Citations refer to the original publication, not to a Scieee localized version.
Ramírez del Amo, P., Iglesias González, M. N., & Dorado, A. D. (2024). Modeling copper leaching from non-pulverized printed circuit boards at high concentrations of bioregenerated ferric sulfate. Elsevier. https://doi.org/10.1016/j.mineng.2024.108913
Ramírez del Amo, Pablo, et al. Modeling copper leaching from non-pulverized printed circuit boards at high concentrations of bioregenerated ferric sulfate. Elsevier, 2024. https://doi.org/10.1016/j.mineng.2024.108913.
Ramírez del Amo, Pablo, María Nieves Iglesias González, and Antonio D. Dorado. Modeling copper leaching from non-pulverized printed circuit boards at high concentrations of bioregenerated ferric sulfate. Elsevier, 2024. https://doi.org/10.1016/j.mineng.2024.108913.
Ramírez del Amo, P., Iglesias González, M. N. and Dorado, A. D. (2024) Modeling copper leaching from non-pulverized printed circuit boards at high concentrations of bioregenerated ferric sulfate. Elsevier. Available at: https://doi.org/10.1016/j.mineng.2024.108913.
P. Ramírez del Amo, M. N. Iglesias González, and A. D. Dorado, “Modeling copper leaching from non-pulverized printed circuit boards at high concentrations of bioregenerated ferric sulfate,” Elsevier, 2024, doi: 10.1016/j.mineng.2024.108913.
@misc{ramirezdelamo2024modeling,
author = {Ramírez del Amo, Pablo and Iglesias González, María Nieves and Dorado, Antonio D.},
title = {Modeling copper leaching from non-pulverized printed circuit boards at high concentrations of bioregenerated ferric sulfate},
year = {2024},
publisher = {Elsevier},
doi = {10.1016/j.mineng.2024.108913},
url = {https://doi.org/10.1016/j.mineng.2024.108913}
}
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