G an Ag eemen numbe :
101058371
P ojec ac onym:
ESTELLA
P ojec i le:
Design o bio-based he mose
polyme wi h ecycling capabili y by
dynamic bonds o bio-composi e
manu ac u ing
DELIVERABLE 1.2
Ma e ial equi emen s o
composi e manu ac u ing
Con ac ual Da e o Deli e y:
31/08/2022
Ac ual Da e o Deli e y:
30/09/2022
Lead con ac o o his deli e able:
CIDAUT
Au ho (s):
Julia Gue e o
Pa icipan s(s):
Filipa A. Vicen e (NIC), Damian Kiełkiewicz (ICSO),
Wou e Pos (WUR), Ghazal Ta akoli (WUR)
WP con ibu ing o he deli e able:
WP1
Na u e:
Public
Ve sion
V. 3
G an Ag eemen 101058371 – P ojec ESTELLA
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REVISION TABLE
Documen e sion
Da e
Modi ied sec ions - De ails
V1
16.09.2022
Fi s d a
V2
22.09.2022
Re ised by NIC and WUR
V3
30.09.2022
Final e sion o submission a e Con en & Quali y check
G an Ag eemen 101058371 – P ojec ESTELLA
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Table o Con en s
ABBREVIATIONS .................................................................................................................................... 4
EXECUTIVE SUMMARY ........................................................................................................................... 5
1. INTRODUCTION ............................................................................................................................ 6
2. REQUIRED PROPERTIES OF THE RAW MATERIALS ......................................................................... 7
2.1. MATRICES - EPOXY ...................................................................................................................... 7
2.1.1. ESTELLA epoxies ................................................................................................................. 8
2.2. REINFORCEMENTS .......................................................................................................................... 13
2.2.1. (Ligno)cellulose (discon inuous ib e) ............................................................................... 14
2.2.2. Hemp (con inuous ib e) ................................................................................................... 16
3. RAW MATERIAL PROCESSING CAPACITY ..................................................................................... 17
3.1. AUTOCLAVE MOULDING .................................................................................................................. 17
3.2. OOA PROCESSES ........................................................................................................................... 17
3.2.1. Vacuum Bagging .............................................................................................................. 17
3.2.2. Vacuum Bag Only/O en Cu e ........................................................................................... 18
3.2.3. Resin T ans e Moulding (RTM) ........................................................................................ 18
3.2.4. Vacuum Assis ed Resin T ans e Moulding (VARTM) ....................................................... 19
3.2.5. Seeman Composi e Resin In usion Moulding P ocess (SCRIMP) ....................................... 20
3.2.6. Comp ession Moulding ..................................................................................................... 21
3.3. PROCESSABILITY REQUIREMENTS ....................................................................................................... 21
BIBLIOGRAPHY ..................................................................................................................................... 23
G an Ag eemen 101058371 – P ojec ESTELLA
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Abb e ia ions
CAN: Co alen Adap i e Ne wo k
DA: Diels-Alde
DGEBA: Bisphenol A diglycidyl e he
DGEBF: Bisphenol F diglycidyl e he
OOA: Ou -o - Au ocla e
RTM: Resin T ans e Moulding
SCRIMP: Seeman Composi e Resin In usion Moulding P ocess
TEMPO: 2,2,6,6-Te ame hylpipe idinyloxy o 2,2,6,6-Te ame hylpipe idine 1-oxyl
VARTM: Vacuum Assis ed Resin T ans e Moulding
VBO: Vacuum bag-only cu ing
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Execu i e Summa y
The sus ainable and ecyclable composi es o be de eloped in he ESTELLA
p ojec a e made up o ma ices and ib es ha mus mee ce ain
equi emen s. On he one hand he mechanical and he mal equi emen s
ha will con e he desi ed p ope ies o u u e applica ions. And on he
o he hand he equi emen s o be p ocessed by ou -o -au ocla e (OOA)
p ocesses.
This deli e able compiles he s udy ca ied ou by NIC, ICSO, WR, CEL, WK+
and CID on he analysis o comme cial ma e ials cu en ly used in he
manu ac u e o he mose composi es. Based on his s udy, and hei
p e ious expe ience, his deli e able p esen s he speci ic equi emen s o
be me by he ma e ials de eloped in ESTELLA. The esul o his deli e able
will eed he wo k packages 2 and 3 dedica ed o he design o he
ma e ials and he manu ac u e o he composi es espec i ely.
This deli e able D1.2 has ully me i s objec i es as se ou in he G an
Ag eemen . I has su e ed a sligh delay in ime due o oca ional season
bu his has no had any impac in he p og ess o he p ojec in e ms o
con en o impac s.
G an Ag eemen 101058371 – P ojec ESTELLA
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1. INTRODUCTION
Polyme composi e ma e ials o composi es a e widely used in sec o s o high
in e es o he in e na ional economy. So much so ha he Eu opean ma ke
o polyme composi es eached a alue o 16.6 billion dolla s in 2018 and is
es ima ed o inc ease by 7.5% by 2025(1) due o he g owing demand o
ligh weigh ma e ials in s a egic sec o s such as wind ene gy, au omo i e,
ae onau ics and de ense. In addi ion, hei use is expec ed o expand o o he
sec o s wi h lowe p o i ma gins such as leisu e.
The impo ance o hese ma e ials lies in he excellen p ope ies ha can be
achie ed, allowing hem o eplace me als educing weigh and emissions. Fo
example, hey can be ound in s uc u al elemen s o an ai c a o an
au omobile o in cons uc ion.
The main composi ion o hese composi es is he mose ing esin (mainly epoxy)
and ca bon o glass ib e. Figu e 1 shows he use o epoxy composi es in
di e en sec o s.
Figu e 1. Epoxy composi e on he ma ke
The e o e, he ad an ages o using composi es a e clea , especially om an
en i onmen al poin o iew. Howe e , despi e he ad an ages o using
composi es, hey ha e no been ully implemen ed in mos sec o s and his is
due o i s low ecyclabili y a e. As a esul , he ESTELLA p ojec was c ea ed
wi h he main objec i e o imp o ing he ecyclabili y o hese composi es; by
ac ing on he whole alue chain o he ma e ials o ha pu pose. Inhe en ly
ecyclable polyme esins will be designed and de eloped h ough he
in oduc ion o e e sible co alen links be ween he polyme chains, which
p o ide he ma e ial wi h he abili y o e u n om he p ocessed s a e o he
o iginal monome s. Fu he mo e, he manu ac u ing p ocesses o epoxy esins
will be con enien ly adap ed, in o de o maximize he economic e enue and
he eco-e iciency along he alue chain.
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The design o he new ma e ial equi es some impo an aspec s o be aken
in o accoun and hei due ul ilmen will allow he ESTELLA p ojec objec i e o
be achie ed. These aspec s a e:
1) The inal p ope ies o he aw ma e ials (ma ices and ib es).
2) The abili y o be p ocessed by OOA echniques.
3) Recyclabili y (ESTELLA p ojec objec i e).
The inal p ope ies o he aw ma e ials and hei p ocessabili y a e objec i es
o his epo (D1.2) and he ecyclabili y p ope ies a e co e ed in D1.4.
2. REQUIRED PROPERTIES OF THE RAW MATERIALS
The composi e ma e ials o be de eloped in he ESTELLA p ojec consis o he
elemen s shown in he Figu e 2:
Figu e 2. ESTELLA composi es manu ac u ing
The na u e o he ma ices will be epoxy esins, one o which is a modi ied
comme cial epoxy and he o he wo will be syn hesised using bioma e ials. The
na u e o bo h ein o cemen s is biological and he majo di e ence be ween
hem is he mo phology: cellulose is a discon inuous ib e and hemp is
con inuous.
The equi ed p ope ies o each ma e ial a e desc ibed below:
2.1. MATRICES - EPOXY
The epoxy esin consis s o a b oad g oup o eac i e compounds ha a e
cha ac e ized by he p esence o an oxi ane o epoxy ing. This is ep esen ed
by a h ee-membe ing con aining an oxygen a om ha is bonded wi h wo
ca bon a oms al eady uni ed in some o he way (Figu e 3).
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Figu e 3. Epoxy molecula scheme
Hence, he p esence o his unc ional g oup de ines a molecule as an epoxide
– whe e he molecula base can a y widely esul ing in a ious ypes o epoxy
esins. And hey a e success ul because hey o e he di e si y in molecula
s uc u e ha can be p oduced using he same chemical me hod.
Fu he , epoxy esins can be combined wi h a ied cu ing agen s, modi ie s o
achie e he p ope ies equi ed o a speci ic applica ion.
The ypes mo e common in composi e applica ions a e: phenolic glycidyl
e he s, a oma ic glycidyl amines, and cycloalipha ics (2).
The mos ele an p ope ies o Epoxy esins a e:
- High s eng h
- Low Sh inkage
- Excellen adhesion o a ious subs a es
- E ec i e elec ical insula ion
- Chemical and sol en esis ance
The anges o mechanical p ope ies a e shown in Table 1.
Table 1. Comme cial Epoxy mechanical p ope ies ange
P ope y
Range
Tensile S eng h (MPa)
90 - 120
Tensile Modulus (MPa)
3100 - 3800
Glass ansi ion empe a u es, Tg (ºC)
150 - 220
Aside om he p ope ies men ioned abo e, epoxy esins ha e wo main
d awbacks which a e hei b i leness and mois u e sensi i i y.
2.1.1. ESTELLA epoxies
The ESTELLA p ojec , in o de o comple e he objec i e, will de elop h ee
epoxy esins wi h speci ic p ope ies. Figu e 4 shows he na u e (o igin), he ype
o co alen adap i e ne wo k (CAN) and i s ecyclabili y and he ESTELLA
pa ne in ol ed.
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Figu e 4. ESTELLA ma ices summa y
WR will de elop a esin ha is s ic ly speaking no an epoxy esin. Al hough he
inal mechanical p ope ies o ypical cu ed epoxy esins a e pu sued, he
cu ing o he eac i e componen s is no based on epoxy g oups, bu on
unsa u a ed g oups suscep ible o Diels-Alde (DA) cycloaddi ion. The
ep ocessabili y o Diels-Alde esins is based on he ac ha he DA eac ion is
e e sible; a high empe a u es, chemical bonds o med by he DA eac ion
b eak (‘ e o-DA’) o gi e back he o iginal eac i e g oups. Simila o mos
epoxy esins, he DA esin is a wo-componen esin, which means ha bo h
eac i e componen s need o be mixed p io o applica ion. One o he aims o
WR is o design a ‘one-po ’ e sion o he esin. This educes p ocessing imes
and handling di icul ies.
In he Es ella p ojec , NIC will design a lignin bio-based epoxy esin. Lignin
p oduc s will be p epa ed wi h app op ia e eac i e si es (hyd oxyl and
ca bonyl g oups). In o de o o m a esin ha ing a co alen adap i e ne wo k,
he lignin p oduc s can be unc ionalised, o example, by he syn hesis o
glycidyla ed lignin p oduc s o o ma ion o imine bonds. The use o lignin i sel
as cu ing agen wi h o wi hou he p esence o a co-cu ing agen will be
e alua ed in o de o educe he complexi y o he sys em.
The ICSO concep consis s o impa ing o CAN in o ossil epoxy esin cu ed wi h
selec ed ca boxylic acids and/o anhyd ides, o ob ain polyme s wi h inhe en
ecyclabili y. T anses e i ica ion among hyd oxyes e bonds p esen in he
ob ained esins will allow o eac ion mechanism comp ising di usion o sol en
molecules in o he ne wo k, b eakage o polyme chain, di usion o chain
segmen s in o he sol en , and u he epolyme iza ion. Viscosi y o esins
composi ions will be adjus ed by epoxidized plan oils se ing as a eac i e
diluen s o p o ide op imal p ocessabili y in he composi e p oduc ion.
In o de o es ablish he p ope ies ha can be achie ed wi h he designed
esins, a ho ough e iew o he s a e o he a has been ca ied ou .
2.1.1.1. ESTELLA Lignin-based epoxy esins
Table 2 shows he mos ele an in o ma ion ob ained om he e iew ela ed
o esins.
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2.2.2. Hemp (con inuous ib e)
Hemp ib e- ein o ced composi es ha e been success ully used o ligh weigh
and low-cos applica ions in ecen yea s, bu signi ican ba ie s o s uc u al
applica ions o hese composi es s ill exis . These ba ie s include lack o
con idence in he use and pe o mance o na u al plan ib es and hei
composi es limi ed unde s anding o di usion beha iou and poo esis ance o
mois u e(22)(23). Table 8 shows he mos ele an in o ma ion ob ained om he
li e a u e e iew ela ed o hemp.
Table 8.Con inuous hemp ib es p ope ies
Type
Tensile
s eng h
(MPa)
Modulus
(GPa)
Densi y
(g/cm3)
The mal
decomp.
(ºC)
S i ness
(GPa)
Failu e o
s ain (%)
Re .
Hemp
ib e
900
70
---
---
---
---
(24)
20-1000
---
1.4-1.6
---
17.6-35.5
2.1-2.6
(25)
---
---
---
280–500
---
---
(26)
---
---
---
250-320
---
---
(27)
Making con inuous ein o cemen using hemp ib e is qui e challenging and i
will be ied in his ESTELLA p ojec . Be o e ha as a e e ence ma e ial ano he
bas ib e lax will be used o he ini ial es ing pu pose.
As Table 8 shows, he mechanical p ope ies o he hemp ib e a e highe han
o he plan ein o cemen . The ESTELLA hemp will be de eloped in o de o
achie e a ensile s eng h a ound 600-900 MPa, he lax will be be ween 350-
1030 MPa and he modulus be ween 20-60 Gpa. These p ope ies a e ela ed
wi h he mo phology o he ib es and he p e- ea men . The ESTELLA hemp has
inhe en hollow mic os uc u e and he p esence o cellulose o lumen shows
ex emely lowe he mal conduc ion han con en ional ib es. The diame e o
he elemen a y ib e will be be ween 10-45 μm. O he ele an p ope y is ha i
will ha e a densi y ange be ween 1-45-1.55 g/cm3.
As men ioned ea lie , he hemp ya ns om bas is a demanding ask hence he
plan is o buy he comme cially a ailable ya n and o wea e hem in o a
ab ic by applying di e en pa e ns (Plain and Twill) o he composi e
applica ion.
The su ace modi ica ion will be ca ied ou o imp o e he su ace mo phology
and o emo e he hemicellulose. The chemical modi ica ion me hods like
NaOH ea men , pe oxide and anhyd ide ea men will be u ilized. The
a mosphe ic plasma ea men will be u ilized o imp o e he we ing beha io
and he su ace mo phology.
In addi ion, his modi ica ion will imp o e he lexibili y as well as he he mal
s abili y. The ini ial decomposi ion due o humidi y is up o 150°C and he i s
s age o decomposi ion s a s a ound 200°C hence he na u al ib e should
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wi hs and minimum o 200°C. The mal cha ac e iza ion will be u ilized o assess
he he mal s abili y o he lax o hemp ib e.
Table 9 shows a summa y o ESTELLA cellulose a ge ed p ope ies:
Table 9: Summa y o ESTELLA cellulose nano ib es p ope ies
Tensile s eng h
(MPa)
Modulus (GPa)
Densi y (g/cm3)
Diame e
(µm)
The mal
decomposi
ion Tª (ºC)
ESTELLA
Hemp
350-1030
20-60
1.45-1.55
10-45
200
3. RAW MATERIAL PROCESSING CAPACITY
The mose composi es could be p ocessed by se e al echniques(28)
depending on he mo phology o ib es, he p oduc geome y,… They could
be classi ied in wo main ypes: au ocla e moulding and OOA p ocesses.
3.1. Au ocla e moulding
Au ocla e moulding is one o he open moulding p ocesses whe e he
moulded pa is cu ed by applica ion o he acuum, hea , and p essu e o
he ine gases. The moulded pa (o piece) is placed in a plas ic bag, whe e
he ai is exhaus ed by a acuum pump. This emo es ai inclusions and ola ile
p oduc s om he moulded pa . Then, hea and ine gas p essu e a e applied
in he au ocla e causing cu ing and densi ica ion o he ma e ial. Finally,
au ocla e cu ing enables ab ica ion o consis en homogeneous ma e ials.
The me hod is ela i ely expensi e and is used o manu ac u ing high-quali y
ae ospace p oduc s. This p ocess has some ad an ages such as he p essu e
ha helps bond composi e laye s, he abili y o manu ac u e pieces wi h high
ib e loads, as well as high-quali y p oduc s. Howe e , i equi es long cycle
imes and high ene gy and en i onmen al cos s. Fo his eason, composi e
ma e ials manu ac u ing p ocesses a e nowadays aiming o a oid his p ocess
(29).
3.2. OOA p ocesses
3.2.1. Vacuum Bagging
The bagging p ocess is a p ocess in which a lexible, anspa en ilm is used o
enclose and compac we lamina es ha a e cu ed unde a mosphe ic
p essu e. This me hod uses a acuum pump o d aw ai om inside he acuum
bag and hen comp esses he pa unde a mosphe ic p essu e (Figu e 7). The
esin is squeezed and sucked ou o he we lamina e in he bleede . This is a
simple p ocess ha can use a wide a ie y o moulds. Howe e , when i comes
o la ge pa s i equi es longe se -up imes and he manu ac u ing a e is low
(30).
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Figu e 7. A ypical acuum bagging lay-up be o e and a e acuum is applied
3.2.2. Vacuum Bag Only/O en Cu e
Vacuum bag-only cu ing (VBO) uses he acuum bag as he p e ious p ocess
and cu es inside a non-p essu ised o en. In he absence o high p essu e, i is
impo an o conside he p ope y o he OOA esin, he a chi ec u e o he
ib e bed and he p ep eg sys em. P ope ab ica ion equi es he emo al o
bubbles and ola iles be o e he gel ime in o de no o gene a e oids and
hus de ec s. The mechanical p ope ies o he composi es a e simila o hose
manu ac u ed wi h he au ocla e bu he manu ac u ing imes a e longe .
3.2.3. Resin T ans e Moulding (RTM)
The RTM p ocess in ol es using a closed mold o ab ica e a composi e pa .
Fibe p e o m is cu acco ding o he mold shape and placed in a closed mold
ca i y. A low- iscosi y he mose esin is injec ed h ough he injec ion po in o
he mold ca i y, usually wi h a 3.5–7 ba p essu e. The injec ed esin
imp egna es he p e o m e acua ing en apped ai bubbles un il comple e
we ing is eached. Once he esin s a s exi ing om he en po s, he esin
injec ion is s opped, and en po s a e closed. The esin is allowed o cu e by
hea ing he mold o he ini ial addi ion o inhibi o s o he esin sys em. A e he
esin is cu ed, he mold is opened, and he pa is de-molded. Some a ian s o
he RTM p ocess a e VIPR, FASTRAC, ligh RTM (LRTM), s uc u al eac ion
injec ion moulding (S-RIM), and co-injec ion esin ans e moulding. Figu e 8
shows he scheme o he p ocess.
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Figu e 8. RTM p ocess scheme
Some ad an ages o RTM a e ha he p ocess can p oduce pa s wi h close
dimensional ole ance and an imp o ed su ace inish. Pa s made by RTM ha e
a high- olume ac ion o abou 60–70%. RTM can manu ac u e complex-
shaped composi e pa s. Consis en ep oducibili y o composi e pa s can be
achie ed using he RTM p ocess. Due o high esin p essu e and as e mould
opening and closing, a as -manu ac u ing cycle is eached, u he imp o ed
by p ocess con ol. Some d awbacks o he RTM p ocess a e he limi ed size o
pa s ha can be manu ac u ed. Fib e wash can occu due o high esin
p essu e and loose ib e compac ion. Fu he mo e, imp ope loca ion o
injec ion ga es and en s can lead o a mac o oid in he composi e (31).
3.2.4. Vacuum Assis ed Resin T ans e Moulding (VARTM)
In he VARTM me hod, he ein o cemen is placed on a one-sided mould and
sealed wi h a acuum bag o o m a closed mould. A acuum is applied a he
en , which d i es he esin unde a mosphe ic p essu e o imp egna e he
ein o cemen while e acua ing he ai bubbles and compac ing he ib e
p e o m. The esin lows h ough he po ous p e o m and a i es a he en . The
injec ion is closed, bu he acuum is main ained un il he pa is comple ely
cu ed and de-moulded. Figu e 9 shows he scheme o he p ocess.
G an Ag eemen 101058371 – P ojec ESTELLA
ESTELLA_D1.2
©ESTELLA - This is he p ope y o ESTELLA Pa ies: shall no be dis ibu ed/ ep oduced wi hou o mal app o al o ESTELLA Gene al
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Figu e 9. VARTM p ocess scheme
The VARTM p ocess is used o p oduce la ge composi e pa s a a low cos wi h
a low p oduc ion olume. This p ocess is widely used in he ene gy, ae ospace,
ma ine, de ense, and in as uc u e building indus ies. Va ia ions o VARTM
ha e been in en ed o ca e o he manu ac u ing o complex pa s wi h
be e quali y a a educed cos . The VARTM p ocess has some ad an ages:
lexibili y o mould ooling and selec ion o mould ma e ials, esin and ca alys
can be s o ed sepa a ely and mixed be o e in usion, low emission o ola ile
o ganic compound, and isible inspec ion o he p ocess o iden i y and
manage d y spo occu ence. Howe e , some d awbacks o his p ocess a e
ha consumables such as sealing ape, peel-ply, and acuum bags may no
be eusable. The low esin injec ion p essu e can limi oid comp essibili y
esul ing in high oid con en and low ibe olume ac ion. The p ocess may
be suscep ible o high chances o ai leakage, depending on he ope a o ’s
skill le el (32).
3.2.5. Seeman Composi e Resin In usion Moulding P ocess
(SCRIMP)
The SCRIMP p ocess is a modi ica ion o he VARTM p ocess. I is an imp o ed
e sion o he VARTM p ocess o e icien ly and e ec i ely dis ibu e esin du ing
imp egna ion using a dis ibu ion media. The e o e, i is used o making high-
quali y and epea able pa s wi h minimal ola ile emissions. Composi e pa s
made by he SCRIMP p ocess ha e a high ibe olume ac ion ypical o
abou 60–75%. The dis ibu ion media is a highly pe meable ma e ial placed
be ween he acuum bag and he opmos laye o he ab ic. I helps o
dis ibu e he esin quickly, he eby educing he ill ime. The esin ini ially lows
h ough he DM laye be o e we ing he ein o cemen s h ough he hickness
di ec ion (see Figu e 10)(33).
G an Ag eemen 101058371 – P ojec ESTELLA
ESTELLA_D1.2
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Figu e 10. SCRIMP p ocess scheme
3.2.6. Comp ession Moulding
Comp ession moulding is among he oldes ma e ials p ocessing echniques.
Fo plas ics, i was one o he i s indus ial me hods, and is also known
as ma ched die moulding. The basic p ocess consis s o hea ing a he mose
esin, unde se e e p essu e, wi hin a closed mould ca i y un il he esin cu es
h ough a chemical eac ion o c oss-linking polyme ic chains. Unde p essu e,
he esin lique ies and lows, aking he shape o he mould ca i y, and hen
ha dens in o he desi ed p oduc (Figu e 11). Once su icien ly cooled and
s ong, he pa is emo ed om he mould. The cu ing eac ion con inues while
cooling o ambien ( oom) condi ions.
Figu e 11. Comp ession Moulding p ocess scheme
3.3. P ocessabili y equi emen s
The ESTELLA p ojec is commi ed o he manu ac u e o composi es using
en i onmen ally iendly p ocesses, i.e. ou side he au ocla e. This educes
ene gy consump ion and en i onmen al emissions.
The speci ic p ocess in which hey a e o be manu ac u ed will be de ined
when he p o o ypes a e designed, as hey depend on hei geome ic
G an Ag eemen 101058371 – P ojec ESTELLA
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©ESTELLA - This is he p ope y o ESTELLA Pa ies: shall no be dis ibu ed/ ep oduced wi hou o mal app o al o ESTELLA Gene al
Assembly.
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complexi y. Howe e , ega dless o he selec ed p ocess, all o hem ha e in
common a se ies o pa ame e s ha will make he designed ma e ials capable
o being manu ac u ed by OOA p ocesses.
The mos ele an pa ame e s o he p ocessing o he ma ices a e:
- Viscosi y
The ma ices mus pene a e he ib e and be injec ed o in used easily, so he
iscosi y o he ma ices mus be as low as possible. Acco ding o comme cial
esins he op imum iscosi y should be 10-600mPa.s.
- Cu ing ime
The cu ing cu e ela es he p ocessing empe a u e o he ime equi ed o all
he ma ix bonds o be es ablished and o ob ain maximum p ope ies.
In he case o he esins designed in he ESTELLA p ojec ; hese a e no as
cu ing esins (cu ed in a ew minu es) as hey lack ca alys . The cu ing ime o
he esins a ies om 30 min o a ew hou s, usually up o 6 h, and he p ocess
ollows a mul i-s ep app oach a di e en empe a u es, anging om 40 o
140ºC(34) .
Table 10 shows some examples o comme cial epoxy heological p ope ies
and Table 11 he a ge ed ESTELLA epoxy p ope ies:
Table 10. Comme ial epoxies heological p ope ies
Re e ence
Viscosi y a 120ºC
(mPa.s)
Cu ing ime a 120ºC
(min)
Re e ence
RTM6_HexFlow
30
>240
(35)
Resol ech 1500
16
2
(36)
A aldi e LY3585
40-60
2
(37)
Table 11. ESTELLA epoxies p ope ies
Viscosi y a 120ºC
(mPa.s)
Cu ing ime a 120ºC
(min)
ESTELLA bio
ma ices
10- 500
360
ESTELLA ossil
ma ix
10-500
15-90
Wi h ega d o ib es, he pa ame e s o hei p ocessabili y a e ease o
handling and compa ibili y wi h esins. Bo h a e achie ed hanks o he
wea ing o he ib es (in he o m o ab ic o hemp and ma o cellulose) and
he compa ibilisa ion p e- ea men s desc ibed abo e.
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Assembly.
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