Copy igh © Au ho (s) 2025. All Righ s Rese ed. Published by GLOBAL PUBLICATION HOUSE. | In . J. Applied Managemen Science
GPH-In e na ional Jou nal o Applied
Managemen Science
(e-ISSN 3050-9688 | Open Access | Pee -Re iewed)
A icle ID: gph/ijams/2025/2113
Scien ome ic Mapping o he In ellec ual Landscape o Digi al
T ans o ma ion and Sus ainable Supply Chain Inno a ion
Kyle Ruskin M. Po azo
ORCID: 0009-0003-1993-5826
A ilia ion:
Indus ial Enginee ing Depa men , College o Technology and Enginee ing, Palompon Ins i u e o
Technology, Palompon, Ley e.
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Volume: 05 | Issue: 09 | Sep embe 2025 | Pages: 01–19
DOI: 10.5281/zenodo.17312490 | www.gphjou nal.o g
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How o ci e: Po azo, K. R. (2025). Scien ome ic Mapping o he In ellec ual Landscape o Digi al
T ans o ma ion and Sus ainable Supply Chain Inno a ion. GPH-In e na ional Jou nal o Applied
Managemen Science, 5(9), 01-13. h ps://doi.o g/10.5281/zenodo.17312490
Page 01 o 19
Scien ome ic Mapping o he In ellec ual Landscape o Digi al T ans o ma ion and Sus ainable Supply Chain Inno a ion
Volume 05 Issue No 09 (2025) Open Access: h ps://gphjou nal.o g/index.php/ams
Abs ac
The accele a ing con e gence o digi al ans o ma ion and sus ainabili y impe a i es is eshaping
global supply chains, d i ing bo h echnological inno a ion and esponsible business p ac ices. This
s udy maps he in ellec ual s uc u e and hema ic e olu ion o esea ch a he in e sec ion o
digi al ans o ma ion (DT) and sus ainable supply chain inno a ion (SSCI) h ough a scien ome ic
analysis o 3,680 Scopus-indexed publica ions om 2003 o 2026. Using bibliome ic indica o s and
isualiza ion ools (VOS iewe and Bibliome ix in R), he s udy examined publica ion ends,
p oli ic au ho s, in luen ial jou nals, ins i u ional and coun y con ibu ions, hema ic clus e s, and
collabo a ion ne wo ks. Resul s e eal a ib an , globally dis ibu ed, and in e disciplina y ield,
wi h China leading in publica ion ou pu and coun ies such as Ge many, I aly, and he Uni ed S a es
achie ing highe ci a ion impac pe publica ion. Co e hemes include “digi al ans o ma ion,”
“sus ainabili y,” and “indus y 4.0,” while eme ging opics such as ESG, ca bon pe o mance, and
supply chain esilience e lec g owing in eg a ion o echnological and sus ainabili y impe a i es.
The collabo a ion ne wo k showcases s ong in a-Eu opean and c oss-con inen al pa ne ships,
aligning di ec ly wi h he Uni ed Na ions Sus ainable De elopmen Goals (SDG 9, SDG 12, SDG 13,
and SDG 17). While he ield is hema ically ma u e, oppo uni ies emain in niche a eas such as
blockchain in eg a ion, Indus y 5.0 applica ions, and digi al inclusion, o e ing di ec ions o
ad ancing bo h esea ch and p ac ice.
Keywo ds
Digi al T ans o ma ion, sus ainable de elopmen goals, esilience, sus ainable supply chain
inno a ion, collabo a ion ne wo ks.
In oduc ion
In ecen yea s, he con e gence o digi al ans o ma ion and sus ainable supply chain inno a ion
has eme ged as a cen al ocus o bo h academic esea ch and indus y p ac ice. Digi al
echnologies, including a i icial in elligence (AI), blockchain, In e ne o Things (IoT), and
ad anced analy ics, a e subs an ially econ igu ing he a chi ec u e and capabili ies o global
supply chains (Vial, 2019; Ma inoiu e .al., 2025). Concu en ly, heigh ened egula o y sc u iny,
shi ing s akeholde expec a ions, and in e na ional sus ainabili y commi men s ha e in ensi ied
p essu e on i ms o align supply-chain ope a ions wi h en i onmen al, social, and go e nance
(ESG) objec i es. Toge he , hese dynamics ha e os e ed an in e disciplina y esea ch domain ha
spans ope a ions managemen , indus ial enginee ing, in o ma ion sys ems, sus ainabili y science,
and inno a ion s udies (Vial, 2019; Ma inoiu e al., 2025).
Despi e he apidly expanding li e a u e, he in ellec ual landscape o his ield emains agmen ed;
di e ing disciplina y lenses, inconsis en e minology, and he e ogeneous esea ch p io i ies
complica e e o s o syn hesize indings and loca e cohe en esea ch agendas. Consequen ly,
sys ema ic insigh s in o he domain’s co e hemes, leading con ibu o s, collabo a i e ne wo ks,
and nascen ends a e s ill limi ed (Seu ing & Mülle , 2008; Vial, 2019).
02
Po azo, K. R. (2025). Scien ome ic Mapping o he In ellec ual Landscape o Digi al T ans o ma ion and Sus ainable
Supply Chain Inno a ion. GPH-In e na ional Jou nal o Applied Managemen Science, 5(9), 01-13.
h ps://doi.o g/10.5281/zenodo.17312490
© GPH-In e na ional Jou nal o Applied Managemen Science | www.gphjou nal.o g
To add ess his gap, his p esen s udy conduc s a scien ome ic mapping o he li e a u e a his
in e sec ion. Using es ablished bibliome ic echniques, including co-au ho ship, co-ci a ion, and
keywo d co-occu ence analyses and le e aging isualiza ion and science-mapping ools such as
VOS iewe and Bibliome ix, he s udy delinea es he ield’s in ellec ual a chi ec u e and hema ic
e olu ion. Analyzing a comp ehensi e da ase ex ac ed om majo bibliog aphic da abases, he
esea ch iden i ies he mos in luen ial publica ions, au ho s, jou nals, and esea ch clus e s ha
ha e shaped he eme gence o digi al ans o ma ion and sus ainable supply-chain inno a ion ( an
Eck & Wal man, 2010; A ia & Cuccu ullo, 2017; Ma inoiu e al., 2025).
In alignmen wi h he s udy’s aim o unco e he in ellec ual a chi ec u e and e olu ion o he ield,
he ollowing esea ch ques ions guide he analysis:
1. How has he ield o digi al ans o ma ion and sus ainable supply chain inno a ion e ol ed
in e ms o publica ion ou pu and hema ic de elopmen ?
2. Who a e he mos in luen ial au ho s, jou nals, and ins i u ions con ibu ing o he
ad ancemen o his in e disciplina y ield?
3. Wha a e he co e esea ch hemes, concep ual clus e s, and eme ging opics ha de ine he
schola ly discou se a he in e sec ion o digi al ans o ma ion and sus ainable supply
chain inno a ion?
Me hods
This s udy adop s a quan i a i e scien ome ic esea ch design, which is widely ecognized as an
e ec i e app oach o mapping he in ellec ual s uc u e and hema ic e olu ion o a esea ch
domain (Don hu e al., 2021; A ia & Cuccu ullo, 2017). The design ocuses on sys ema ically
analyzing bibliome ic me ada a o unco e publica ion ends, in luen ial au ho s, esea ch on s,
and pa e ns o schola ly collabo a ion. Scien ome ic mapping enables he iden i ica ion o
concep ual clus e s, hema ic ajec o ies, and in ellec ual ounda ions, p o iding a da a-d i en
unde s anding o he domain’s de elopmen ( an Eck & Wal man, 2010). The s udy was
concep ualized and execu ed on Augus 7, 2025, ensu ing a ixed empo al e e ence poin o da a
collec ion and analysis.
The bibliome ic da ase was e ie ed om he Scopus da abase, a leading sou ce o pee -
e iewed scien i ic li e a u e known o i s b ead h, ci a ion acking, and mul idisciplina y
co e age (Mongeon & Paul-Hus, 2016). Da a ex ac ion was conduc ed on Augus 7, 2025, o ensu e
eplicabili y. The da ase included comp ehensi e bibliog aphic me ada a such as au ho ship
de ails, a icle i les, publica ion yea s, sou ce i les, documen ypes, ci a ion coun s, DOIs, au ho
a ilia ions, publishe s, indexed keywo ds, and comple e lis s o ci ed e e ences. This ensu ed ha
bo h desc ip i e and ela ional bibliome ic analyses could be pe o med wi h high accu acy.
Sea ch S a egy
A s uc u ed Boolean sea ch s a egy was de eloped o ensu e comp ehensi e e ie al while
minimizing i ele an esul s. The exac ph ases "Digi al T ans o ma ion", "Sus ainable Supply
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Scien ome ic Mapping o he In ellec ual Landscape o Digi al T ans o ma ion and Sus ainable Supply Chain Inno a ion
Volume 05 Issue No 09 (2025) Open Access: h ps://gphjou nal.o g/index.php/ams
Chain Managemen ", and "Supply Chain Inno a ion" we e used wi h Boolean ope a o s (AND / OR)
o cap u e eco ds con aining a leas one o hese e ms in a icle i les o au ho keywo ds.
Abs ac s we e also included in he sea ch scope, acknowledging ha keywo d occu ence in
abs ac s does no always gua an ee di ec hema ic ele ance. The sea ch co e ed all a ailable
publica ion yea s up o Janua y 2025, wi hou es ic ions on language, documen ype, o jou nal
ca ego y. This inclusi e app oach aligns wi h bes p ac ices in bibliome ic esea ch o a oid
empo al o disciplina y bias (Zupic & Ča e , 2015).
Da a Analysis
The analysis employed bibliome ic and scien ome ic echniques o cap u e bo h desc ip i e and
ela ional dimensions o he esea ch domain. A he desc ip i e le el, me ics such as annual
publica ion ends, p oli ic au ho s, highly ci ed pape s, leading jou nals, ins i u ional p oduc i i y,
and coun y-le el con ibu ions we e assessed. Ci a ion indica o s, including o al ci a ions and h-
index alues, we e calcula ed o measu e academic in luence.
To comp ehensi ely map he in ellec ual and hema ic landscape o he ield, mul iple bibliome ic
echniques we e employed. Co-au ho ship analysis was conduc ed o examine pa e ns o schola ly
collabo a ion ac oss au ho s, ins i u ions, and coun ies, p o iding insigh s in o he s uc u e and
dynamics o esea ch ne wo ks. Keywo d co-occu ence analysis was u ilized o iden i y dominan
esea ch opics, concep ual linkages, and hema ic clus e s, he eby e ealing he concep ual
ounda ions o he domain. In addi ion, bibliog aphic coupling was applied o de ec eme ging
esea ch on s by iden i ying ecen ly published wo ks ha sha e common e e ences. A hema ic
e olu ion analysis was also unde aken o ace longi udinal shi s in esea ch ocus and hema ic
p io i ies o e ime. These analy ical p ocedu es we e implemen ed using VOS iewe ( an Eck &
Wal man, 2010) and Bibliome ix in R (A ia & Cuccu ullo, 2017), bo h o which a e widely
ecognized and ex ensi ely applied ools o science mapping.
P ocedu e
The bibliome ic s udy ollowed a sys ema ic and eplicable me hodological amewo k o ensu e
igo , anspa ency, and alidi y in mapping he in ellec ual s uc u e and hema ic e olu ion o
esea ch a he in e sec ion o digi al ans o ma ion and sus ainable supply chain inno a ion. Fi s ,
he esea ch scope and objec i es we e clea ly de ined o cap u e he hema ic o e lap be ween
hese wo domains. A ca e ully designed sea ch s a egy was de eloped, employing Boolean
ope a o s and exac ph ase ma ching o main ain e m in eg i y and p ecision in e ie al. Da a
we e ex ac ed om he Scopus da abase on Augus 7, 2025, ensu ing comp ehensi e co e age o
pee - e iewed publica ions ele an o he opic. The ex ac ed da ase unde wen a igo ous
cleaning p ocess, which in ol ed emo ing duplica e eco ds, uni ying au ho and ins i u ion
names, and s anda dizing keywo ds o enhance analy ical consis ency. Desc ip i e bibliome ic
analyses we e conduc ed o iden i y publica ion ends, p oli ic au ho s, leading ins i u ions, and
ci a ion impac , he eby ou lining he ounda ional s uc u e o he ield. Subsequen ly, ela ional
ne wo k analyses—including co-au ho ship, co-ci a ion, bibliog aphic coupling, and keywo d co-
occu ence mapping—we e applied o isualize collabo a ion pa e ns, in ellec ual linkages, and
hema ic clus e s. A hema ic e olu ion analysis was also pe o med o ace he longi udinal
04
Po azo, K. R. (2025). Scien ome ic Mapping o he In ellec ual Landscape o Digi al T ans o ma ion and Sus ainable
Supply Chain Inno a ion. GPH-In e na ional Jou nal o Applied Managemen Science, 5(9), 01-13.
h ps://doi.o g/10.5281/zenodo.17312490
© GPH-In e na ional Jou nal o Applied Managemen Science | www.gphjou nal.o g
de elopmen and shi s in schola ly ocus o e ime. Finally, he indings om hese quan i a i e
analyses we e syn hesized o p oduce an in eg a ed in e p e a ion o he ield’s knowledge
s uc u e and eme ging esea ch di ec ions. This me hodological app oach is consis en wi h
es ablished scien ome ic esea ch guidelines, ensu ing obus ness and eplicabili y (Don hu e al.,
2021; Zupic & Ča e , 2015).
Resul s
As summa ized in Table 1, he bibliome ic da ase o Digi al T ans o ma ion and Sus ainable
Supply Chain Inno a ion (2003–2026) comp ises 3,680 documen s d awn om 1,283 dis inc
sou ces, suppo ed by 245,086 e e ences. Wi h an a e age o 25 ci a ions pe documen and a
mean documen age o 1.92 yea s, he co pus e lec s bo h schola ly ele ance and ecency.
Thema ic di e si y is e idenced by 8,868 Keywo ds Plus and 7,642 au ho -supplied keywo ds,
cap u ing he ield’s mul idimensional scope. Con ibu ions om 9,120 au ho s, including 258
single-au ho ed wo ks, e eal a p edominan ly collabo a i e s uc u e, wi h a mean o 3.47 co-
au ho s pe documen and an in e na ional collabo a ion a e o 30.35%, unde sco ing he ield’s
global and in e disciplina y cha ac e . Publica ion o ma s a e domina ed by jou nal a icles
(2,467), ollowed by con e ence pape s (579) and book chap e s (284), complemen ed by 267
e iews ha consolida e eme ging knowledge. The ela i ely low occu ence o e ac ed wo ks
and o he non- esea ch o ma s a i ms he ield’s academic in eg i y (Tiwa i, S., & Goel, R., 2025).
O e all, he da ase depic s a ib an , collabo a i e, and hema ically ich esea ch landscape
ac i ely shaping he in eg a ion o digi al ans o ma ion in o sus ainable supply chain inno a ion.
Table 1. Desc ip i e Bibliome ic P o ile o Resea ch on Digi al T ans o ma ion and Sus ainable
Supply Chain Inno a ion.
DESCRIPTION
RESULTS
Main In o ma ion Abou Da a
Timespan
2003:2026
Sou ces (Jou nals, Books, e c.)
1283
Documen s
3680
Annual G ow h Ra e %
0
Documen A e age Age
1.92
A e age ci a ions pe doc
25
Re e ences
245086
DOCUMENT CONTENTS
Keywo ds Plus (ID)
8868
Au ho ’s Keywo ds (DE)
7642
AUTHORS
Au ho s
9120
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Scien ome ic Mapping o he In ellec ual Landscape o Digi al T ans o ma ion and Sus ainable Supply Chain Inno a ion
Volume 05 Issue No 09 (2025) Open Access: h ps://gphjou nal.o g/index.php/ams
Au ho s o single-au ho ed docs
258
AUTHORS COLLABORATION
Single-au ho ed docs
276
Co-Au ho s pe doc
3.47
In e na ional co-au ho ships %
30.35
DOCUMENT TYPES
a icle
2467
book
62
book chap e
284
con e ence pape
579
con e ence e iew
7
edi o ial
4
e a um
1
no e
4
e ac ed
3
e iew
267
sho su ey
2
Figu e 1 shows he global scien ome ic map o digi al ans o ma ion and sus ainable supply
chain inno a ion, e ealing ha China is he leading con ibu o , p oducing he highes numbe o
publica ions in his domain, consis en wi h p io bibliome ic analyses highligh ing i s dominance
in digi aliza ion and sus ainabili y esea ch ou pu (Wang e al., 2023). O he no able con ibu o s
include India, B azil, he Uni ed S a es, and se e al Eu opean coun ies such as Ge many, I aly, and
Finland, which, al hough p oducing ewe pape s han China, demons a e highe ci a ion impac
pe publica ion, sugges ing g ea e esea ch quali y and in luence (Wang e al., 2023; Zhang e al.,
2024). The map also illus a es egional collabo a ion pa e ns, wi h s ong in a-Eu opean
ne wo ks and signi ican c oss-con inen al ies be ween he Uni ed S a es, Eu ope, and Asia,
echoing p e ious indings on global collabo a ion s uc u es in sus ainabili y-o ien ed
06
Po azo, K. R. (2025). Scien ome ic Mapping o he In ellec ual Landscape o Digi al T ans o ma ion and Sus ainable
Supply Chain Inno a ion. GPH-In e na ional Jou nal o Applied Managemen Science, 5(9), 01-13.
h ps://doi.o g/10.5281/zenodo.17312490
© GPH-In e na ional Jou nal o Applied Managemen Science | www.gphjou nal.o g
echnological esea ch (Zhang e al., 2024). In con as , ligh e -shaded egions in A ica, pa s o
La in Ame ica, and he Middle Eas indica e unde ep esen a ion, unde sco ing pe sis en
dispa i ies in esea ch capaci y and o e ing oppo uni ies o a ge ed capaci y building and
Sou h–Sou h collabo a ions (Li e al., 2024).
Figu e 1. Global Dis ibu ion o Resea ch Ou pu on Digi al T ans o ma ion and Sus ainable Supply
Chain Inno a ion.
Table 2 shows he in ellec ual landscape o digi al ans o ma ion and sus ainable supply chain
inno a ion, leading con ibu o s demons a e dis inc p o iles in esea ch p oduc i i y and
schola ly in luence. F ank, A.G. eme ges as he mos p oli ic and impac ul au ho , p oducing 19
publica ions (14% o o al) wi h he highes o al ci a ions (5,095) and a e age ci a ions pe pape
(268.2), while Ghobakhloo, M. ollows closely wi h sligh ly ewe publica ions (18) bu a highe h-
index (13), e lec ing consis en ly ci ed wo k. O he au ho s, such as Caiado, R.G.G., and Deschamps,
F., display mode a e p oduc i i y bu compa a i ely lowe ci a ion impac , unde sco ing he
une en ela ionship be ween ou pu and in luence. These a ia ions highligh he impo ance o
using mul iple bibliome ic indica o s TP, TC, ACP, and h-index— o ob ain a balanced
unde s anding o schola ly pe o mance (Hi sch, 2005; Don hu e al., 2021). In e p e ing hese
me ics h ough a sensemaking lens scanning o pa e ns, sensing hei implica ions, and
subs an ia ing conclusions p o ides deepe insigh s in o he dynamics shaping esea ch
con ibu ions in his eme ging ield (Lim & Kuma , 2024).
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Scien ome ic Mapping o he In ellec ual Landscape o Digi al T ans o ma ion and Sus ainable Supply Chain Inno a ion
Volume 05 Issue No 09 (2025) Open Access: h ps://gphjou nal.o g/index.php/ams
Table 2. Top Con ibu ing Au ho s and Thei Schola ly Impac in Digi al T ans o ma ion and
Sus ainable Supply Chain Inno a ion
AUTHOR’S
NAME
AFFILIATION
TP (%)
TC
ACP
H-INDEX
RANK
F ank, A.G.
Uni e sidade Fede al do Rio
G ande do Sul
19 (14%)
5,095
268.2
11
1s
Ghobakhloo,
M.
Uppsala Uni e si e
18
(13%)
3,247
180.4
13
2nd
Caiado, R.G.G.
Pon i icia Uni e sidade
Ca olica do Rio de Jane io
15
(11%)
259
17.3
7
3 d
Gunaseka an,
A.
Penn S a e Ha isbu g
15
(11%)
966
64.4
11
4 h
Beni ez, G.B.
Ox o d B ookes Pon i icia
Uni e sidade Ca olica do Rio
de Pa ana
14
(10%)
2050
146.4
7
5 h
Deschamps,
F.
Pon i icia Uni e sidade
Ca olica do Rio de Pa ana
14
(10%)
98
7.0
3
6 h
Rau , R.D.
Indian Ins i u e o
Managemen Mumbai
11
(8%)
547
49.7
8
7 h
To o ella,
G.L.
Uni e si y o Melbou ne
11
(8%)
160
14.5
8
8 h
De eci, M.
Milli Sa unma Uni e si esi
10
(7%)
160
16
8
9 h
I anmanesh,
M.
Edi h Cowan Uni e si y
10
(7%)
143
14.3
4
10 h
Legend: TP – To al Publica ions; TC – To al Ci a ions; ACP – A e age Ci a ions pe Publica ion
Figu e 2(a) highligh s Poli ecnico di Milano as he leading con ibu o o esea ch on digi al
ans o ma ion (DT) and sus ainable supply chain inno a ion (SSCI), wi h 72 publica ions,
e lec ing i s es ablished epu a ion as a hub o inno a ion managemen and Indus y 4.0 esea ch
(Li e al., 2024). Jiangsu Uni e si y (56 publica ions) and Uni e sidade Fede al do Rio G ande do Sul
(55 publica ions) ollow closely, demons a ing s ong engagemen om bo h Asian and Sou h
Ame ican academic ins i u ions in ad ancing he in eg a ion o digi al echnologies wi h
sus ainable supply chain p ac ices. Mid- ie con ibu o s such as Is anbul Technical Uni e si y (42),
The Hong Kong Poly echnic Uni e si y (40), and LUT Uni e si y (39) ep esen di e se geog aphic
egions, unde sco ing he ield’s global scope and mul idisciplina y cha ac e (Wang e al., 2023;
Zhang e al., 2024).
No ably, ins i u ions like he Uni e si y o Johannesbu g, Wuhan Uni e si y, and Sou h China
Uni e si y o Technology main ain s eady ou pu (37–38 publica ions), indica ing an ac i e ye
egionally ocused con ibu ion o he ield. Eme ging esea ch hubs such as Bina Nusan a a
Uni e si y also appea in he anking, signaling he inc easing pa icipa ion o Sou heas Asian
ins i u ions in DT–SSCI schola ship. The di e si y in geog aphic ep esen a ion mi o s b oade
bibliome ic ends showing ha while Eu ope and Asia lead in o al esea ch ou pu , con ibu ions
om La in Ame ica and A ica a e gaining momen um, po en ially os e ing new egional
pe spec i es and collabo a i e oppo uni ies (Don hu e al., 2021; Li e al., 2024).
08
Po azo, K. R. (2025). Scien ome ic Mapping o he In ellec ual Landscape o Digi al T ans o ma ion and Sus ainable
Supply Chain Inno a ion. GPH-In e na ional Jou nal o Applied Managemen Science, 5(9), 01-13.
h ps://doi.o g/10.5281/zenodo.17312490
© GPH-In e na ional Jou nal o Applied Managemen Science | www.gphjou nal.o g
Figu e 2(a). Top Con ibu ing Ins i u ions in he Schola ly Domain o Digi al T ans o ma ion and
Sus ainable Supply Chain Inno a ion.
Figu e 3 cap u es he empo al analysis o high- equency e ms in Digi al T ans o ma ion and
Sus ainable Supply Chain Inno a ion esea ch, e ealing he e olu ion and hema ic consolida ion
o he ield o e he pas decade. Co e e ms such as “digi al ans o ma ion,” “digi iza ion,”
“sus ainabili y,” and “indus y 4.0” domina e ecen discou se, wi h signi ican equency peaks
occu ing be ween 2021 and 2024, indica ing hei cen ali y o con empo a y schola ship.
Eme ging hemes such as “supply chain esilience,” “g een de elopmen ,” and “secu i y o da a”
highligh a g owing emphasis on esilience, en i onmen al conside a ions, and cybe secu i y
wi hin digi ally enabled supply chains. The sus ained p esence o manage ial and ope a ional
concep s such as “chain managemen ,” “decision making,” and “business in elligence” e lec s he
in eg a ion o s a egic and analy ical pe spec i es in o echnological ans o ma ion amewo ks.
The clus e ing o e m eme gence in ecen yea s sugges s a apid hema ic expansion aligned wi h
global supply chain dis up ions and accele a ed digi al adop ion, unde sco ing he in e disciplina y
and adap i e na u e o he esea ch domain.
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Scien ome ic Mapping o he In ellec ual Landscape o Digi al T ans o ma ion and Sus ainable Supply Chain Inno a ion
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Figu e 7. Concep ual S uc u e o Digi al T ans o ma ion and Sus ainable Supply Chain Inno a ion.
Discussion
The indings o his s udy e eal a apidly e ol ing, mul idisciplina y esea ch ield si ua ed a he
in e sec ion o digi al ans o ma ion (DT) and sus ainable supply chain inno a ion (SSCI). The
obse ed g ow h in publica ion olume, coupled wi h high hema ic di e si y, unde sco es he
inc easing schola ly ecogni ion o DT as bo h an enable and d i e o sus ainabili y in supply
chains (Vial, 2019; Wang e al., 2023). Au ho - and ins i u ion-le el analyses indica e a dual
esea ch s uc u e in which a small coho o highly ci ed schola s and globally ecognized
ins i u ions shape he heo e ical ounda ions, while a b oade ne wo k o con ibu o s
dissemina es p ac ical and con ex -speci ic insigh s (Lo ka, 1926; Don hu e al., 2021). This aligns
wi h ea lie bibliome ic s udies sugges ing ha global collabo a ion is essen ial o ad ancing
in e disciplina y domains such as DT–SSCI (Zhang e al., 2024; Li e al., 2024).
The hema ic mapping u he illus a es he ield’s concep ual ma u i y, wi h co e hemes such as
“digi al ans o ma ion,” “sus ainabili y,” and “indus y 4.0” exhibi ing s ong cen ali y and densi y.
A he same ime, eme ging opics like “ESG,” “supply chain esilience ”and“ ca bon pe o mance”
e lec a shi owa d in eg a ing socio-en i onmen al impe a i es in o digi al s a egies, likely in
esponse o pos -pandemic dis up ions and clima e change impe a i es (Quei oz e al., 2019; Zhang
e al., 2024). These hema ic di ec ions a e di ec ly aligned wi h mul iple Uni ed Na ions
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Po azo, K. R. (2025). Scien ome ic Mapping o he In ellec ual Landscape o Digi al T ans o ma ion and Sus ainable
Supply Chain Inno a ion. GPH-In e na ional Jou nal o Applied Managemen Science, 5(9), 01-13.
h ps://doi.o g/10.5281/zenodo.17312490
© GPH-In e na ional Jou nal o Applied Managemen Science | www.gphjou nal.o g
Sus ainable De elopmen Goals (SDGs), pa icula ly SDG 9 (Indus y, Inno a ion, and
In as uc u e), which emphasizes os e ing esilien in as uc u e and inno a ion; SDG 12
(Responsible Consump ion and P oduc ion), which ad oca es sus ainable supply chain p ac ices;
and SDG 13 (Clima e Ac ion), which calls o u gen ac ion o mi iga e clima e impac s. Addi ionally,
he global collabo a ion pa e ns iden i ied in his s udy suppo SDG 17 (Pa ne ships o he
Goals), highligh ing he impo ance o c oss-bo de and in e disciplina y pa ne ships in
accele a ing he adop ion o sus ainable digi al p ac ices.
Conclusion
This scien ome ic mapping has p o ided a comp ehensi e o e iew o he in ellec ual s uc u e,
hema ic e olu ion, and collabo a i e ne wo ks de ining esea ch on digi al ans o ma ion and
sus ainable supply chain inno a ion. The analysis e eals a ib an , collabo a i e, and hema ically
in eg a ed ield ancho ed by co e digi al and sus ainabili y hemes, ye s ill e ol ing o inco po a e
eme gen p io i ies such as ESG pe o mance, esilience, and echnological inclusi i y. By
iden i ying in luen ial schola s, ins i u ions, and hema ic clus e s, he s udy o e s a s a egic
ounda ion o ad ancing bo h academic inqui y and p ac ical implemen a ion. S eng hening
global collabo a ions, di e si ying egional ep esen a ion, and os e ing niche esea ch di ec ions
will be c i ical o sus aining he momen um o his in e disciplina y domain in add essing he win
impe a i es o echnological ad ancemen and sus ainable de elopmen .
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