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PUF-derived IoT identities in a zero-knowledge protocol for blockchain

Abstract

As the internet of things moves into increasingly sensitive domains, connected devices need to be secured against data manipulation and counterfeiting. Where the underlying business processes involve multiple independent parties, a blockchain platform can provide a common source of truth. If changes to the common state depend on IoT devices, the authenticity and integrity of the IoT input must be ensured. Employing a blockchain platform for authenticating devices makes the process independent of the device manufacturer. This paper shows how cryptographic keys derived from a device's physical fingerprint can be employed in a zero-knowledge protocol to authenticate a device. As the keys are regenerated at boot time rather than stored, the approach does not need an expensive secure element. An efficient implementation enables even lightweight devices to prove their identity and sign messages. Experimental results demonstrate the robustness of the approach.

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PUF-derived IoT identities in a zero-knowledge protocol for blockchain

Author: Prada Delgado, Miguel Ángel; Baturone Castillo, María Iluminada; Dittmann, Gero; Jelitto, Jens; Kind, Andreas
Publisher: Elsevier
Year: 2020
DOI: 10.1016/j.iot.2019.100057
Source: https://idus.us.es/bitstreams/23991e3f-c095-409a-91a4-2b5564c5420c/download
Depósi o de in es igación de la Uni e sidad de Se illa
h ps://idus.us.es/
“This is an Accep ed Manusc ip o an a icle published by Else ie in In e ne
o Things (The Ne he lands) on Ma ch 2020, a ailable
a : h ps://doi.o g/10.1016/j.io .2019.100057 ”
PUF-de i ed IoT iden i ies in a
ze o-knowledge p o ocol o blockchain
Miguel ´
Angel P ada-Delgado, Iluminada Ba u one
Ins i u o de Mic oelec ´onica de Se illa, IMSE, CNM (Uni e sidad de Se illa, CSIC)
Se ille, Spain
Ge o Di mann, Jens Jeli o, And eas Kind
IBM Resea ch – Zu ich, Swi ze land
Abs ac
As he in e ne o hings mo es in o inc easingly sensi i e domains, connec ed
de ices need o be secu ed agains da a manipula ion and coun e ei ing. Whe e
he unde lying business p ocesses in ol e mul iple independen pa ies, a block-
chain pla o m can p o ide a common sou ce o u h. I changes o he common
s a e depend on IoT de ices, he au hen ici y and in eg i y o he IoT inpu mus
be ensu ed. Employing a blockchain pla o m o au hen ica ing de ices makes
he p ocess independen o he de ice manu ac u e .
This pape shows how c yp og aphic keys de i ed om a de ice’s physical
inge p in can be employed in a ze o-knowledge p o ocol o au hen ica e a
de ice. As he keys a e egene a ed a boo ime a he han s o ed, he app oach
does no need an expensi e secu e elemen . An e icien implemen a ion enables
e en ligh weigh de ices o p o e hei iden i y and sign messages. Expe imen al
esul s demons a e he obus ness o he app oach.
Keywo ds: PUF, IoT, blockchain, ze o-knowledge p oo , au hen ica ion,
mic ocon olle , SRAM
1. In oduc ion
The numbe o objec s wi h embedded mic ocon olle s (MCUs) connec ed
o he in e ne o hings (IoT) is inc easing apidly [1]—also in he sa e y-
P ep in submi ed o In e ne o Things May 12, 2019
and secu i y-c i ical medical, ene gy and au omo i e indus ies. The use o dis-
ibu ed ledge echnology in combina ion wi h IoT de ices has gained a lo o 5
a en ion no only in he inancial sec o bu in many indus ies as a means o
inc ease us and isibili y, e.g. along complex supply chains o mo e accu-
a e goods acing, coun e ei de ec ion [2, 3] and in o ma ion e i ica ion [4].
Complex manu ac u ing lines and dis ibu ion sys ems can be secu ely moni-
o ed and documen ed such ha downs eam business p ocesses can alida e10
he p o enance o p oduc s. This back- o-bi h aceabili y is c i ical and o en
e en manda o y, e.g. in he ai line indus y o li e-limi ed pa s [5] o in he
pha ma sec o o p esc ip ion medicine [6]. Likewise, ups eam business p o-
cesses can de e mine he ecipien s o goods, o ins ance in case o a p oduc
ecall.15
Blockchains le e age c yp og aphy, dis ibu ed p o ocols, and p i acy-enabling
echniques (e.g. ze o-knowledge p o ocols, h eshold-signa u e schemes) o en-
able us and o con ol isibili y o he in o ma ion in mul i-pa y en i on-
men s [7]. In his ega d, i is o c ucial impo ance he p i acy p o ec ion in
blockchain-based IoT sys ems om issues caused due o in o ma ion leakage20
[8]. A blockchain alone, howe e , is o en insu icien o p o e p oduc o iginal-
i y o p o ide an unin e up ed and indispu able chain o cus ody h oughou
he p oduc li e-cycle because i canno gua an ee he uniqueness o a physical
en i y.
In addi ion, an IoT connec ion is commonly used o moni o o con ol an25
objec connec ed o he blockchain. This connec ion wi h physical de ices is
necessa y, bu i opens he doo o new a ack ec o s such as he injec ion o
ha dwa e ulne abili ies by a malicious i mwa e upda e [9]. Fo secu i y, c yp-
og aphic p o ocols au hen ica e he objec s wi h keys o passwo ds con igu ed
by he manu ac u e 1. Au hen ica ion also add esses coun e ei p oduc s and30
ake eplacemen pa s which a e becoming mo e sophis ica ed and p esen a
majo p oblem o many indus ies [10].
1By manu ac u e we e e o he in eg a o a he han he p oduce o he MCU chip.
2
Hence, an IoT-enabled home appliance such as a washing machine whose
con olle boa d ea u es a ne wo k connec ion mus be secu e, no only o p o-
ec i sel om a acks bu o p o ec also he ne wo k o which i is connec ed.35
In he p oduc ion p ocess, he manu ac u e con igu es he con olle wi h a
c yp og aphic key and s o e he coun e pa key in a da abase.2Once sold and
deployed in he ield, he machine may equi e se ices o e ed by he manu-
ac u e . To au hen ica e he machine, he manu ac u e sends a challenge ha
he machine mus answe employing i s sec e key. The manu ac u e e i ies40
he esponse using he coun e pa key. Beyond au hen ica ion, he sec e key
may also be used o signing da a sen by he machine, e.g., senso eadings,
a es ing om which machine hey o igina e.
In MCUs, he sec e key mus be s o ed in a way ha is no accessible
om he ou side o make hem impossible o copy in o a coun e ei . The se-45
cu e elemen s ha p o ide such s o age [11], howe e , add signi ican cos and,
consequen ly, ew con olle s ha e hem.
In his pape , an al e na i e au hen ica ion app oach in which an MCU gen-
e a es a sec e key in e nally is in oduced, exploi ing manu ac u ing a iabili y
as a physical unclonable unc ion (PUF). As he key is gene a ed by he de-50
ice i sel , manu ac u e s sa e he expense o a secu e en i onmen o ex e nal
key gene a ion. In p oduc ion, once chips a e loaded wi h a i mwa e, i is only
necessa y o un an in e nal cha ac e iza ion and pass on he esul ing public
key, mask and helpe da a o be s o ed o au hen ica ion and eco e y. Fu he
ex e nal memo y access is p e en ed, e.g., by blowing he JTAG secu i y use.55
As he sec e key is egene a ed (wi h he same esul each ime) a he han
s o ed in non- ola ile memo y, i is e y ha d o clone and he cos o a secu e
elemen can be sa ed.
The case o such IoT de ices is s eng hened u he in combina ion wi h a
dis ibu ed ledge , o blockchain. Fi s o all, he immu abili y and dis ibu ed60
2In asymme ic c yp og aphy, he de ice is con igu ed wi h a p i a e key and he manu-
ac u e s o es he public key; in symme ic c yp og aphy, bo h hold he same sec e key.
3
us p o ided by a blockchain can make he de ice au hen ica ion independen
o he manu ac u e . Secondly, a business p ocess implemen ed in chaincode ha
elies on IoT inpu s can alida e de ice signa u es o ensu e he au hen ici y
and in eg i y o hose inpu s.
Replacing he cen al da abase ope a ed by a manu ac u e wi h a blockchain65
makes he sys em independen o he manu ac u e . The chaincode will s ill al-
low only he manu ac u e o c ea e new machine en ies on he dis ibu ed
ledge bu as he ledge con en is dis ibu ed o all pa icipan s (mul iple man-
u ac u e s, e aile s, owne s, e c.) he manu ac u e is elie ed o adminis e ing
he sys em and gua an eeing i s a ailabili y. A cen al da abase would go o line70
when he manu ac u e goes ou o business whe eas a blockchain can su i e.
Gi en he secu i y disad an ages o symme ic au hen ica ion schemes (keep-
ing a da abase o keys o au hen ica e wi h he isk o being hacked o los , he
isk o cloning, and ba ie s o hi d-pa y au hen ica ion, among o he s) ou
app oach ins ead uses public-key c yp og aphy based on lea ning pa i y wi h75
noise (LPN) p oblems, and in pa icula ze o-knowledge (ZK) p o ocols o u -
he simpli y he managemen o de ice public keys. The blockchain may make
he public keys gene a ed by each de ice a ailable o anyone o use in hei
own au hen ica ion sys em.
As o he second aspec , e en a low-cos de ice can p e en manipula ion80
o i s communica ion wi h a blockchain by signing i s messages wi h ou PUF-
de i ed keys, making he p oposal sui able o any esou ces-limi ed de ice con-
nec ed o he blockchain [9]. The chain code, in u n, can also alida e he
de ice signa u es o ensu e da a in eg i y and au hen ici y, ex ending he us
he blockchain p o ides in o he IoT de ice.85
This pape p oposes using an SRAM-based PUF o gene a e c yp og aphic
keys ha a e employed in a ze o-knowledge p oo o au hen ica e an IoT de ice.
We p esen an e icien implemen a ion in an MCU and show ha e en low-cos
de ices can pe o m he equi ed compu a ional asks su icien ly as . Expe -
imen al esul s demons a e ha ou app oach is obus agains empe a u e90
a ia ions and ha collisions o de ice iden i ies a e unlikely.
4

This pape is s uc u ed as ollows. Sec ion 2 e iews ela ed wo k in digi al
and physical us on he blockchain as well as PUFs using LPN p oblems o
unde s and PUFs, ZK p oo s o knowledge, and exac LPN (xLPN) p oblems.
Sec ion 3 desc ibes ou p oposal o use PUFs in c yp osys ems based on xLPN95
p oblems. An e icien implemen a ion o he p oposal on an MCU is desc ibed in
Sec ion 4. Expe imen al esul s o he implemen a ion a e p esen ed in Sec ion 5.
Finally, conclusions and u u e wo k a e gi en in Sec ion 6.
2. P elimina ies
2.1. Ex ension o us in o physical p oduc s100
An ex ension o he blockchain-p o ided us beyond he digi al in o he
physical domain is equi ed o eliably de e mine p oduc o iginali y o o accu-
a ely ace he mo emen o goods. The physical objec s mus be unequi ocally
ied o hei associa ed digi al eco ds. Typically, a unique iden i ie (UID) is
used o link a physical objec o a digi al eco d. The iden i ie can be unique in105
he sense ha i ep esen s an indi idual objec , o i can mo e b oadly iden i y
a class o objec s by model, ba ch, p oduc ion si e, manu ac u e o simila [12].
A UID is ypically a ached as a ag, p in ed o embossed on he objec o i s
packaging. Such iden i ie s, howe e , can o en easily be cloned o ans e ed o
a ake objec . Hence, an iden i ie alone canno uniquely and secu ely iden i y,110
i.e., au hen ica e an objec .
A b oad a ie y o concep s and solu ions has been s udied and in oduced o
iden i y objec s secu ely and uniquely. The concep s include ha d- o-clone elec-
onic ags [13], embedded secu i y ea u es such as hose ound in bankno es,
all he way o physical inge p in s o he objec s hemsel es. Such inge p in s115
ypically esul om uncon ollable ma e ial o manu ac u ing a iabili ies and
a e well s udied in he con ex o PUFs [14, 15]. Examples include he s uc u e
o lea he , he imp in o p oduc ion-line ools, o he doping in semiconduc o s.
The a iabili y may be a common p oduc ion side-e ec (in insic) o speci i-
cally in oduced (ex insic), o ins ance by adding special pa icles [16] o colo 120
5
codes [17] o medical p oduc s.
2.2. PUFs and compu a ionally ha d p oblems
The e m PUF was used o he i s ime o cha ac e ize he physical mi-
c os uc u e in oduced by andom a ia ions o a manu ac u ing p ocess, pa -
icula ly o he CMOS ab ica ion p ocess [18, 19]. The unique a ia ions be-125
ween CMOS componen s a e exploi ed by a ha dwa e PUF o gene a e unique,
componen -speci ic esponses o iden ical challenges. Howe e , since PUF e-
sponses change sligh ly om one measu emen o ano he , he use o a uzzy
ex ac o was p oposed o help econs uc ing a cons an and unique esponse
linked o he physical cha ac e is ics o a PUF [20].130
Recen ly, he use o lea ning wi h e o (LWE) p oblems was p oposed [21]
in a LWE-based lossless compu a ional uzzy ex ac o as a way o p o ec
sec e in o ma ion in a compu a ionally secu e manne . In a e y simila way,
[22, 23] used lea ning pa i y wi h noise (LPN) o c ea e a compu a ional uzzy
ex ac o and c yp og aphically-secu e PUF. Tha p oposal uses an LPN-based135
challenge- esponse p o ocol oge he wi h a symme ic key (ob usca ed by he
compu a ional uzzy ex ac o ) o au hen ica e he PUF. Despi e he in e es ing
ad an ages o compu a ional uzzy ex ac o s, hei use is ou side he scope o
his wo k, and we will use only adi ional uzzy ex ac o s o simplici y.
2.3. Physical unclonable unc ions p ope ies and me ics140
The e is always una oidable a iabili y du ing he manu ac u ing p ocess o
any de ice. In his con ex , a PUF is a physically e alua ed unc ion ha exploi s
he andom a iabili y unin en ionally in oduced in he de ice p oduc ion. Be-
cause o he uncon ollable na u e o hese a ia ions, hey a e impossible o
clone and he esponses o a challenge can iden i y di e en de ices uniquely,145
like inge p in s.
To be conside ed as a PUF, he ollowing p ope ies mus be sa is ied [15]:
•Rep oducibili y: The esponse o a PUF o a gi en challenge mus be he
same o e ime.
6
•Uniqueness: The esponses o di e en PUFs o a gi en challenge mus be150
e y di e en .
•Unp edic abili y: I di e en challenges a e p o ided o a PUF, i s e-
sponses mus be comple ely di e en and unp edic able.
As PUF esponses a e ypically digi al hese p ope ies a e commonly e al-
ua ed using he Hamming dis ance (HD) [24] which ep esen s he pe cen age
o di e en bi s be ween PUF esponses as ollows:
HD( i, gj) = 1
L
L−1
X
b=0
i[b]⊕gj[b] (1)
whe e iand gj ep esen he esponse o a PUF o he challenge iand g o
he challenge j, espec i ely; Lis he leng h o he esponse ec o in bi s and155
bis a bi posi ion in he esponse ec o , and ’⊕’ deno es bi wise XOR.
I is he esponse o a PUF a a ime = 1 o a gi en challenge i, and g
is he esponse o his PUF a ime = 2 o he same challenge (i=j) hen
Equa ion 1 yields he in a-de ice Hamming dis ance (in a-HD), e alua ing he
ep oducibili y o he PUF esponses by i s e o , which ideally should be 0. I ,160
in con as , gis he esponse o his PUF a = 1 o a di e en challenge (i6=j)
hen Equa ion 1 e alua es he unp edic abili y o he PUF esponses by hei
simila i y, wi h an ideal alue o 50%. Finally, i gis he esponse o ano he
PUF a any ime o he same challenge, hen Equa ion 1 gi es he in e -de ice
Hamming dis ance (in e -HD) and e alua es he uniqueness o he PUFs by he165
simila i y o hei esponses, whose ideal alue is 50%.
Ano he me ic ha can be used o e alua e he PUF p ope ies is he min-
imum en opy [24]. I gi es he pe cen age o andomness in a se o sequences
wi h he ollowing equa ion:
Hmin (pmax) = 1
L
L−1
X
b=0
−log2(pmax [b]) (2)
whe e pmax [b] ep esen s he maximum p obabili y o aking logic alue 0 o 1
obse ed a he b h bi o he PUF esponse.
7
I pmax [b] is calcula ed in a single PUF using esponses o e ime o he
same challenge, hen Equa ion 2 e alua es he ep oducibili y and he minimum170
en opy should ideally be 0. I he esponses a e gene a ed using di e en chal-
lenges, hen i e alua es he unp edic abili y and he minimum en opy should
ideally be 100%. Finally, i he esponses a e ob ained om di e en PUFs, hen
he p ope y e alua ed is he uniqueness, and he minimum en opy should ide-
ally be 100%.175
2.4. Fuzzy ex ac o s
PUF esponses will be e y simila bu no exac ly he same o successi e
gene a ions. The e o e, an e o -co ec ing code (ECC) has o be implemen ed
o econs uc a s able esponse. Fuzzy ex ac o s [25] ha e been widely used in
PUFs oge he wi h a so -decision helpe -da a algo i hm [20]. The PUF quali y180
can be u he imp o ed by condi ioning esponses o elimina e uns able bi s and
bias.
To do his, he algo i hm desc ibed in [26, 27] i s akes mul iple esponses
om a PUF and compa es hem o de ec which bi s o he esponse a e s able
and which bi s a e uns able. This esul is exp essed as masks o s able and185
uns able bi s. Conside ing only he s able bi s inc eases he ep oducibili y o
he PUF esponses. The masks a e used o c ea e unique iden i ie s o keys om
s able bi s, and andom seeds om uns able bi s.
The s able bi s selec ed om he PUF esponse may be biased owa ds ei he
1 o 0 and he e o e mus be condi ioned be o e being used in a c yp og aphic190
algo i hm. In [26], he pai -ou pu on Neumann algo i hm (2O-VN) is in o-
duced o debiasing. I c ea es ano he mask ha , combined wi h he mask o
s able bi s, esul s in a selec ion mask. The bi sequence ob ained a e ap-
plying he selec ion mask is a PUF esponse wi h highe ep oducibili y and
unp edic abili y, hus sui able o c yp og aphy.195
The ope a ion o uzzy ex ac o s can be di ided in o wo phases: egis a ion
and gene a ion. The egis a ion phase akes he debiased s ing o he PUF, D,
and combines i wi h an n- imes epe i ion o a sec e key s,C=REPEAT(s, n),
8
Subsec ion 2.6, he de ice needs he sec e e o , e, o calcula e C2. Since he
de ice s o es i s public key (o i is p o ided om he ou side a e i is powe ed
up), i can compu e e=A·s⊕y. Besides, his e o can be e i ied as easily as
coun ing he numbe o bi s wi h alue ’1’ o he ec o ob ained, i.e., calcula ing350
i s Hamming weigh . As explained in [29], i he e we e a single w ong bi in
s, he ec o eob ained would look like a uni o m andom a iable, and he
p obabili y ha i s weigh we e equal o wwould be negligible hanks o he
ha dness o he xLPN p oblem. This allows he de ice no only o e i y he
co ec ness o he e o bu also o de ec i be o e exchanging any message in355
he ZK p o ocol.
4. E icien implemen a ion on a mic ocon olle
4.1. Ha dwa e pla o m
One o he main challenges o many c yp og aphic algo i hms is he an-
si ion om heo e ical desc ip ion o implemen a ion, especially when i comes360
o making e icien use o ha dwa e esou ces. We used SRAM PUFs o com-
me cial mic ocon olle s [26] o ob ain he in insic iden i y o elec onic de ices
and es i s sui abili y as sec e s o he ZK p oo s de ailed in Sec ion 3. The
in e ac i e ze o-knowledge p oo s make i impossible o ans e he us , and
so he iden i y canno be coun e ei ed.365
While he p o ocol is gene ic and simple enough o wo k in any mic ocon-
olle , he ideal de ice should ha e enough pe sis en memo y o s o e cha ac-
e iza ion da a (such as ma ix A) o a oid ecalcula ing i o e e y i e a ion
o ecei ing i om he e i ie . I is also ecommended o ha e c yp og aphic
accele a o s a ailable in low powe mic ocon olle s o simpli y he design, all370
wi hou ha ing o d aw upon mo e expensi e high- equency p ocesso s o DSPs.
We ha e implemen ed ou app oach on a Texas Ins umen s (TI) Launch-
PadTM de elopmen ki wi h a 16-bi RISC MSP430FR5994 mic ocon olle a
16 MHz. In addi ion, we designed a command-line in e ace (CLI) in MAT-
LABTM o in e ac wi h he mic ocon olle ia a se ial po . In his se up,375
15

he mic ocon olle ac s as p o e while he CLI ac s as a e i ie and sends
challenges in o de o e i y he ZK p oo s.
The mic ocon olle has 8 KB o SRAM, 256 KB o e oelec ic andom-
access memo y (FRAM) and uses a lib a y ha implemen s he NIST s anda d
o he coun e -mode de e minis ic andom bi gene a o (CTR-DRBG) [35] us-380
ing i s AES ha dwa e accele a o . I also has a low-ene gy accele a o o signal
p ocessing, se e al ul a-low-powe modes, and up o ou eUSCI po s (TI’s
enhanced uni e sal se ial communica ion in e ace). We used all hese cha ac-
e is ics o simpli y he de elopmen o ou p oo o concep .
Rega ding he use o PUFs, he de ice sel -cha ac e iza ion is mo e esou ce-385
demanding han he e i ica ion s ep. Howe e , his p ocess is ca ied ou only a
he egis a ion phase o he uzzy ex ac o and can be ully au oma ed wi hin
he de ice. Wi h espec o he ZK p o ocol, he asks ha equi e he highes
compu a ional powe a e he mul iplica ion o ma ices and he gene a ion o
andom numbe s. The implemen a ion o all hese algo i hms and he pa icula 390
solu ions p oposed a e p esen ed in he ollowing.
4.2. Sel -cha ac e iza ion
While many TI mic ocon olle s a e low powe , hose o he FRAM amily
ea u e ul a-low-powe modes. They can shu down pa s o he sys em on a
chip (SoC) in a con olled way, powe ing down anscei e s and pe iphe als,395
clocks and he SRAM.
We use he ul a-low-powe mode LPM 3.5 and he eal- ime clock o powe
cycle he p ocesso a e a p ede ined ime o e ase he in o ma ion s o ed in
SRAM and all egis e s. A e each powe cycle, he SRAM s a -up alues
ep esen he PUF esponses used in he uzzy ex ac o , as de ailed in Subsec-400
ion 2.4. The FRAM, which is non- ola ile, is employed o s o e he mul iple
measu emen s o PUF esponses needed o gene a e he bi -selec ion mask.
4.3. Ma ix and ec o ope a ions in xLPN
Ma ix and ec o mul iplica ions a e compu a ionally cos ly ope a ions. In
he p o ocol employed, hey a e equi ed o gene a e he public key in he o m405
16
y=A·s⊕e, o calcula e he pe ec ly binding commi men (as de ailed in
Subsec ion 2.6), and o gene a e he commi men messages o he p oo s (as
de ailed in Subsec ion 2.7).
As discussed in [29], xLPN ope a ions ha e a simila complexi y o decoding
andom linea codes. Thanks o wo king wi h bina y ec o p oduc s and XOR410
sums, he ope a ions a e equi alen o pe o ming linea combina ions o ec o s.
The bina y ec o sin he ope a ion y=A·s⊕eindica es which columns o A
should pa icipa e in he calcula ion o he pa i y sum along wi h he ec o e.
Only he columns ha a e mul iplied by a non-ze o alue a ec he esul . One
way o combine he ec o p oduc s is employing XOR sums, educing he xLPN415
p oduc o linea combina ions o he columns o A ha a e mul iplied by non-
ze o elemen s o s. Figu e 2 shows an example in which he non-ze o elemen s o s
a e {0,2,3}, and he e o e ycan be calcula ed as y=A(:,0)⊕A(:,2)⊕A(:,3)⊕e.
𝒚 = 𝑨 ∙ 𝒔 ⨁ 𝒆
𝑘 𝑘
ℓ
+
𝑛
𝑘
ℓ+ 𝑛
10101
10001
10110
10011
00100
11010
10001
00101
11001
01100
1
0
1
1
0
0
0
1
0
0
0
0
0
0
1
0
1
0
0
1
0
1
1
1
0
Figu e 2: Linea combina ions o Acolumns wi h noise e.
When his ope a ion is used o calcula e he commi men s, he claimed in-
17
o ma ion mus be compac ed o he size o s, which is analogous o gene a ing420
mul iple p oduc s o ma ix Awi h pieces o he claim, and hen add an e o e.
In o he wo ds, when used o calcula ing Com(m) = A·( ||m)⊕ewi h m∈ In,
i o example he claim mhad size k=O(n) = β·nins ead o size n, and i
could be desc ibed as m= [m1, m2, ..., mβ], hen:
Com(m) =
β
M
i=1
[A·( i||mi)] ⊕e=A· ||
β
M
i=1
[mi]!⊕e
o eR
← Ik
w, i
R
← I`, and Lβ
i=1 i= . In his equa ion, he message o 425
leng h βn is compac ed using XOR ope a ions in o a message o leng h n, and
only a single xLPN ope a ion is equi ed o calcula e he commi men o his
claim. This comp ession is e y use ul especially o he commi men o he
andom pe mu a ion which helps o educe he size om k·log2(k) o n.
4.4. Va ian s o he de e minis ic andom bi gene a o 430
The p o ocol equi es andom ec o s om a uni o m dis ibu ion in mul iple
s eps. We gene a e hem using he mic ocon olle ’s AES ha dwa e accele a o
in he NIST app o ed CTR-DRBG mode4. O he pa s o he algo i hm, such
as he weigh ed e o s o he andom ec o pe mu a ions, equi e andom se-
quences o a di e en na u e. The algo i hms used o adap he andom numbe 435
gene a o o ul ill hese p o ocol equi emen s a e desc ibed in he ollowing.
4.4.1. Weigh ed uni o m andom bi gene a o
The CTR-DRBG unc ions a e used o gene a e a weigh ed uni o m dis i-
bu ion. The sequences needed by he xLPN p oblem should ha e a Hamming
weigh no o won a e age bu exac ly equal o w. To achie e his, he imple-440
men ed algo i hm s a s om an all-ze os ec o o kelemen s deno ed as 0k.
Since he esul ing ec o mus ha e a cons an weigh , i means ha w=bτke
ones a e inse ed in he sequence o ze os. The posi ions in which he wones a e
4Al e na i ely, a C implemen a ion o he AES algo i hm can be used o a p ocesso
wi hou such an accele a o .
18
in oduced ollow a uni o m dis ibu ion o andom alues in he ange [0, k −1]
p o ided by he CTR-DRBG. I a andom posi ion is epea ed, i is disca ded,445
and a new posi ion is gene a ed un il wones a e inse ed. Figu e 3 shows he
diag am ha desc ibes he algo i hm.
2
Fo ha
eason,
ou
modi ica ion o e he Knu h Shu le algo i hm pe o ms a modulo ope a ion, bu only using powe s o 2
𝑤
[0,𝑘 − 1]
0𝑘→
1𝑤
Figu e 3: Weigh ed andom numbe gene a o using CTR-DRBG.
4.4.2. Random pe mu a ion gene a ion
Ins ead o gene a ing andom posi ions by ial and e o o all elemen s o a
ec o , we de eloped and implemen ed a a ian o he Knu h shu le algo i hm.450
The o iginal algo i hm s a s wi h any pe mu a ion ( o example, he iden i y
pe mu a ion) w i en o a s ing π[ ] o size k. Then, i poin s o posi ions
0 h ough k−2 using an index a iable i(assuming he ec o elemen s a e
indexed 0 o k−1). Fo each posi ion o i, he algo i hm swaps he elemen in
ha posi ion wi h a andomly chosen elemen be ween and including posi ions455
iand k−1 ( he end o he ec o ).
The e a e some issues ega ding he andom numbe gene a ion in he ange
i o k–1. The CTR-DRBG o he chosen mic ocon olle always p oduces a
128-bi ou pu , so he ou pu is pos -p ocessed o ma ch he in e al [i, k–1].
19
Applying echniques such as modulo ope a o o he ou pu o he RNG will no 460
gene a e he uni o m ou pu in he desi ed ange bu a biased s ing in which
he lowe pa o he ange has a highe p obabili y o occu ence.
[𝑘 − 𝑥,𝑘 − 1]
M andom numbe s (posi ions)
0
𝑘 ze os bi s ing
𝑘 bi s wi h exac ly
⌊𝑘 × 𝜏⌉ weigh
1
⌊𝑘 × 𝜏⌉ one bi s
𝑚𝑜𝑑(𝑥)+𝑘 − 𝑥
[0,2128 − 1]
Figu e 4: Random pe mu a ion gene a o based on he Knu h shu le.
To add ess his p oblem, ou modi ica ion o he Knu h shu le algo i hm,
shown in Figu e 4, pe o ms a modulo ope a ion using only powe s o 2 (which
is equi alen o elimina ing he leas signi ican bi s). Wi h his change i gen-465
e a es andom numbe s in he ange [0, x −1] o x= 2n, making he Knu h
shu le algo i hm mo e e icien while main aining a p obabili y o occu ence
ha ollows he uni o m dis ibu ion. Besides, kmus be a powe o wo so ha
he absence o bias is also sa is ied when educing he ange o andom numbe s
om [0,2128 −1] o [0, k−1]. I is wo h no ing ha modulo 2nope a ions can be470
implemen ed by shi ing a egis e by nbi s. This g ea ly simpli ies compu ing
on any de ice wi h limi ed esou ces.
20

The modi ied Knu h shu le algo i hm o andom pe mu a ions is summa-
ized in algo i hm 1. The p obabili y o epea ing a andom posi ion will be
always in he ange (0,0.5) wi h his modi ica ion. Wi h he o iginal imple-475
men a ion (wi hou applying modulo) he p obabili y o epea ing a andom
posi ion ends o (1 −1/k) when i ends o k. Gi en ha each i e a ion o he
ZK p o ocol equi es pe mu a ions, his imp o emen subs an ially inc eases he
pe o mance o ou implemen a ion.
Algo i hm 1 Random pe mu a ion gene a o based on he Knu h shu le
p ocedu e Gene a e a andom pe mu a ion, π∈ Sk
Ini ialize a iables:
π←[0,1,2,3, ..., k −2, k −1]
i←0
while i < k:
x←2dlog2(k−i)e
p←CTR-DRBG[0,2128 −1] mod (x)+k−x
i p≥i hen
swap(π[i], π[p])
i←i+ 1
5. Expe imen al esul s480
This sec ion de ails he expe imen al esul s as well as he p o ocol imple-
men a ion. P o ec ion o he de ice agains side-channel a acks is beyond he
scope o his wo k. To p e en some o hese a acks, such as di e en ial powe
analysis (DPA), he sys em should be buil in such a way ha i is impossible
o ex ac any in o ma ion om he ou side, e.g., by measu ing elec omagne ic485
adia ion. Conside ing a acks ia he JTAG po , he secu i y uses should
be blown once he de ice is pu in o p oduc ion. These coun e measu es a e
conside ed s anda d in he indus y when dealing wi h secu e sys ems.
We an he expe imen s on 10 TI LaunchPadsTM wi h MSP430FR5994 mi-
21
c ocon olle s. In o al we ook 120 eadings o he comple e SRAM (8 KB)490
o each mic ocon olle a 3 di e en empe a u es, wi h he de ice powe ed
o be ween measu emen s o wo seconds by LPM 3.5.5This numbe o mea-
su emen s and ope a ing condi ions ha e p o en o be su icien o cha ac e ize
SRAMs co ec ly and ob ain hei mask in an e icien way [24]. F om each
se o 120 measu emen s, we used 20 measu emen s o compu e he selec ion495
mask o he de ices. Wi h he emaining 100 measu emen s we e alua ed he
p ope ies o he mic ocon olle SRAM PUFs ( ep oducibili y, uniqueness, and
unp edic abili y).
As shown in [24], empe a u e a ia ions al e he beha io o SRAM PUFs
signi ican ly. The empe a u es suppo ed by he mic ocon olle ange om500
−40 ◦C o +85 ◦C, acco ding o he manu ac u e . We conduc ed expe imen s a
a±5◦C ma gin om hese bounda ies, a −35 ◦C and 80 ◦C, and a a con olled
nominal empe a u e o 25 ◦C.
We calcula ed he in a-de ice Hamming dis ance (in a-HD) and in e -
de ice Hamming dis ance (in e -HD) acco ding o Equa ion 1. Figu e 5(a) shows505
in a-HD in one de ice a −35 ◦C wi h and wi hou selec ion mask, and Fig-
u e 5(b) he in e -HD conside ing all he 10 de ices a −35 ◦C. Figu es 6 and
7 show he same in a-HD and in e -HD ep esen a ions a 25 ◦C and 80 ◦C,
espec i ely.
I can be seen how he selec ion mask d as ically educes he in a-HD by510
mo e han 50% a ex eme empe a u es, and app oxima ely 90% in nominal
condi ions, app oaching he op imal in a-HD alue o 0%. The in e -HD dis i-
bu ions, on he o he hand, a e p ac ically una ec ed by he mask wi h a e ages
a ound he ideal uniqueness alue o 50%.
Ano he c i ical pa o he ze o-knowledge p oo p o ocol is he gene a ion515
o andom numbe s. I is impo an o e alua e he quali y, i.e., unp edic abili y
5The ime be ween measu emen s has been de e mined by cha ac e izing he mic ocon-
olle s o his pa icula p o o ype. I mus be adjus ed o each indi idual ype o mic ocon-
olle o in eg a ed ci cui .
22
(a) (b)
Figu e 5: In a- and in e -de ice Hamming dis ance (exp essed in %) wi h and wi hou selec-
ion mask a −35 ◦C.
o he seeds ha a e used o eed he pseudo andom numbe gene a o . Since
hese seeds come om he uns able cells o he SRAM, we mus e alua e hei
minimum en opy as de ailed in Equa ion 2. The expe imen al esul s o his
me ic can be seen in Figu e 8, wi h and wi hou selec ion mask, a −35 ◦C,520
25 ◦C and 80 ◦C.
10 20 30 40 50 60 70 80 90 100
Numbe o measu emen s
0
5
10
15
20
25
30
35
Pe cen age o Hmin
Masked a -35ºC
Unmasked a -35ºC
Masked a 25ºC
Unmasked a 25ºC
Masked a 80ºC
Unmasked a 80ºC
Figu e 8: Minimum en opy a −35 ◦C, 25 ◦C and 80 ◦C, wi h and wi hou selec ion mask.
23
(a) (b)
Figu e 6: In a- and in e -de ice Hamming dis ance (exp essed in %) wi h and wi hou selec-
ion mask a 25 ◦C.
Tables 1 and 2 show he indi idual measu emen s o a e age in a-HD and
minimum en opy in he en de ices, cha ac e ized a −35 ◦C, 25 ◦C and 80 ◦C,
bo h wi h and wi hou he mask. We obse e ha he ela i e beha io o all
de ices is simila , jus showing sligh ly di e en absolu e alues owing o hei 525
di e en manu ac u ing a ia ions.
De ice 1 2 3 4 5 6 7 8 9 10
Unmasked a −35 ◦C 5.18 5.31 5.02 4.24 3.98 4.94 4.23 5.14 4.91 4.86
Masked a −35 ◦C 1.99 3.86 3.79 3.86 2.31 2.35 1.96 3.96 1.95 2.65
Unmasked a 25 ◦C 4.98 5.02 4.90 5.03 4.27 4.89 4.58 4.58 5.02 4.59
Masked a 25 ◦C 0.44 0.45 0.42 0.45 0.36 0.43 0.40 0.38 0.42 0.33
Unmasked a 80 ◦C 4.85 4.71 4.67 4.40 4.80 4.71 4.90 3.57 4.41 4.11
Masked a 80 ◦C 2.45 2.70 2.48 3.50 3.51 2.41 3.36 1.58 2.01 1.98
Table 1: A e age in a-HD pe cen age o en de ices a −35 ◦C, 20 ◦C and 80 ◦C wi h and
wi hou mask.
24
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