Copy igh ©Au ho (s) 2025. All Righ s Rese ed. Published by Global Publica ion House | GPH-In e na ional Jou nal o Educa ional Resea ch
Teaching Business in a Digi al Wo ld: A TPACK-In o med
Phenomenological S udy on Cu iculum Alignmen wi h
Technology, Globaliza ion, and Sus ainabili y
By:
Ge y B. de Cadiz
*
1, , Leo Roswald M. Tugonon2, Nikki Shane M. Tugonon3
1 P o esso VI, Eas e n Visayas S a e Uni e si y, Philippines
2 Assis an P o esso I, Palompon Ins i u e o Technology, Philippines
3 Ins uc o s I, Palompon Ins i u e o Technology, Philippines
Abs ac
This phenomenological s udy explo ed how business educa o s na iga e cu iculum alignmen wi h echnology,
globaliza ion, and sus ainabili y wi hin he amewo k o Technological Pedagogical Con en Knowledge
(TPACK). The esea ch engaged 11 acul y membe s in business- ela ed p og ams h ough pu posi e sampling
and w i en in e iews. Thema ic analysis e ealed key disposi ional hemes: adap i e mindse owa d
echnological in eg a ion, global awa eness and cul u al sensi i i y, commi men o sus ainabili y and e hical
esponsibili y, esilience amids ins i u ional cons ain s, and an equi y-o ien ed pe spec i e on digi al access.
While eme ging echnologies such as AI, blockchain, and da a analy ics a e acknowledged, cu iculum
in eg a ion emains pa ial due o sys emic ba ie s like limi ed acul y aining, igid app o al p ocesses, digi al
di ide, and lack o ins i u ional suppo . S a egies cu en ly employed such as case s udies, simula ions, and
localized examples a e o en hinde ed by ou da ed in as uc u e and inconsis en acul y eadiness. ESG
p inciples a e p esen bu ea ed pe iphe ally, calling o deepe , sys emic embedding. The s udy concludes ha
ull TPACK in eg a ion is essen ial o equip educa o s wi h he abili y o deli e globally compe i i e,
echnologically luen , and sus ainabili y-d i en business educa ion. I ecommends a ge ed p o essional
de elopmen , cu icula inno a ion, and in as uc u e in es men s o b idge exis ing gaps. These insigh s
p o ide guidance o policymake s, academic leade s, and acul y in ans o ming business educa ion o mee
21s -cen u y demands.
Keywo ds:
TPACK F amewo k, Business Educa ion, Cu iculum Inno a ion, Digi al T ans o ma ion, Sus ainabili y
In eg a ion.
How o ci e: Cadiz, G. B., M. Tugonon, L. R., & M. Tugonon, N. S. (2025). Teaching Business in a Digi al
Wo ld: A TPACK-In o med Phenomenological S udy on Cu iculum Alignmen wi h Technology,
Globaliza ion, and Sus ainabili y. GPH-In e na ional Jou nal o Educa ional Resea ch, 8(9), 19-39.
h ps://doi.o g/10.5281/zenodo.17295005
*
Co esponding E-mail: ge y.decadiz@e su.edu.ph
ARTICLE ID: #02109
10.5281/ZENODO.17295005
E- 3050-9599
P- 2795-3264
Page 19 o 39
VOL. 08 ISSUE 09 SEPT. - 2025
Cadiz, G. B., M. Tugonon, L. R., & M. Tugonon, N. S. (2025). Teaching Business in a Digi al Wo ld: A TPACK-In o med
Phenomenological S udy on Cu iculum Alignmen wi h Technology, Globaliza ion, and Sus ainabili y. GPH-
In e na ional Jou nal o Educa ional Resea ch, 8(9), 19-39. h ps://doi.o g/10.5281/zenodo.17295005
© 2025 GPH | In e na ional Jou nal o Educa ional Resea ch | h ps://gphjou nal.o g/index.php/e
Impac s o he S udy
The s udy p o ides e idence-based insigh s o aligning business educa ion cu icula
wi h eme ging echnologies, sus ainabili y, and globaliza ion, enabling ins i u ions o
mode nize cou se con en sys ema ically.
I iden i ies speci ic gaps in acul y aining, o e ing a amewo k o designing
a ge ed p o essional de elopmen p og ams ha enhance echnological, pedagogical,
and con en expe ise.
Findings in o m highe educa ion policymake s on he s uc u al and sys emic ba ie s
o digi al and sus ainabili y in eg a ion, p omp ing go e nance e o ms and budge
p io i iza ion.
The esea ch highligh s he e ec s o he digi al di ide, p omo ing equi y-o ien ed
s a egies and esou ce alloca ion o ensu e all s uden s gain access o ele an digi al
ools and aining.
I ope a ionalizes he TPACK amewo k wi hin a localized, eal-wo ld educa ional
con ex in he Philippines, con ibu ing o schola ly discou se and u u e esea ch on
ech-in eg a ed pedagogy in business educa ion.
1. In oduc ion
The g owing demands o he digi al economy and sus ainabili y impe a i es necessi a e a
eexamina ion o business educa ion. The amewo k Technological Pedagogical Con en
Knowledge o e s a obus lens o unde s anding educa o s‘ capaci y o blend echnology,
pedagogy, and con en knowledge o add ess complex lea ning domains—digi al ools, global
business, and ESG in eg a ion (Nan ha, 2024).
Se oningsih (2023) demons a ed ha e en a seconda y le els, eache s wi hou
su icien TPACK s uggle o implemen digi aliza ion in sus ainable de elopmen con ex s,
unde sco ing he ele ance o TPACK o highe educa ion.
Tasdemi & Gazo (2020) had shown ha in eg a ion o sus ainabili y in cu icula has
shown posi i e ou comes when handled h ough ansdisciplina y amewo ks ha engage
s uden s in hands-on p oblem-sol ing, which sugges s oppo uni ies o business educa ion
e o m. These in e disciplina y and expe ien ial app oaches align wi h TPACK-in o med
pedagogy, emphasizing au hen ic engagemen wi h AI, ESG, and global con ex s.
Howe e , educa o s con inue o ace ba ie s, including insu icien p o essional
de elopmen , une en ins i u ional suppo , and digi al inequi ies. The s udy o
Mele iou‑Ma o he is & Papa is odemou (2024) highligh ed ha sys emic, communi y -
o ien ed acul y lea ning is mo e e ec i e han isola ed ini ia i es in building TPACK.
Global sus ainabili y in eg a ion o en emains agmen ed in cu icula due o ins i u ional
ine ia and lack o in as uc u e.
This s udy adop s a he meneu ic phenomenology design o deeply explo e educa o s
li ed expe iences in na iga ing cu iculum alignmen wi h eme ging echnologies, global
compe encies, sus ainabili y, and digi al equi y amed h ough TPACK. Such insigh s a e
essen ial o in o m a ge ed acul y de elopmen , policy measu es, and p ac ice-based
s a egies ha os e comp ehensi e, u u e- eady business educa ion.
While in e na ional s udies employing he TPACK amewo k demons a e i s alue
in enhancing educa o s' compe ence and eadiness o digi al ins uc ion, ew in es iga ions
ha e ocused on Philippine business educa ion speci ically.
Page No. 20
Teaching Business in a Digi al Wo ld: A TPACK-In o med Phenomenological S udy on Cu iculum Alignmen
wi h Technology, Globaliza ion, and Sus ainabili y
Volume 08 Issue 09 Sep 2025
Exis ing Philippine esea ch p ima ily a ge s K–12 o p e-se ice eache s o
example, Besa and Limpo (2023) e ealed ha while Filipino eache s exhibi high o e all
ins uc ional compe ence, hey s ill lag in TPACK eadiness o online eaching. Valle and
colleagues (2024) simila ly ound ha basic-educa ion eache s‘ echnological knowledge
and digi al na i i y a y signi ican ly by school clima e.
In highe educa ion, he li e a u e emains spa se. Though blended lea ning and LMS
adop ion a e eme ging in he coun y, challenges o unequal in as uc u e, acul y
p epa edness, and u ban– u al dispa i ies pe sis (Shim, 2021). The e is a no ed absence o
empi ical s udies examining how business acul y in Philippine uni e si ies enac TPACK
p inciples when in eg a ing eme ging echnologies (e.g., AI, blockchain), global business
compe encies, and sus ainabili y (ESG) con en especially unde he in luence o ins i u ional
ine ia and digi al inequi ies.
This s udy he e o e add esses a c i ical gap by explo ing, h ough he meneu ic
phenomenology, he li ed expe iences o Filipino business educa o s in aligning cu iculum
wi h TPACK-in o med pedagogy amid global, digi al, and sus ainabili y challenges.
Focusing on his unde - esea ched con ex enables a deepe unde s anding o bo h heo e ical
applica ion and p ac ical ensions inhe en in cu iculum inno a ion wi hin Philippine highe
educa ion.
The TPACK amewo k is especially pe inen o his s udy as i elucida es how
educa o s in eg a e echnological knowledge (TK), pedagogical knowledge (PK), and con en
knowledge (CK) when deli e ing business cu iculum ha includes AI, blockchain, global
compe encies, and ESG. The in e play among hese domains (TCK, TPK, PCK) and hei
in e sec ion (TPACK) p o ides a s uc u e o analyzing how acul y balance con en
expe ise, pedagogical s a egies, and digi al ools (Mena Guacas e al., 2025).
Li e a u e con i ms ha educa o s wi h s onge TPACK p o iciency mo e e ec i ely
in eg a e EdTech such as AI-enhanced ins uc ion imp o ing s uden engagemen and
lea ning ou comes, especially in con ex s in luenced by he digi al di ide (Wang & Choi,
2024). TPACK-in o med p o essional de elopmen os e s sus ainable eaching p ac ices by
b idging echnology and con en h ough collabo a i e, con ex -sensi i e s a egies
(K isna esan i e al., 2024). Applying TPACK in his phenomenological s udy will help
e eal how Philippine business educa o s in e p e and enac cu iculum inno a ions,
add essing ba ie s in global exposu e, ESG in eg a ion, and equi able digi al educa ion.
The s udy aligns di ec ly wi h UN SDG 4 Quali y Educa ion, pa icula ly Ta ge 4.7,
which emphasizes inco po a ing sus ainable de elopmen and global ci izenship in o
cu icula (Ou Wo ld in Da a, 2023). By applying he TPACK amewo k, he esea ch
enhances educa o s‘ capaci y o in eg a e digi al compe encies (SDG 4.4) wi hin business
educa ion, add essing he ICT skills gap (La ip e al., 2023).
Embedding sus ainabili y and ESG p inciples in cu icula suppo s b oade SDG goals
by os e ing esponsible leade ship and social/en i onmen al awa eness among u u e
business p o essionals (C ipps & Smi h, 2024). This s udy con ibu es o p epa ing globally
compe en , digi al- luen g adua es capable o ad ancing sus ainable and inclusi e economic
g ow h.
This s udy o e s aluable insigh s o policymake s, highe educa ion leade s, and
business acul y by iden i ying key challenges and a ge ed in e en ions in cu iculum
alignmen . Tu nell (2023) showed ha TPACK-in o med aining can e ec i ely suppo
educa o s‘ adop ion o digi al and blended pedagogies in pos -pandemic highe educa ion
con ex s.
The indings o Dziubaniuk and colleagues (2023) highligh ing in as uc u e
inequi ies and digi al li e acy gaps help policymake s alloca e esou ces o closing he digi al
Page No. 21
Cadiz, G. B., M. Tugonon, L. R., & M. Tugonon, N. S. (2025). Teaching Business in a Digi al Wo ld: A TPACK-In o med
Phenomenological S udy on Cu iculum Alignmen wi h Technology, Globaliza ion, and Sus ainabili y. GPH-
In e na ional Jou nal o Educa ional Resea ch, 8(9), 19-39. h ps://doi.o g/10.5281/zenodo.17295005
© 2025 GPH | In e na ional Jou nal o Educa ional Resea ch | h ps://gphjou nal.o g/index.php/e
di ide and enhancing ICT in as uc u e. Insigh s in o in eg a ing sus ainabili y h ough
digi al ools align wi h bes p ac ices in sus ainable business educa ion, suppo ing
ans o ma i e and collabo a i e pedagogies.
Fo acul y, iden i ying ba ie s o eaching AI, ESG, and global con en enables
p o essional de elopmen ha enhances TPACK domains con en , pedagogy, and echnology
imp o ing eaching e ec i eness and cu icula ele ance. The s udy in o ms e idence-based
policy, ins i u ional s a egy, and acul y educa ion s a egies o mode nize business cu icula
o digi al, globalized, and sus ainable u u es.
2. Objec i es
The p ima y objec i e o his s udy is o explo e and in e p e he li ed expe iences o
business educa ion acul y membe s in aligning hei cu iculum wi h he demands o digi al
ans o ma ion, globaliza ion, and sus ainabili y using he Technological Pedagogical Con en
Knowledge (TPACK) amewo k. The speci ic objec i es a e as ollows:
a. To examine he ex en o which business educa ion cu icula align wi h eme ging
echnologies such as a i icial in elligence, blockchain, and da a analy ics, and o iden i y
gaps in acul y p epa edness o digi al ins uc ion.
b. To assess he e ec i eness o cu en s a egies in eaching global business compe encies,
including cul u al in elligence, in e na ional law, and economic di e si y, in he absence
o global imme sion oppo uni ies.
c. To e alua e he in eg a ion o sus ainabili y and en i onmen al, social, and go e nance
(ESG) p inciples wi hin business p og ams and de e mine he ins i u ional ba ie s ha
hinde hei inclusion as co e cu icula componen s.
d. To in es iga e ins i u ional and sys emic ac o s con ibu ing o esis ance o cu iculum
e o m, pa icula ly in upda ing con en ela ed o digi al ans o ma ion and
sus ainabili y.
e. To analyze he impac o he digi al di ide on business educa ion deli e y and s uden
ou comes, ocusing on how access dispa i ies a ec he de elopmen o digi al luency
and hands-on echnological skills.
3. Me hodology
Figu e 1. The Thema ic Flow indica ing ha each Disposi ional Theme co e s In e en ial Themes wi h he
Unique Ini ial Codes, each segmen se ing as baseline o he incoming discussion and analysis.
This s udy adop s a he meneu ic phenomenological design o explo e how pu posi ely
sampled business educa ion acul y a Palompon Ins i u e o Technology in e p e and enac
Page No. 22
Teaching Business in a Digi al Wo ld: A TPACK-In o med Phenomenological S udy on Cu iculum Alignmen
wi h Technology, Globaliza ion, and Sus ainabili y
Volume 08 Issue 09 Sep 2025
cu iculum alignmen wi h echnology, globaliza ion, and sus ainabili y h ough he lens o
he TPACK amewo k (Ramsook, 2018). He meneu ic phenomenology is ideal o
examining educa o s‘ li ed expe iences, emphasizing in e p e i e meaning-making
embedded in pe sonal and his o ical con ex s (Knigh , 2022).
Ele en (11) business acul y membe s we e selec ed h ough pu posi e sampling
based on hei oles in cu iculum design and amilia i y wi h digi al, global, o sus ainabili y
opics. Pa icipan s comple ed w i en, semi-s uc u ed in e iews wi h open-ended ques ions
aligned o TPACK domains (TK, PK, CK, and in e sec ions) o explo e ich na a i e
accoun s o hei expe iences eaching eme ging echnologies, global compe encies, and ESG
in eg a ion. W i en esponses p omo e e lec i e dep h, allowing pa icipan s o elabo a e on
acul y de elopmen needs, ins i u ional cons ain s, and digi al equi y issues (Olms ead &
Tu pen, 2016).
The Thema ic Flow in Figu e 1 indica es he Disposi ional Themes (DT) wi h each
gene a ed In e en ial Themes (IT) and Unique Ini ial Codes based on he Ques ions (Q) o he
s udy (Pu is e al., 2024). I implied ha he business educa o s we e able o a icula e
expe iences in hei own e ms while allowing ime o deepe in ospec ion pa icula ly
e ec i e in sensi i e o bu eauc a ically nuanced con ex s (B aun & Cla ke, 2006). Analysis
ollowed a he meneu ic cycle in ol ing i e a i e eading, in e p e a ion, and e lec i e
w i ing (Kesha a z, 2020).
T ansla ed insigh s we e coded acco ding o TPACK domains and phenomena
eme ging om he ex . The esea che s‘ e lexi i y was documen ed ia a e lec i e jou nal,
acknowledging how o e-s uc u es shape in e p e a ions (La e y, 2003). Themes we e
e ined by dialogically mo ing be ween pa s (indi idual ansc ip s) and he whole ( he
coho ), ensu ing us wo hiness ia cyclical analysis (McLeod, 2025).
T iangula ion was applied by u ilizing a ious documen s, including policy di ec i es
and acul y eco ds, o s eng hen he alidi y and us wo hiness o he esul s (Bowen,
2009). Adhe ing o es ablished quali a i e esea ch p o ocols, e hical measu es such as
ob aining in o med consen , ensu ing pa icipan anonymi y, and main aining da a
con iden iali y we e igo ously upheld (O b e al., 2001).
4. Resul s and Discussion
Resul s e ealed pa ial cu iculum alignmen wi h eme ging echnologies, limi ed global
exposu e s a egies, and minimal in eg a ion o ESG p inciples. Facul y ace challenges in
digi al ins uc ion, cu iculum e o m, and access dispa i ies. Ins i u ional igidi y, inadequa e
aining, and he digi al di ide hinde e o s o deli e inclusi e, u u e- eady business
educa ion aligned wi h global s anda ds.
4.1. The P o ile o Business Educa o s
The s udy in ol ed 11 business educa ion acul y membe s om Palompon Ins i u e o
Technology, comp ising nine ull- ime and wo pa - ime ins uc o s. Mos held he ank o
Ins uc o I, wi h one pa icipan a he Ins uc o III le el. Thei assigned cou ses span a wide
ange o unde g adua e p og ams, including Bachelo o Science in Business Adminis a ion,
Bachelo o Science in Hospi ali y Managemen , Bachelo o Science in Ho el and Res au an
Technology, and Bachelo o Science in Indus ial Enginee ing.
The cou ses augh include co e business subjec s such as Ma ke ing Managemen ,
Cos Managemen , Supply Chain, S a egic Managemen , P oduc and Ope a ions
Managemen , Applied Economics, and Ad e ising, as well as specialized subjec s in
hospi ali y and ou ism, such as Quali y Se ice Managemen and Hospi ali y Ope a ions.
Page No. 23
Cadiz, G. B., M. Tugonon, L. R., & M. Tugonon, N. S. (2025). Teaching Business in a Digi al Wo ld: A TPACK-In o med
Phenomenological S udy on Cu iculum Alignmen wi h Technology, Globaliza ion, and Sus ainabili y. GPH-
In e na ional Jou nal o Educa ional Resea ch, 8(9), 19-39. h ps://doi.o g/10.5281/zenodo.17295005
© 2025 GPH | In e na ional Jou nal o Educa ional Resea ch | h ps://gphjou nal.o g/index.php/e
These cou se assignmen s e eal a b oad ep esen a ion o business and allied ields, which
p o ides ich, di e se pe spec i es o he s udy.
This academic p o ile is signi ican o he s udy as i ensu es ha he TPACK
amewo k is applied ac oss mul iple con en domains, no limi ed o a single business
specializa ion. The di e si y in subjec expe ise allows he esea ch o cap u e how educa o s
om di e en a eas o business educa ion engage wi h eme ging echnologies, global
con en , and sus ainabili y hemes.
The a ying academic anks highligh di e ences in ins i u ional expe ience and
au ho i y in cu iculum implemen a ion, e ealing dispa i ies in decision-making powe and
p o essional de elopmen access— ac o s ha di ec ly impac acul y eadiness and he
ins i u ion‘s abili y o align business cu icula wi h he demands o he digi al and global
economy.
4.2. Discussion o he Resul s
The esea che s ex ac ed Disposi ional Themes (main hemes) and co esponding In e en ial
Themes (sub hemes) om ansc ibed esponses by gene a ing Unique Ini ial Codes. This
coding p ocess enabled a nuanced in e p e a ion o he pa icipan s' li ed expe iences,
unco e ing deepe insigh s and ecu ing pa e ns. These hemes illumina ed how acul y
membe s na iga e eaching business- ela ed cou ses in a digi al con ex , using he TPACK
amewo k o align he cu iculum wi h he e ol ing demands o echnology, globaliza ion,
and sus ainabili y.
Table 1 p esen s he disposi ional hemes de i ed om acul y esponses, highligh ing
key a eas a ec ing cu iculum alignmen wi h eme ging echnologies. These include pa ial
in eg a ion, digi al p epa edness challenges, ins i u ional aining gaps, in as uc u e
limi a ions, sel -d i en adap a ion e o s, and inno a i e models adop ed by leading
ins i u ions o suppo echnological in eg a ion in business educa ion.
Table 1. Adap i e Mindse owa d Technological In eg a ion
Q1
To wha ex en does you business educa ion cu iculum align wi h eme ging
echnologies such as a i icial in elligence, blockchain, and da a analy ics, and wha
challenges do you encoun e in p epa ing you sel o digi al ins uc ion?
DT1
Adap i e Mindse owa d Technological In eg a ion
IT(n)
UIC(n)
P(n)
IT1-1
Pa ial o Mode a e
Cu iculum Alignmen
wi h Eme ging
Technologies
"Touches on eme ging ech"
P1
"Mode a ely aligned"
P2
"Limi ed in eg a ion"
P5
"Co e s some opics"
P7
"G owing in eg a ion in analy ics, AI, and blockchain"
P8
"Endea o s o in eg a e eme ging echnologies"
P11
IT1-2
Challenges in Facul y
Digi al P epa edness
"Lea ning o ac ually use he ools"
P1
"Some acul y lack iable digi al ideas"
P2
"Feel unp epa ed o echnical complexi y"
P4
"Need mo e knowledge in new ways o eaching"
P10
"E ol ing pedagogical compe encies"
P11
IT1-3
Ins i u ional Gaps in
T aining and Upskilling
"Co- acul y and ainings helped"
P3
"Insu icien hands-on, e hics-o ien ed aining"
P4
"Need s uc u ed, expe ien ial p o essional de elopmen "
P4
"Wi hou access o egula ainings and semina s"
P6
"Lack o esou ces o aining"
P7
"Con inuous upskilling is necessa y"
P11
IT1-4
"P in media and e e ence books"
P9
Page No. 24
Teaching Business in a Digi al Wo ld: A TPACK-In o med Phenomenological S udy on Cu iculum Alignmen
wi h Technology, Globaliza ion, and Sus ainabili y
Volume 08 Issue 09 Sep 2025
Resou ce Cons ain s
"Limi ed access o ad anced digi al in as uc u e"
P11
IT1-5
Sel -d i en E o s and
Commi men o
Adap a ion
"Sel -lea ning helps"
P6
"Commi ed o b idging his gap"
P11
"P oac i e adap a ion and p o essional de elopmen "
P11
IT1-6
Eme ging Ins i u ional
Models o In eg a ion
"Mapúa, AIM, and Asia Paci ic College examples"
P4
"CMU Aus alia upskilling ini ia i e"
P4
"P oac i e cu iculum design and eal-wo ld applica ion"
P8
IT1-1 This heme e lec s he a ying deg ees o in eg a ion o a i icial in elligence,
blockchain, and da a analy ics in business educa ion cu icula. Pa icipan s commonly no ed
ha while eme ging echnologies a e in oduced, hey a e o en no deeply embedded in o
co e ins uc ion. Educa o s acknowledge hese echnologies' impo ance bu also highligh he
gap be ween heo e ical men ion and p ac ical applica ion. This pa ial alignmen sugges s a
cu icula lag behind apidly e ol ing indus y demands. Such alignmen is u he in luenced
by ex e nal p essu es, including acc edi a ion s anda ds and ou da ed syllabi, limi ing
ins i u ions' abili y o inco po a e cu ing-edge con en . The heme indica es a need o
in en ional cu iculum e o m ha p io i izes digi al ele ance.
IT1-2 Many pa icipan s e ealed a lack o eadiness in using eme ging digi al ools
o ins uc ion. This includes bo h echnological and pedagogical dimensions. Some
educa o s exp essed a s eep lea ning cu e in unde s anding and applying AI o da a ools in
eaching, highligh ing a gap in Technological Knowledge (TK) and Technological
Pedagogical Knowledge (TPK) as concep ualized in he TPACK amewo k. The unce ain y
and anxie y su ounding echnological in eg a ion a e compounded by he as -paced na u e
o digi al inno a ion, making i di icul o acul y o s ay upda ed. This heme unde sco es
he u gency o s uc u ed p o essional lea ning ini ia i es ha a e con ex ualized and
discipline-speci ic.
IT1-3 Facul y na a i es indica e ha exis ing ins i u ional suppo o digi al
upskilling is o en eac i e and agmen ed. While some educa o s eso o sel -s udy, mos
emphasized he need o sus ained and expe ien ial aining p og ams, such as wo kshops,
boo camps, o indus y ce i ica ions. The absence o such p og ams limi s oppo uni ies o
hands-on p ac ice and con idence-building in eaching wi h echnology. Addi ionally, some
ins i u ions lack clea oadmaps o policies o suppo con inuous p o essional de elopmen .
This heme highligh s he sys emic na u e o digi al eadiness and poin s o he impo ance o
ins i u ional accoun abili y in os e ing inno a ion.
IT1-4 Ano he c i ical conce n is he dispa i y in access o adequa e digi al
in as uc u e. Pa icipan s ci ed ou da ed compu e s, limi ed in e ne bandwid h, and eliance
on p in -based ma e ials. These cons ain s a e especially p onounced in esou ce-limi ed
ins i u ions and u al se ings. The lack o in es men in ha dwa e, so wa e, and s able
connec i i y impedes bo h eaching and lea ning. This heme calls o equi y-based
in as uc u e planning and unding alloca ion ha suppo s echnology in eg a ion in unde -
esou ced ins i u ions.
IT1-5 Despi e sys emic challenges, se e al educa o s displayed esilience and
ini ia i e in adap ing o echnological changes. Sel -lea ning, pee collabo a ion, and
pa icipa ion in ee webina s o MOOCs we e men ioned as s a egies o b idge compe ency
gaps. This heme illus a es he in insic mo i a ion among educa o s o emain ele an and
e ec i e. I also e lec s he e hical commi men o p epa e s uden s o a digi al wo k o ce,
e en in he absence o ins i u ional suppo .
IT1-6 Some pa icipan s ci ed bes p ac ices om ins i u ions like Mapúa Uni e si y
and AIM, which ha e embedded AI modules and os e ed acul y upskilling h ough global
pa ne ships. These cases ep esen o wa d- hinking models o in eg a ing echnology in
Page No. 25
Cadiz, G. B., M. Tugonon, L. R., & M. Tugonon, N. S. (2025). Teaching Business in a Digi al Wo ld: A TPACK-In o med
Phenomenological S udy on Cu iculum Alignmen wi h Technology, Globaliza ion, and Sus ainabili y. GPH-
In e na ional Jou nal o Educa ional Resea ch, 8(9), 19-39. h ps://doi.o g/10.5281/zenodo.17295005
© 2025 GPH | In e na ional Jou nal o Educa ional Resea ch | h ps://gphjou nal.o g/index.php/e
business cu icula. The heme sugges s ha collabo a i e models be ween academia and
indus y can accele a e echnological adap a ion and in o m scalable policy in e en ions o
o he ins i u ions.
Table 2 p esen s he in e en ial hemes on s a egies used by acul y o de elop
s uden s' global business compe encies. These hemes highligh he eliance on heo e ical
ins uc ion, mode a e e ec i eness, use o localized simula ions, inno a ion wi h limi ed
esou ces, acul y de elopmen needs, and s uden engagemen as a measu e o ins uc ional
success in non-imme si e con ex s.
Table 2. Global Awa eness and Cul u al Sensi i i y.
Q2
How e ec i e a e you cu en s a egies in de eloping s uden s' global business
compe encies, including cul u al in elligence, in e na ional law, and economic
awa eness, especially in he absence o global exposu e o imme sion p og ams?
DT2
Global Awa eness and Cul u al Sensi i i y
IT(n)
UIC(n)
P(n)
IT2-1
Theo e ical S eng h bu
Expe ien ial De ici
―Tough o de elop global business skills wi hou eal-wo ld
exposu e‖
P1
―Mos ly heo e ical… missing he ‗how‘ ha comes om eal-li e
business si ua ions‖
P6
―Ha de o s uden s o ully de elop cul u al in elligence wi hou
imme sion‖
P7
―No able gap in so -skill de elopmen … cul u al nuance,
adap abili y‖
P8
―Signi ican limi a ion… absence o di ec global exposu e‖
P11
IT2-2
Mode a ely E ec i e
and Inc emen al
S a egies
―Sligh ly e ec i e… can be imp o ed i acul y ha e upda ed
knowledge‖
P2
―Mode a ely e ec i e in helping shape s uden s‘ compe encies‖
P5
―Cu en s a egies… mode a ely e ec i e in heo y and
collabo a ion‖
P8
―Reasonably e ec i e… bu limi ed by lack o imme sion‖
P11
IT2-3
Use o Localized Global
Simula ions and Case
S udies
―C oss-cul u al case s udies and locally adap ed global business
modules‖
P4
―PEST/SWOT exe cises g ounded in Philippine and ASEAN
con ex s‖
P4
―Class oom discussions and simula ions‖
P7
―In eg a ed cou sewo k in in e na ional law and economics‖
P11
IT2-4
Ins uc ional Inno a ion
and Resou ce
Maximiza ion
―Go beyond Philippine se ing wi h global examples‖
P10
―AI may be help ul i inco po a ed in o day- o-day lessons‖
P9
―Tech-enabled and human-connec ed lea ning me hods needed‖
P8
―Vi ual collabo a ions… simula e in e na ional con ex s‖
P11
IT2-5
Facul y De elopmen
and Capaci y Building
Needs
―S a egies may imp o e i acul y ha e upda ed knowledge and
skills‖
P2
―Ins uc o s unde going a ge ed wo kshops‖
P4
―Canno ully assess… s ill new o ole‖
P5
IT2-6
S uden Engagemen
―S uden s we e ecep i e… able o comply wi h equi emen s‖
P3
IT2-1 Facul y pa icipan s consis en ly emphasized ha while hei eaching s a egies
inco po a e essen ial heo e ical componen s such as cul u al in elligence, in e na ional law,
and global economic p inciples hey all sho in deli e ing expe ien ial lea ning. Wi hou
access o in e na ional imme sion, c oss-bo de collabo a ions, o eal-wo ld global exposu e,
s uden s o en g asp he ―wha ‖ and ―why‖ o global business, bu miss he ―how.‖ This
heme e lec s a c i ical gap in he o ma ion o au hen ic global compe encies. S uden s may
be amilia wi h amewo ks, bu lack he li ed unde s anding o applying hem in
Page No. 26
Teaching Business in a Digi al Wo ld: A TPACK-In o med Phenomenological S udy on Cu iculum Alignmen
wi h Technology, Globaliza ion, and Sus ainabili y
Volume 08 Issue 09 Sep 2025
in e cul u al o ansna ional business con ex s. The challenge lies in ans o ming passi e
lea ning in o expe ien ial unde s anding ha mi o s eal-wo ld complexi ies.
IT2-2 Many acul y membe s assessed hei app oaches as mode a ely o pa ially
e ec i e. While s a egies such as class discussions, con en in eg a ion, and simula ions
p o ide some ounda ional knowledge, hey o en do no su ice o build deep, ans e able
global compe encies. Inc emen al e o s such as in using new global hemes in o exis ing
cou sewo k o adop ing case s udies a e s eps in he igh di ec ion. Howe e , he
e ec i eness o hese me hods is o en cons ained by he lack o imme sion p og ams,
ins i u ional suppo , and dynamic pedagogical models. These limi a ions poin o a need o
mo e in en ional, whole-p og am edesigns a he han piecemeal addi ions.
IT2-3 To compensa e o he lack o di ec global exposu e, educa o s ha e adap ed
s a egies ha simula e global con ex s wi hin he local en i onmen . Th ough case s udies,
PEST/SWOT analyses, and egionally con ex ualized modules, hey a emp o build
in e cul u al awa eness and global economic unde s anding. These ools se e as p oxies o
imme sion, allowing s uden s o examine global business dynamics h ough Philippine and
ASEAN lenses. While no a subs i u e o li ed expe ience, hese me hods o e scalable and
cul u ally sensi i e al e na i es ha can b idge lea ning gaps, especially in esou ce-
cons ained ins i u ions.
IT2-4 Despi e sys emic limi a ions, some educa o s demons a e c ea i e use o
digi al echnologies and global con en . Examples include he in eg a ion o a i icial
in elligence ools, i ual collabo a ions, and he use o global examples beyond Philippine
con ex s. These app oaches highligh a spi i o inno a ion, whe e acul y maximize wha is
a ailable o deli e engaging and globally ele an lessons. This heme unde sco es he ole
o indi idual agency and ini ia i e in enhancing cu iculum ele ance, e en in en i onmen s
lacking obus in as uc u e o in e na ional linkages.
IT2-5 Se e al pa icipan s poin ed ou ha he success o global compe ency
ins uc ion is closely ied o acul y expe ise and con idence. Ins uc o s who lack
in e na ional exposu e, p o essional de elopmen , o pedagogical aining in in e cul u al and
global amewo ks may ind i di icul o deli e e ec i e ins uc ion. The need o a ge ed
wo kshops, men o ship, and con inuous upskilling eme ged as a sha ed conce n. Building
acul y capaci y is essen ial no only o imp o e eaching e ec i eness bu also o sus ain
long- e m cu icula alignmen wi h globaliza ion.
IT2-6 Some acul y membe s iew s uden s‘ compliance wi h assignmen s and ac i e
pa icipa ion as indica o s o s a egy e ec i eness. While such me ics o e insigh in o
engagemen , hey may no ully cap u e compe ency de elopmen . This heme aises
impo an ques ions abou assessmen p ac ices and whe he cu en e alua ion ools
adequa ely measu e s uden s‘ eadiness o global business en i onmen s.
Table 3 p esen s he eme gen hemes ega ding he in eg a ion o sus ainabili y and
ESG p inciples in o business cu icula. I highligh s pa ial implemen a ion, acul y
dedica ion despi e cons ain s, ins i u ional ba ie s such as limi ed aining and esou ces,
esis ance o e o m, and eme ging s uc u ed e o s and good p ac ices aimed a deepening
ESG in eg a ion.
Table 3. Commi men o Sus ainabili y and E hical Responsibili y.
Q3
How well is sus ainabili y, including en i onmen al, social, and go e nance (ESG)
p inciples, in eg a ed in o you business cu iculum, and wha ins i u ional ba ie s
do you ace in making hese opics a co e componen ?
DT3
Commi men o Sus ainabili y and E hical Responsibili y
IT(n)
UIC(n)
P(n)
IT3-1
―Only sc a ching he su ace‖
P1
Page No. 27
Cadiz, G. B., M. Tugonon, L. R., & M. Tugonon, N. S. (2025). Teaching Business in a Digi al Wo ld: A TPACK-In o med
Phenomenological S udy on Cu iculum Alignmen wi h Technology, Globaliza ion, and Sus ainabili y. GPH-
In e na ional Jou nal o Educa ional Resea ch, 8(9), 19-39. h ps://doi.o g/10.5281/zenodo.17295005
© 2025 GPH | In e na ional Jou nal o Educa ional Resea ch | h ps://gphjou nal.o g/index.php/e
dynamics.
Implemen
Technological
Pedagogical
Knowledge (TPK)
Redesign lessons wi h ech ools like i ual boa d ooms and
Padle , and ensu e access ia mobile apps, downloadable
modules, and low-bandwid h con en o inclusi i y.
Cul i a e Full
TPACK In eg a ion
Encou age in e disciplina y cou se c ea ion ha in eg a es
con en , pedagogy, and echnology, while u ilizing ac ion o
design-based esea ch o imp o e TPACK-d i en business
eaching p ac ices.
Add ess Ins i u ional
Con ex
P omo e ICT in es men , acul y aining, and s uden access;
build indus y-academe ies o cu iculum ele ance; and
adop pee men o ing o collabo a i e TPACK-based
eaching.
Adap i e Mindse owa d Technological In eg a ion
A
Global Awa eness and Cul u al Sensi i i y
B
Commi men o Sus ainabili y and E hical Responsibili y
C
Resilience in he Face o Ins i u ional Cons ain s
D
Equi y-O ien ed Pe spec i e on Digi al Access
E
In Figu e 2, he Technological Pedagogical Con en Knowledge (TPACK) amewo k o e s
a comp ehensi e lens o analyzing he compe encies equi ed by business educa o s in he
21s -cen u y lea ning en i onmen . In his s udy, each o he TPACK componen is in ica ely
connec ed o he key challenges o cu iculum alignmen wi h echnology, globaliza ion, and
sus ainabili y.
Technological Knowledge (TK) is c ucial as acul y na iga e ools like AI, blockchain, and
LMS pla o ms o deli e mode n business con en . Many pa icipan s acknowledged he
di icul y in s aying cu en wi h eme ging ech, highligh ing TK as bo h a s eng h and gap
a ea. Pedagogical Knowledge (PK) plays a cen al ole in ensu ing ha con en deli e y is
inclusi e and esponsi e—especially in de eloping global compe encies and accommoda ing
digi al di ides h ough adap i e s a egies like case s udies and simula ions.
Con en Knowledge (CK) is e iden in educa o s‘ unde s anding o business ields, including
ESG, co po a e e hics, and global ade, hough some admi ed limi a ions in in eg a ing hese
in o co e syllabi. The s eng h o Pedagogical Con en Knowledge (PCK) appea s in he
acul y‘s e o s o con ex ualize abs ac opics, like sus ainabili y, h ough ac i e lea ning
me hods e en wi hou imme sion expe iences.
Technological Con en Knowledge (TCK) was e lec ed in examples whe e ech ools
enhance business unde s anding, such as da a isualiza ion o analy ics o blockchain
simula ions. Technological Pedagogical Knowledge (TPK) is i al in ans o ming adi ional
ins uc ion in o ech-enhanced lea ning, as seen in he use o lipped class ooms o
asynch onous modes o add ess access gaps.
The co e o he amewo k, TPACK, cap u es he educa o s‘ abili y o in eg a e hese
domains holis ically. Se wi hin he Philippine educa ional con ex , ins i u ional challenges
Page No. 34
Teaching Business in a Digi al Wo ld: A TPACK-In o med Phenomenological S udy on Cu iculum Alignmen
wi h Technology, Globaliza ion, and Sus ainabili y
Volume 08 Issue 09 Sep 2025
like ou da ed in as uc u e and limi ed acul y aining se e as c i ical ba ie s bu also
oppo uni ies o s a egic in e en ion and inno a ion.
Table 6 p esen s a de ailed explana ion o how he TPACK-aligned s a egies ela e o he
disposi ional hemes gene a ed om he s udy. Each s a egy di ec ly suppo s he
de elopmen o acul y disposi ions needed o each business cou ses e ec i ely in a digi al,
global, and sus ainable wo ld.
This ela ionship be ween s a egy and disposi ion c ea es a cohe en amewo k o
e o ming cu iculum, pedagogy, and ins i u ional sys ems owa d mo e ans o ma i e
business educa ion.
DT1 – Adap i e Mindse owa d Technological In eg a ion
Educa o s wi h an adap i e mindse emb ace ongoing change. These s a egies
ein o ce adap abili y by enhancing hei abili y o in eg a e e ol ing ools in o ins uc ion.
By mas e ing TK, TCK, and TPK, eache s mo e beyond s a ic eaching me hods, making
inno a ion pa o hei p o essional iden i y. This suppo s cu iculum esponsi eness o
echnological ad ances.
DT2 – Global Awa eness and Cul u al Sensi i i y
Global compe encies equi e educa o s o unde s and and each wi hin a b oade
cul u al con ex . S a egies unde PK, CK, and ull TPACK implemen a ion align cou se
con en wi h globally o ien ed pedagogy, e en wi hou physical imme sion. These app oaches
os e empa hy, inclusi i y, and eadiness o global business dynamics.
DT3 – Commi men o Sus ainabili y and E hical Responsibili y
Educa o s commi ed o sus ainabili y iew business h ough an e hical and
en i onmen al lens. By aligning ESG con en wi h inno a i e deli e y me hods, hey
ans o m sus ainabili y om a pe iphe al opic o a guiding p inciple. These s a egies allow
e hical esponsibili y o be augh as a p ac ical, da a-d i en, and essen ial componen o
business educa ion.
DT4 – Resilience in he Face o Ins i u ional Cons ain s
Resilience a ises when educa o s pe sis despi e bu eauc a ic o in as uc u al
ba ie s. These s a egies empowe acul y o deli e quali y educa ion h ough esou ce ul,
lexible, and con ex -sensi i e me hods. Facul y who adap s pedagogical app oaches o
ad oca e o sys emic change can b idge gaps be ween aspi a ion and ins i u ional limi a ions.
DT5 – Equi y-O ien ed Pe spec i e on Digi al Access
Equi y-minded educa o s acknowledge dispa i ies in digi al access and design
in e en ions acco dingly. These s a egies mi iga e he digi al di ide by ocusing on
inclusi e con en deli e y, equi able esou ce dis ibu ion, and pedagogical lexibili y. The
esul is a mo e jus and accessible business educa ion o all lea ne s, ega dless o
socioeconomic backg ound.
Page No. 35
Cadiz, G. B., M. Tugonon, L. R., & M. Tugonon, N. S. (2025). Teaching Business in a Digi al Wo ld: A TPACK-In o med
Phenomenological S udy on Cu iculum Alignmen wi h Technology, Globaliza ion, and Sus ainabili y. GPH-
In e na ional Jou nal o Educa ional Resea ch, 8(9), 19-39. h ps://doi.o g/10.5281/zenodo.17295005
© 2025 GPH | In e na ional Jou nal o Educa ional Resea ch | h ps://gphjou nal.o g/index.php/e
6. Conclusion
The s udy “Teaching Business in a Digi al Wo ld: A TPACK-In o med Phenomenological
S udy on Cu iculum Alignmen wi h Technology, Globaliza ion, and Sus ainabili y” e ealed
ha while business educa o s demons a e s ong p o essional commi men and adap abili y,
hey ace signi ican ins i u ional, echnological, and pedagogical challenges in aligning he
cu iculum wi h 21s -cen u y demands. Eme ging echnologies such as AI, blockchain, and
da a analy ics a e mode a ely in eg a ed, bu acul y digi al p epa edness emains une en due
o gaps in aining and limi ed access o in as uc u e.
S a egies o de elop s uden s' global business compe encies such as localized case
s udies and in e cul u al discussions a e in place, ye hey all sho wi hou imme si e global
exposu e. Simila ly, sus ainabili y and ESG p inciples a e in oduced bu o en ea ed as
supplemen al a he han co e hemes, cons ained by ou da ed ma e ials, ime limi a ions,
and sys emic ine ia.
Th ough he lens o he Technological Pedagogical Con en Knowledge (TPACK)
amewo k, he s udy emphasizes he need o holis ic acul y de elopmen ha combines
echnological luency, con en mas e y, and adap i e pedagogy. The disposi ional hemes
such as esilience, global awa eness, e hical esponsibili y, and equi y highligh he human
dimension o digi al ans o ma ion in educa ion.
Meaning ul and u u e- eady cu iculum e o m mus add ess s uc u al ba ie s,
b idge he digi al di ide, and empowe educa o s h ough s a egic ins i u ional suppo and
capaci y-building. Only by doing so can business educa ion uly equip s uden s wi h he
compe encies needed o h i e in a digi ally connec ed, globally in eg a ed, and
sus ainabili y-conscious economy.
7. Recommenda ions
Based on he indings, he s udy ecommends ha ins i u ions p io i ize s uc u ed acul y
de elopmen p og ams ha in eg a e TPACK p inciples, equipping educa o s wi h
echnological, pedagogical, and con en expe ise. Business cu icula should be e o med o
embed eme ging echnologies, global compe encies, and ESG p inciples as co e componen s,
no supplemen a y opics. In es men s in digi al in as uc u e and equi able access a e
c i ical o b idge he digi al di ide.
Ins i u ions mus s eamline bu eauc a ic p ocesses o accele a e cu iculum
inno a ion and p o ide suppo o expe ien ial, in e disciplina y, and indus y-linked
lea ning. Fos e ing a cul u e o adap abili y, global-mindedness, and sus ainabili y among
educa o s will ensu e business educa ion emains ele an in an e ol ing digi al wo ld.
Decla a ion o compe ing in e es
The au ho s decla e ha hey ha e no known compe ing inancial in e es s o pe sonal
ela ionships ha could ha e appea ed o in luence he wo k epo ed in his pape .
Acknowledgemen s
This wo k was sel - unded by he esea che s. Facul y membe s eaching business educa ion
cou ses p o ided aluable insigh s and na a i es o hei expe iences in ela ion o he
p oblems o he s udy.
Page No. 36
Teaching Business in a Digi al Wo ld: A TPACK-In o med Phenomenological S udy on Cu iculum Alignmen
wi h Technology, Globaliza ion, and Sus ainabili y
Volume 08 Issue 09 Sep 2025
Re e ences
Besa, D. P., & Limpo , M. Y. (2023). TPACK, ins uc ional compe ence, and eache s‘
a i ude owa d in e ne use: A s uc u al equa ion model in eadiness o each online in
Filipino. Asian Jou nal o Educa ion and Social S udies, 46(2), 40–53.
h ps://doi.o g/10.9734/ajess/2023/ 46i21001
Bowen, G. A. (2009). Documen analysis as a quali a i e esea ch me hod. Quali a i e
g/10.3316/QRJ0902027h ps://doi.o 40. –, 9(2), 27Resea ch Jou nal
B aun, V., & Cla ke, V. (2006). Using hema ic analysis in psychology. Quali a i e Resea ch
h ps://doi.o g/10.1191/1478088706qp063oa101. –(2), 77in Psychology, 3
C ipps, K., & Smi h, S. (2024, Augus 15). Embedding a sus ainabili y mindse in esponsible
managemen educa ion. In e na ional Jou nal o O ganiza ional Analysis.
3774-3202-05-h ps://doi.o g/10.1108/IJOA
Digi al Technologies Hub. (n.d.). TPACK model. Aus alian Go e nmen Depa men o
-d /p o essional-.edu.au/unde s andingh ps://www.digi al echnologieshubEduca ion. model/-lea ning/ pack
Dziubaniuk, O., I ano a-Gongne, M., & Nyholm, M. (2023). Lea ning and eaching
sus ainable business in he digi al e a: A connec i ism heo y app oach. In e na ional
Jou nal o Educa ional Technology in Highe Educa ion, 20(1), A icle 20.
w-00390-023-h ps://doi.o g/10.1186/s41239
Kesha a z, H. (2020). He meneu ic phenomenology in suppo ing esea ch and in o ma ion
se ices: Con ibu ions o in o ma ion science. Jou nal o In o ma ion Science Theo y and h ps://doi.o g/10.1633/JISTaP.2020.8.4.339. –(4), 298, P ac ice
Knigh , C. (2022). Re lec i e Equilib ium. In E. N. Zal a & U. Nodelman (Eds.), S an o d
Encyclopedia o Philosophy (Fall 2022 Edi ion). Me aphysics Resea ch Lab, S an o d
equilib ium/-ps://pla o.s an o d.edu/a chi es/ all2022/en ies/ e lec i eh Uni e si y.
K isna esan i, A., Suwa no, S., & Disman, D. (2024). Sus ainable eache p o essional
de elopmen : A e iew om a echnological pedagogical con en knowledge (TPACK)
pe spec i e. In K. B. Abip ayu & A. B. Se iawan (Eds.), P oceedings o he In e na ional
Con e ence o Economics Business and Economics Educa ion Science (ICE-BEES-24)
(Ad ances in Economics, Business and Managemen Resea ch, Vol. 298, pp. 49–62).
5_5-522-6463-94-h ps://doi.o g/10.2991/978A lan is P ess.
La ip, A., Robandi, B., Amaliah, A., Khakim, R. R., & Fa onah, N. (2023). Technological
pedagogical con en knowledge (TPACK) amewo k o science eache s‘ compe ences in
acing global challenges and issues: A na a i e li e a u e e iew. In e na ional Jou nal o
h ps://doi.o g/10.20961/ijp e. 0i0.7469957. –(1), 45Pedagogy and Teache Educa ion, 7
La e y, S. M. (2003). He meneu ic phenomenology and phenomenology: A compa ison o
his o ical and me hodological conside a ions. In e na ional Jou nal o Quali a i e Me hods,
h p://www.ualbe a.ca/~iiqm/backissues/2_3 inal/h ml/la e y.h ml(3), A icle 3. 2
Page No. 37
Cadiz, G. B., M. Tugonon, L. R., & M. Tugonon, N. S. (2025). Teaching Business in a Digi al Wo ld: A TPACK-In o med
Phenomenological S udy on Cu iculum Alignmen wi h Technology, Globaliza ion, and Sus ainabili y. GPH-
In e na ional Jou nal o Educa ional Resea ch, 8(9), 19-39. h ps://doi.o g/10.5281/zenodo.17295005
© 2025 GPH | In e na ional Jou nal o Educa ional Resea ch | h ps://gphjou nal.o g/index.php/e
McLeod, S. (2025, Janua y 2). He meneu ic phenomenology. Simply Psychology.
phenomenology.h ml-h ps://www.simplypsychology.o g/he meneu ic
Mele iou-Ma o he is, M., & Papa is odemou, E. (2024). Sus aining eache p o essional
lea ning in STEM: Lessons lea ned om an 18-yea -long jou ney in o TPACK-guided
p o essional de elopmen . Educa ion Sciences, 14(4), A icle 402.
040402h ps://doi.o g/10.3390/educsci14 Mena-Guacas, A. F., López-Ca alán, L., Be nal-B a o, C., & Balles e os-Regaña, C. (2025).
Educa ional ans o ma ion h ough eme ging echnologies: C i ical e iew o scien i ic
impac on lea ning. Educa ion Sciences, 15(3), 368.
h ps://doi.o g/10.3390/educsci15030368
Mish a, P., & Koehle , M. J. (2006). Technological pedagogical con en knowledge: A
amewo k o eache knowledge. Teache s College Reco d, 108(6), 1017–1054.
h ps://one2oneheigh s.pbwo ks.com/ /Mish a_Punya.pd
Nan ha, C., Si ipongdee, K., Si ipongdee, S., Pimdee, P., Kan a hanawa , T., &
Boonsomchuae, K. (2024). Enhancing ICT li e acy and achie emen : A TPACK-based
blended lea ning model o Thai Business Adminis a ion s uden s. Educa ion Sciences,
h ps://doi.o g/10.3390/educsci14050455455. (5), A icle14
Olms ead, A., & Tu pen, C. (2016, Oc obe 31). Assessing he in e ac i i y and
p esc ip i eness o acul y p o essional de elopmen wo kshops: The Real-Time
P o essional De elopmen Obse a ion Tool (R-PDOT) (a Xi :1606.07126 2). a Xi .
h ps://doi.o g/10.48550/a Xi .1606.07126
O b, A., Eisenhaue , L., & Wynaden, D. (2001). E hics in quali a i e esea ch. Jou nal o
5069.2001.00093.x-h ps://doi.o g/10.1111/j.154796. –(1), 9333, Nu sing Schola ship Ou Wo ld in Da a. (2023). Ensu e inclusi e and quali y educa ion o all and p omo e
educa ion-h ps://ou wo ldinda a.o g/sdgs/quali y. Ou Wo ldInDa a.o g. li elong lea ning
Pu is A.J. Nicholas, V. and Tai, J. (2024). Wha 's you p oblem? W i ing e ec i e esea ch
ques ions o quali y publica ions. Jou nal o Uni e si y Teaching and Lea ning P ac ice.
h ps://doi.o g/10.53761/j64xa573(10). 21
Ramsook, L. (2018). A me hodological app oach o he meneu ic phenomenology.
In e na ional Jou nal o Humani ies and Social Sciences, 10(1), 14–24.
h ps://ijhss.ne /index.php/ijhss/a icle/ iew/408
Se oningsih, D. A. (2023). Eme ging TPACK & digi aliza ion in educa ion o sus ainable
de elopmen : Voices o seconda y educa ion eache s. English Lea ning Inno a ion, 4(2),
h ps://doi.o g/10.22219/englie. 4i2.2711296. –82
Shim, H. Y., Kwon, Y.-M., & Lee, J. (2021). Lea ning om he p oblems and challenges in
blended lea ning. Asian Jou nal o Dis ance Educa ion, 15(2), 112–132.
h ps://asianjde.com/ojs/index.php/AsianJDE/a icle/ iew/433
Tasdemi , C., & Gazo, R. (2020). In eg a ing sus ainabili y in o highe educa ion cu iculum
h ough a ansdisciplina y pe spec i e. Jou nal o Cleane P oduc ion, 265, A icle 121759.
h ps://doi.o g/10.1016/j.jclep o.2020.121759
Page No. 38
Teaching Business in a Digi al Wo ld: A TPACK-In o med Phenomenological S udy on Cu iculum Alignmen
wi h Technology, Globaliza ion, and Sus ainabili y
Volume 08 Issue 09 Sep 2025
Tu nell, C. (2023, June 12). Digi al ans o ma ion o pos -pandemic lea ning and eaching:
U ilising TPACK o suppo educa o de elopmen in a lipped lea ning pilo . S udies in
- u nell-02-h ps://s el.pubpub.o g/pub/03(2). Technology Enhanced Lea ning, 3
2023/ elease/1 Tuga, B., & Jocson, J. (2023). Li ed expe iences o college acul y adminis a o s amids
COVID-19. In e na ional Jou nal o Humani ies and Social Science, 10(1), 14–24.
h ps://ijhss.ne /index.php/ijhss/a icle/ iew/408/0
Valle, L. C., Gonzales, R. R., Almacen, R. M. L., Ba ucan, G., & Gonzales, G. G. (2024).
Modeling he ela ionship o he TPACK amewo k wi h cybe wellness, school clima e,
and digi al na i i y o basic educa ion eache s. F on ie s in Educa ion, 46(2), A icle
h ps://doi.o g/10.3389/ educ.2024.13978881397888.
Wang, L., & Lee, J. C. (2024, Augus 23). TPACK and EdTech in eg a ion in eaching and
lea ning p ocess: A sys ema ic li e a u e e iew (2014–2024). Communica ions on Applied
Nonlinea Analysis, 31(7S). h ps://doi.o g/10.52783/cana. 31.1381
Page No. 39
