The mal echniques
expe imen ed end o de elop unde s anding o aging o
he ma e ials. Expe imen al esul s a e he e o e in
compa ison o he nume ical simula ions as unc ions o
mass, weigh , and empe a u e ends. The influence o
he mal aging on physical p ope ies o a composi e
ma e ial is de ec ed expe imen ally o Menzoli BMC
3100, a composi e ma e ial.
Menzoli BMC 3100 is a ype o polycomponen com-
posi e ma e ial comp ising an o ganic polyme ma ix
o med by polyes e esin and wo main ino ganic com-
ponen s, a mine al fille o CaCO
3
and i egula ly a anged
glass fib es. A sui able a io o hese componen s achie es a
desi ed empe a u e esis ance while main aining sufficien
mechanical p ope ies o i s in ended use in he au omo i e
indus y.
Menzoli BMC 3100 can be conside ed a empe a u e-
esis an composi e ma e ial sui able o use in applica ions
wi h con inuous empe a u es up o 200°C. Abo e his
empe a u e, he ma e ial begins o deg ade a he su ace,
especially i s o ganic componen (polyes e esin). This ype
o deg ada ion has a nega i e impac on a a ie y o i s
physical p ope ies. Exposu e o empe a u es abo e 200°C
educes he ma e ial’s ha dness, oughness, and shape s a-
bili y. Deg ada ion inc eases wi h highe he mal loads al-
mos linea ly o all he obse ed p ope ies.
Con lic s o In e es
The au ho s decla e ha hey ha e no conflic s o in e es .
Acknowledgmen s
This wo k was suppo ed by he Minis y o Educa ion,
You h and Spo s, Czech Republic, in he amewo k o he
p ojec numbe s SP2020/18, SP2020/61, and SP2020/39 a
VSB Technical Uni e si y o Os a a, Czech Republic. The
au ho s also acknowledge suppo o he p ojec Sma
Solu ions in Ubiqui ous Compu ing En i onmen s, G an
Agency o Excellence, Uni e si y o H adec K alo e, Facul y
o In o ma ics and Managemen , Czech Republic (ID: UHK-
FIM-GE-2020).
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