Citations refer to the original publication, not to a Scieee localized version.
Trevisi, M., Akbari, A., Trocan, M., Rodríguez Vázquez, Á. B., & Carmona Galán, R. (2020). Compressive Imaging Using RIP-Compliant CMOS Imager Architecture and Landweber Reconstruction. Institute of Electrical and Electronics Engineers. https://doi.org/10.1109/TCSVT.2019.2892178
Trevisi, Marco, et al. Compressive Imaging Using RIP-Compliant CMOS Imager Architecture and Landweber Reconstruction. Institute of Electrical and Electronics Engineers, 2020. https://doi.org/10.1109/TCSVT.2019.2892178.
Trevisi, Marco, Ali Akbari, Maria Trocan, Ángel Benito Rodríguez Vázquez, and Ricardo Carmona Galán. Compressive Imaging Using RIP-Compliant CMOS Imager Architecture and Landweber Reconstruction. Institute of Electrical and Electronics Engineers, 2020. https://doi.org/10.1109/TCSVT.2019.2892178.
Trevisi, M. et al. (2020) Compressive Imaging Using RIP-Compliant CMOS Imager Architecture and Landweber Reconstruction. Institute of Electrical and Electronics Engineers. Available at: https://doi.org/10.1109/TCSVT.2019.2892178.
M. Trevisi, A. Akbari, M. Trocan, Á. B. Rodríguez Vázquez, and R. Carmona Galán, “Compressive Imaging Using RIP-Compliant CMOS Imager Architecture and Landweber Reconstruction,” Institute of Electrical and Electronics Engineers, 2020, doi: 10.1109/TCSVT.2019.2892178.
@misc{trevisi2020compressive,
author = {Trevisi, Marco and Akbari, Ali and Trocan, Maria and Rodríguez Vázquez, Ángel Benito and Carmona Galán, Ricardo},
title = {Compressive Imaging Using RIP-Compliant CMOS Imager Architecture and Landweber Reconstruction},
year = {2020},
publisher = {Institute of Electrical and Electronics Engineers},
doi = {10.1109/TCSVT.2019.2892178},
url = {https://doi.org/10.1109/TCSVT.2019.2892178}
}
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