Recei ed: 13 Feb ua y 2025
Accep ed: 16 Feb ua y 2025
Published: 11 Ma ch 2025
Ci a ion: To es, Y.; Bel án, A.M.;
Felix, M. Scien i ic Ad ances in STEM:
Syne gies o Achie e Success
(Volume 3). Appl. Sci. 2025,15, 3030.
h ps://doi.o g/10.3390/
app15063030
Copy igh : © 2025 by he au ho s.
Licensee MDPI, Basel, Swi ze land.
This a icle is an open access a icle
dis ibu ed unde he e ms and
condi ions o he C ea i e Commons
A ibu ion (CC BY) license
(h ps://c ea i ecommons.o g/
licenses/by/4.0/).
Edi o ial
Scien i ic Ad ances in STEM: Syne gies o Achie e Success
(Volume 3)
Yadi To es 1,* , Ana M. Bel án 1and Manuel Felix 2
1Depa amen o de Ingenie ía y Ciencia de los Ma e iales y del T anspo e, Escuela Poli écnica Supe io ,
Uni e sidad de Se illa (US), 41011 Se ille, Spain; [email p o ec ed]
2Depa amen o de Ingenie ía Química, Escuela Poli écnica Supe io , Uni e sidad de Se illa (US),
41011 Se ille, Spain; [email p o ec ed]
*Co espondence: y o [email p o ec ed]
1. In oduc ion
“Scien i ic Ad ances in STEM: Syne gies o Achie e Success, Volume 3” emphasizes
he impo ance o in e disciplina y collabo a ion in Science, Technology, Enginee ing, and
Ma hema ics (STEM) o d i ing inno a ion and socie al bene i s. I explo es ad anced
ma e ials, echnologies, and hei ans o ma i e impac on indus ies, medicine, ag icul-
u e, and sus ainabili y. This olume add esses challenges like clima e change and esou ce
managemen wi h inno a i e solu ions, emphasizing he in eg a ion o di e se knowledge
o ackle global issues. By add essing collabo a i e e o s in compu ing, a i icial in elli-
gence, and en i onmen al science, i highligh s he in e connec ions o STEM disciplines,
inspi ing eade s o alue esea ch o no el disco e ies and p ac ical applica ions.
2. O e iew o he Published A icles
This collec ion demons a es c i ical ad ancemen s in a ious STEM ields, including
a machine lea ning amewo k o moni o machining p ocesses, enhancing e iciency and
educing indus ial cos s [
1
]. In ela ion o esea ch abou hea ans e imp o emen s
h ough nano luids, subsequen ly showcasing signi ican ad ancemen s in cooling sys-
ems and ene gy echnologies [
2
]. Inno a ions in ma e ial science a e also highligh ed,
analyzing he mechanical p ope ies o ad anced s uc u al ma e ials o ae ospace and
ci il enginee ing applica ions [
3
]. Biocompa ibili y and biomedical inno a ions a e also
add essed [
4
], emphasizing 3D-p in ed nanocomposi es o medical implan s, issue en-
ginee ing and o mabili y in medical-g ade polyme s [
5
], and polyme cu ing in den al
applica ions [
6
]. En i onmen al sus ainabili y is explo ed [
7
], ocusing on biodeg adable
polyme s de i ed om in asi e seaweed species; he e alua ion o ood p ese a ion
echniques using cassa a-based edible ilms is also analyzed [
8
]. Ad ances in s uc u al
enginee ing a e add essed [
9
], analyzing he mechanical pe o mance o injec ion-molded
ca bon ibe composi es.
Indus ial applica ions a e also co e ed [
10
,
11
], whe e chlo ide pe meabili y in alkali-
ac i a ed slag conc e es unde high empe a u es and he eco e y o an imony om
indus ial was e a e in es iga ed. Ha dwa e and senso implemen a ion a e also add essed
in his collec ion [
12
,
13
]. Thus, hype spec al imaging o ag icul u al moni o ing, Field P o-
g amable Ga e A ay (FPGA)-based c yp oha dwa e p o ec ion, ad ancing cybe secu i y,
and ad ances in wea able senso echnologies o heal h moni o ing a e epo ed.
These wo ks illus a e he in eg a ion o esea ch ac oss disciplines o add ess global
challenges and d i e inno a ion.
Appl. Sci. 2025,15, 3030 h ps://doi.o g/10.3390/app15063030
Appl. Sci. 2025,15, 3030 2 o 2
Au ho Con ibu ions: The au ho s equally con ibu ed o he pape . All au ho s ha e ead and
ag eed o he published e sion o he manusc ip .
Con lic s o In e es : The au ho s decla e no con lic s o in e es .
Re e ences
1.
Ga ilo i´c, T.; Despo o i´c, V.; Zo , M.-I.; T umi´c, M.S. P edic ion o Flo a ion Deinking Pe o mance: A Compa a i e Analysis o
Machine Lea ning Techniques. Appl. Sci. 2024,14, 8990. [C ossRe ]
2.
Zou, F.; Yao, S. Mul i-Objec i e Op imiza ion o C ashwo hiness o Sh ink Tube Ene gy Abso p ion S uc u e. Appl. Sci. 2024,
14, 7347. [C ossRe ]
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Ho igon, B.; Rod iguez-Mayo ga, E.; San iago-Espinal, J.A.; Ancio, F.; Galla do, J.M. In luence o Ma e ials o Moulds and
Geome y o Specimens on Mechanical P ope ies o G ou s Based on Ul a ine Hyd aulic Binde . Ma e ials 2024,17, 1645.
[C ossRe ] [PubMed]
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Rosa-Sainz, A.; Sil a, M.B.; Bel án, A.M.; Cen eno, G.; Vallellano, C. Assessing Fo mabili y and Failu e o UHMWPE Shee s
h ough SPIF: A Case S udy in Medical Applica ions. Polyme s 2023,15, 3560. [C ossRe ] [PubMed]
6.
Díaz-Rod íguez, S.D.; Ta ano-A igas, O.; He e a-Kao, W.; Cauich-Rod íguez, J.V.; Ce an es-Uc, J.M.; Rosa-Sainz, A.; La Se na,
A.A.; Ve anes-Pan oja, Y. E ec o he Silaniza ion o Ae osil OX50 in he P ope ies o Ligh -Cu ed Den al Composi es. Appl. Sci.
2024,14, 2453. [C ossRe ]
7.
San ana, I.; Felix, M.; Bengoechea, C. Feasibili y o In asi e B own Seaweed Rugulop e yx okamu ae as Sou ce o Algina e:
Cha ac e iza ion o P oduc s and E alua ion o De i ed Gels. Polyme s 2024,16, 702. [C ossRe ] [PubMed]
8.
O álo a González, C.M.; Felix, M.; Bengoechea, C.; Flo es, S.; Ge schenson, L.N. De elopmen and Cha ac e iza ion o Edible
Films Based on Cassa a S a ch Modi ied by Co ona T ea men . Foods 2024,13, 468. [C ossRe ] [PubMed]
9.
Wang, X.; Bao, Z.; Gao, D.; Huang, S.; Huang, L.; Chen, Q.; Zhao, H.; Han, W.; Xu, Y. Mechanical P ope ies o Weld Lines in
Injec ion-Molded Ca bon Fibe -Rein o ced Nylon (PA-CF) Composi es. Polyme s 2023,15, 2476. [C ossRe ] [PubMed]
10.
Zhou, B.; Ma, Q.; Guo, R.; Li, P. Chlo ide Pe meabili y o Alkali-Ac i a ed Slag Conc e es a e Exposu e o High Tempe a u es.
Ma e ials 2024,17, 1028. [C ossRe ] [PubMed]
11.
Díaz Gu ié ez, E.; Maldonado Cal o, J.A.; Galla do Fuen es, J.M.; Paúl Escolano, A. E ec o pH Hyd olysis on he Reco e y o
An imony om Spen Elec oly es om Coppe P oduc ion. Ma e ials 2023,16, 3918. [C ossRe ] [PubMed]
12.
Domínguez-Cid, S.; La ios, D.F.; Ba bancho, J.; Molina, F.J.; Gue a, J.A.; León, C. Iden i ica ion o Oli es Using In-Field
Hype spec al Imaging wi h Ligh weigh Models. Senso s 2024,24, 1370. [C ossRe ] [PubMed]
13.
Po es ad-O dóñez, F.E.; Casado-Galán, A.; Tena-Sánchez, E. P o ec ing FPGA-Based C yp oha dwa e Implemen a ions om
Faul A acks Using ADCs. Senso s 2024,24, 1598. [C ossRe ] [PubMed]
Disclaime /Publishe ’s No e: The s a emen s, opinions and da a con ained in all publica ions a e solely hose o he indi idual
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people o p ope y esul ing om any ideas, me hods, ins uc ions o p oduc s e e ed o in he con en .
