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Silicon dioxide atomic layer deposition at low temperature for PDMS microlenses coating

Abstract

The optical performance of a microlens is strongly affected by its surface roughness, which depends on its fabrication process. High-surface roughness leads to scattering issues, decreasing the optical efficiency of a microlens. In this work, a polydimethylsiloxane microlens was coated with a very thin-film of silicon dioxide (30 nm), deposited by plasma-enhanced atomic layer deposition at a low temperature (50 °C). The main goal was to passivate the polymeric microlens and reduce its surface roughness. Atomic force microscopy was performed before and after the silicon dioxide coating, confirming the surface roughness reduction by a factor of 3.2. The microlens was observed by scanning electron microscopy after silicon dioxide coating. Surface elemental composition analysis of the silicon dioxide thin-film was also performed through X-ray photoelectron spectroscopy, confirming the formation of silicon dioxide and a stoichiometric ratio of silicon to oxygen (Si:O) close to 27:58. The refractive index of the deposited film was measured by ellipsometry, obtaining a value of 1.4617 at 470 nm.

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Silicon dioxide atomic layer deposition at low temperature for PDMS microlenses coating

Author: Cunha, Florival Moura; Freitas, João Rui Martins; Pimenta, Sara Filomena Ribeiro; Silva, Manuel Fernando Ribeiro; Correia, J. H.
Publisher: Elsevier B.V.
Year: 2024
DOI: 10.1016/j.optmat.2024.116167
Source: https://repositorium.uminho.pt/bitstreams/cfac24d1-66eb-460b-99cb-4df3c3ae7b98/download
Sho Communica ion
Silicon dioxide a omic laye deposi ion a low empe a u e o PDMS
mic olenses coa ing
Flo i al M. Cunha
a
, Jo˜
ao R. F ei as
a
, Sa a Pimen a
a,b,*
, Manuel F. Sil a
a,b
, Jos´
e H. Co eia
a,b
a
CMEMS-UMinho, Uni e si y o Minho, 4800-058, Guima ˜
aes, Po ugal
b
LABBELS-Associa e Labo a o y, B aga/Guima ˜
aes, Po ugal
ARTICLE INFO
Keywo ds:
Polyme ic mic olenses
Su ace oughness
Op ical e iciency
ABSTRACT
The op ical pe o mance o a mic olens is s ongly a ec ed by i s su ace oughness, which depends on i s
ab ica ion p ocess. High-su ace oughness leads o sca e ing issues, dec easing he op ical e iciency o a
mic olens. In his wo k, a polydime hylsiloxane mic olens was coa ed wi h a e y hin- ilm o silicon dioxide (30
nm), deposi ed by plasma-enhanced a omic laye deposi ion a a low empe a u e (50 ◦C). The main goal was o
passi a e he polyme ic mic olens and educe i s su ace oughness. A omic o ce mic oscopy was pe o med
be o e and a e he silicon dioxide coa ing, con i ming he su ace oughness educ ion by a ac o o 3.2. The
mic olens was obse ed by scanning elec on mic oscopy a e silicon dioxide coa ing. Su ace elemen al
composi ion analysis o he silicon dioxide hin- ilm was also pe o med h ough X- ay pho oelec on spec os-
copy, con i ming he o ma ion o silicon dioxide and a s oichiome ic a io o silicon o oxygen (Si:O) close o
27:58. The e ac i e index o he deposi ed ilm was measu ed by ellipsome y, ob aining a alue o 1.4617 a
470 nm.
1. In oduc ion
The main challenge o using dielec ic coa ings in op ical mic o-
de ices is he achie emen o low-abso p ion and low-sca e ing losses.
Addi ionally, he coa ing ilms mus be deposi ed wi h p ecise hickness
and uni o mi y [1].
A omic laye deposi ion (ALD) is a high-quali y hin- ilm deposi ion
echnique wi h unique ea u es, including excellen ilm hickness con-
ol, high uni o mi y, and con o mali y, e en on complex o s uc u ed
su aces [2–7].
ALD is a special ype o chemical apo deposi ion (CVD), whe e
gaseous p ecu so s a e sequen ially and independen ly exposed o he
subs a e. The p ecu so pulses a e sepa a ed by pu ging cycles. Due o
his cycle-based p ocess, he eac ion does no happen in he gas phase
bu is only su ace-limi ed. Using ALD, he esul ing ilm hickness is
p ecisely con olled (a a sub-nanome e scale) by he numbe o ALD
cycles [1,8,9].
Due o he high con o mi y o he ALD, he oughness o he subs a e
can dec ease because he deposi ion ills all he holes in he subs a e
and u ns he su ace less ough [10].
ALD deposi ion o dielec ic hin- ilms a low- empe a u e subs a e
(<250 ◦C) ypically esul s in amo phous ilms wi h low-su ace
oughness, and hus low-sca e ing losses can be expec ed [1,11].
Silicon dioxide (SiO
2
) is he mos widely used dielec ic hin- ilm in
he semiconduc o indus y o pho onics and elec onic applica ions
due o i s excellen insula ing p ope ies and can be easily deposi ed by
ALD a low- empe a u e deposi ions. This is especially in e es ing
conside ing polyme s as subs a e ma e ials, making i possible o coa a
subs a e wi h an ul a hin oxide ilm wi h good elec ical p ope ies
[12–14].
Ul a- hin SiO
2
ilms ha e also been epo ed as good componen s o
he nano echnology ield, such as dielec ic ma e ials in mic oelec onic
de ices, an ico osion/passi a ion ilms, e c. [15–17].
O he oxides (e.g., i anium dioxide (TiO
2
) and alumina (Al
2
O
3
)) a e
epo ed in he li e a u e as good coa ings o inc ease he o ganic sol en
esis ance o a polyme (polydime hylsiloxane (PDMS)) o inc ease i s
hyd ophilici y [18,19].
The su ace oughness o a mic olens is an impo an pa ame e o
e alua ing i s op ical pe o mance and i is mainly a ec ed by he
ab ica ion p ocess. High-su ace oughness leads o sca e ing issues,
which dec eases he op ical e iciency o he mic olens [20].
In his wo k, a PDMS mic olens, p e iously mic o ab ica ed wi h he
* Co esponding au ho . CMEMS-UMinho, Uni e si y o Minho, 4800-058, Guima ˜
aes, Po ugal.
E-mail add ess: [email p o ec ed] (S. Pimen a).
Con en s lis s a ailable a ScienceDi ec
Op ical Ma e ials
jou nal homepage: www.else ie .com/loca e/op ma
h ps://doi.o g/10.1016/j.op ma .2024.116167
Recei ed 29 Ap il 2024; Recei ed in e ised o m 26 Augus 2024; Accep ed 24 Sep embe 2024
Op ical Ma e ials 157 (2024) 116167
A ailable online 24 Sep embe 2024
0925-3467/© 2024 The Au ho s. Published by Else ie B.V. This is an open access a icle unde he CC BY-NC-ND license ( h p://c ea i ecommons.o g/licenses/by-
nc-nd/4.0/ ).
p ocess epo ed a [21], was coa ed wi h a SiO
2
hin- ilm (30 nm hick),
deposi ed a a low empe a u e (50 ◦C) by plasma-enhanced a omic
laye deposi ion (PEALD), using a SENTECH Ins umen s GmbH sys em.
The e o e, he main goal o his wo k was o pe o m he passi a ion o a
he mally sensi i e PDMS mic olens by PEALD echnique and o educe
i s su ace oughness, achie ing he educ ion o op ical sca e ing los-
ses. Fu he mo e, he cha ac e iza ion echniques used du ing his
s udy, speci ically a omic o ce mic oscopy (AFM), scanning elec on
mic oscopy (SEM), X- ay pho oelec on spec oscopy (XPS), and ellips-
ome y p o e he PDMS mic olens op imiza ion.
2. Ma e ials and me hods
As p e iously e e ed, he SiO
2
PEALD was pe o med using a
SENTECH Ins umen s GmbH sys em. This ALD sys em in eg a es an
ellipsome e o eal- ime ilm hickness moni o ing. The Bis(die h-
ylamino)silane (BDEAS) p ecu so was selec ed wi h he O
2
-plasma as a
co- eac an . BDEAS is a usual p ecu so o SiO
2
ALD due o i s chemical
s abili y [15]. The subs a e (PDMS mic olens) and he eac o we e
hea ed up o 50 ◦C, he p ecu so BDEAS up o 60 ◦C, and he p ecu so ’s
lines up o 125 ◦C. The O
2
-plasma was exci ed a 13.6 MHz by adio
equency (RF) powe o 200 W and a low a e o 200 sccm. The eac o
acuum p essu e was h o le-con olled a 20 Pa. Table 1 shows he
ecipe condi ions used.
AFM was used o measu e he su ace oughness o he PDMS
mic olens be o e and a e he SiO
2
PEALD coa ing. The AFM mea-
su emen s we e pe o med wi h a BRUKER sys em (Dimension Icon) wi h
a ip model RTESPA-150 in con ac mode.
SEM measu emen s we e also pe o med a e he SiO
2
PEALD
coa ing, using a NanoSEM sys em (FEI No a 200) by no mal seconda y
elec on (SE) mode, wi h an accele a ion ol age o 10 kV, and wi h a
Gold/Palladium (Au/Pd) an is a ic coa ing o high conduc i i y.
XPS measu emen s we e pe o med o ob ain a chemical composi-
ion analysis o he SiO
2
hin- ilm, using a The moFishe Scien i ic sys em
(SCALAB250Xi) wi h a monoch oma ed X- ay sou ce Al K
α
(h =
1486.68 eV) adia ion, ope a ed a 220 W, 14.6 kV, spo size 650
μ
m.
The XPS spec a we e collec ed a pass ene gies 100 eV and 40 eV o
su ey spec a and indi idual elemen s espec i ely (N 1s, Al 2p, Si 2p, O
1s, and C 1s scan). The ene gy s ep o indi idual elemen s was 0.1 eV.
The XPS spec a we e peak- i ed using A an age da a p ocessing so -
wa e. Fo peak i ing he Shi ley- ype backg ound sub ac ion was used.
All he XPS peaks a e o be e e enced o ad en i ious ca bon C 1s, C–C
peak a 284.8 eV. Quan i ica ion has been done using sensi i i y ac o s
p o ided by he A an age lib a y. Cha ge neu aliza ion was achie ed
wi h bo h low-ene gy elec on and a gon ion lood guns (<0.1 eV, 120
μ
A, and 70
μ
A cu en , espec i ely) du ing XPS measu emen s.
Finally, ellipsome y o he SiO
2
hin- ilm was also pe o med o
access he e ac i e index o he hin- ilm, using a J.A. Woollam Co.
sys em (alphaSE Ellipsome e ) wi h wa eleng hs om 381 nm o 893 nm,
a di e en measu emen angles (65◦, 70◦, and 75◦) and applying he
Sellmeie model. The gene al o m o he model is gi en by (1) [22]:
n(λ)2=
ε
∞+AUV λ2
λ2−λ2
UV
+AIR λ2
λ2−λ2
IR
(1)
whe e nis he e ac i e index o he ma e ial a a gi en alue o λ,A
UV
and A
IR
a e he ampli ude o he ul a iole (UV) and in a ed (IR) poles,
espec i ely, λ
UV
and λ
IR
a e he posi ions o he UV and IR poles, and
ε
∞
is he low- equency o se . In he so wa e o he ellipsome e , he
Sellmeie model was used o i he pole pa ame e s and he low-
equency o se , ex ac ing he SiO
2
e ac i e index and hickness.
The mean squa e e o (MSE) o he i ing p ocess was 0.947.
3. Resul s and discussion
The SiO
2
PEALD hin- ilm was moni o ed using he ALD sys em in si u
ellipsome e . Fig. 1 shows he g ow h pa ame e s o he SiO
2
PEALD
hin- ilm a 50 ◦C. The ecipe s a s wi h a s abiliza ion pe iod o
app oxima ely 10 min be o e he i s cycle o ensu e he main enance o
all he deposi ion pa ame e s (p essu e, empe a u e, gas low a e). A
g ow h pe cycle (GPC) o 1.32 Å/cycle was measu ed by he ellips-
ome e . A mo e de ailed iew o he i s h ee cycles is shown in Fig. 1
(b). The exposi ion ime o he BDEAS and he O
2
-plasma is indica ed in
he shaded egions. A hickness gain was obse ed du ing he BDEAS
exposu e, while a dec ease in hickness occu ed du ing he O
2
-plasma
exposu e. This dec ease is a ibu ed o he eplacemen o die hylamine
g oups ((CH
3
CH
2
)
2
N) on he su ace wi h oxygen a oms du ing he O
2
-
Table 1
PEALD ecipe o he SiO
2
hin- ilm deposi ion.
Numbe o ALD
cycles
BDEAS O
2-
plasma
Pulse ime
(ms)
Pu ge ime
(s)
Pulse ime
(ms)
Pu ge ime
(s)
227 180 5 5000 1
Fig. 1. Thickness measu ed by he ALD sys em in si u ellipsome e o SiO
2
PEALD hin- ilm a 50 ◦C: (a) g ow h o e many cycles; (b) de ailed g ow h o e he i s
h ee cycles.
F.M. Cunha e al. Op ical Ma e ials 157 (2024) 116167
2
plasma exposu e, he eby educing he amoun o ma e ial a ached o
he su ace.
AFM measu emen s we e pe o med in he PDMS mic olens be o e
and a e he SiO
2
coa ing. Fig. 2 shows he AFM su ace opog aphy o
he PDMS mic olens be o e and a e he SiO
2
coa ing. Conside ing an
a ea o 1 ×1
μ
m
2
on he op o he mic olens, i was measu ed an
a e age su ace oughness (R
a
) o 1.6 nm be o e he SiO
2
coa ing, and
0.5 nm a e he SiO
2
coa ing. Thus, i was con i med ha he su ace
oughness was educed by a ac o o 3.2, which b ings less sca e ing
issues and imp o es he op ical e iciency o he PDMS mic olens. As an
example, an a e age su ace oughness o 3.7 nm is epo ed in he
li e a u e o a PDMS mic olens and conside ing he same su ace a ea
on he op o he mic olens o 1 ×1
μ
m
2
[23]. The e o e, he PEALD
coa ing could be an al e na i e me hod o educing he su ace
oughness and imp o ing polyme ic-mic olens op ical e iciency.
Fig. 3 (a) shows a op iew SEM image o he a ay o PDMS
mic olenses coa ed wi h he SiO
2
PEALD hin- ilm, highligh ing he
analyzed PDMS mic olens in his wo k. Fig. 3 (b) shows a c oss-sec ion
SEM image o a PDMS mic olens coa ed wi h a SiO
2
PEALD hin- ilm.
XPS is a highly sensi i e echnique o su ace elemen al composi ion
analysis o e y hin- ilms (below 40 nm hick). Fig. 4 shows he XPS o
he SiO
2
PEALD hin- ilm. The s oichiome ic a io o silicon o oxygen
(Si:O) was ound o be close o 27:58, by calcula ing he XPS peak a eas
o he Si 2p and O 1s. This alue is e y close o he expec ed alue o 1:2.
The appea ance o Si 2p a ≈103 eV con i med he o ma ion o SiO
2
[24].
Fig. 5 shows he e ac i e index as a unc ion o wa eleng h o he
SiO
2
PEALD hin- ilm, ob ained by ellipsome y (applying he Sellmeie
model). The e ac i e index o he SiO
2
a 470 nm is 1.4617, which is
e y close o he PDMS e ac i e index, 1.4014 also a 470 nm [25].
This small e ac i e index di e ence doesn’ ha e a signi ican impac
on he SiO
2
coa ed PDMS mic olens e ac i e p ope ies, which is
p e ended in his wo k. To ob ain he SiO
2
e ac i e index, 30 nm o
SiO
2
was g own on a small ba e Si wa e nex o he mic olens sample.
Ellipsome y measu emen s we e pe o med in si u du ing i s g ow h
p ocess and ex si u on a di e en ellipsome e o con i m i s hickness.
Fig. 2. AFM su ace opog aphy a he op o he PDMS mic olens (a ea o 1 ×1
μ
m
2
): (a) wi hou coa ing; (b) wi h he PEALD hin- ilm SiO
2
coa ing. R
a
: a e age
su ace oughness.
Fig. 3. SEM image o PDMS mic olenses wi h he SiO
2
PEALD coa ing: (a) op iew; (b) c oss-sec ion iew.
F.M. Cunha e al. Op ical Ma e ials 157 (2024) 116167
3
4. Conclusions
In his wo k, a PDMS mic olens was coa ed wi h a e y hin- ilm o
SiO
2
deposi ed by PEALD a a low empe a u e (50 ◦C). The main goal
was o passi a e a he mally sensi i e PDMS mic olenses and o educe
i s su ace oughness. AFM measu emen s pe o med be o e and a e
he coa ing con i med he su ace oughness educ ion by a ac o o 3.2.
Also, he XPS esul s con i med he o ma ion o a SiO
2
hin- ilm by
PEALD. Finally, ellipsome y cha ac e iza ion con i med ha he SiO
2
PEALD hin- ilm e ac i e index is e y close o he PDMS e ac i e
index a he same wa eleng h, as equi ed. PEALD coa ing is an in e -
es ing app oach o passi a e op ical s uc u es (e en polyme ic) o in-
c ease hei e iciency and educe sca e ing issues.
CRediT au ho ship con ibu ion s a emen
Flo i al M. Cunha: W i ing –o iginal d a , Visualiza ion, Valida-
ion, Me hodology, In es iga ion, Fo mal analysis, Concep ualiza ion.
Jo˜
ao R. F ei as: W i ing – e iew &edi ing, Valida ion, Me hodology,
In es iga ion, Fo mal analysis, Concep ualiza ion. Sa a Pimen a:
W i ing –o iginal d a , Valida ion, Me hodology, Fo mal analysis,
Concep ualiza ion. Manuel F. Sil a: W i ing – e iew &edi ing, Vali-
da ion, Me hodology, Concep ualiza ion. Jos´
e H. Co eia: W i ing –
e iew &edi ing, Supe ision, Resou ces, Concep ualiza ion.
Decla a ion o compe ing in e es
The au ho s decla e ha hey ha e no known compe ing inancial
in e es s o pe sonal ela ionships ha could ha e appea ed o in luence
he wo k epo ed in his pape .
Da a a ailabili y
Da a will be made a ailable on eques .
Acknowledgmen s
This wo k was suppo ed by he CMEMS-UMinho S a egic P ojec
(UIDB/04436/2020 and UIDP/04436/2020) and he MPho onBiopsy
(PTDC/FIS-OTI/1259/2020, h p://doi.o g/10.54499/PTDC/FIS-OTI/
1259/2020). Flo i al M. Cunha and Jo˜
ao R. F ei as hank FCT
(Fundaç˜
aopa aaCiˆ
enciaeaTecnologia) o hePh.D.g an s(2023.00594.
BD, h ps://doi.o g/10.54499/2023.00594.BD and 2020.07708.BD,
h ps://doi.o g/10.54499/2020.07708.BD, espec i ely). Sa a Pimen a
hanksFCT o heg an 2022.00101.CEECIND/CP1718/CT0008,h ps://
doi.o g/10.54499/2022.00101.CEECIND/CP1718/CT0008. Manuel F.
Sil a hanks FCT o he g an CEECINST/00156/2018/CP1642/CT0004,
h ps://doi.o g/10.54499/CEECINST/00156/2018/CP1642/CT0004.
Re e ences
[1] K. P ei e , S. Shes ae a, A. Bingel, P. Munze , L. Ghaza yan, C. an Hel oi , W.M.
M. Kessels, U.T. Sanli, C. G ´
e en , G. Schü z, M. Pu konen, I. Buchanan, L. Jensen,
D. Ris au, A. Tünne mann, A. Szeghalmi, Compa a i e s udy o ALD SiO_2 hin
ilms o op ical applica ions, Op . Ma e . Exp ess 6 (2016) 660, h ps://doi.o g/
10.1364/OME.6.000660.
[2] L. Kochanneck, J. R¨
onn, A. Tewes, G.-A. Ho mann, S. Vi anen, P. Maydannik,
S. Sneck, A. Wienke, D. Ris au, Enabling o a y a omic laye deposi ion o op ical
applica ions, Appl. Op . 62 (2023) 3112, h ps://doi.o g/10.1364/AO.477448.
[3] S. Ris ok, P. Flad, H. Giessen, A omic laye deposi ion o con o mal an i- e lec i e
coa ings on complex 3D p in ed mic o-op ical sys ems, Op . Ma e . Exp ess 12
(2022) 2063, h ps://doi.o g/10.1364/OME.454475.
[4] M. Fang, J.C. Ho, A ea-selec i e a omic laye deposi ion: con o mal coa ing,
subnanome e hickness con ol, and sma posi ioning, ACS Nano 9 (2015)
8651–8654, h ps://doi.o g/10.1021/acsnano.5b05249.
[5] T. Fa az, H.C.M. Knoops, M.A. Ve heijen, C.A.A. an Hel oi , S. Ka wal,
A. Sha ma, V. Beladiya, A. Szeghalmi, D.M. Hausmann, J. Hen i, M. C ea o e, W.M.
M. Kessels, Tuning ma e ial p ope ies o oxides and ni ides by subs a e biasing
du ing plasma-enhanced a omic laye deposi ion on plana and 3D subs a e
opog aphies, ACS Appl. Ma e . In e aces 10 (2018) 13158–13180, h ps://doi.
o g/10.1021/acsami.8b00183.
[6] L. Fe n´
andez-Men´
endez, A. Gonz´
alez, V. Vega, V. de la P ida, Elec os a ic
supe capaci o s by a omic laye deposi ion on nanopo ous anodic alumina
empla es o en i onmen ally sus ainable ene gy s o age, Coa ings 8 (2018) 403,
h ps://doi.o g/10.3390/coa ings8110403.
[7] F.M. Cunha, M.F. Sil a, N.M. Gomes, J.H. Co eia, Al2O3 ul a- hin ilms deposi ed
by PEALD o ubidium op ically pumped a omic magne ome e s wi h on-chip
pho odiode, Coa ings 13 (2023) 638, h ps://doi.o g/10.3390/coa ings13030638.
[8] R.W. Johnson, A. Hul q is , S.F. Ben , A b ie e iew o a omic laye deposi ion:
om undamen als o applica ions, Ma e . Today 17 (2014) 236–246, h ps://doi.
o g/10.1016/j.ma od.2014.04.026.
[9] B.C. Mallick, C.-T. Hsieh, K.-M. Yin, Y.A. Gandomi, K.-T. Huang, Re iew—on
a omic laye deposi ion: cu en p og ess and u u e challenges, ECS Jou nal o
Solid S a e Science and Technology 8 (2019) N55–N78, h ps://doi.o g/10.1149/
2.0201903jss.
[10] T.J. Mye s, J.A. Th ockmo on, R.A. Bo elli, M. O’Sulli an, T. Ha wa , S.
M. Geo ge, Smoo hing su ace oughness using Al2O3 a omic laye deposi ion,
Appl. Su . Sci. 569 (2021) 150878, h ps://doi.o g/10.1016/j.
apsusc.2021.150878.
[11] V. Miikkulainen, M. Leskel¨
a, M. Ri ala, R.L. Puu unen, C ys allini y o ino ganic
ilms g own by a omic laye deposi ion: o e iew and gene al ends, J. Appl.
Phys. 113 (2013), h ps://doi.o g/10.1063/1.4757907.
[12] Y.-S. Lee, D. Choi, B. Shong, S. Oh, J.-S. Pa k, Low empe a u e a omic laye
deposi ion o SiO2 hin ilms using di-isop opylaminosilane and ozone, Ce am. In .
43 (2017) 2095–2099, h ps://doi.o g/10.1016/j.ce amin .2016.10.186.
[13] D. A l, V. Rog´
e, N. Adje oud, B.R. Pis illo, M. Sa , N. Bahlawane, D. Lenoble, SiO 2
hin ilm g ow h h ough a pu e a omic laye deposi ion echnique a oom
Fig. 4. XPS spec um o SiO
2
PEALD hin- ilm.
Fig. 5. Expe imen al e ac i e index o he SiO
2
PEALD hin- ilm.
F.M. Cunha e al. Op ical Ma e ials 157 (2024) 116167
4
empe a u e, RSC Ad . 10 (2020) 18073–18081, h ps://doi.o g/10.1039/
D0RA01602K.
[14] Y.-S. Lee, J.-H. Han, J.-S. Pa k, J. Pa k, Low empe a u e SiOx hin ilm deposi ed
by plasma enhanced a omic laye deposi ion o hin ilm encapsula ion
applica ions, J. Vac. Sci. Technol. A: Vacuum, Su aces, and Films 35 (2017),
h ps://doi.o g/10.1116/1.4985140.
[15] X.-Y. Zhang, Y. Yang, Z.-X. Zhang, X.-P. Geng, C.-H. Hsu, W.-Y. Wu, S.-Y. Lien, W.-
Z. Zhu, Deposi ion and cha ac e iza ion o RP-ALD SiO2 hin ilms wi h di e en
oxygen plasma powe s, Nanoma e ials 11 (2021) 1173, h ps://doi.o g/10.3390/
nano11051173.
[16] H. Cha, J. Lee, L.R. Jo dan, S.H. Lee, S.-H. Oh, H.J. Kim, J. Pa k, S. Hong, H. Jeon,
Su ace passi a ion o a pho onic c ys al band-edge lase by a omic laye
deposi ion o SiO 2 and i s applica ion o biosensing, Nanoscale 7 (2015)
3565–3571, h ps://doi.o g/10.1039/C4NR07552H.
[17] W. Zhou, L. Zheng, X. Cheng, W. Zhou, P. Ye, L. Shen, D. Zhang, Z. Gu, Y. Yu,
Plasma-enhanced a omic laye deposi ion o SiO2 o channel isola ion o colloidal
quan um do s pho o ansis o s, Supe la ices Mic os uc 125 (2019) 281–286,
h ps://doi.o g/10.1016/j.spmi.2018.11.013.
[18] A. San oso, A. Damen, J.R. an Ommen, V. an S eijn, A mosphe ic p essu e
a omic laye deposi ion o inc ease o ganic sol en esis ance o PDMS, Chem.
Commun. 58 (2022) 10805–10808, h ps://doi.o g/10.1039/D2CC02402K.
[19] D.J. O’B ien, A.J.H. Sedlack, P. Bha ia, C.J. Jensen, A. Quin ana-Puebla,
M. Pa anjape, Sys ema ic cha ac e iza ion o hyd ophilized polydime hylsiloxane,
J. Mic oelec omech. Sys . 29 (2020) 1216–1224, h ps://doi.o g/10.1109/
JMEMS.2020.3010087.
[20] W. Yuan, L.-H. Li, W.-B. Lee, C.-Y. Chan, Fab ica ion o mic olens a ay and i s
applica ion: a e iew, Chin. J. Mech. Eng. 31 (2018) 16, h ps://doi.o g/10.1186/
s10033-018-0204-y.
[21] J.R. F ei as, S. Pimen a, J.F. Ribei o, T. Dong, Z. Yang, J.H. Co eia, Simula ion,
ab ica ion and mo phological cha ac e iza ion o a PDMS mic olens o ligh
collima ion on op odes, Op ik 227 (2021) 166098, h ps://doi.o g/10.1016/j.
ijleo.2020.166098.
[22] C. Cushman, N. Smi h, M. Kaykhaii, N. Pod aza, M. Lin o d, An in oduc ion o
modeling in spec oscopic ellipsome y, ocusing on models o anspa en
ma e ials: he Cauchy and Sellmeie models, Vacuum Technology &Coa ing 7
(2016) 2–9.
[23] E. Roy, B. Voisin, J.-F. G a el, R. Pey a i, D. Boud eau, T. Ve es, Mic olens a ay
ab ica ion by enhanced he mal e low p ocess: owa ds e icien collec ion o
luo escence ligh om mic oa ays, Mic oelec on. Eng. 86 (2009) 2255–2261,
h ps://doi.o g/10.1016/j.mee.2009.04.001.
[24] F.A. S e ie, C.L. Donley, In oduc ion o x- ay pho oelec on spec oscopy, J. Vac.
Sci. Technol. A: Vacuum, Su aces, and Films 38 (2020), h ps://doi.o g/10.1116/
6.0000412.
[25] X. Zhang, J. Qiu, X. Li, J. Zhao, L. Liu, Complex e ac i e indices measu emen s o
polyme s in isible and nea -in a ed bands, Appl. Op . 59 (2020) 2337, h ps://
doi.o g/10.1364/AO.383831.
F.M. Cunha e al. Op ical Ma e ials 157 (2024) 116167
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