S ony B ook Uni e si y (CFNS)CPAD
P oduc ion o Vessel and Mi o s
o he p RICH De ec o
a he Elec on-Ion-Collide
C-J. Naïm
Coo dina ing Panel on Ad anced De ec o s (CPAD)
Oc obe , 9, 2025
S ony B ook Uni e si y (CFNS)CPAD 1
•A compac cen al de ec o wi h se e al subsys ems"
•He me ic co e age: –3.5 < η < 3.5 ( acking, calo ime y, pa icle iden i ica ion)
p/A
e
p RICH subsys em in backwa d egion
The ePIC de ec o a he EIC
S ony B ook Uni e si y (CFNS)CPAD 2
Physics Mo i a ions a he EIC
e−
h
•Semi-Inclusi e Deep Inelas ic Sca e ing
•P oduc ion o had ons in inal-s a e"
•P o ide in o ma ion on: "
he agmen a ion p ocess (had oniza ion)
he had onic s uc u e
→
→
p/A
Pa icle Iden i ica ion de ec o s a e c ucial
S ony B ook Uni e si y (CFNS)CPAD 3
p
K
π
The p RICH Concep
e−
p/A
θc∼θ2
sa −
1
n
m2
p2
θc
Pa icle Iden i ica ion
•Cha ged pa icle → emi s Che enko pho ons a angle
•Pho ons p ojec on o pho ode ec o s → o m a ing
Ring adius
•Measu ing ing size → deduce → pa icle mass
θc
→
∝ an θc
θc
De ec ion P inciple
The p RICH will p o ide > 3σ π/K sepa a ions o
momen um up o 7 GeV/c o –3.5 < η < -1.5
S ony B ook Uni e si y (CFNS)CPAD 4
The p RICH Design Summa y
Ae ogel
•Th ee adial bands
•Opaque di ide s
•2.5 cm hick, 42 iles o al
Vessel
• Ligh weigh s uc u e
• Rein o ced ca bon ibe and 3D
p in ed ma e ials
• Filled wi h ni ogen
HRPPD pho osenso s
• 120 mm size
• Tiled wi h a 3.0 mm gap
• 68 senso s o al
Mi o s
•Cylind ical and
conical geome ies
•La ge accep ance
•High e lec i i y
S ony B ook Uni e si y (CFNS)CPAD 5
p RICH
An In e na ional Task Fo ce
S ony B ook Uni e si y (CFNS)CPAD 6
Vessel Componen s and Fab ica ion
Vessel consis s o
• Cylind ical body (S ony B ook)
Ca bon- ibe sandwich s uc u e
→ ligh weigh , gas- and ligh - igh
• Rein o cing end- ings (Pu due)
Machined ca bon- ibe end- ings
→ s abili y & senso /ae ogel moun ing
• Senso plane (Pu due)
• Ae ogel wall (Pu due)
Objec i e: build a cylind ical essel
Vessel
End- ings
Senso
S ony B ook Uni e si y (CFNS)CPAD 7
Mand el Assembly o he Vessel
S ony B ook Uni e si y (CFNS)CPAD 8
Mand el Machining o he Vessel
Foam Machining Sys em
•Cu ing uses a la he-like se up wi h a o a ing bi , d i en by 3 mo o s"
Milling - Linea - Ro a y mo o s "
1. End mill moun ed on a mo o ized mic ome e s age → p ecise dep h con ol
2. Lead sc ew mo o mo es he s age ho izon ally"
3. Mand el mo o o a es he oam
S ony B ook Uni e si y (CFNS)CPAD 16
p RICH Mi o Re lec i i y
Cu off by ac ylic il e below 300 nm
Coa ing mix u e (sample)
•28: C = 4.033 kA ; Al = 17.058 kA
•47: C = 5.006 kA ; Al = 20.009 kA
•48: C = 1.997 kA ; Al = 8.048 kA
Cu ed mi o de elopmen
s ill ongoing
→
Capabili y o each 90% e lec i i y
Objec i e: Mi o s wi h high e lec i i y
( 90% o e 300–600 nm)
∼
S ony B ook Uni e si y (CFNS)CPAD 17
Conclusion
• Had on ID is c ucial o many EIC physics goals
→ p o ided in elec on-going di ec ion by p RICH
• Ca bon- ibe essel minimizes ma e ial budge
→ i s enginee ing p o o ype comple ed
• Mi o de elopmen wi h high e lec i i y unde way a SBU
p
e−
p/A
K
π
