This is an Open Access a icle dis ibu ed unde he e ms o he CC-BY-NC-ND 3.0 PL license, which pe mi s o he s o
dis ibu e he wo k, p o ided ha he a icle is no al e ed o used comme cially. You a e no equi ed o ob ain pe mission
o dis ibu e his a icle, p o ided ha he o iginal wo k is p ope ly ci ed.
A d a n c e s i n M e c h a n i c a l a n d M a e i a l s E n g i n e e i n g
Volume 40, 2023, Pages 5-13
h ps://doi.o g/10.7862/ m.2023.1
O iginal Resea ch
Expe imen al Resea ch on he In luence o S uc u al
Modi ica ions o Adhe ends on he Load-Bea ing
Capaci y o Lap Join s o S235JR S eel Shee s
Władysław Zielecki 1 , Ka a zyna Łabno 2, Rysza d Pe łowski 1,* ,
Łukasz Bąk 3, Tomáš Ka ňák 4
1 Depa men o Manu ac u ing and P oduc ion Enginee ing, Rzeszow Uni e si y o Technology, al. Pows .
Wa szawy 8, 35-959 Rzeszów, Poland
2 Zakłady Mechaniczne Ta nów S.A., ul. Kochanowskiego 30, 33-100 Ta nów, Poland
3 Depa men o Ma e ials Fo ming and P ocessing, Rzeszow Uni e si y o Technology, al. Pows . Wa szawy
8, 35-959 Rzeszów, Poland
4 Ins i u e o Ae ospace Enginee ing, B no Uni e si y o Technology, An onínská 548/1, 601 90 B no, Czech
Republic
* Co espondence: [email p o ec ed]
Recei ed: 27 Augus 2022 / Accep ed: 22 No embe 2022 / Published online: 12 Janua y 2023
Abs ac
The pape p esen s he esul s o he esea ch de e mining he impac o s uc u al modi ica ions o adhe ends
on he load capaci y o he join s de e mined in he s a ic shea es . Tes s o adhesi e lap join s o S235JR
s eel shee s bonded wi h A aldi e 2014-2 epoxy adhesi e a e desc ibed. The in luence o echnologically sim-
ple s uc u al modi ica ions was in es iga ed; i consis ed in making no ches and holes a he leading edge o
he adhe ends. These modi ica ions we e aimed a b inging abou local lexibili y o he join in he sensi i e
a ea o s ess concen a ion. Based on expe imen al s udies, i was shown ha he e is a possibili y o inc eas-
ing he load-bea ing capaci y o he join due o he applied modi ica ions; in he mos a o able a ian , an
inc ease in he load-bea ing capaci y by 15.9% compa ed o he base a ian was demons a ed. The es s con-
i med ha he no ches illed wi h he adhesi e in he on pa o he adhe ends can signi ican ly imp o e
he s eng h p ope ies o join , while he conside ed modi ica ions in he o m o holes do no ha e a signi i-
can impac on he p ope ies o he adhe ends.
Keywo ds: adhesi e join s, s uc u al modi ica ion, s a ic shea es , S235JR s eel
1. In oduc ion
S uc u al adhesi e join s a e becoming mo e and mo e widely used, as hey enable joining ma e-
ials wi h di e en p ope ies. They a e used in composi e s uc u es combining a ious ma e ial p op-
e ies (Da is e al., 1999). The ype o join s conside ed is commonly used in he cons uc ion o he
means o anspo , especially in he au omo i e, a ia ion o ailways, because hey enable he p oduc-
ion o s uc u es wi h a ela i ely low weigh . Adhesi e join s a e no only used in manu ac u ing o
new p oduc s, bu a e also widely used in epai s, including a ia ion s uc u es (Da is e al., 1999).
The s eng h o adhesi e bonds depends on many ac o s, such as he me hod o su ace p epa a-
ion o adhe ends, he condi ions o bonding and ha dening he adhesi e, and he hickness o he ad-
hesi e laye (Ba czak e al., 2013; da Sil a e al., 2009; Da ies e al., 2009; Kadioglu & Adams,
2015; Ka achalios e al., 2013).
The ac o s in luencing he p ope ies o join s also include he geome ic ea u es o he ad-
he ends (da Sil a e al., 2011; Zhao e al., 2011). The mos impo an o hem a e he geome ical di-
mensions and he shape o he join , which ansla es in o he way i is loaded and he s i ness o he
adhe ends (Zhao e al., 2011).
6 W. Zielecki e al.
Ad ances in Mechanical and Ma e ials Enginee ing, Volume 40, 2023, Pages 5-13
A gene al ecommenda ion o he design o adhesi e join s de e mines he shape o he join s so
ha hey a e domina ed by shea s esses.
In eali y, howe e , he e is usually no pu e shea in lap join s. Usually he e appea s a complex
s a e o s esses, in which an impo an ole is also played by no mal s esses, causing an un a ou able
s a e o peeling (da Sil a e al., 2009).
A he on edges o he loaded lap join , a s ess concen a ion occu s (da Sil a e al., 2009),
which usually ini ia es he ailu e o he join . The amoun o accumula ion depends p ima ily on he
s i ness o he adhe ends and he p ope ies o he adhesi e.
In he li e a u e, he e a e a ious me hods aimed a limi ing s ess concen a ion a he leading
edges o he join . Godzimi ski (2002) sugges s making a g oo e (unde cu ) along he edge o he ad-
hesi e join as one o he me hods o educing he concen a ion o s esses. Such a p ocedu e, despi e
weakening he adhe ends, educes he alue o s esses in he join and mo es he maximum s ess
away om he edge o he join .
In he adhesi e joining echnology, i he e is no such equi emen , i is ecommended no o e-
mo e he adhesi e lashes. Many au ho s ha e shown ha lashes ha e a posi i e e ec on s ess dis-
ibu ion (Belinga di e al., 2002; Godzimi ski, 2002). They uni y and educe he maximum s ess
alues in he nea -edge zone o he join . The au ho s o esea ch wo ks (Belinga di e al., 2002; Lang
and Mallick, 1998; Risple e al., 2000; Wang e al., 1998) showed ha he addi ional applica ion o
adhesi e beyond he ou line o he main lap join , which inc eases he spew, inc eases he s eng h.
An addi ional me hod o educing he nea -edge s ess concen a ion in lap join s is o inc ease he
hickness o he adhesi e laye in his zone. A numbe o scien i ic wo ks aise he issue o he app o-
p ia e shaping o adhe ends, which aims o inc ease he hickness o he adhesi e laye locally in he
a ea o s ess concen a ion (da Sil a & Adams, 2007; Kaye & Helle , 2002; Kim e al., 2001; Lang
and Mallick, 1999; Mazumda & Mallick, 1998). These modi ica ions may include, in e alia, he ap-
plica ion o cham e o ille on he leading edge o adhe end (Belinga di e al.2002; You e al., 2007;
Zielecki e al., 2017). Thanks o his, local lexibili y o he join in he sensi i e a ea is in oduced.
The au ho s o he wo k (Belinga di e al., 2002) conduc ed FEM analyzes o be elled edges o
adhe ends. The analyzes conce n he in luence o he be el angle on he dis ibu ion o angen ial and
no mal s esses in a single- old join o adhe ends o di e en hickness. Wi h he p oposed modi ica-
ions, clea bene i s can be no iced, ela ed no only o he lowe ing o he maximum angen ial s ess-
es, bu also o he uni o mi y o he dis ibu ion in he sensi i e zone.
Simila analyzes we e ca ied ou by You e al. (2007), who suppo ed hese conside a ions wi h
expe imen al esea ch. They con i med he possibili y o imp o ing he s eng h o adhesi e lap join s
wi h s uc u al modi ica ions. In he mos p e e ed cases, an inc ease in he shea s eng h o abou
20% (You e al., 2007) is ob ained.
S uc u al modi ica ions consis ing in making a adius in he join nea -edge zones we e consid-
e ed by Lucas (2011). Conside a ions om he publica ion (Lucas, 2011) also apply o he shea lap
join . Va ious dimensions o he adius we e conside ed he e, oge he wi h adhesi es wi h di e en
modulus o elas ici y. In he mos p e e ed a ian s, an inc ease in he shea s eng h o abou 40%
was demons a ed.
On he basis o he li e a u e e iew, i wha was no iced was he need o ela i ely simple ways
o in oducing s uc u al changes ha do no equi e a signi ican inc ease in echnology cos s, which
would con ibu e o he imp o emen o he p ope ies o he join s.
In his pape , expe imen al es s we e ca ied ou on s uc u al adhesi e join s wi h s uc u al
modi ica ions o he on pa o he adhe ends. The modi ica ions consis ed in in oducing simple
no ches and holes a he edges o shee s o a ious sizes. The aim o he s udy was o show whe he
his ype o ela i ely echnologically simple modi ica ion o join s can con ibu e o he local lexibil-
i y o he adhesi e join in he sensi i e zone, whe e s ess concen a ion occu s.
2. Ma e ial and me hods
The esea ch on he impac o s uc u al modi ica ions aimed a educing s ess concen a ion in
he on al a ea o he adhesi e join was ca ied ou o adhesi e lap join s wi h he dimensions shown
in Fig. 1a. Bo h adhe ends we e made o S235JR shee s eel wi h a hickness o 2 mm. The shape and
dimensions o he conside ed s uc u al modi ica ions in he o m o no ches a he leading edge o he
adhe end a e shown in Fig. 1b, while he modi ica ions in he o m o holes a e shown in Fig. 1c. As
s uc u al modi ica ions, a ian s wi h he inden a ions o 1 mm, 2 mm and 3 mm widd and leng hs: 1
Expe imen al Resea ch on he In luence o S uc u al Modi ica ions o Adhe ends on he Load-Bea ing Capaci y… 7
Ad ances in Mechanical and Ma e ials Enginee ing, Volume 40, 2023, Pages 5-13
mm, 2 mm, 3 mm and 4 mm we e used. Modi ica ions in he o m o holes wi h he diame e s o 2
mm, 3 mm and 4 mm we e also es ed. A de ailed speci ica ion o he modi ica ion dimensions a he
leading edge o he adhe ends is p esen ed in Table 1. As pa o he esea ch, only symme ical join s
we e es ed, i.e. in each a ian , bo h adhe ends had iden ical modi ica ions.
No ches and holes in he on pa o he adhe ends we e made by machining. The no ches we e
made using disc cu e s wi h he hickness co esponding o he wid h o he no ches, while he holes
we e made using d ills.
The join was made using he epoxy adhesi e A aldi e 2024-2 (supplied by Hun sman Co po a-
ion, Texas USA).
a)
b)
c)
Fig. 1. The shape and dimensions o he samples o adhesi e lap join s used in he es s in he basic e sion (a) and he shape
and dimensions o s uc u al modi ica ions in he on pa o he adhe ends in he o m o no ches (b) and holes (c)
The same me hods o su ace p epa a ion and ha dening condi ions o he adhesi e composi ion
we e applied o all join a ian s. Each su ace o be joined was subjec ed o ab asi e blas ing wi h
aloxi e 95A, which con ains 96% aluminium oxide (Al2O3), ~3% i anium dioxide (TiO2) and 1-2%
o he admix u es. Ab asi e blas ing was pe o med unde he ollowing condi ions: g ain size wz =
0.27 mm, ai p essu e p = 0.8 ± 0.1 MPa, and blas ing ime = 60 s.
Table 1. Summa y o dimensions o s uc u al modi ica ions o indi idual a ian s o samples
Va ian
No ch wid h
(W in mm)
No ch leng h
(L in mm)
Hole diame e
(D in mm)
Pi ch
(P in mm)
Loca ion o he
holes
(L in mm)
Base
-
-
-
-
-
Na ow
no ch
N-1x1
1
1
-
6.5
-
N-1x2
1
2
-
6.5
-
N-1x3
1
3
-
6.5
-
N-1x4
1
4
-
6.5
-
Medium
no ch
N-2x1
2
1
-
6.5
-
N-2x2
2
2
-
6.5
-
N-2x3
2
3
-
6.5
-
N-2x4
2
4
-
6.5
-
Wide no ch
N-3x1
3
1
-
6.5
-
N-3x2
3
2
-
6.5
-
N-3x3
3
3
-
6.5
-
N-3x4
3
4
-
6.5
-
Hole
H-2
-
-
2
6.5
2
H-3
-
-
3
6.5
2.5
H-4
-
-
4
6.5
3
Su ace mo phology o he adhe ends was measu ed wi h he Talysu CCI Li e 3D op ical p o il-
e (Taylo Hobson L d., Leices e , Uni ed Kingdom). Figu e 2 p esen s su ace mo phology o he
adhe ends a e he sand blas ing p ocess.
8 W. Zielecki e al.
Ad ances in Mechanical and Ma e ials Enginee ing, Volume 40, 2023, Pages 5-13
Fig. 2. Su ace mo phology o he adhe ends a e he sand blas ing p ocess
The alues o basic su ace oughness pa ame e s a e as ollows: a i hme ical mean heigh Sa =
1.55 µm, oo mean squa e de ia ion Sq = 3.92 µm, ku osis Sku = 4.98, skewness Ssk = -0.447, max-
imum p o ile peak heigh Sp = 24.6 µm, maximum heigh Sz = 60.0 µm and maximum p o ile alley
dep h S = 35.4 µm.
The ha dening p ocess o he adhesi e-bonded join s las ed o 24 h a oom empe a u e 20 ± 3
°C unde a cons an p essu e o 0.1 MPa applied o he join a ea.
The in es iga ion o he load capaci y o he join by ensile/shea es s was ca ied ou using a
ZWICK Roell Z-100 uni e sal es ing machine (Zwick/Roell GmbH & Co. KG, Ulm, Ge many) wi h
he cons an c osshead speed o 5 mm/min a ambien empe a u e. The esea ch was ca ied ou o
i e epe i ions o each a ian .
The mo phologies o he ac u e su aces o he adhesi e join s we e examined using an scanning
elec on mic oscope (SEM) Phenom P oX (Nanoscience Ins umen s, Phoenix, AZ, USA).
3. Resul s and discussion
Figs. 3a-c show ep esen a i e cu es om s a ic shea es s o join s o each o he a ian s o
he applied modi ica ions in compa ison o he basic a ian . In Fig. 3a he shea cu es o he samples
om na ow no ch o di e en leng hs we e ela ed o he base a ian . He ein, in selec ed cases, a
highe load capaci y o he join s was obse ed, and in each a ian wi h a modi ica ion, a sligh ly
highe s i ness o he join in ela ion o he base a ian was also obse ed. Simila phenomena we e
demons a ed o he a ian s o medium no ch and wide no ch.
On he o he hand, in he case o s uc u al modi ica ions consis ing in making holes, no signi i-
can di e ences we e e ealed in he s eng h and s i ness o join s in ela ion o he base a ian .
The discussion o he possible mechanisms o ailu e o join s a ec ing he na u e o he mecha-
nism o s a ic shea cu es o indi idual a ian s will be ca ied ou on he basis o ac og aphic ana-
lyzes.
Diag am shown in Fig. 4 summa izes he indi idual es esul s o indi idual samples along wi h
he mean alue o each a ian and he alue o he s anda d de ia ion. The highes inc ease in he
load capaci y o he join in ela ion o he base a ian was demons a ed o he no ch medium, spe-
ci ically o he N-3x1 a ian . In his case, he a e age alue o he load capaci y o he join in-
c eased by abou 15.9%, as o he a ian unde conside a ion i was 8634.04 N, while o he base
a ian , his alue is 7446.95 N. I should be no ed ha he dispe sion o he load capaci y esul s was
also inc eased he e, because o he a ian N-3x1 he s anda d de ia ion alue was 381.6 N, while o
he base a ian , he s anda d de ia ion was 201.5 N. The inc ease in he sp ead o s eng h esul s was
obse ed o mos a ian s wi h s uc u al modi ica ions. The la ges sca e ing o esul s in ela ion o
he base a ian was shown o he a ian wi h holes, namely H-3, whe e he s anda d de ia ion was
982.9 N and he a e age alue o he load capaci y o his a ian was 7033.12 N.
I should be no ed ha om he echnological poin o iew, accu a e illing o he no ches wi h
adhesi e is di icul o ob ain, hence in many cases qui e signi ican sca e ing o he s eng h esul s
was demons a ed. Addi ionally, illing ce ain olumes wi h adhesi e mass c ea es he possibili y o
he occu ence o oids, ai bubbles in hese olumes, which may be andom, and undoub edly a ec
he epea abili y o he es esul s.
Expe imen al Resea ch on he In luence o S uc u al Modi ica ions o Adhe ends on he Load-Bea ing Capaci y… 9
Ad ances in Mechanical and Ma e ials Enginee ing, Volume 40, 2023, Pages 5-13
Fig. 3. Shea load-displacemen ep esen a i e s a ic es cu es o adhesi e join s wi h s uc u al modi ica ions in ela ion o
he base a ian , o he ollowing ypes o modi ica ions: na ow no ch (a), medium no ch (b), wide no ch (c) and hole (d)
Fig. 4. E ec o he geome y o s uc u al modi ica ions on load capaci y o adhesi e join s
Howe e , in he case o one o he a ian s wi h a s uc u al modi ica ion, namely N-1x1, high e-
pea abili y o he esul s was demons a ed du ing he es s, because in his case he a e age load ca-
paci y o he join was 7834.13 N wi h he s anda d de ia ion equal o 61.62 N. I should be no ed ha
his is he a ian wi h he smalles no ch dimensions ha we e conside ed, namely he olume o he
no ches which is illed wi h he adhesi e, has he dimensions o 1×1×2 mm. Wi h such a small ol-
ume, i is easy o comple ely and epe i i ely ill he space wi h adhesi e; he p obabili y o de ec s
a)
b)
c)
d)

10 W. Zielecki e al.
Ad ances in Mechanical and Ma e ials Enginee ing, Volume 40, 2023, Pages 5-13
such as oids occu ing in hese olumes is educed, hence he high epea abili y o he es esul s is
ensu ed.
On he basis o ac og aphic analyzes, an a emp was made o de e mine he phenomena in lu-
encing he inc ease in s eng h o he selec ed join a ian s. The analyzes we e s a ed wi h he
no ched a ian s, as his modi ica ion esul ed in a signi ican inc ease in he s eng h o he join . Fig.
5 shows images o he ac u e su ace o he N-2x4 a ian showing he bo de be ween he shee
su ace and he no ch illed wi h adhesi e. The SEM mic og aph shows a clea di e ence in he na u e
o he ac u e o he adhesi e in he a ea o he no ch and he shee su ace. In he case o ailu e o
he join in he a ea o he shee , a ypical ailu e o he adhesi e join was obse ed due o shea ing o
a hin laye o adhesi e o abou 0.1 mm hickness. In his case, he e is essen ially cohesi e ailu e,
al hough agmen s o adhesi e ailu e can also be seen in small a eas a he leading edge o he shee .
A simila cha ac e o ailu e occu s wi h he basic a ian (Fig. 6a), while in his case no a eas o ad-
hesi e ailu e we e obse ed. A comple ely di e en cha ac e o he c acking akes place in he no ch
a ea; in his case he ac u e is cha ac e ized by a ailu e mechanism ypical o he s e ching o
he mose s, whe e he ac u e o adhesi e a b i le cha ac e . In he a ea o he no ch, he ha dened
adhesi e has a hickness ha is much g ea e han ha o he adhesi e join , i.e. close o he hickness
o he shee , i.e. 2 mm. In he conside ed a eas o med by he adhesi e- illed no ches, a di e en , low-
e join s i ness occu s locally, which esul s in a change in he s ess dis ibu ion. The local lexibili y
o he on join a ea is ad an ageous due o he s ess concen a ion ypical o his ype o join . I is
in his phenomenon ha he inc ease in s eng h o a ian s wi h no ches should be seen. A he same
ime, as p e iously obse ed, he echnological p oblem o uni o m illing o he olume o no ches
and holes wi h adhesi e may ansla e in o an inc ease in he sca e o es esul s. On he one hand,
he g ea e he olumes o med by he no ches, he g ea e he lexibili y o he join , bu on he o he
hand, he la ge olumes illed wi h he adhesi e mass inc ease he likelihood o he a o emen ioned
d awbacks, such as ai bubbles, oids, e c.
In he case o s uc u al modi ica ions consis ing in making ound holes a he on edges o he
adhe ends, no signi ican e ec on he s eng h o he join was demons a ed. Fig. 6b shows he mi-
c og aphs o he ac u e su ace o he H-4 a ian . Based on he SEM image, i can be concluded
ha in his case he e was no signi ican di e ence in he mechanism o ailu e o he join in he a ea
o he shee su ace and he hole illed wi h adhesi e. In he case o no ches, he adhesi e ha ills he
no ch olume has one deg ee o eedom, i.e. i s e ches in he di ec ion o he join loading. On he
o he hand, he adhesi e closed in a hole made in s eel ha ing signi ican ly highe s i ness han he
ha dened adhesi e ma e ial, has no possibili y o s e ching. The e o e, such a s uc u al modi ica ion
does no ha e a signi ican impac on he s ess dis ibu ion a he leading edge o he join - he adhe-
si e illing he holes is shea ed in he join plane.
Fig. 5. Mic og aphs o he ac u e su aces o a ian : medium no ch 4 mm leng h
To sum up, a signi ican po en ial o inc ease he s a ic s eng h o he adhesi e join by se e al
pe cen hanks o making he on pa o he join mo e lexible has been demons a ed. The issue
equi es u he op imiza ion s udies aimed a indica ing he op imal dimensions and shapes o no ch-
es. The issue o echnology also equi es de elopmen , because in o de o ensu e he epea abili y o
Expe imen al Resea ch on he In luence o S uc u al Modi ica ions o Adhe ends on he Load-Bea ing Capaci y… 11
Ad ances in Mechanical and Ma e ials Enginee ing, Volume 40, 2023, Pages 5-13
he s eng h o join s, i is necessa y o ill he space in he no ches in such a way so as o ensu e uni-
o m mechanical p ope ies.
a)
b)
Fig. 6. Mic og aphs o he ac u e su aces o base (a) and hole wi h a diame e o 4 mm (b)
4. Conclusions
The aim o he wo k was o demons a e, on he basis o expe imen al s udies, he possibili y o
inc easing he s uc u al load-bea ing capaci y o S235JR s eel adhesi e join s by making ela i ely
easy s uc u al modi ica ions o he adhe ends. Based on he esea ch wo k ca ied ou , he ollowing
conclusions we e d awn:
• Due o he applica ion o ela i ely easy- o-implemen s uc u al modi ica ions, he load-
bea ing capaci y o adhesi e lap join s can be imp o ed. As pa o he esea ch, he highes
inc ease was shown o he a ian wi h 3 mm wide and 1 mm long no ches. In his case, he
a e age alue o he load capaci y o he join inc eased by abou 15.9%, as o he a ian un-
de conside a ion i was 8634.04 N, while o he base a ian , his alue is 7446.95 N.
• The inc ease in he load capaci y o he join s was demons a ed only o he a ian s wi h
no ches, while no signi ican changes in he load capaci y we e obse ed o he a ian s wi h
openings a he leading edge o he adhe ends.
• The inc ease in load capaci y o a ian s wi h s uc u al modi ica ions in he o m o no ches
is caused by he local elas ici y o he on pa o he join , whe e s ess concen a ion occu s.
In he a ea o he no ches, he adhesi e illing unde goes a di e en des uc ion mechanism
han he hin laye o adhesi e shea ed be ween he shee su aces.
• In mos cases, o a ian s wi h s uc u al modi ica ions, he s anda d de ia ion o he es e-
sul s was inc eased. The la ges dispe sion o esul s in ela ion o he base a ian was shown
o he a ian wi h holes wi h he diame e o 3 mm, whe e he s anda d de ia ion was 982.9
12 W. Zielecki e al.
Ad ances in Mechanical and Ma e ials Enginee ing, Volume 40, 2023, Pages 5-13
N and he a e age alue o he load capaci y was 7033.12 N, while o he base a ian he
alue o he s anda d de ia ion was 201.5 N o he a e age alue o he load capaci y o he
join s equal o 7446.95 N.
• Inc easing he dispe sion o he esul s is caused by a echnological p oblem, because illing
he no ches and holes wi h adhesi e mass c ea es he possibili y o he occu ence o oids, ai
bubbles in hese olumes, which may be andom and has a signi ican impac on he epea a-
bili y o he es esul s.
Acknowledgemen s
This wo k was suppo ed by Polish Na ional Agency o Academic Exchange, p ojec i le: „Re-
sea ch in o inno a i e o ming and joining me hods o hin-walled componen s”, p ojec numbe :
BPN/BSK/2021/1/00067/U/00001.
Re e ences
Ba czak, B., Mucha, J., & T zepieciński, T. (2013). S ess dis ibu ion in adhesi ely-bonded join s and he load-
ing capaci y o hyb id join s o ca body s eels o he au omo i e indus y. In e na ional Jou nal o Adhe-
sion and Adhesi es, 45, 42–52. h ps://doi.o g/10.1016/j.ijadhadh.2013.03.012
Belinga di, G., Goglio, L., & Ta di i, A. (2002). In es iga ing he e ec o spew and cham e size on he s esses
in me al/plas ics adhesi e join s. In e na ional Jou nal o Adhesion and Adhesi es, 22(4), 273–282.
h ps://doi.o g/10.1016/S0143-7496(02)00004-0
Da ies, P., Sohie , L., Cogna d, J. Y., Bou maud, A., Choqueuse, D., Rinne , E., C éac’hcadec, R. (2009). In-
luence o adhesi e bond line hickness on join s eng h. In e na ional Jou nal o Adhesion and Adhesi es,
29(7), 724–736. h ps://doi.o g/10.1016/j.ijadhadh.2009.03.002
Da is, M. J., & Bond, D. (1999). P inciples and p ac ise o adhesi e bonded s uc u al join s and epai s. In e -
na ional Jou nal o Adhesion and Adhesi es, 19(2-3), 91–105. h ps://doi.o g/10.1016/S0143-
7496(98)00026-8
Godzimi ski, J. (2002). Wy zymałość do aźna kons ukcyjnych połączeń klejowych [Ul ima e s eng h o s uc-
u al adhesi e join s]. Wydawnic wa Naukowo-Techniczne.
Kadioglu, F., & Adams, R. D. (2015). Flexible adhesi es o au omo i e applica ion unde impac loading. In-
e na ional Jou nal o Adhesion and Adhesi es, 56, 73–78. h ps://doi.o g/10.1016/j.ijadhadh. 2014. 08.001
Ka achalios, E. F., Adams, R. D., & da Sil a, L. F. M. (2013). The beha iou o single lap join s unde bending
loading. Jou nal o Adhesion Science and Technology, 27(16), 1811–1827.
h ps://doi.o g/10.1080/01694243.2012.761926
Kaye, R. H., & Helle , M. (2002). Th ough- hickness shape op imisa ion o bonded epai s and lap-join s. In e -
na ional Jou nal o Adhesion and Adhesi es, 22(1), 7–21. h ps://doi.o g/10.1016/S0143-7496(01)00029-X
Kim, J. S., Kim, C. G., & Hong, C. S. (2001). P ac ical design o ape ed composi e s uc u es using he manu-
ac u ing cos concep . Composi e S uc u es, 51, 285–299. h ps://doi.o g/10.1016/S0263-8223(00)00145-
8
Lang, T., & Mallick, K. (1998). E ec o spew geome y on s esses in single lap adhesi e join s. In e na ional
Jou nal o Adhesion and Adhesi es, 18(3), 167–177. h ps://doi.o g/10.1016/S0143-7496(97)00056-0
Lang, T., & Mallick, K. (1999). The e ec o ecessing on he s esses in adhesi ely bonded single-lap join s.
In e na ional Jou nal o Adhesion and Adhesi es, 19(4), 257–271. h ps://doi.o g/10.1016/S0143-
7496(98)00069-4
Lucas, F. M. (2011). Design Rules and Me hods o Imp o e Join S eng h. Sp inge -Ve lag.
h ps://doi.o g/10.1007/978-3-642-01169-6_27
Mazumda , S. K., & Mallick, K. (1998). S a ic and a igue beha io o adhesi e join s in SMC-SMC composi es.
Polyme Composi es, 19(2), 139–146. h ps://doi.o g/10.1002/pc.10084
Risple , A. R., Tong, L., S e en, G. P., & Wisnom, M. R. (2000). Shape op imisa ion o adhesi e ille s. In e na-
ional Jou nal o Adhesion and Adhesi es, 20(3), 221–231. h ps://doi.o g/10.1016/S0143-7496(99)00047-
0
da Sil a, L. F. M., das Ne es P. J. C., Adams R. D., Spel , J.K. (2009). Analy ical models o adhesi ely bonded
join s – Pa I: li e a u e su ey. In e na ional Jou nal o Adhesion and Adhesi es, 29, 319–330.
h ps://doi.o g/10.1016/j.ijadhadh.2008.06.005
da Sil a, L. F. M., Ochsne , A., & Adams R. D. (Eds.). (2011). Handbook o adhesion echnology. Sp inge -
Ve lag.
da Sil a, L. F. M., & Adams, R. D. (2007). Techniques o educe he peel s esses in adhesi e join s wi h compo-
si es. In e na ional Jou nal o Adhesion and Adhesi es, 27(3), 227–235.
h ps://doi.o g/10.1016/j.ijadhadh.2006.04.001
Expe imen al Resea ch on he In luence o S uc u al Modi ica ions o Adhe ends on he Load-Bea ing Capaci y… 13
Ad ances in Mechanical and Ma e ials Enginee ing, Volume 40, 2023, Pages 5-13
Wang, C. H., Helle , M., & Rose, L. R. F. (1998). Subs a e s ess concen a ions in bonded lap join s. Jou nal o
S ain Analysis o Enginee ing Design, 33(5), 331–346. h ps://doi.o g/10.1243/0309324981513039
You, M., Yan, Z., Zheng, X., Yu, H., & Li, Z. A. (2007). A nume ical and expe imen al s udy o adhesi ely
bonded aluminium single lap join s wi h an inne cham e on he adhe ends. In e na ional Jou nal o Adhe-
sion and Adhesi es, 28(1-2), 71–76. h ps://doi.o g/10.1016/j.ijadhadh.2007.06.001
Zhao, X., Adams, R. D., da Sil a, L. F. M. (2011). Single lap join s wi h ounded adhe end co ne s: expe i-
men al esul s and s eng h p edic ion. Jou nal o Adhesion Science and Technology, 25(8), 837–856.
h ps://doi.o g/10.1163/016942410X520880
Zielecki, W., Kubi , A., Kluz, R., & T zepieciński, T. (2017). In es iga ing he in luence o he cham e and
ille on he high-cyclic a igue s eng h o adhesi e join s o s eel pa s. Jou nal o Adhesion Science and
Technology, 31(6), 627-644. h ps://doi.o g/10.1080/01694243.2016.1229521
Badania Ekspe ymen alne Wpływu Mody ikacji Kons ukcyjnych Ma e iałów Kle-
jonych na Nośność Złącza Zakładkowego Blach S alowych S235JR
S eszczenie
W a ykule p zeds awiono wyniki badań ok eślających wpływ mody ikacji kons ukcyjnych elemen ów kle-
jonych na nośność złączy wyznaczoną w s a ycznej p óbie ścinania. Opisano badania połączeń klejowych za-
kładkowych blach s alowych S235JR sklejonych klejem epoksydowym A aldi e 2014-2. Zbadano wpływ
p os ych echnologicznie mody ikacji kons ukcyjnych, polegających na wykonaniu nacięć i o wo ów na
k awędzi na a cia elemen ów klejonych. Mody ikacje e miały na celu dop owadzenie do miejscowego uela-
s ycznienia połączenia we w ażliwym obsza ze koncen acji nap ężeń. Na pods awie badań ekspe ymen al-
nych wykazano, że is nieje możliwość zwiększenia nośności złącza dzięki zas osowanym mody ikacjom. W
najko zys niejszym wa iancie zaobse wowano wz os nośności o 15,9% w s osunku do wa ian u niemody i-
kowanego kons ukcyjnie. Badania po wie dziły, że wypełnione p zez klej nacięcia w p zedniej części ele-
men ów klejonych mogą znacząco pop awić właściwości wy zymałościowe złącza, na omias ozważane
mody ikacje w pos aci o wo ów nie mają is o nego wpływu na właściwości elemen ów klejonych.
Słowa kluczowe: połączenia klejowe, mody ikacja kons ukcyjna, s a yczna p óba ścinania, s al S235JR