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SOLIS-Sou ceme e : Use Manual o Kei hley
2636A
Cu en -Vol age Cha ac e iza ion So wa e
Zacha ie Jehl Li-Kao
zacha [email protected]
Oc obe 10, 2025
Con en s
1 In oduc ion 3
1.1 Suppo ed Connec ion Types . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
1.2 KeyFea u es ...................................... 3
2 Diode Mode: Pho o ol aic and Rec i ie Cha ac e iza ion 3
2.1 Measu emen P inciple................................. 3
2.2 Con igu a ionPa ame e s ............................... 3
2.3 Pho o ol aic Pa ame e Ex ac ion . . . . . . . . . . . . . . . . . . . . . . . . . . 3
2.4 Hys e esisMeasu emen ................................ 4
2.5 Da k s. Illumina ed Measu emen s . . . . . . . . . . . . . . . . . . . . . . . . . 4
3 T ansis o Mode: Field-E ec Cha ac e iza ion 4
3.1 Measu emen P o ocol................................. 4
3.2 ChannelCon igu a ion................................. 4
3.3 Pa ame e Ex ac ion ................................. 5
3.4 Da aExpo Fo ma .................................. 5
4 Synapse Mode: Neu omo phic De ice Cha ac e iza ion 5
4.1 Basic Synapse Measu emen . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
4.1.1 Pulse-ReadSequence.............................. 5
4.1.2 TimingPa ame e s............................... 5
4.1.3 D i eTypes................................... 5
4.1.4 SynapseMe ics ................................ 6
4.2 P ese s o Common P o ocols . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
4.3 Spike-Ra e-Dependen Plas ici y (SRDP) . . . . . . . . . . . . . . . . . . . . . . 6
4.3.1 Measu emen P o ocol............................. 6
4.3.2 SRDPPa ame e s ............................... 6
4.3.3 Da aIn e p e a ion .............................. 7
4.4 Spike-Timing-Dependen Plas ici y (STDP) . . . . . . . . . . . . . . . . . . . . . 7
4.4.1 TimingCon en ion............................... 7
4.4.2 Implemen a ion................................. 7
4.4.3 STDPPa ame e s ............................... 7
4.4.4 Expec ed STDP Window . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
4.5 Po en ia ion-Dep ession Cycling . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
4.5.1 CycleS uc u e................................. 8
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4.5.2 Independen Pa ame e Con ol . . . . . . . . . . . . . . . . . . . . . . . . 8
4.5.3 CycleP ese s.................................. 8
4.5.4 CycleMe ics.................................. 8
4.5.5 Real-TimePlo ing............................... 8
4.6 Mul i-De ice Sequen ial Tes ing . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
4.6.1 Con igu a ion.................................. 9
4.6.2 Mul i-De ice Wo k low . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
4.6.3 S a is icalAnalysis............................... 9
5 Simula ion Mode 9
5.1 Simula ionModels ................................... 9
6 Measu emen Op imiza ion 10
6.1 NPLCSelec ion..................................... 10
6.2 Au o ange s. Fixed Range . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
6.3 4-Wi e s. 2-Wi e Sensing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
6.4 ComplianceSe ings .................................. 10
6.5 Timeou Con igu a ion................................. 10
7 Da a Expo and Analysis 10
7.1 CSVFileS uc u e................................... 10
7.1.1 DiodeMode................................... 10
7.1.2 SynapseMode ................................. 11
7.1.3 Cycle Cha ac e iza ion . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
7.1.4 Mul i-De iceDa a ............................... 11
7.2 Ex ac ingMe ada a.................................. 11
8 Con ac and Suppo 12
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1 In oduc ion
This so wa e was de eloped as a deli e able o he MSCA S a Exchange P ojec
SOLIS (h ps://co dis.eu opa.eu/p ojec /id/101183049). SOLIS-Sou ceme e is a mea-
su emen sui e o elec ical cha ac e iza ion o semiconduc o de ices using he Kei hley 2636A
dual-channel Sou ceMe e . The so wa e suppo s h ee p ima y measu emen modes: diode/pho o ol aic
cha ac e iza ion, ansis o cha ac e iza ion, and neu omo phic synapse measu emen s. All mea-
su emen s u ilize bu e ed acquisi ion o speed and eliabili y.
1.1 Suppo ed Connec ion Types
•GPIB (IEEE-488)
•RS232 (Se ial)
•LAN (TCP/IP)
1.2 Key Fea u es
•Real- ime JV cu e plo ing wi h dual-axis powe densi y display
•Au oma ic pho o ol aic pa ame e ex ac ion (Voc,Jsc, FF, PCE)
•Semi-loga i hmic cu en isualiza ion
•Hys e esis cha ac e iza ion o e oelec ic and mem is i e de ices
•Ad anced synapse cha ac e iza ion: SRDP, STDP, cycling endu ance
•Mul i-de ice sequen ial es ing
•Ha dwa e- ee simula ion mode o p o ocol de elopmen
2 Diode Mode: Pho o ol aic and Rec i ie Cha ac e iza ion
2.1 Measu emen P inciple
The so wa e pe o ms ol age-sweep cu en measu emen s o gene a e cu en densi y s. ol -
age (JV) cu es. Fo pho o ol aic de ices unde illumina ion, he so wa e au oma ically calcu-
la es s anda d sola cell pa ame e s.
2.2 Con igu a ion Pa ame e s
Pa ame e Desc ip ion Typical Range
S a ing Vol age Ini ial sweep ol age −0.5 o 0 V
Ending Vol age Final sweep ol age 0.8 o 1.2 V
Vol age S ep Vol age inc emen 0.01 o 0.05 V
NPLC In eg a ion ime (powe line cycles) 0.01 o 10
Compliance Cu en limi 1 nA o 1.5 A
Su ace A ea Ac i e de ice a ea 0.01 o 10 cm2
I adiance Inciden ligh in ensi y 100 o 1000 W/m2
Table 1: Diode mode con igu a ion pa ame e s
2.3 Pho o ol aic Pa ame e Ex ac ion
Fo illumina ed measu emen s, he so wa e calcula es:
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1. Open-Ci cui Vol age (Voc): In e pola ed ol age whe e J= 0
Voc =Vlow −Jlow
Vhigh −Vlow
Jhigh −Jlow
(1)
2. Sho -Ci cui Cu en Densi y (Jsc): Cu en densi y a V= 0
Jsc =−J(V= 0) [mA/cm2] (2)
3. Fill Fac o (FF): Ra io o maximum powe o heo e ical maximum
FF = |Vmp ·Jmp|
Voc ·Jsc
×100% (3)
4. Powe Con e sion E iciency (PCE):
PCE = |Pmax|
Pinciden
×100% = |Vmp ·Jmp|
Pinciden
×100% (4)
whe e Pinciden is he i adiance in mW/cm2.
2.4 Hys e esis Measu emen
Enable hys e esis measu emen o cha ac e ize ol age-dependen pola iza ion o ion mig a ion
e ec s. The so wa e pe o ms o wa d and e e se ol age sweeps o he speci ied numbe o
cycles. This is impo an mos ly o :
•Pe o ski e sola cells (ion mig a ion)
•Fe oelec ic de ices
•Mem is i e sys ems
2.5 Da k s. Illumina ed Measu emen s
Da k JV: Cha ac e izes diode p ope ies wi hou pho ogene a ion. The so wa e does no
include i ing ye . Use o :
•Ideali y ac o de e mina ion
•Re e se sa u a ion cu en ex ac ion
•Shun and se ies esis ance analysis
Illumina ed JV: Measu es pho o ol aic pe o mance. Ensu e accu a e calib a ion o wha -
e e ligh sou ce you use o p ecise PCE calcula ion.
3 T ansis o Mode: Field-E ec Cha ac e iza ion
3.1 Measu emen P o ocol
T ansis o mode pe o ms ou pu cha ac e is ics (ID-VDS) measu emen s a mul iple ga e ol -
ages (VGS). The so wa e sweeps d ain-sou ce ol age while inc emen ally s epping he ga e
ol age, gene a ing a amily o cu es.
3.2 Channel Con igu a ion
The selec ed channel con ols VDS (d ain-sou ce), while he opposi e channel con ols VGS (ga e-
sou ce):
•Channel A selec ed: SMU A = d ain, SMU B = ga e
•Channel B selec ed: SMU B = d ain, SMU A = ga e
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3.3 Pa ame e Ex ac ion
F om he ou pu cha ac e is ics, ex ac :
•Linea egime: Mobili y, h eshold ol age
•Sa u a ion egime: On/o a io, sub h eshold swing
•Con ac esis ance: F om low VDS beha io
3.4 Da a Expo Fo ma
The CSV ile con ains columns o each VGS alue wi h pai ed ol age-cu en densi y da a.
Su ace a ea is embedded in he heade o conduc i i y calcula ions.
4 Synapse Mode: Neu omo phic De ice Cha ac e iza ion
Synapse mode implemen s pulse- ead sequences o cha ac e izing a i icial synapses and mem-
is i e de ices. The so wa e suppo s basic po en ia ion/dep ession measu emen s as well as
he mo e ad anced plas ici y p o ocols.
4.1 Basic Synapse Measu emen
4.1.1 Pulse-Read Sequence
The undamen al ope a ion sequence is:
1. Apply s imulus pulse ( ol age o cu en ) on s imulus channel
2. Wai o pulse du a ion ( wid h)
3. Tu n o s imulus
4. Wai o ead delay ( delay)
5. Apply ead ol age on ead channel
6. Measu e cu en a e se ling ime
7. Calcula e conduc ance: G=I/V ead
8. Re u n o idle s a e
9. Wai o pe iod comple ion
4.1.2 Timing Pa ame e s
Pa ame e Desc ip ion Typical Range
S im Wid h Pulse du a ion 10 o 1000 ms
S im Pe iod Time be ween pulses 50 o 2000 ms
Read Delay Pos -pulse se ling ime 5 o 100 ms
Se le Time Measu emen s abiliza ion 2 o 20 ms
Table 2: Synapse iming pa ame e s
C i ical cons ain :
pe iod ≥ wid h + delay + se le + measu emen (5)
4.1.3 D i e Types
•Vol age-d i en (V): Apply ixed ol age, measu e cu en
•Cu en -d i en (I): Apply ixed cu en , measu e ol age
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Vol age d i e is p e e ed o mos mem is i e de ices; cu en d i e is sui able o phase-
change memo y (PCM) cha ac e iza ion, which is no pa o he SOLIS p ojec .
4.1.4 Synapse Me ics
The so wa e calcula es:
•Pai ed-Pulse Facili a ion (PPF):
PPF = G2
G1
×100% (6)
Measu es sho - e m plas ici y; c i ical o empo al in o ma ion p ocessing.
•Conduc ance Change (∆G):
∆G=G inal −Gini ial (7)
∆G%=G inal −Gini ial
Gini ial
×100% (8)
•Dynamic Range: Gmax/Gmin a io (on/o a io)
4.2 P ese s o Common P o ocols
P ese Vol age Wid h Pe iod Pulses
LTP Mode a e +1.0 V 100 ms 200 ms 50
LTD Mode a e −1.0 V 100 ms 200 ms 50
PPF Tes +1.5 V 10 ms 30 ms 2
High Speed +1.0 V 10 ms 20 ms 100
Table 3: P ese con igu a ions o basic synapse measu emen s
4.3 Spike-Ra e-Dependen Plas ici y (SRDP)
SRDP cha ac e izes how synap ic weigh change depends on inpu spike equency which is a
c i ical p ope y o a e-coded neu al ne wo ks.
4.3.1 Measu emen P o ocol
The so wa e sweeps h ough use -de ined equencies, applying a ixed numbe o pulses a each
equency and measu ing he esul ing ∆G.
i=(Loga i hmic: 10log10( min)+i·
log10( max)−log10( min)
N−1
Linea : min +i· max− min
N−1
(9)
whe e i∈[0, N −1] and Nis he numbe o equency poin s.
4.3.2 SRDP Pa ame e s
•F eq S a : Minimum equency (1-100 Hz ypical)
•F eq End: Maximum equency (10-1000 Hz ypical)
•F eq Poin s: Numbe o equencies o es (5-20 ecommended)
•Log Scale: Loga i hmic spacing ( ecommended o wide equency anges)
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4.3.3 Da a In e p e a ion
Plo ∆G s. equency o iden i y:
•Po en ia ion egime: Posi i e ∆Ginc easing wi h equency
•Dep ession egime: Nega i e ∆Gmagni ude inc easing wi h equency
•Sa u a ion: Pla eau a high equencies
•C i ical equency: T ansi ion poin be ween LTD and LTP
4.4 Spike-Timing-Dependen Plas ici y (STDP)
STDP cha ac e izes synap ic weigh change as a unc ion o ela i e iming be ween p e- and
pos -synap ic spikes, and i is he undamen al lea ning ule in empo al coding.
4.4.1 Timing Con en ion
∆ = p e − pos (10)
•∆ >0: P e-synap ic spike p ecedes pos -synap ic →LTP (po en ia ion)
•∆ <0: Pos -synap ic spike p ecedes p e-synap ic →LTD (dep ession)
4.4.2 Implemen a ion
Fo each ∆ alue:
1. Measu e ini ial conduc ance G0
2. Apply Nspike pai s wi h iming o se ∆
3. Measu e inal conduc ance G
4. Calcula e ∆G=G −G0
The s imulus channel deli e s p e-synap ic spikes; he ead channel deli e s pos -synap ic
spikes.
4.4.3 STDP Pa ame e s
•∆ S a : Minimum iming o se ( ypically −50 ms)
•∆ End: Maximum iming o se ( ypically +50 ms)
•∆ Poin s: Numbe o iming poin s (10-20 ecommended)
•Spike Pai s: Numbe o pai ed spikes pe iming poin (20-100)
•P e-spike Le el: P e-synap ic pulse ampli ude
•Pos -spike Le el: Pos -synap ic pulse ampli ude
•Pai Pe iod: Time be ween consecu i e spike pai s
4.4.4 Expec ed STDP Window
Classic STDP ollows exponen ial decay:
∆G(∆ ) =
A+exp −∆
τ+∆ >0 (LTP)
−A−exp ∆
τ−∆ <0 (LTD) (11)
whe e A+,A−a e ampli udes and τ+,τ−a e ime cons an s ( ypically 10-20 ms).
4.5 Po en ia ion-Dep ession Cycling
Cycling cha ac e iza ion assesses de ice endu ance and ep oducibili y by al e na ing po en ia-
ion and dep ession phases.
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4.5.1 Cycle S uc u e
Each cycle consis s o :
1. Po en ia ion phase: Apply posi i e s imulus sequence
2. Dep ession phase: Apply nega i e s imulus sequence
3. In e -cycle delay: Reco e y ime be o e nex cycle
4.5.2 Independen Pa ame e Con ol
Po en ia ion and dep ession phases use sepa a e pa ame e se s, allowing asymme ic cha ac-
e iza ion:
•Di e en pulse ampli udes (e.g., +1.5 V po , −1.0 V dep)
•Di e en pulse wid hs (e.g., 50 ms po , 100 ms dep)
•Di e en numbe o pulses
•Di e en ead ol ages (e.g., 0.15 V po , 0.08 V dep)
4.5.3 Cycle P ese s
P ese Cycles Po /Dep In e -cycle Applica ion
S anda d Cycle 5 ±1.0 V 1000 ms Balanced p o ocol
Fas Cycle 10 ±1.2 V 500 ms Rapid sc eening
High Endu ance 20 ±0.8 V 2000 ms Long- e m s abili y
Asymme ic 5 +1.5/−1.0 V 1500 ms Unbalanced dynamics
Table 4: Cycle p ese con igu a ions
4.5.4 Cycle Me ics
The so wa e calcula es:
•Mean ∆G(po en ia ion): A e age po en ia ion ac oss cycles
•Mean ∆G(dep ession): A e age dep ession ac oss cycles
•Rep oducibili y (CV): Coe icien o a ia ion
CV = σ(∆G)
|µ(∆G)|×100% (12)
Lowe CV indica es be e ep oducibili y.
•Dynamic Range:
∆G ange =⟨Gpo , inal⟩−⟨Gdep, inal⟩(13)
•On/O Ra io:
On/O = ⟨Gpo , inal⟩
⟨Gdep, inal⟩(14)
4.5.5 Real-Time Plo ing
The so wa e p o ides eal- ime plo upda es du ing cycling, allowing immedia e obse a ion o :
•Cycle- o-cycle a iabili y
•Fa igue e ec s (deg ada ion o e cycles)
•Asymme ic beha io be ween po en ia ion and dep ession
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4.6 Mul i-De ice Sequen ial Tes ing
Mul i-de ice mode enables au oma ed cha ac e iza ion o mul iple de ices wi hou manual in-
e en ion.
4.6.1 Con igu a ion
•Numbe o De ices: To al de ices o es (2-20 ypical)
•De ice Name Pa e n: Base iden i ie (e.g., ”De ice” gene a es De ice 1, De ice 2, ...)
•In e -de ice Delay: Reco e y ime be ween de ices (1-5 seconds)
All de ices use he same cycle pa ame e s (po en ia ion, dep ession, numbe o cycles).
4.6.2 Mul i-De ice Wo k low
1. Con igu e cycle pa ame e s
2. Enable mul i-de ice mode
3. Se de ice coun and naming
4. Run measu emen
5. So wa e sequen ially es s each de ice
6. Agg ega ed esul s display de ice- o-de ice a iabili y
4.6.3 S a is ical Analysis
Mul i-de ice measu emen s enable:
•De ice- o-de ice a iabili y assessmen
•Fab ica ion yield es ima ion
•S a is ical eliabili y me ics
•Ou lie iden i ica ion
I is be e used wi h a mul iplexe on a synap ic ne wo k o example.
5 Simula ion Mode
Simula ion mode allows p o ocol de elopmen and es ing wi hou ha dwa e connec ion. Enable
ia he ”Simula e (No Ha dwa e)” checkbox in Synapse mode. I made i a i s o es he logic
wi hou ha ing o connec he ha dwa e, bu i can also be use ul o help designing expe imen al
p o ocols.
5.1 Simula ion Models
•Basic Synapse: Exponen ial conduc ance change wi h lea ning a e
Gn+1 =Gn+ (G a ge −Gn)×α(15)
whe e α= 0.05 (5% s ep size).
•SRDP: Loga i hmic equency dependence
∆Gno m( ) = log10( + 1)
log10(100) ×A(16)
•STDP: Exponen ial iming window
∆G(∆ ) = (0.5 exp(−∆ /20 ms) ∆ >0
−0.3 exp(∆ /20 ms) ∆ <0(17)
All simula ions include Gaussian noise (±2%-5%) o app oxima e ealis ic beha io .
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