Thermal aging of Menzolit BMC 3100

Re iew A icle The mal Aging o Menzoli BMC 3100 Pa ol Kos ial, 1 Zo a Kos ialo a Janciko a, 1 Ond ej K ejca , 2 Kamil Kuca , 2 Oluwaseun Fadeyi, 2 , 3 Adebola O ogun, 4 and Robe F ische 1 , 2 1 VSB-Technical Uni e si y o Os a a, 17. Lis opadu 15/2172, Os a a 708 33, Czech Republic 2 Cen e o Basic and Applied Resea ch, Facul y o In o ma ics and Managemen , Uni e si y o H adec K alo e, Roki anskeho 62, H adec K alo e 500 03, Czech Republic 3 Depa men o Geology, Facul y o Space and En i onmen al Science, Uni e si y o T ie , T ie , Ge many 4 Adekunle Ajasin Uni e si y, Akungba-Akoko, Nige ia Co espondence should be add essed o Ond ej K ejca ; [email p o ec ed] Recei ed 8 July 2019; Accep ed 9 Ma ch 2020; Published 8 May 2020 Academic Edi o : Vic o M. Cas año Copy igh ©2020 Pa ol Kos ial e al. This is an open access a icle dis ibu ed unde he C ea i e Commons A ibu ion License, which pe mi s un es ic ed use, dis ibu ion, and ep oduc ion in any medium, p o ided he o iginal wo k is p ope ly ci ed. This pape deals wi h he influence o he mal aging on physical p ope ies o a composi e ma e ial, Menzoli BMC 3100. Fi s , we p esen a numbe o analysis, FTIR (in a ed spec oscopy), DSC (diffe en ial scanning calo ime y), TMA ( he momechanical analysis), TGA ( he mog a ime ic analysis), and HDT (hea deflec ion empe a u e), o unde s and he ma e ial pe o mance unde hea , and hen, we ca y ou a es o oughness and s eng h using Cha py impac s eng h and B inell ha dness. Finally, we p esen op ical su ace analysis o he ma e ial unde in es iga ion by ca ying ou aging analysis a inc emen s om oom empe a u e up o 300°C. I was obse ed ha abo e 200°C, he ma e ial begins o deg ade a he su ace, especially i s o ganic componen , polyes e esin. This ype o deg ada ion has a nega i e impac on a a ie y o i s physical p ope ies. Exposu e o empe a u es abo e 200°C educes he ma e ial’s ha dness, oughness, and shape s abili y, likewise, ma e ial deg ada ion was ound o inc ease wi h highe he mal loads almos linea ly o all he obse ed p ope ies. 1. In oduc ion Menzoli BMC 3100 is a composi e ma e ial ha is spa sely desc ibed in he scien ific li e a u e. De ailed e e ence is only made o he ma e ial when p oduce s gi e p oduc specifica ions in offe ing he ma e ial as an ad e ised i em. Such specifica ions a e also limi ed, p o iding only specific physical alues ha cha ac e ise he ma e ial and a ely publishing de ails on ma e ial composi ion. Polyme composi es play e y impo an oles in mode n indus y, especially he au omo i e sec o [1–8], in which ligh weigh , high specific modulus, and s eng h a e c i ical ac o s pu in o conside a ion in p oduc ion and whe e hese ma e ials find a wide ange o applica ion. This pape desc ibes he composi ion o polyme composi es, e.g., Menzoli BMC 3100, and he unique ad an ages hey offe , ela i e o adi ional ma e ials. De ails a e gi en on p e- ailing ma ke si ua ion o polyme composi es in Eu ope, and hei special applica ion in he Eu opean au omo i e indus y. Specific emphasis is also laid on he manu ac u ing o spa e pa s om he moplas ic, he - mose ing plas ics, and sho and con inuous fib e- ein- o ced composi es. In [9–12], he au ho s offe insigh s on some ecen echnological and en i onmen al applica ions o ein o ced polyme s. In [13], he au ho no ed ha Menzoli BMC 3100 is a special ma e ial de eloped o he au omo i e indus y o p oduce headligh s. This polyme composi e ma e ial is g adually eplacing adi ional me al eflec o s, mainly due o i s simplici y and low cos in se ial p oduc ion. Ne e heless, u u e use o Menzoli BMC 3100 in mode n au omobile ligh ing sys ems pose an unan- swe ed ques ion, gi en he cu en use o “cold” ligh emi ing diodes (LEDs) and lase o he same pu pose and he moplas ic ma e ials (e.g., polyca bona e) sufficing as hea esis an . Table 1 shows he p ope ies o Menzoli BMC 3100 (gi en as a e age alues o he es esul s) de i ed om nonpigmen ed, comp ession moulded panels a oom empe a u e [13]. Hindawi Ad ances in Ma e ials Science and Enginee ing Volume 2020, A icle ID 8575189, 8 pages h ps://doi.o g/10.1155/2020/8575189 2. Theo e ical Backg ound Acco ding o [14], composi e p oduce s p o ide a specific da ase use ul o e e ence pu pose, especially when de- signing hese ma e ials. Ne e heless, o bes da ase s, a numbe o expe imen al p ocedu es may be necessa y. One way is o de e mine a composi e composi ion om he cha ac e is ics o i s cons i uen s. While he e seems o be ex ensi e use o polyme ma ix composi es (pa icula he o m ein o ced wi h fib e) in ai c a s uc u es [15] and au omobile, accu a e p edic ion o s eng h o he ma e ials becomes e y impo an [14, 16, 17]. The au ho s o s udies such as [14] ha e esea ched how he ein o ced o ms o polyme ma ix a e impac ed upon ailu e. Failu e analysis is ca ied ou on pa o a composi e ma e ial made up o polyme ic ma ix as well as fib e wi h he aim o unde s anding he s ess-s ain si ua ion o he whole composi e ma e ial (fib e and ma ix included) [15]. This ela ionship is used o s uc u ally p edic ma ix o fib e ailu e o he ma e ial. Depending on he kind o echnique adop ed, he e is he possibili y o indi idually p edic ing ma ix ailu e and hen fib e ailu e in a sepa a e se up ia compu a ional me hods [16, 17]. Ne e heless, ad anced composi e cha ac e is ics do no only depend on he kind o ma ix, bu he ype o ein- o cemen also plays a i al ole as well as a ea u e ha is no associa ed o i s composi ion, configu a ion o ein o ce- men . In some composi e ma e ials, only s eng hening fib e concen a ion can be con olled, and composi e dimensions canno be con olled [18]. A ypical example is mouldable sho fib e- ein o ced he moplas ics. This pape hus offe s a ela i ely comp ehensi e s udy o he physical pa ame e s o BMC exposed o hea o e a ela i ely la ge empe a u e ange om ambien empe a u e o 300°C. 2.1. Fea u es o BMC 3100. Menzoli BMC 3100 is ypically designed using wo unique kinds o moulding: comp ession moulding and injec ion moulding [13]. The o me in ol es moulding Menzoli compounds using hea s eel moulds wi h shea edges, as high densi y moulds gene ally offe he bes esul s. Fu he mo e, 20–30 seconds-pe -millime e o wall hickness is p e e ed o cu ing when using comp ession mould. This is impo an as in oduc ion o Menzoli compound o ho mould mus be ollowed by a quick closing o he p ess o disallow p ecu ing [13]. Injec ion moulding o en akes place be ween 140°C and 165°C (s anda d compounds) and 30°C–40°C (injec ion uni ). Back p essu e is jus needed o assu e cons an dosing, injec ion p essu e a ies be ween 50 and 250 ba , and injec ion ime should be as sho as possible bu long enough o ensu e en ila ion. A small holding p essu e should be applied un il he ga e is cu ed. A guide o cu ing is 10 seconds pe millime e o wall hickness [13]. 2.2. The moanaly ical Techniques. Acco ding o [19], he - mal analysis e e s o a numbe o hea measu emen echniques in which physical p ope ies o a subs ance a e measu ed wi h espec o ime o empe a u e while he empe a u e o he ma e ial, in a specified a mosphe e, is ei he cons an ly hea ed o cooled ( empe a u e p o- g amme) a a specific desi ed empe a u e. In [20], he au ho epo ed ha he moanaly ical measu emen gen- e ally depends on how empe a u e o a ma e ial in e ac s wi h olume, hea o eac ion, and mass. These me hods find a wide ange o applica ion in scien ific discou se, anging om pha maceu icals [21], au omobile, and a ia ion con- s uc ion ma e ials [22]. A numbe o he moanaly ical echniques exis in he li e a u e. Howe e , o he pu pose o his s udy, only in a ed spec ome y, diffe en ial scan- ning calo ime y, he momechanical analysis, he mog a- ime ic analysis, and hea deflec ion empe a u e echniques a e discussed. Diffe en ial scanning calo ime y, commonly abb e ia ed as DSC, deals wi h effec s om physiochemical p ocesses o he wise known as phase- an- si ion eac ions o which specific hea is a majo cons i uen [23], so ha hea flow a e in o a subs ance is measu ed as a unc ion o empe a u e while he empe a u e o he sub- s ance i sel is p og ammed [24]. Via he mocouple, em- pe a u e diffe ence (be ween sample and e e ence) is hus measu ed. The mog a ime ic analysis in ol es changes in mass as a esul o ma e ial/subs ance in e ac ing wi h he a mosphe e, e apo a ion, and decomposi ion [23, 24]. I in ol es mass measu emen o a ma e ial as a unc ion o empe a u e, while subjec ing he ma e ial o some o m o con olled- empe a u e p og ammes. In [25], he au ho explained he momechanical analysis as a measu e o s iffness and damping p ope ies o ma e ials in e ms o Table 1: P ope ies o Menzoli BMC 3100 (adap ed om [13]). P ope y Value Fib e con en (%) 12 Moulding empe a u e (°C) 135–160 4 Moulding p essu e (ba ) 20–80 Densi y (g/cm 3 ) 2.0 1,3 Sh inkage (%) −0.03 3 CTE (10∗∗6 m/m·K) 10 HDT (°C) >200 Glass ansi ion empe a u e (°C) 185 2 Con inuous se ice empe a u e (°C) 190 3 Young’s modulus (GPa) 14 3 Tensile s eng h (MPa) 25 3 Flex s eng h (MPa) 79 3 Flex modulus (GPa) 11 3 Impac s eng h (kJ/m 2 ) 15 3 Poisson’s a io 0.30 Limi ed oxygen index (%) 22 5 Glow wi e (°C) 750 Fi e e a dancy 12 (le el) — Volume esis i i y (Ohm ∗cm) 10 15 Su ace esis i i y (Ohm) 10 12 Compa a i e acking index (le el) CT1600 Wa e abso p ion (%) <0.5 (1) nega i e alues show expansion; (2) con inuous se ice empe a u e wi hou ex e nal loads; (3) i wo figu es a e gi en o one p ope y, he fi s e e s o he ans e sal di ec ion, while he second ep esen s p incipal axis; (4) moulding p essu e in comp ession moulding; (5) wall hickness 3 mm; (6) figu es gi en apply o quasi-iso opic 6-laye [0/90/45/-45/90/0] design; (7) hea conduc i i y is unde s ood pe pendicula o he plane o he lamina e (ou -o -plane axis). 2Ad ances in Ma e ials Science and Enginee ing empe a u e, ime, and equency, h ough he applica ion o sinusoidal load o a specimen and subsequen ly measu ing he esul an de o ma ion. Du ing his ime, he sample unde goes con olled empe a u e p og amme. Fo hea deflec ion empe a u e, he polyme ma ix o Menzoli BMC 3100 unde goes de o ma ion, subjec o a specified load. This empe a u e ollows he ASTM D648 guidelines, wi h he es p ocedu e simila o ISO 75 s anda ds. 3. Me hod The mog a ime ic analysis was ca ied ou using a quan- i a i e analysis o BMC composi ion wi h he aid o Hi-Res TGA TA Ins umen s 2950. Fu he mo e, iso he mal analysis was used o de e mine he hea load ime o up o 300 minu es. Fo deg ada ion o he su ace laye , he 1147 cm −1 band co esponding o he C-O-C bond was closely moni o ed. B inell ha dness ollows expe imen ally wi h he use o B inell ha dness es e ZWICK/ROELL. 4. Resul s and Discussion A quan i a i e analysis o BMC composi ion (Figu e 1) can be pe o med wi h he mog a ime ic analysis (Hi-Res TGA TA Ins umen s 2950) [26, 27]. Depending on he weigh - o- empe a u e a io, da a on he amoun (mass) o he indi- idual componen s in he sample can be ob ained. Fo p ope e alua ion o he TGA cu e, i is necessa y o know he chemis y o ongoing decomposi ion eac ions: (a) 0–200°C: sho -li ed componen s up o 200°C; weigh loss o he ma e ial’s ola ile componen s, especially s y ene and mois u e esidues (b) 200–600°C: decomposi ion o he polyme ic, o ganic pa o he ma e ial up o 600°C wi h dynamic hea ing o 20°C/min (c) 600–800°C: decomposi ion o he CaCO 3 fille (d) 800°C: esidue a e combus ion in ai CaO + glass fib e The esul ing composi ion is as ollows: (a) 0.4% o sho -li ed componen s up o 200°C, ep- esen ing mainly mois u e con en and esidual s y ene (b) 20.6% o polyme ma ix (c) 63.6% o ino ganic CaCO 3 fille (d) 15.4% o glass fib e This is he pe cen age composi ion o he ma e ial o one ba ch o BMC. The composi ion may diffe om one ba ch o ano he . To de e mine he hea load ime, an iso he mal he mal analysis o a small amoun o ma e ial was pe o med (up o 300 minu es). Figu e 2 g aphs he mass loss (in %) de- pendence on empe a u e. Mass loss inc eased abo e 240°C. Due o he mal deg ada ion, he o ganic ma ix decomposed in he su ace laye . Decomposi ion is eflec ed by he loss o specific chemical bonds and he change in in ensi y o he espec i e bands in he IR spec um (FTIR Nicole iS10 spec opho ome e ). The FTIR g aph in Figu e 3 shows he g adual dec ease o bands co esponding o he bonds o he o ganic ma ix o he polyme . To assess deg ada ion o he su ace laye , he 1147 cm −1 band co esponding o he C-O-C bond was obse ed. Wi h inc easing empe a u e and p og essi e deg ada ion o he su ace laye , he polyme ic ma ix decomposed, esul ing in a educ ion in he in ensi y o he C-O-C bonding band. The 1728 cm −1 band co esponds o he ib a ional mo emen o he C�O bond, e e ed o as “s e ching ib a ion” in ac yla e g oups o polyes e esins, and he 1147 cm −1 band co esponds o he s e ching i- b a ion o C-O-C bonds. The esul s o su ace decomposi ion a e plo ed in Figu e 4. F om he weigh dependence o he load o he load empe a u e, he ma e ial was s able up o abou 250°C wi h a hea load ime o 30 minu es. This co esponds o he e alua ion o FTIR su ace analysis (see g aph in Figu e 4). The nex pa o he expe imen desc ibes measu emen o B inell ha dness (B inell ha dness es e ZWICK/ ROELL). As he empe a u e inc eased, ha dness was ound o dec eased (Figu e 5). F om 200°C, ha dness dec eased almos linea ly. Con e sely, he measu emen ime in- c eased. Wi hou hea s ess, he bulle was c ushed almos ins an aneously. By con as , a e a 30-minu e load a 300°C, 0.6 200 400 600 8000 40 60 80 100 0.2 0.4 0.8 1.0 0 120 0.3976% 2.713% 17.86% 27.95% Tempe a u e (°C) Residue 51.04% (7.047 mg) De i . weigh (%/°C) Figu e 1: TGA decomposi ion cu e o BMC. 0.00 200 220 240 260 280 300 320 1.00 2.00 3.00 4.00 5.00 6.00 7.00 8.00 9.00 Loss o mass (%) 180 Loss o mass a e 20min Loss o mass a e 30min Loss o mass a e 60min Tempe a u e (°C) Figu e 2: Mass loss dependence on empe a u e. Ad ances in Ma e ials Science and Enginee ing 3 he specimen ook a bulle o a while be o e he su ace laye was pie ced. As he empe a u e inc eased, i is likely ha a “sin e ed” laye o ma e ial o med on he su ace and ha his ma e ial educed he ha dness o he ma e ial. Fu - he mo e, he ma e ials we e es ed o Cha py impac s eng h (CEAST Resil 5.5) e sus loading empe a u e applied o e 30 min. In his es , we also saw dec easing alues wi h inc easing empe a u e (Figu e 6). The inc ease in impac s eng h a 300°C/30 minu es could be due o he ein o cemen /sin e ing o he sample su ace. The esul s o he he momechanical analysis (TMA TA Ins umen s 2940) did no show any isible dependence on deg ada ion (Fig- u e 7). The only diffe ence is isible be ween he unexposed sample, which had an addi ional cu e eac ion, and he mos in ensi ely loaded specimen a 300°C/30 minu es, whe e he CLTE (linea he mal expansion coefficien ) was almos linea o e he en i e empe a u e ange. De e mining he glass ansi ion empe a u e o BMC ma e ial wi h he DSC me hod (DSC Du Pon Ins umen s 2910) acco ding o ISO 11357-2 was somewha p oblema ic. The ma e ial da a shee o BMC indica ed a glass ansi ion empe a u e (Tg) o 185°C (acco ding o ISO 11357-2). The de e mina ion me hod was se o mee he specified con- di ions. The signal esponse o BMC was e y poo . No clea ly iden ifiable ansi ion (p obably Tg) was obse ed a ound 185°C. Ce ain ansi ions can be e alua ed a a ound 90°C and 130°C. Howe e , hese we e almos un- iden ifiable du ing he second hea ing, so i is possible ha hey may ha e been i e e sible ( empe a u e his o y, e apo a ion o ola ile componen s, and abso bed mois u e) (Figu e 8). As he he mal load inc eased, he esponse diminished. The esul s we e compa ed wi h he measu ed TA-Ins umen s he mose cu es [28]. The clea glass ansi ion was no obse able in any ma e ial, as he em- pe a u e ange wi h he occu ence o glass ansi ion always o e lapped he cu e eac ion. 1800 1700 1600 1500 Wa enumbe s (cm–1) 1400 1300 1200 1100 0.55 0.50 0.45 0.40 0.35 0.30 0.25 0.20 0.15 0.10 0.05 Abso bance 1728.14 1147.03 BMC 200°C_30min BMC 250°C_30min BMC 280°C_30min BMC 300°C_30min BMC wi hou he mal load Figu e 3: De ails o binding zone C-O-C 1147 cm −1 . 0 100 150 200 250 300 350 14 Ma e ial loss (%) 50 Tempe a u e load (°C/30min) 15 16 17 18 19 20 21 Figu e 4: BMC ma e ial loss in ela ion o empe a u e load. 0 100 150 200 250 300 350 250 B inell ha dness (N/mm2) 50 The mal load (C/30min) 270 290 310 330 350 370 390 Figu e 5: B inell ha dness dependence on he mal loading. 0 100 150 200 250 300 350 6.0 Cha py impac (kJ/m2) 50 Tempe a u e load (C/30min) 7.0 8.0 9.0 10.0 11.0 12.0 13.0 Figu e 6: BMC-Cha py impac s eng h in ela ion o empe a u e load. 4Ad ances in Ma e ials Science and Enginee ing The weak signal esponse may ha e been due o he p esence o a la ge pe cen age o ino ganic fille s (limes one and glass fib e accoun o abou 80% o he composi e a he expense o he polyme ma ix, which is only 20%). Fo his eason, hea is likely o be g ea ly diffused by he sample, and he eac ion o he polyme ma ix o inc easing cell empe a u e was weak and he change in hea flow was no de ec able. Du ing he fi s hea ing (1s s ep), he DSC cu e showed undefined ansi ions a ound 90°C and 130°C. The ansi ion s ages we e e y small, so hei in e p e a ion is unce ain. The second hea ing (2nd s ep) did no show any changes in hea flow (Figu e 9). A no iceable change could be seen in he he mal his o y o he sample exposed o a hea load o 250°C on he DSC fi s hea ing cu e (1s s ep). Du ing he second hea ing (2nd s ep), hese effec s we e no longe isible, and he DSC cu e shows no significan hea flow changes (Figu e 10). The TMA dimension change cu e eflec s he DSC eco d o hea flow change [29]. Physical ansi ions caused nonlinea i y o he s e ch cu e (Figu e 11). The fi s 30 25 20 15 10 5 0 Dimension change (µm) 20 40 60 80 100 120 140 160 180 Tempe a u e (°C) Uni e sal V3.9A TA Ins umen s BMC 200°C.002 BMC 250°C.004 BMC wi hou he mal load.001 BMC 280°C.005 BMC 300°C.005 Figu e 7: The mal expansion cu es o BMC depending on he mal load. 30 55 80 105 130 155 180 205 230 –0.40 –0.35 –0.30 –0.25 –0.20 –0.15 Tempe a u e (°C) Hea flow (no malized) (W/g) Midpoin ype: hal heigh Midpoin : 87.878 °C Midpoin ype: hal heigh Midpoin : 129.883 °C Figu e 8: Sample wi hou he mal load: 1 s hea ing. –0.325 –0.375 Hea flow (W/g) –0.425 –0.475 Exo up 30 80 130 Tempe a u e (°C) 180 230 Uni e sal V3.9A TA Ins umen s 2nd s ep 1s s ep 92.27°C 79.40°C 87.09°C (I) 124.90°C (I) 130.75°C 117.94°C Figu e 9: Sample a e load 200°C/30 minu es: 1 s hea ing (1 s s ep); 2 nd hea ing (2 nd s ep). –0.30 –0.35 –0.40 –0.45 Hea flow (W/g) 30 80 130 180 230 Exo up Tempe a u e (°C) Uni e sal V3.9A TA Ins umen s 2nd s ep 1s s ep Figu e 10: Sample a e load 250°C/30 min: 1 s hea ing (1 s s ep); 2 nd hea ing (2 nd s ep). Ad ances in Ma e ials Science and Enginee ing 5 ansi ion in he empe a u e ange up o 100°C, co e- sponding o e apo a ing mois u e and ola ile componen s. A empe a u es abo e 150°C, e idence o addi ional cu ing o he BMC on bo h cu es is seen. HDT (VICAT-HDT CEAST) measu emen was based on ISO 75 o Plas ics-De e mina ion o deflec ion em- pe a u e unde load. By de aul , a body o 10 mm hickness was used. The load was de e mined acco ding o he s an- da d a 0.45 o 1.82 MPa (me hod A o B). The esul ing HDT empe a u e, acco ding o he s anda d, indica ed he empe a u e a which he es body had a deflec ion o 0.32 mm. As he BMC can wi hs and empe a u es abo e 200°C, which is he maximum ope a ing empe a u e o he HDT, he BMD had o be >200°C o all samples. The es was he e o e designed o ead deflec ion o he es body o he selec ed empe a u es, and he dependence o shape de o ma ion on ising empe a u e was plo ed. Only he es condi ions om he s anda d we e used, which we e a hea ing a e o 120°C/h and a load o 1.82 MPa. F om he esul s o he HDT es , i is clea ha he sample deflec ion significan ly inc eased wi h he applied hea load (Fig- u e 12). Op ical su ace analysis showed he ollowing esul s (KEYENCE digi al 3D mic oscope). As we said abo e, Menzoli BMC 3100 belongs o he g oup “bulk moulding compounds” based on unsa u a ed polyes e esin. The ma e ial is glass fib e ein o ced. Figu e 13 shows diffe en ly o ien ed glass fib es eaching abou 500 μm in leng h and a ious CaCO 3 pa icles in he ange o ens o hund eds o μm. Figu e 14 shows CaCO 3 pa icles in he ange o ens o hund eds o μm. All a e connec ed by a c oss-linked polyes e ma ix. The fille s uc u e is no p e e en ially o ien ed, bu he fib es a e andomly a anged o o m he bonded bundles associa ed wi h he mine al fille and he esin. A a he mal load o 280°C/30 minu es, he su ace laye o he ma e ial was isibly deg aded o a dep h o 60–70 μm. A e he mal s ess o 300°C/30 minu es, he su ace laye was al eady damaged o a dep h o abou 90 μm. A a lowe he mal load, deg ada ion on he c oss sec ion was no so isible. This co esponds o he esul s o he TGA and FTIR analysis, whe e mo e deg ada ion occu ed a empe a u es abo e 250°C. Only a colou change o he su ace laye occu s below his empe a u e. 5. Limi a ions Ha ing c i ically examined he s abili y o Menzoli BMC 3100 unde specific he mal condi ions, he glass ansi ion o he polyme ic ma ix could no be de ec ed p obably due o he la ge pe cen age o ino ganic fille ; he e o e, i was no possible o s udy he effec o he mal deg ada ion on i s –0.2 25 20 15 10 5 –5 0 –0.3 –0.4 Hea flow (W/g) Dimension change (µm) 25 75 125 175 Exo up Tempe a u e (°C) Uni e sal V3.9A TA Ins umen s TMA DSC BMC wi hou he mal load Figu e 11: Compa ison o DSC and TMA samples wi hou hea exposu e. Tempe a u e (°C) Deflec ion × 0.01mm Wi hou he mal load 200 °C/30min 250 °C/30min 280 °C/30min 300 °C/30min 200 2251751501251007550250 0.0 5.0 10.0 15.0 20.0 25.0 30.0 Figu e 12: De e mina ion o shape deflec ion (0.01 mm) plo acco ding o empe a u e. Figu e 13: Diffe en ly o ien ed glass fib es. Figu e 14: Randomly a anged fib es o med by bonded bundles associa ed wi h mine al fille and esin. 6Ad ances in Ma e ials Science and Enginee ing alue. The moanaly ical echniques used in his s udy also ha e specific limi a ions o which each me hod may no be comple ely effec i e. 6. Conclusions I is impo an o ake no e o he shape and quali y o he moanaly ical cu es so a discussed [30]. Fo ex- ample, o selec ed empe a u es o mass losses as hey ha e been in e p e ed in line wi h all demons a ed ex- pe imen al condi ions, conside a ion o he shapes and quali y o he he moanaly ical cu es helps o ob ain u he impo an in o ma ion on Menzoli BMC 3100. The undamen als o he echniques discussed and ana- lysed in his s udy a e unc ions o changes in he em- pe a u e p ofiles as a hea flux passes h ough a ma e ial [31], Menzoli 3100 in his case. The mal echniques expe imen ed end o de elop unde s anding o aging o he ma e ials. Expe imen al esul s a e he e o e in compa ison o he nume ical simula ions as unc ions o mass, weigh , and empe a u e ends. The influence o he mal aging on physical p ope ies o a composi e ma e ial is de ec ed expe imen ally o Menzoli BMC 3100, a composi e ma e ial. Menzoli BMC 3100 is a ype o polycomponen com- posi e ma e ial comp ising an o ganic polyme ma ix o med by polyes e esin and wo main ino ganic com- ponen s, a mine al fille o CaCO 3 and i egula ly a anged glass fib es. A sui able a io o hese componen s achie es a desi ed empe a u e esis ance while main aining sufficien mechanical p ope ies o i s in ended use in he au omo i e indus y. Menzoli BMC 3100 can be conside ed a empe a u e- esis an composi e ma e ial sui able o use in applica ions wi h con inuous empe a u es up o 200°C. Abo e his empe a u e, he ma e ial begins o deg ade a he su ace, especially i s o ganic componen (polyes e esin). This ype o deg ada ion has a nega i e impac on a a ie y o i s physical p ope ies. Exposu e o empe a u es abo e 200°C educes he ma e ial’s ha dness, oughness, and shape s a- bili y. Deg ada ion inc eases wi h highe he mal loads al- mos linea ly o all he obse ed p ope ies. Con lic s o In e es The au ho s decla e ha hey ha e no conflic s o in e es . Acknowledgmen s This wo k was suppo ed by he Minis y o Educa ion, You h and Spo s, Czech Republic, in he amewo k o he p ojec numbe s SP2020/18, SP2020/61, and SP2020/39 a VSB Technical Uni e si y o Os a a, Czech Republic. 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