9.24.3
New Elec omagne ic In e e ence
Shielding Ma e ials: Biocha s,
Sca olds, Ra e Ea h, and Fe i e-
Based Ma e ials
D agana Ma inko ić, Slađana Do on ić, Dejan Kepić, Kamel Haddadi, Muhammad Yasi , Blaž Na din
and S e lana Jo ano ić
Special Issue
Ad anced Nanoma e ials o Elec omagne ic Shielding and Abso p ion Applica ions
Edi ed by
D . Mingxing Piao and D . Yenan Song
Re iew
h ps://doi.o g/10.3390/nano15070541
Academic Edi o s: Mingxing Piao and
Yenan Song
Recei ed: 7 Ma ch 2025
Re ised: 30 Ma ch 2025
Accep ed: 31 Ma ch 2025
Published: 2 Ap il 2025
Ci a ion: Ma inko i´c, D.; Do on i´c,
S.; Kepi´c, D.; Haddadi, K.; Yasi , M.;
Na din, B.; Jo ano i´c, S. New
Elec omagne ic In e e ence
Shielding Ma e ials: Biocha s,
Sca olds, Ra e Ea h, and Fe i e-
Based Ma e ials. Nanoma e ials 2025,
15, 541. h ps://doi.o g/10.3390/
nano15070541
Copy igh : © 2025 by he au ho s.
Licensee MDPI, Basel, Swi ze land.
This a icle is an open access a icle
dis ibu ed unde he e ms and
condi ions o he C ea i e Commons
A ibu ion (CC BY) license
(h ps://c ea i ecommons.o g/
licenses/by/4.0/).
Re iew
New Elec omagne ic In e e ence Shielding Ma e ials: Biocha s,
Sca olds, Ra e Ea h, and Fe i e-Based Ma e ials
D agana Ma inko i´c 1,*, Sla ¯
dana Do on i´c 1, Dejan Kepi´c 1, Kamel Haddadi 2, Muhammad Yasi 3,
Blaž Na din 4and S e lana Jo ano i´c 1,*
1Vinˇca Ins i u e o Nuclea Sciences, Na ional Ins i u e o he Republic o Se bia, Uni e si y o Belg ade,
P.O. Box 522, 11001 Belg ade, Se bia; [email p o ec ed] (S.D.); [email p o ec ed] (D.K.)
2Uni e si y o Lille, CNRS, Cen ale Lille, Uni e si y Poly echnique Hau s-de-F ance, UMR
8520-IEMN-Ins i u d’Elec onique de Mic oélec onique e de Nano echnologie–Lille,
59650 Villeneu e-d’Ascq, F ance; [email p o ec ed]
3Depa men o Compu e Science, Di ision o Mic o obo ics and Con ol Enginee ing, Uni e si y o
Oldenbu g, Amme lände Hee s aße 114-118, 26129 Oldenbu g, Ge many;
[email p o ec ed]
4Facul y o Polyme Technology, Oza e 19, 2380 Slo enj G adec, Slo enia; blaz.na [email p o ec ed]
*Co espondence: [email p o ec ed] (D.M.); [email p o ec ed] (S.J.)
Abs ac : In his e iew, a comp ehensi e sys ema ic s udy o he esea ch backg ound,
de elopmen s, classi ica ion, ends, and ad ances o e he pas ew yea s in esea ch on
new elec omagne ic in e e ence (EMI) shielding ma e ials will be desc ibed. The ollowing
g oups o new ma e ials o EMI shielding will be discussed: biocha s, sca olds, a e ea h,
and e i e-based ma e ials. We selec ed wo no el, o ganic, ligh weigh ma e ials (biocha s
and sca olds) and compa ed hei shielding e ec i eness o ino ganic ma e ials ( e i e and
a e ea h ma e ials). This a icle will b oadly discuss he EMI shielding pe o mance, he
basic p inciples o EMI shielding, he p epa a ion me hods o selec ed ma e ials, and hei
applica ion p ospec s. Biocha s a e p omising, eco- iendly, sus ainable, and enewable
ma e ials ha can be po en ially used as a il e in polyme composi es o EMI shielding,
along wi h sca olds. Sca olds a e new-gene a ion, easy- o-manu ac u e ma e ials wi h
excellen EMI shielding pe o mance. Ra e ea h (RE) plays an impo an ole in de eloping
high-pe o mance elec omagne ic wa e abso p ion ma e ials due o he unique elec onic
shell con igu a ions and highe ionic adii o RE elemen s. Fe i e-based ma e ials a e o en
combined wi h o he componen s o achie e enhanced EMI shielding, mechanical s eng h,
and elec ical and he mal conduc i i y. Finally, he cu en challenges and u u e ou look
o new EMI shielding ma e ials will be highligh ed in he hope o ob aining guidelines o
hei u u e de elopmen and applica ion.
Keywo ds: EMI shielding ma e ials; mechanisms o EMI shielding; biocha s; sca olds; a e
ea h; e i e-based ma e ials
1. In oduc ion
The human popula ion in u ban and u al egions is exposed o non-ionizing elec o-
magne ic ields (EMFs) due o he apid de elopmen o elecommunica ion echnology
and digi al sys ems o in o ma ion ans e [
1
,
2
]. The associa ion o he i h gene a ion
(5G) and upcoming six h gene a ion (6G) will lead o he eme gence o inno a i e applica-
ions (In e ne o Things and sel -d i ing ehicles) [
3
,
4
]. Wea able and po able elec onics
will soon become mo e commonly used [
4
]. The COVID-19 pandemic igge ed he im-
plemen a ion o echnology ends such as digi al paymen s, elemedicine, and obo ics,
Nanoma e ials 2025,15, 541 h ps://doi.o g/10.3390/nano15070541
Nanoma e ials 2025,15, 541 2 o 24
which use adio equency (RF) elec omagne ic wa es (EMWs) in he 100 kHz–300 GHz
equency ange [
5
]. These echnological ad ances caused an inc ease in a i icial sou ces
o EMF and esul ed in he ch onic exposu e o people and he en i onmen , c ea ing
elec omagne ic pollu ion. Elec omagne ic pollu ion is he con inuous and uncon olled
exposu e o elec omagne ic ields om any emi ing sou ce o he EMF spec um [
5
]. F om
1950 o 2010, he le els o exposu e o RF-EMF ha e inc eased om ex emely low na u al
le els by abou 1018 imes [
6
]. Many s udies ha e shown he ha m ul e ec s o EMF on
human heal h [
7
–
11
] and he en i onmen [
12
–
15
]. In addi ion o he po en ial heal h
isks, he in e e ence o EMW wo sens hea accumula ion, signi ican ly sho ening equip-
men li espan [
16
]. Thus, new elec omagne ic in e e ence (EMI) shielding ma e ials a e
u gen ly needed.
The con en ional EMI shielding ma e ials a e me als, ca bons, ce amics, cemen , con-
duc i e polyme s, and associa ed composi es. Me als and ca bons a e he mos unc ional
ma e ials due o hei high conduc i i y, while ce amics, cemen , and (non-conduc i e)
polyme s a e less e icien unless combined wi h unc ional componen s/ma e ials [
17
,
18
].
Shielding ba ie s should mee he equi ed dimensions and shapes a he lowes possible
cos o a ious applica ions.
Among he a ious new ma e ials, o ganic ma e ials such as g aphene, ca bon black,
and ca bon nano ubes a e highly conduc ing, ligh weigh , lexible, and highly e icien EMI
shielding ma e ials. S ill, hei high p ice and he complexi y o p oduc ion and pu i ica ion
lead o high cos and limi hei use. Ino ganic ma e ials, such as me al powde s and me al
oxides, a e highly e icien EMI shielding ma e ials due o hei high elec ical conduc i i y
accompanied by magne ic pe meabili y. Challenges in hei applica ion a e associa ed
wi h hei high p ices, chemical ins abili y, co osion, and hea y weigh . Thus, in his
e iew pape , we a e ocusing on new, sui able, low-cos o ganic ma e ials—biocha s and
sca olds. These o ganic EMI shielding ma e ials a e compa ed o no el ino ganic shielding
ma e ials— a e ea h and e i e-based composi es. By e iewing hei p oduc ion me hods,
yields, physico-chemical p ope ies, and EMI shielding e ec i eness, he u u e di ec ion
in he de elopmen o EMI shielding ma e ials is es ima ed.
Acco ding o he e iewed li e a u e, biocha s a e p omising, eco- iendly, sus ainable,
and enewable ma e ials ha can po en ially be used as il e s in polyme composi es
o EMI shielding applica ions in elec onic de ices and cons uc ion ma e ials. P e ious
esea ch showed ha sca olds a e new-gene a ion, easy- o-manu ac u e ma e ials wi h
excellen EMI shielding pe o mance.
Recen ly, g ea a en ion has been paid o adi ional magne ic ma e ials/alloys wi h
excellen abso p ion o EMWs, bu hey a e o en limi ed by hickness and ange o use.
Howe e , acco ding o Snoek’s limi , whe e he di ec cu en (DC) suscep ibili y and he
cu -o equency a e cons an , he pe meabili y alue dec eases in he high- equency
ange, which leads o an appa en dec ease in magne ic loss capabili y [
19
–
21
]. Imp o ing
he pe meabili y and magne ic loss o magne ic ma e ials/alloys a high equencies is
c ucial o ob aining good elec omagne ic/mic owa e abso p ion p ope ies [
22
]. I was
shown ha he elec onic s uc u e and well-chosen me hods o designing magne ic
ma e ials/alloys can imp o e magne ism a high equencies [23].
The e o e, magne ic me al oxide composi es o pe o ski e oxides doped wi h a e
ea h elemen ions ha e been in de elopmen o he las ew yea s due o hei speci ic
s uc u es, in e acial pola iza ion, mul iple e lec ions, and excellen conduc ing and EMI
shielding p ope ies [24].
Nanoma e ials 2025,15, 541 3 o 24
Ra e ea h ma e ials a e o en cha ac e ized by a ious names, such as a e ea h
elemen s (REEs), a e ea h me als (REMs), a e ea h oxides, o y ium-based a e
ea h ma e ial. This g oup ep esen s a se o 17 chemical elemen s, as lis ed in he
pe iodic able, om lan hanum (La) o lu e ium (Lu), including 15 lan hanides and
scandium (Sc) and y ium (Y) wi h a endency o occu in he same co e deposi s
as lan hanides and exhibi ing iden ical chemical p ope ies [
25
]. In he c ys al s uc-
u e, REEs a e mos o en ound in he i alen s a e (RE
3+
), al hough he di alen
s a e (RE
2+
) is also possible. REEs wi h s ong in e -elec on in e ac ions wi h hei
localized 3d and 4 elec ons as well as s ong coupling wi h magne ic ma e ials
ha e eme ged as ou s anding ma e ial dopan s [
26
]. REEs based on neodymium
(Nd), dysp osium (Dy), and sama ium (Sm), due o hei ela i ely la ge numbe o
unpai ed elec ons in he a omic s uc u e, possess a high emanen magne iza ion
and coe ci i y alue de e mining he s abili y o he emanen s a e. The o bi al
elec on s uc u e o hese elemen s con ains many unpai ed elec ons, which al-
lows hem o s o e la ge amoun s o magne ic ene gy. The o al magne ic momen
o igina es om hese unpai ed elec ons [
27
,
28
]. The e iewed li e a u e e ealed
he g owing in e es in a e-ea h-based ma e ials as ma e ials o EMI shielding
applica ions [
29
,
30
]. These ma e ials can be classi ied in o se e al g oups: RE-doped
e i es (RE-Fs), F
2
O
3
/Fe
3
O
4
, RE– ansi ion me al in e me allics (RETMIs), RE ox-
ides (REOs), RE-based alloys, RE spinels, RE-doped MoS
2
, and RE polyme s. The
abo e-men ioned g oups o a e-ea h-based ma e ials will be discussed in de ail
h oughou his manusc ip . The main ad an ages o a e-ea h-based ma e ials o e
adi ional EMI shielding ma e ials a e he magne o-dielec ic e ec s and unable
dielec ic p ope ies in an elec ic o magne ic ield. These p ope ies make hem
a ac i e o explo ing hei EMI shielding applica ions.
New nanocomposi e-based oams and he e ogeneous laye ed s uc u es ha e shown
ou s anding EMI shielding p ope ies. Namely, he moplas ic polye he -block-amide
elas ome beads coa ed wi h Ti
3
C
2
T
x
showed an EMI shielding e iciency o 44 dB a
8.5–12.5 GHz [29]
, mic ocellula a amid nano ibe /Ti
3
C
2
T
x
MXene oams eached a alue
o 64.9 dB [
30
], and oams based on he conduc i e polyme polypy ole wi h Fe
3
O
4
achie ed a alue o 41.1 dB [
31
]. Combining MXenes wi h ca bon nano ubes and sil e
nanowi es in a laye -by-laye a chi ec u e, Zhang e al. achie ed an EMI shielding e iciency
o 53.1 dB in he X-band [32].
The de elopmen , classi ica ion, ends, and ad ancemen s o esea ch on no el
shielding ma e ials in elec omagne ic i adia ion du ing he pas ew yea s will be
ho oughly and me hodically e iewed he ein. The ecen p og ess in he de elopmen
o new-gene a ion shielding ma e ials based on biocha s, 3D ne wo k s uc u es ( e e ed
o as sca olds in he ollowing), ma e ials wi h a e ea h ( e e ed o as a e-ea h-based
ma e ials in he ollowing), and e i e ma e ials will be desc ibed (Figu e 1). This
pape will comp ehensi ely discuss he EMI shielding pe o mance, basic p inciples and
mechanisms, p epa a ion me hods, s uc u e, mo phology, and applica ion p ospec s o
hese ma e ials.
Nanoma e ials 2025,15, 541 4 o 24
ff
ff
ffi
Figu e 1. Schema ic ep esen a ion o new shielding ma e ials based on biocha s, sca olds, a e
ea h, and e i e ma e ials discussed in his e iew. Pa o Figu e 1(lowe , le pa ) is adap ed om
e e ence [33].
2. New EMI Shielding Ma e ials: Biocha s, Sca olds, Ra e Ea h, and
Fe i e-Based Ma e ials
2.1. Biocha as EMI Shielding Ma e ial
Among con en ional EMI shielding ma e ials, me als such as Cu, Ag, Al, e c., a e
highly e icien EMI shielding ma e ials due o hei elec ical conduc i i y and abili y o
e lec inciden EMWs [
16
]. Rega dless, he use o hese me als is limi ed owing o hei
high densi y, incon enien p ocessing, and poo esis ance o co osion [
16
]. Recen ly,
shielding ma e ials ha e been in es iga ed in he o m o composi es wi h plas ic o me als
as subs a es [
34
]. As al e na i e solu ions, conduc i e polyme -based composi es, po ous
conduc i e oams, and polyme s wi h mic o- and nanoscale il e s such as ca bon ma e ial
(g aphi e, g aphene, educed g aphene oxide, ca bon nano ubes), MXenes, me al nanopa -
icles, and nanowi es ha e been explo ed due o hei low mass densi ies, good lexibili y,
and s e chabili y [4,35].
One o he la es app oaches in de eloping new, sus ainable, and eco- iendly solu ions
o EMI shielding is he in eg a ion o na u al, enewable ca bon ma e ials—biocha s—in o
polyme s [
4
]. Biocha s o igina e om a ious biomass sou ces, such as bamboo, suga cane,
and co k. To c ea e biocha s om biomass, biomass esou ces a e con e ed o ca bon
ma e ials by py oly ic p ocesses in an oxygen-limi ed en i onmen . A schema ic p esen-
a ion o biocha s a ing ma e ials and p oduc ion s eps is displayed in Figu e 2. A e
high- empe a u e ca boniza ion, biocha s show ex ao dina y ha dness, excellen he mal
s abili y, and high elec ical conduc i i y, making hem sui able ille s o polyme s [
36
]. By
combining biocha s and polyme s, he mechanical, physical, and elec ical p ope ies o
bo h ma e ials can be upg aded success ully.
Nanoma e ials 2025,15, 541 5 o 24
ff
ff
ff
Figu e 2. Di e en s a ing ma e ials (Ricinus communis ou e shell, bamboo, wood, apple, and quince
s illage, oli e ee p uning, eucalyp us) in biocha p oduc ion, a a ious empe a u es, usually in
an oxygen-con olled a mosphe e, lead o he p oduc ion o po ous ma e ials wi h domains wi h
g aphene and amo phous ca bon.
The elec ical conduc i i y o biocha is closely ela ed o he sou ce p ope ies and
ca boniza ion condi ions [
37
]. Ne e heless, some esea che s ha e dis ega ded he elec i-
cal p ope ies o biocha s, so hei po en ial applica ion in EMI shielding has a ely been
examined [38–40].
In 2018, Li e al. conduc ed an ini ial esea ch s udy [
39
]. Namely, hey used comme -
cially a ailable bamboo cha coal as he biocha ille and/o an ul a-high-molecula -weigh
polye hylene (UHMWPE)/linea low-densi y polye hylene (LLDPE) blend as a po en ial
EMI shielding composi e. The composi e wi h 80 w .% o biocha was ab ica ed using he
mass-p oducing ex usion and ho comp ession me hods. Th ough he ca boniza ion o
bamboo cha coal a 1100
◦
C, a g aphi ic-like s uc u e wi h good elec ical conduc i i y and
a high speci ic su ace a ea was ob ained. Namely, an elec ical conduc i i y o 107.6 S/m
and EMI shielding e ec i i y (SE) o 48.7 dB we e measu ed a 1.5 GHz. The speci ic EMI
SE o he composi e was 39.0 dB cm
3
/g. This alue is ou imes highe han he speci ic
EMI SE o coppe (10.0 dB cm3/g) [41].
Tol anen e al. applied he same app oach o p epa e a biodeg adable wo- and h ee-
phase composi e o g aphi e, biocha de i ed om pine chips, and polylac ic acid (PLA) [
4
].
The EMI shielding pe o mances we e es ed in he K-band (18–26.5 GHz). The composi e
showed an ou s anding EMI SE o >32 dB when he ma e ials we e p epa ed in he o m
o a ilm wi h a hickness o 25
µ
m and a high speci ic shielding e ec i eness (SSE/ ) o
>890 dB cm
2
/g. I can be seen ha hese composi es a e con enien o he applica ion o
wea able/po able and s a iona y de ices.
Sho ly a e , Akgül e al. p esen ed a biocha –i on (BC-Fe) ma e ial ob ained by he
py olysis o indus ial ea was e biomass and he encapsula ion o BC-Fe in o polyme hyl
me hac yla e (PMMA) polyme [
42
]. Du ing syn hesis, Fe(III) ions p omo ed he g aphi i-
Nanoma e ials 2025,15, 541 6 o 24
za ion o he amo phous ca bon in biomass and con ibu ed o biocha su ace s abiliza ion.
The esul s o EMI SE measu emen s showed ha he e lec ion componen o he EMI SE
o pu e PMMA was nea
−
10 dB a equencies o 7.8 and 10.1 GHz, while i was educed
by ~60% when he con en o BC-Fe in he polyme was 40 w .% in he equency ange o
8.5–12.9 GHz.
Liang e al. success ully de eloped a mo a /b ick s uc u e using wood-de i ed
po ous ca bon (WPC) as a skele on and conduc i e 3D MXene ae ogel [
1
]. The MXene
ae ogel/WPC composi e was composed o highly o de ed honeycomb cells inside WPC
as a mic o eac o . He ein, a high g aphi iza ion le el o na u al wood was achie ed by
applying a high ca boniza ion empe a u e o 1500
◦
C. The MXene ae ogel/WPC composi e
showed an excellen EMI SE alue o 71.3 dB in a equency ange o be ween 8.5 GHz
and 12.5 GHz, while he sample densi y was only 0.197 g/cm
3
. In he s udy, a wall-like
mo a b ick s uc u e (WPC as mo a and MXene ae ogel as b ick) sol ed he ins abili y
o he MXene ae ogel ne wo k as well as p olonged he ansmission pa h o EM wa es,
dissipa ing he inciden EM wa es in he o m o hea and elec ical ene gy. The ma e ial’s
supe io EMI shielding pe o mance was achie ed hanks o a speci ic design.
The shielding e iciency o a gypsum–biocha d ywall-like composi e was in es iga ed
by Na alio e al. [
43
]. They used wooden chips and eucalyp us biocha and combined hem
wi h gypsum. An enhancemen in he shielding e iciency was eco ded wi h an inc eased
biocha con en in he composi es. Namely, he EMI SE alues o he d ywall-like pla es wi h
10%, 20%, and 40% w/wbiocha con en s we e 11.65
±
1.6, 19.2
±
5.7, and
19.25 ±1.8 dB
a a equency o 6 GHz. This in es iga ion con ibu es o expanding inno a i e bio-based
sus ainable ma e ials wi h EM shielding p ope ies in he mic owa e egion.
Sa i e al. used sewage sludge o ob ain biocha and in es iga ed i s EMI-shielding
ea u es [
44
,
45
]. The biocha was mixed wi h epoxy polyme (20 w %) and cas in o a ilm
4 mm hick. The composi e showed a p omising EMI SE o
−
10 dB [
44
]. Sa i e al. epo ed
an ou s anding elec ical conduc i i y o 300 S/m [
44
]. The same g oup compa ed he EMI
SE p ope ies o biocha p oduced om ca bonized sludge wi h g aphene nanopla ele s [
46
].
He ein, he au ho s p oduced polyme composi es wi h poly inylidene luo ide (PVDF),
while ille s (biocha and g aphene) we e added a 90 w %. The biocha –PVDF composi e
showed ansmission sca e ing o less han −30 dB.
Sa i e al. also s udied comme cial biocha p oduced om wood biomass o coa
se e al laye s o common building componen s, such as d ywall panels [
47
]. They eco ded
EMI SE alues o 17 dB a 1 GHz and 25 dB a 18 GHz. D ywall panels coa ed wi h
se e al laye s o biocha a e easy o ab ica e and a low-cos solu ion o ealize a p o ec ed
su ounding o heal hca e applica ions (chemo he apy and omog aphy) o minimize he
in ensi y o he EM ield close o elec onic equipmen . The same esea ch g oup p oduced
a cemen -based composi e wi h comme cial lignin-based biocha and poly inyl chlo ide
(PVC) [
48
]. They in oduced biocha powde in o cemen pas e o imp o e i s shielding
p ope ies. PVC, which was used as a ille , was ob ained by decommissioning old elec ical
cables ha would ha e ended up in a land ill. A combina ion o 10 w .% biocha and 6 w .%
PVC e ealed he bes shielding capaci y, a ound 16 dB in he 5.4–8 GHz equency ange.
This in es iga ion shows g ea impo ance in he EMI shielding applica ion and om he
aspec o he ci cula economy.
Miao e al. ab ica ed a conduc i e EBC@CNF@MWCNT composi e ae ogel by he
eeze-d ying p ocess, mixing e i e chlo ide wi h elec ically conduc i e bamboo cha coal
(EBC), wi h cellulose nano ib ils (CNFs) as a skele on and mul i-walled ca bon nano ubes
(MWCNTs) as a conduc i e enhance in he eeze-d ying p ocess [
36
]. A e wa d, he
ae ogel was soaked wi h polydime hylsiloxane and ho -p essed in o he memb ane. In he
composi e, EBC and MWCNTs we e a anged uni o mly in he CNF skele on o o m a 3D
Nanoma e ials 2025,15, 541 7 o 24
conduc ing ne wo k. The composi e displayed excep ional elec ical conduc i i y (47 S/m)
and a high EMI shielding e ec i eness o 39.5 dB, wi h an adso p ion loss o ~75%.
Recen ly, Nikolopoulus e al. used biocha p epa ed om oli e ee p uning o ab-
ica e composi e samples wi h ca bon black and poly e a luo oe hylene as binde s [
49
].
The EMI shielding capaci y was measu ed in he 1–3 GHz equency ange. The esul s
demons a ed ha he aw pu e biocha had a low EMI SE, be ween 1.5 and 4 dB, which
was enhanced wi h an inc ease in he hickness om 0.1 o 0.5 mm. On he con a y, he
composi e signi ican ly imp o ed he EMI SE, eaching a alue o 39 dB. This wo k indica es
ha biocha could be used as a basis o de eloping composi es wi h high EMI SE alues.
Milenko ic e al. ecen ly epo ed ha ag icul u al biowas e collec ed a e apple
and quince p ocessing could be con e ed in o EMI shielding ma e ial [
50
]. The s a ing
ma e ials we e chopped, homogenized, d ied, and mixed wi h an equal mass o KOH. The
mix u es we e ca bonized a 850
◦
C, unde ni ogen low. The esul ing biocha s we e
mixed wi h sodium silica e a 40 w .%. The ilm o only 0.2 mm hickness showed an
EMI SE o 15.5 dB in he 8–12 GHz equency ange. Al hough mode a e EMI SE alues
we e ound, he s udy demons a es he ou s anding po en ial o selec ed biowas e in he
p oduc ion o sus ainable EMI shielding ma e ials.
Ano he s udy by Pe umal e al. p oposed a new o ganic was e o biocha p oduc-
ion [
37
]. Wi hin he s udy, he composi e buil om Ricinus communis ou e shell-based
biocha and epoxy was ab ica ed by slow py olysis a 400–700
◦
C. The esul s showed ha
he biocha py olysis a 700
◦
C led o a maximal elec ical conduc i i y o 95 S/m due o
he p esence o g aphi ic ca bon. A maximum EMI SE o 26.5 dB was ound in he X-band
equency ange, a 40 w .% biocha o epoxy ma ix.
Acco ding o he e iewed li e a u e, biocha is a p omising, eco- iendly, sus ainable,
and enewable ma e ial ha could be used as a il e o EMI shielding applica ions in
elec onic de ices and cons uc ion ma e ials. The biocha shielding e ec i eness is associ-
a ed wi h he elec ically conduc i e g aphene egion in biocha s and po ous s uc u e [
50
].
Namely, EMW a enua ion is he esul o wa e e lec ion om he g aphene egion and
mul iple e lec ions inside he po es. Biocha ea u es ely on wo main ac o s:
(1)
The expe imen al condi ions ( empe a u e, du a ion o hea ing, addi ion o chemical
agen o po e o ma ion o ac i i a ion o g aphi iza ion, selec ed gas);
(2)
The s a ing ma e ial’s chemical composi ion [39].
Wi h an inc eased empe a u e, he po osi y, speci ic ee space, and ca bon con en
inc ease oo, while he selec ion o sou ce ma e ials a ec s bo h he p ope ies and yields o
he esul ing biocha [39].
2.2. Sca olds as EMI Shielding Ma e ial
Many s uc u al pa e ns, including highly po ous ma e ials and conduc i e s uc u es
such as mul ilaye composi es ob ained by s acking cellulose nano ibe s/ educed g aphene
oxide ( GO), GO ilms, and mul is age composi e oams, a e ecognized as excellen
EMI shielding ma e ials. These s uc u es a e ob ained using acuum-assis ed il a ion,
eeze-d ying echniques, o elec oless deposi ion [
51
]. The men ioned p ocedu es allow
o a educ ion in he e lec ion coe icien , bu hey a e complex and o en no eliable.
The inno a i e manu ac u ing echnologies imply 3D ne wo k s uc u es (sca olds) ha
can be deco a ed wi h me al nanopa icles [
52
], coa ed by polyme s, encapsula ed wi h
pa a in [
53
], e c. These app oaches enable design eedom, lexibili y, p ecise con ol o e
he shape and size, and he connec i i y o po ous s uc u es.
Cellulose sca olds (CSs) a e ecognized as a p omising ma e ial o EMI shielding ap-
plica ions due o he abili y o cellulose nano ibe s o imp o e he he mal and mechanical
ea u es o nanocomposi es. T an e al. ep esen ed a 3D ne wo k s uc u e o cellulose
Nanoma e ials 2025,15, 541 8 o 24
sca olds deco a ed wi h sil e nanopa icles (AgNPs) [
52
]. The sca olds we e il e ed a he
epoxy ma ix and cu ed a 40
◦
C o ix he nanopa icles. The ob ained composi e possesses
a he mal conduc i i y o 2.52 W/m/K, which is o e 11- old he he mal conduc i i y o
pu e epoxy. The ex emely high elec ical conduc i i y o 53.691 S/m caused a ema kable
SE alue o 69.1 dB. He e al. designed a sca old connec ed wi h me al nanopa icles [
53
].
In his wo k, he shape-s able composi e was composed o a pa a in imp egna ed in a
biological po ous ca bon sca old, ollowed by a coa ing wi h polyu e hane and Fe
3
O
4
nanopa icles. The biological po ous ca bon was ob ained om a loo ah sponge by imme -
sion in a phenolic esin solu ion ollowed by ca boniza ion. Scanning elec on mic oscopy
(SEM) esul s e ealed ha he sys em kep i s o iginal shape wi h a 3D and honeycomb-like
po ous s uc u e o single ibe s a e ca boniza ion. The polyu e hane coa ing p o ided
adequa e mechanical suppo and e ec i e leak-p oo pe o mance. The p oduced ame-
wo k shows s ong EMI shielding pe o mance (up o 32 dB). Ano he s udy based on he
encapsula ion o Fe
3
O
4
nanopa icles in ca bon sca olds was conduc ed by Wei e al. [
54
].
He ein, lamina cellulose-pape -based sca olds wi h bidi ec ional g adien dis ibu ed
Fe
3
O
4
nanopa icles we e cons uc ed ia imme sion, d ying, and ca boniza ion p ocesses.
The esul ing ca bon sca olds exhibi ed high in-plane elec ical conduc i i y (96.3 S/m)
and high shielding e iciency (1805.9 dB/cm2g).
A 3D cellulose sca old was combined wi h a CNT/MXene composi e [
55
]. Nanoshee s
o he composi e we e inse ed in o a cellulose sca old by acuum imp egna ion. Finally,
a hyd ophobic and mul i unc ional 3D sys em was p oduced by w apping i wi h poly
(dime hylsiloxane). The composi e had a high comp essi e s eng h o 1.53 MPa, a maxi-
mum s ain a ac u e o 74.1%, and an ou s anding SE (29.3 dB).
Hu e al. epo ed a dual-ice empla ing assembly s a egy o p epa e a dual-
in e pene a ed sca old [
56
]. The sca old was linked wi h a high-quali y g aphene a ay
and po ous MXene-Co ae ogel. I showed an abso p ion-domina ed EMI SE o 72.86 dB.
Th ee-dimensional-p in ing echnology was applied o sca old ab ica ion based on
a iply pe iodic minimal su ace and 70% po osi y [
42
]. The monoli hic laye ed dipping
me hod was used o egula e he g adien dis ibu ion o ca bon nano ubes on he 3D-
p in ed sca old su ace and ensu e in eg i y. This sys em blocked 99.9% o EM wa es. The
alue o he SE in his case was 35.9 dB.
P e ious esea ch showed ha sca olds a e new-gene a ion, easy- o-manu ac u e
ma e ials wi h excellen EMI shielding pe o mance. Due o hei excep ional h ee-
dimensional cons uc ion and inne ne wo k, hey show aniso opic he mal conduc i i y
and allow hea dissipa ion, making hem e icien EMI shielding ma e ials [
52
,
56
]. The
esul s om he li e a u e based on biocha and sca olds in shielding applica ions a e lis ed
in Table 1.
Table 1. Summa ized esul s o biocha and sca olds as EMI shielding ma e ials.
Ma e ial Rein o cemen and
Ma ix Thickness
EMI Shielding
E ec i eness F equency
Bamboo cha coal/HMWPE/LLDPE composi e 3 mm, 140 mm 48.7 dB 1500 MHz [39]
Pine chip/PLA composi e 0.25 mm >32 dB 18–26.5 GHz [4]
MXene ae ogel/WPC composi e 3 mm 71.3 dB 8.5–12.5 GHz [1]
Gypsum–biocha d ywall-like composi e >2 mm
11.65 ±1.6 dB, 19.2 ±5.7
dB, and 19.25 ±1.8 dB o
10, 20, and 40% w/w
biocha con en s
6 GHz [43]
Nanoma e ials 2025,15, 541 15 o 24
p epa e
α
-Fe
2
O
3
a e he mal decomposi ion and p ecipi a ion in he liquid phase. The
β
-phase o Fe
2
O
3
is me as able, and a empe a u es abo e 773 K, i con e s o he
α
-phase.
I can be ob ained by he he mal decomposi ion o i on (III) sal s. Simila o he
β
-phase,
γ
-Fe
2
O
3
is also me as able and con e s o he
α
-phase a high empe a u es [
114
]. I has a
cubic s uc u e, and in he bulk o m, i is e omagne ic, bu
γ
-Fe
2
O
3
nanopa icles less
han 10 nm in size show supe pa amagne ic beha io . The me hods o
γ
-Fe
2
O
3
p epa a ion
in ol e he he mal dehyd a ion o gamma i on (III) oxide-hyd oxide, he modes oxida ion
o
Fe3O4
, o he he mal decomposi ion o sui able i on sal s [
115
]. The
ε
-phase is hombic
wi h p ope ies be ween hose o he alpha and gamma phases. I is me as able wi h a
endency o ans o m o he alpha phase a empe a u es o be ween 773 and 1000 K. The
syn hesis o pu e
ε
-Fe
2
O
3
is challenging and in ol es he oxida ion o i on in an elec ic
a c o sol–gel p ecipi a ion om i on (III) ni a e [
116
]. In addi ion, an amo phous o m o
Fe2O3also exis s, which can be p epa ed unde high p essu e.
Oxides o i on ha e become in e es ing candida es o elec omagne ic in e e ence
(EMI) shielding due o se e al ac o s. Fe
2
O
3
is a magne ic ma e ial, while Fe
3
O
4
is a
e omagne ic. Magne ic ma e ials can in e ac wi h and abso b elec omagne ic wa es,
especially a lowe equencies (like adio wa es), hus educing EMI. I on oxides exhibi
a ce ain le el o elec ical conduc i i y, allowing hem o con ibu e o EMI shielding by
e lec ing o abso bing he elec ical componen s o elec omagne ic wa es. In addi ion,
hey can con ibu e o he abso p ion o elec omagne ic ene gy h ough dielec ic loss,
a mechanism ha in ol es con e ing elec omagne ic ene gy in o hea . This makes i
e ec i e in dissipa ing ene gy and p e en ing he ansmission o EMI. Finally, i on oxides
a e abundan , inexpensi e, and easy o combine in composi e ma e ials, such as polyme s
o ca bon-based ma e ials, and can main ain hei p ope ies o e ime.
Fo EMI shielding applica ions, i on oxides a e o en combined wi h o he ma e ials,
such as a ious polyme s, g aphene oxide, ca bon nano ubes, o simila , o achie e desi -
able EMI shielding, mechanical s eng h, and elec ical and he mal conduc i i y. Using an
in si u polyme iza ion echnique, Azadmanji i e al. c ea ed i on oxide and polypy ole
nanocomposi es and examined hei EMI shielding p ope ies in he 0.1–18 GHz equency
ange [
117
]. The composi es’ in ima e con ac be ween he conduc ing and magne ic phases
inc eased abso p ion by 10.10 dB a he ins umen ’s highes equency limi (17–18 GHz),
while i on oxide nanopa icles only inc eased he abso p ion by 2.6 dB. As he possible
cause o his imp o emen , hey p oposed a be e ma ch be ween dielec ic loss, magne ic
loss, and imp o ed dispe sion o he magne ic/conduc i e nanocomposi es in he ma ix.
Gup a e al. [
118
] epo ed ha he mic owa e shielding p ope ies we e a ec ed by he
a ious mo phologies o i on oxides. Using a wo-s ep sol–gel p ocess, hey p oduced a i-
ous e i e s uc u es, including cubes, ods, and lakes, co e ed wi h mul ilaye GO. Thei
EMI shielding capabili ies we e e alua ed in he Ku-band equency ange. In compa ison
o he lake- and cube-shaped i on oxides, he od-shaped i on oxide co e ed wi h GO
shee s had he highes shielding e iciency alue o ~33.30 dB (>99.9% a enua ion). This
esul ed om he combined e ec o magne ic and dielec ic losses. Aniso opy ene gy in
he composi es, eddy cu en e ec s, and na u al esonances we e he sou ces o magne ic
loss. The nano e i e pa icle con en o he composi e was he main cause o eddy cu en s
in he mic owa e anges. The su ace aniso opic ield would esul in highe aniso opy
ene gy o he small ma e ials due o he small-size e ec . The highe aniso opy ene gy
also con ibu ed o g ea e mic owa e abso p ion. Mo eo e , he magne ic i on oxide
was coa ed wi h an GO laye , which inc eased he in e aces and su ace pola iza ion
cha ges. In e acial pola iza ion is a signi ican pola iza ion p ocess, and he co esponding
elaxa ion will lead o a loss mechanism. One o he main causes o dielec ic loss could be
Nanoma e ials 2025,15, 541 16 o 24
in e acial pola iza ion. I is well known ha some hea ing-induced abso p ion losses a e
caused by he in e ac ion o su ace- o med molecula dipoles wi h he mic owa e ield.
Dhawan e al. c ea ed a conduc ing e imagne ic PANI nanocomposi e implan ed
wi h i anium dioxide (70–90 nm) and
γ
-Fe
2
O
3
(9–12 nm) nanopa icles using mic o-
emulsion polyme iza ion [
119
]. They disco e ed ha he high shielding e ec i eness
alue o
−
45 dB owing o abso p ion (SE
A
) was caused by dielec ic and magne ic losses
ha esul ed om he combined ac ion o
γ
-Fe
2
O
3
and TiO
2
. In con as , he SE
A
o PANI-
TiO
2
was a ound 22.4 dB, bu ha o PANI-
γ
-Fe
2
O
3
was app oxima ely 8.8 dB. In ano he
wo k, PANI ubes made o GO coa ed wi h
γ
-Fe
2
O
3
nanopa icles we e syn hesized and
cha ac e ized by Singh e al. [
120
]. The in e cala ed i on oxide nanopa icles we e p o-
duced by he mally b eaking down e ic ace yl ace ona e in a educing a mosphe e. The
β
-naph halene sulphonic acid-induced oxida i e polyme iza ion o aniline, which p o-
duced he co e–shell shape, was also used o enclose hose nanopa icles. A a hickness o
2.5 mm, he p esence o GO-
γ
-Fe
2
O
3
in he PANI co e s uc u es inc eased he composi e’s
in e acial pola iza ion and e ec i e aniso opy ene gy, which inc eased sca e ing and
p oduced a high shielding e iciency o abou 51 dB.
I on oxides a e equen ly combined wi h di e en ca bon nanoma e ials. The com-
posi e ma e ial can e ec i ely abso b, e lec , and dissipa e elec omagne ic adia ion o e
a wide equency ange by using he elec ical conduc i i y o ca bon nano ubes wi h he
magne ic quali ies o i on oxides. Fe
3
O
4
-nanopa icle-loaded unc ionalized mul i-walled
ca bon nano ubes we e p oduced by Bhaska a Rao e al. [
121
]. They disco e ed a high
o e all speci ic shielding e iciency o a ound 49.56 dB/(g cm
−3
), along wi h imp o ed
abso p ion (15.85 dB) and e lec ion (9.43 dB). Liu e al. [
122
] de eloped ilaye - ype lami-
na ed nanocomposi es wi h a ma ching laye o 15 w .% Fe
3
O
4
, an abso ben laye o 5 w .%
MWCNTs, and a e lec ing laye o 10 w .% MWCNTs. Thei esul s showed ha such
ilaye - ype lamina ed nanocomposi es ha e an excellen abili y o abso b mic owa es up
o 40 dB in he 13 GHz o 40 GHz equency ange. Fe o e ic oxide (Fe
3
O
4
) and MWCNTs
we e in eg a ed by Li e al. in o a co e–shell sys em made o high-densi y polye hylene
(HDPE), poly inylidene luo ide (PVDF), and polys y ene (PS) [
123
]. The composi e wi h
MWCNTs in he PS shell and Fe
3
O
4
in he PVDF ma ix had he highes SE, measu ing
25 dB a 9.5 GHz wi h 1 ol.% Fe
3
O
4
and 1 ol.% MWCNTs. The SE was o e 20 dB
h oughou he es ed equency ange (X-band). P asad e al. [
124
] de eloped a acile
wo-s ep hyd o he mal p ocess o he syn hesis o a MoS
2
– educed g aphene oxide/Fe
3
O
4
(MoS
2
- GO/Fe
3
O
4
) nanocomposi e and i s applica ion as an enhanced shielding ma e-
ial agains elec omagne ic in e e ence. The Fe
3
O
4
nanopa icles we e sphe ical and
e enly dis ibu ed h oughou he MoS
2
- GO composi e. The MoS
2
- GO/Fe
3
O
4
nanocom-
posi e was ound o be an ex emely e ec i e elec omagne ic shielding ma e ial in he
8.0–12.0 GHz
X-band, acco ding o an examina ion o i s elec omagne ic shielding e -
iciency. The MoS
2
- GO composi e showed low shielding pe o mance (SE
T
~3.81 dB)
compa ed o he MoS
2
- GO/Fe
3
O
4
nanocomposi e (SE
T
~8.27 dB). This was caused by
in e acial pola iza ion in he p esence o an elec omagne ic ield.
By he chemical oxida i e polyme iza ion o py ole, Sambyal e al. c ea ed a conduc -
ing polyme -based composi e encapsula ed wi h ba ium s on ium i ana e (BST), GO, and
Fe
3
O
4
nanopa icles [
125
]. Fille componen s in he conduc ing polyme ma ix p oduced
an abso p ion-domina ed shielding e iciency alue o 48 dB in he 8.2–12.4 GHz (X-band)
equency ange. Fu he mo e, he chemical and he mal s abili y o he composi e ma e ial
was enhanced by he use o magne ic and dielec ic ille s. By using a sel -assembly p ocess,
GO was also added o la ex coupled wi h magne ic i on oxide (Fe
3
O
4
) and lexible na u al
ubbe [
126
]. Compa ed o NRG composi es, Fe
3
O
4
enhanced he elec omagne ic in e e -
ence shielding e ec i eness (EMI SE) o na u al ubbe / educed g aphene oxide (NRG)
Nanoma e ials 2025,15, 541 17 o 24
composi es. The EMI SE alue o he NRMG composi e wi h 10 pa s pe 100 pa s o
ubbe GO is 1.4 imes highe han ha o he NRG composi e wi h he same GO con en
in he 8.2–12.4 GHz equency band. Wi h a speci ic EMI SE o 26.4 dB mm
−1
, he NRMG
composi e ou pe o ms he p e iously epo ed polyme /Fe
3
O
4
@ GO composi es wi h a
low GO concen a ion. Rema kably, he NRMG composi e’s EMI SE only dec eases by
3.5% a e 2000 bending– elease cycles, indica ing ha i may ind applica ion in lexible
shielding ma e ials.
In o de o c ea e 3D ne wo k po ous g aphene nanopla ele (GNP)/Fe
3
O
4
/epoxy
nanocomposi es wi h a low densi y o 0.34–0.73 g/cm
3
, Liu e al. sugges ed a new and sim-
ple me hod called epoxy–wa e –ino ganic ille suspended emulsion polyme iza ion [
127
].
The po ous nanocomposi e ha esul ed om loading 7 w .% g aphene nanopla ele s and
7 w .% Fe
3
O
4
nanopa icles showed a sa is ac o y speci ic elec omagne ic in e e ence
(EMI) shielding e ec i eness o abou 37.03 dB/(g/cm
3
), which was much highe han ha
o he solid equi alen s (28.30 dB/(g/cm
3
)). In ano he s udy, Fe
3
O
4
/ he mally annealed
g aphene ae ogel (Fe
3
O
4
/TAGA) was c ea ed by i s he mally annealing e hylenediamine-
unc ionalized Fe
3
O
4
(NH
2
-Fe
3
O
4
) nanopa icles wi h g aphene oxide (GO), ollowed by
he addi ion o l-asco bic acid [
128
]. Then, he Fe
3
O
4
/TAGA/epoxy nanocomposi es we e
c ea ed using a empla e-cas ing echnique. The esul ing Fe
3
O
4
/TAGA/epoxy nanocom-
posi es achie ed he highes elec omagne ic in e e ence shielding e ec i eness (EMI SE o
35 dB in he X-band) when he mass a io o GO o NH2-Fe3O4was 2:1 and he o al mass
ac ion o Fe
3
O
4
/TAGA was 2.7 w .% (comp ising 1.5/1.2 w .% Fe
3
O
4
/TAGA). This was
signi ican ly be e han epoxy nanocomposi es wi h he same Fe3O4/ he mally annealed
g aphene oxide (Fe3O4/TAGO) loading, which only showed an EMI SE o 10 dB.
Liu e al. c ea ed magne ic educed g aphene oxide GO@Fe
3
O
4
nanopla ele s (NPs),
which we e used as ille s, by co-p ecipi a ion and elec os a ic sel -assembly [
129
]. The
nanocomposi es we e made by applying ex e nal magne ic ields o align GO@Fe
3
O
4
NPs du ing epoxy cu ing. Because o he aniso opic p ope ies o GO@Fe
3
O
4
NPs and
ex e nal magne ic ields, he nanocomposi e con aining aligned GO@Fe
3
O
4
NPs showed
aniso opic he mal conduc i i y. The p oduced sample exhibi ed excep ional he mal
s abili y and 13.45 dB EMI shielding a 8.2 GHz. O e all, he GO@Fe
3
O
4
NPs’ in-plane
in e ac ion was enhanced by aligning hem unde a magne ic ield, which p omo ed he
g ow h o ho izon al he mal conduc i e ne wo ks. Re lec ion is he main EMI shielding
mechanism. Th ee-dimensional Fe
3
O
4
-deco a ed ca bon nano ube/ educed g aphene
oxide oam/epoxy (3D Fe
3
O
4
-CNT/ GF/EP) nanocomposi es wi h highly aligned h ee-
dimensional s uc u es we e c ea ed by Liang e al. using a simple empla e app oach [
130
].
The ob ained 3D Fe
3
O
4
-CNT/ GF/EP nanocomposi es wi h 0.24 w .% GF and 2.76 w .%
Fe
3
O
4
-CNTs showed a ema kable elec ical conduc i i y o 15.3 S/m and an EMI SE o
36 dB wi hin he X-band ange, which was a nea ly 482% imp o emen when compa ed
o he EMI SE alue o physically blended Fe
3
O
4
-CNT/EP nanocomposi es wi hou a
h ee-dimensional s uc u e (~6 dB). Using a supe c i ical ca bon dioxide (Sc-CO
2
) oam-
ing echnique, ligh weigh and lexible me hyl inyl silicone ubbe (VMQ)/mul i-walled
ca bon nano ube (MWCNT)/ e i e ous oxide (Fe
3
O
4
) nanocomposi e oams wi h su-
pe io EMI shielding capabili ies we e c ea ed [
131
]. The addi ion o a cellula s uc u e
and magne ic Fe
3
O
4
nanopa icles g ea ly imp o ed he VMQ/MWCNT/Fe
3
O
4
oams’
mic owa e-abso bing capaci y by success ully lowe ing seconda y elec omagne ic wa e
in e e ence b ough on by e lec ion. In he 8.2–12.4 GHz equency ange, hese nanocom-
posi e oams, which ha e an app oxima e densi y o 0.48 g/cm
3
, showed an EMI shielding
e iciency (SE) o 27.5 dB and an a e age abso p ion a io o up o 64%. The oams had a
speci ic EMI SE o abou 72 dB g
−1
cm
3
and a high conduc i i y o abou 14.6 S/m wi h a
ille loading o 1.78 ol.%.
Nanoma e ials 2025,15, 541 18 o 24
Shu e al. [
132
] used ice-husk-based ac i a ed ca bon (AC) and p oduced compo-
si es wi h acicula o oc ahed al Fe
3
O
4
nanopa icles. A signi ican e ec on he EMI
shielding e ec i eness o he composi es was assigned o he mo phology o he me allic
nanopa icles and he laye ed s uc u e o he C componen o he composi es. They
achie ed an EMI SE o −52.14 dB.
Reco d alues o EMI shielding e ec i eness we e achie ed o MXene by inco po a -
ing magne ic nanopa icles as in e cala o s be ween laye s [
133
] and 3D N-doped GO wi h
sil e nanowi es (−79.99 dB) a a hickness o 2.660 mm [134].
3. Conclusions
This e iew has p o ided a comp ehensi e o e iew o he de elopmen s, classi ica-
ion, ends, and ad ances in new elec omagne ic shielding ma e ials. I gi es a ho ough
li e a u e e iew o he EMI shielding p ope ies o new EMI shielding ma e ials such as
biocha s, sca olds, a e ea h, and e i e-based ma e ials. A de ailed discussion is gi en
ega ding he p epa a ion me hods, s uc u e, EMI shielding pe o mance, EMI shielding
mechanisms, and applica ion pe spec i es o hese ma e ials.
Looking ahead, he p ospec s o and esea ch on elec omagne ic shielding ma e i-
als should ocus on scalabili y, imp o ing pe o mance, cos -e ec i eness, sus ainabili y,
e sa ili y, and p oduc ion me hods o ad ance new ma e ials like biocha s, sca olds, a e
ea h, and e i e-based ma e ials as no el EMI shielding solu ions. Biocha s a e p omising
eco- iendly, sus ainable, and enewable ma e ials ha can be po en ially used as EMI
shielding ma e ials in elec onic de ices and cons uc ion ma e ials, simila o sca olds,
new-gene a ion, easy- o-manu ac u e ma e ials wi h excellen EMI shielding pe o mance.
Al hough MXene, ca bon nano ubes, and g aphene-based composi es a e highly e icien
EMI shielding ma e ials due o hei la ge ee su ace a ea, high aspec a io, chemical
s abili y, and ligh weigh na u e, he la ge numbe o syn he ic phases leads o hei high
p ice. Ca bon-based nanoma e ials de i ed om biomass a e being de eloped in a ques
o new, cos -e icien , sus ainable, and a o dable ma e ials.
The cu en disad an ages o hese ma e ials a e he hickness o he shielding ba ie
and lack o anspa ency, which limi some applica ions.
Ma e ials doped wi h a e ea h elemen s ha e been de eloping o e he las ew
yea s. They ha e speci ic s uc u es, in e acial pola iza ion, mul iple e lec ions, and
excellen conduc i e and EMI shielding p ope ies. Combining he magne ic p ope ies o
e i e-based ma e ials wi h he elec ical conduc i i y o ca bon nanoma e ials, composi e
ma e ials can e icien ly abso b, e lec , and dissipa e elec omagne ic ene gy ac oss a
b oade equency ange. Al hough he ma e ials showed ou s anding EMI shielding
pe o mance, he p ice o REEs will limi he applica ion o hese composi es o mo e
sophis ica ed and sensi i e ields such as medicine.
Thei EMI shielding e ec i eness, good magne ic and dielec ic p ope ies, excellen
he mal s abili y, and high elec ical conduc i i y and mechanical s eng h make biocha s,
sca olds, a e ea h, and e i e-based ma e ials ecological and sus ainable solu ions as
new p oduc s o blocking EMWs.
Au ho Con ibu ions: Concep ualiza ion, S.J. and D.M.; alida ion, S.D., M.Y., K.H., B.N. and D.K.;
esou ces, S.J. and M.Y.; w i ing—o iginal d a p epa a ion, S.J., S.D., D.K., M.Y., K.H., B.N. and D.M.;
w i ing— e iew and edi ing, S.J., M.Y. and D.M.; supe ision, S.J., M.Y., K.H., B.N. and D.M.; p ojec
adminis a ion, S.J.; unding acquisi ion, S.J. All au ho s ha e ead and ag eed o he published
e sion o he manusc ip .
Funding: This esea ch was suppo ed by he Eu opean Union’s Ho izon Eu ope Coo dina ion and
Suppo Ac ions P og amme unde g an ag eemen No 101079151-G InShield. S.J., S.D., D.K., and
Nanoma e ials 2025,15, 541 19 o 24
D.M. hank he Minis y o Science, Technological De elopmen and Inno a ion o he Republic o
Se bia (g an numbe 451-03-136/2025-03/200017).
Da a A ailabili y S a emen : This e iew a icle does no con ain any o iginal da a. All da a
e e enced in his a icle a e publicly a ailable om he sou ces ci ed in he e e ences. No new
da ase s we e gene a ed o analyzed in his wo k.
Con lic s o In e es : The au ho s decla e no con lic s o in e es .
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