scieee Science in your language
[en] (orig)

Remote Cooling of Rolls in Hot Rolling; Applicability to Other Processes

Abstract

A novel method of cooling rolls in hot rolling is proposed. This method uses a combination of solid jet nozzles and specially shaped deflecting vanes. The vanes transform the incoming cylindrical water jet into a flat fan. Thereby, the coolant can be directed into hardly accessible locations whilst maintaining the optimal angle of impingement. The vanes allow for effectively cooling the roll surface near the rolling gap, which is otherwise not possible with classical flat fan nozzles. The jet impact is tangential due to the limited room for nozzle mounts or a coolant supply. The developed method was laboratory tested. A similar cooling efficiency was found between the vane and the flat fan nozzle. The latter was however mounted in a position impossible in the plant. The potential of the proposed cooling is, therefore, eminent. Apart from hot rolling, it could be exploited in other technological processes such as high pressure die casting, machining, turning, hot stamping, etc.

Read accessible full text

Remote Cooling of Rolls in Hot Rolling; Applicability to Other Processes

Author: Boháček, Jan; Raudenský, Miroslav; Kotrbáček, Petr
Publisher: MDPI
Year: 2021
DOI: 10.3390/met11071061
Source: https://dspace.vut.cz/bitstreams/df9f10c7-6062-4b7e-a5df-d8569ca79370/download
me als
Communica ion
Remo e Cooling o Rolls in Ho Rolling; Applicabili y o
O he P ocesses
Jan Bohacek *, Mi osla Raudensky and Pe Ko bacek


Ci a ion: Bohacek, J.; Raudensky, M.;
Ko bacek, P. Remo e Cooling o Rolls
in Ho Rolling; Applicabili y o O he
P ocesses. Me als 2021,11, 1061.
h ps://doi.o g/10.3390/
me 11071061
Recei ed: 27 May 2021
Accep ed: 28 June 2021
Published: 30 June 2021
Publishe ’s No e: MDPI s ays neu al
wi h ega d o ju isdic ional claims in
published maps and ins i u ional a il-
ia ions.
Copy igh : © 2021 by he au ho s.
Licensee MDPI, Basel, Swi ze land.
This a icle is an open access a icle
dis ibu ed unde he e ms and
condi ions o he C ea i e Commons
A ibu ion (CC BY) license (h ps://
c ea i ecommons.o g/licenses/by/
4.0/).
Hea T ans e and Fluid Flow Labo a o y, Facul y o Mechanical Enginee ing, B no Uni e si y o Technology,
Technicka 2, 61669 B no, Czech Republic; mi osla [email p o ec ed] (M.R.); pe [email p o ec ed] (P.K.)
*Co espondence: [email p o ec ed]
Abs ac :
A no el me hod o cooling olls in ho olling is p oposed. This me hod uses a combina ion
o solid je nozzles and specially shaped de lec ing anes. The anes ans o m he incoming
cylind ical wa e je in o a la an. The eby, he coolan can be di ec ed in o ha dly accessible
loca ions whils main aining he op imal angle o impingemen . The anes allow o e ec i ely
cooling he oll su ace nea he olling gap, which is o he wise no possible wi h classical la an
nozzles. The je impac is angen ial due o he limi ed oom o nozzle moun s o a coolan supply.
The de eloped me hod was labo a o y es ed. A simila cooling e iciency was ound be ween he
ane and he la an nozzle. The la e was howe e moun ed in a posi ion impossible in he plan .
The po en ial o he p oposed cooling is, he e o e, eminen . Apa om ho olling, i could be
exploi ed in o he echnological p ocesses such as high p essu e die cas ing, machining, u ning, ho
s amping, e c.
Keywo ds:
sp ay cooling; ho olling; high p essu e die cas ing; u ning; s amping; c yogenics;
nozzle; hea ans e coe icien
1. In oduc ion
Ope a ional condi ions and many s udies con i med ha he sp ay cooling in he ho
olling p ocess has a signi ican impac on damage and se ice li e o wo k olls. I he
cooling is no app op ia e, he p o ile and shape o he olled ma e ial can be ad e sely
in luenced. Typical cooling p ac ice is based on he use o heade s wi h ows o wa e
nozzles. Cooling is usually loca ed on bo h sides (exi and en ance) o he oll. An example
o dis ibu ion o empe a u e along ci cum e ence o he oll is shown in Figu e 1. I is
ob ious ha he high su ace empe a u e d ops apidly a e he exi om he olling
gap due o hea conduc ion o he oll. The cooling in ensi y depends on hea lux a he
sp ayed su aces. Hea lux can be ob ained as a p oduc o hea ans e coe icien (HTC)
and a di e ence be ween he su ace empe a u e and he empe a u e o wa e . Hea
ans e coe icien is dominan ly dependen on he sp ay cha ac e is ics such as wa e
impingemen densi y, d ople sizes and eloci ies he eo , and p ope ies o he su ace
being cooled.
The main subjec o his wo k is ocused on shi ing he in ensi e cooling close o he
olling gap. The high su ace empe a u e o he oll could po en ially yield a high cooling
in ensi y he ein.
The ques ion o how o inc ease he wo k olls’ li e has been he subjec o con inuous
in e es . The pape o S e ens was published in 1971 bu i is s ill e y li e [
1
]. The
published esul s o he plan measu emen a e unique e en hese days. The mos equen
demand o oll cooling designe s is o hold he oll empe a u e low. Some oll p oduce s
e en ecommend a maximum ope a ing empe a u e o olls. Solu ion can be o shi he
cooling close o he olling gap. The op imal cooling depends on he oll ma e ial and is
ob ious ha ension s ess in oll su ace laye g ows wi h in ensi y o cooling.
Me als 2021,11, 1061. h ps://doi.o g/10.3390/me 11071061 h ps://www.mdpi.com/jou nal/me als
Me als 2021,11, 1061 2 o 7
Me als 2021, 11, 1061 2 o 8
Figu e 1. Typical example o oll empe a u e in ho olling.
The main subjec o his wo k is ocused on shi ing he in ensi e cooling close o
he olling gap. The high su ace empe a u e o he oll could po en ially yield a high
cooling in ensi y he ein.
The ques ion o how o inc ease he wo k olls’ li e has been he subjec o con inuous
in e es . The pape o S e ens was published in 1971 bu i is s ill e y li e [1]. The pub-
lished esul s o he plan measu emen a e unique e en hese days. The mos equen
demand o oll cooling designe s is o hold he oll empe a u e low. Some oll p oduce s
e en ecommend a maximum ope a ing empe a u e o olls. Solu ion can be o shi he
cooling close o he olling gap. The op imal cooling depends on he oll ma e ial and is
ob ious ha ension s ess in oll su ace laye g ows wi h in ensi y o cooling.
As he plan measu emen o cooling in ensi y is a e he in es iga o s use mos ly
esul s o labo a o y measu emen s. De ailed in o ma ion abou he measu ed HTC is
gi en in [2]. A hollow oll diame e 352 mm, he leng h o 900 mm and he hickness o
he wall o 16 mm is used as a es su ace. The o a ing es oll is hea ed by lame on one
side and is cooled by ow o la an nozzles on he opposi e side. Embedded he mocou-
ples a e used o empe a u e measu emen nea he oll su ace. Hea ans e coe icien s
a e e alua ed om he empe a u e measu emen s by he in e se hea conduc ion ask.
The esul s show he HTC dis ibu ion bo h a ound and along he oll.
A simila labo a o y es me hod wi h a hea ed d um was used by Tseng [3,4].
The
measu ed da a is used in nume ical simula ions o s ess–s ain condi ions in he oll. and
sugges ions a e d awn o cooling o ex end he oll li e. Mode a e cooling is ecom-
mended wi h a la ge oll su ace. On he con a y o ecommenda ions o mo e ecen
wo ks, Tseng does no ecommend in ensi e cooling nea he olling gap. As he eason
he gi es he inc eased he mal cyclic s ess educing he oll li e.
Publica ion [5] ela es o he cold olling, ye in e es ing esul s e eal he in luence
o oil in cooling wa e . I is shown ha e en small amoun o oil can signi ican ly educe
cooling in ensi y and his ac is alid o ho olling as well. This no equen ly men-
ioned e ec can be he sou ce o a cooling mal unc ion.
Clea esul s desc ibing he in luence o posi ion o cooling on he s ess in he su ace
laye is gi en in [6]. Se e al nume ical simula ions show cooling dis ibu ion dependen
on he su ace empe a u e and i s e ec on s ess condi ions. Cooling applied close o he
olling gap is conside ed as a o able.
Pape s [7,8] s udy he mal s esses in bime allic olls. Ad anced echnology o p o-
duc ion and hea ea men o hese olls allow o p epa e a o able dis ibu ion o esid-
ual s esses. Bo h pape s use nume ical me hods o e alua ion o he in luence o cooling
s a egy on s ess-s ain condi ions in bo h he su ace laye and he oll co e. S anda d
Figu e 1. Typical example o oll empe a u e in ho olling.
As he plan measu emen o cooling in ensi y is a e he in es iga o s use mos ly
esul s o labo a o y measu emen s. De ailed in o ma ion abou he measu ed HTC is
gi en in [
2
]. A hollow oll diame e 352 mm, he leng h o 900 mm and he hickness o he
wall o 16 mm is used as a es su ace. The o a ing es oll is hea ed by lame on one side
and is cooled by ow o la an nozzles on he opposi e side. Embedded he mocouples
a e used o empe a u e measu emen nea he oll su ace. Hea ans e coe icien s a e
e alua ed om he empe a u e measu emen s by he in e se hea conduc ion ask. The
esul s show he HTC dis ibu ion bo h a ound and along he oll.
A simila labo a o y es me hod wi h a hea ed d um was used by Tseng [
3
,
4
]. The
measu ed da a is used in nume ical simula ions o s ess–s ain condi ions in he oll. and
sugges ions a e d awn o cooling o ex end he oll li e. Mode a e cooling is ecommended
wi h a la ge oll su ace. On he con a y o ecommenda ions o mo e ecen wo ks, Tseng
does no ecommend in ensi e cooling nea he olling gap. As he eason he gi es he
inc eased he mal cyclic s ess educing he oll li e.
Publica ion [
5
] ela es o he cold olling, ye in e es ing esul s e eal he in luence
o oil in cooling wa e . I is shown ha e en small amoun o oil can signi ican ly educe
cooling in ensi y and his ac is alid o ho olling as well. This no equen ly men ioned
e ec can be he sou ce o a cooling mal unc ion.
Clea esul s desc ibing he in luence o posi ion o cooling on he s ess in he su ace
laye is gi en in [
6
]. Se e al nume ical simula ions show cooling dis ibu ion dependen
on he su ace empe a u e and i s e ec on s ess condi ions. Cooling applied close o he
olling gap is conside ed as a o able.
Pape s [
7
,
8
] s udy he mal s esses in bime allic olls. Ad anced echnology o p o-
duc ion and hea ea men o hese olls allow o p epa e a o able dis ibu ion o esidual
s esses. Bo h pape s use nume ical me hods o e alua ion o he in luence o cooling
s a egy on s ess-s ain condi ions in bo h he su ace laye and he oll co e. S anda d
cooling is compa ed o he si ua ion o a cooling ailu e and he si ua ion o a mill s op
when he oll is in a long con ac wi h he ho ma e ial. I is shown ha abno mali y
in cooling can cause undesi able inc eases o he s ess in he oll co e ha can cause a
oll b eakdown. Bo h pape s p esen a gene al ecommenda ion o keep he a e age oll
empe a u e as low as possible. I should be no iced ha in [
8
] i y yea s old plan measu e-
men s o E en s [
1
] we e used as an inpu . Plan measu emen s o his kind a e aluable
and a e. Pape [
9
] shows an expe imen al echnique o empe a u e measu emen s in ho
olling in which empe a u e senso s a e embedded in inse s, whose su ace is aligned
pe ec ly wi h he oll su ace. Two ypes o senso we e used. The ho olling esul s we e
compa ed o each o he . The es s we e done wi h h ee le els o slab educ ion 10%, 30%,
Me als 2021,11, 1061 3 o 7
and 50%. The esul s show he hea lux in he cooling a ea. Signi ican ly di e en hea
luxes we e obse ed wi h each educ ion. The cooling sec ion was iden ical in all h ee
cases conside ed. A cons an wa e p essu e was used. The di e ence in he hea lux was
caused by a di e en su ace empe a u e a he en ance o he cooling sec ion.
The p esen pape concen a es on in ensi ying cooling du ing he ho olling. In
p inciple, he p oposed me hod can be employed in o he echnological p ocesses as
well. E.g., in machining namely u ning o hea esis an supe alloys equi es in ensi e
cooling [
10
]. Al hough he mains eam o ecen de elopmen s is owa ds he use o he
CO
2
c yogenic cooling, a window emains o app op ia e in ensi e sp ay cooling. The
MQL migh see he po en ial o he p oposed me hod also wi h he ho s amping [
11
,
12
]
and he olle bu nishing [
13
]. Ano he p ocess ecei ing much a en ion la ely is he sp ay
cooling du ing he high p essu e die cas ing [
14
]. The empe a u e o he die mus be
swi ly lowe ed o a uni o m p ede ined alue be ween wo consecu i e cas ings, which is
ealized by a nozzle a ay moun ed on a single compu e -con olled obo ic a m. Cooling
o he die is poo on ace s aligned wi h he je di ec ion. Such ace s could be e icien ly
cooled by he me hod desc ibed below.
The main opic o he p esen pape is o edesign he sp ay cooling o he oll in
ho olling. The wa e sp ay is b ough close o he olling gap while he nea - o-no mal
o ien a ion o he wa e sp ay o he su ace o he oll is main ained. The eby, high in ensi y
cooling is achie ed.
The in oduc ion sec ion is ollowed by he sec ion Remo e cooling design, in which
he new sp ay cooling me hod is explained. In he subsequen sec ion Cooling e iciency,
he me hod is subjec ed o labo a o y es s and he ob ained cooling in ensi y is compa ed
wi h ha o a s anda d la - an nozzle. The e iciency o he newly p oposed me hod is
con i med. The CZ pa en has been app o ed by he Czech Pa en and T adema k O ice.
The pa en claims a e summa ized in he sec ion Conclusions.
2. Remo e Cooling Design
The high su ace empe a u e a he exi om he olling gap d ops as due o hea
conduc ion in o he oll co e. The ein, he high empe a u e g adien is e iden om
Figu e 1. I is ad an ageous o ex ac hea om he ho hin su ace laye and a oid hea
pene a ion in o he oll co e.
Figu e 2shows a ypical posi ioning o he i s ow o he cooling je s (a). The je
impac is oblique and hus hea ans e coe icien is low. The con igu a ion (b) is no
easible because he cooling heade would collide wi h he wipe blade o ano he essen ial
echnology. The p oposed solu ion uses solid je nozzles loca ed in he posi ion o s anda d
cooling heade s and de lec ion su aces– anes– o ans o m he solid je in o a la an. The
de lec ed la an is o ien ed in a a o able angle and posi ion. The ow o he anes can be
moun ed di ec ly on he wipe . The shape o he anes is shown in Figu e 3. The complex
3D shape o he ane is designed o he op imal con e sion o he solid je in o a la an.
The ailing edge o he ane can be s aigh o cu ed. Fu he , i can be ho izon al o
il ed depending on equi emen s o o e lapped sp ay pa e ns.
Me als 2021, 11, 1061 4 o 8
Figu e 2. A cooling sec ion con igu a ion: (a) ypical posi ion o he sp ay, (b) he op imal posi ion,
and (c) he new design.
Figu e 3. An example o di e en anes used o a con e sion o solid je s in o la ans ( he size o
he g ay ane is 50 × 50 × 24 mm
3
).
3. Cooling E iciency
The labo a o y es s we e used o compa e he cooling e iciency o he p oposed
anes (Figu e 2c) and s anda d la an nozzles (Figu e 2b) in he espec i e con igu a ions
depic ed. A single ow o i e anes was conside ed, as shown a he op o Figu e 3. Solid
je nozzles wi h he o i ice diame e o 4 mm and la an nozzles we e selec ed o ha e an
iden ical low a e a a gi en p essu e. Fu he mo e, he sp ay angle o he la an nozzle
was nea ly iden ical o ha p oduced by he ane (30°). The dis ance be ween he solid je
o i ice and he anes was 215 mm. The sp ay heigh was 170 mm. The sp ay heigh is
de ined as dis ance be ween he o i ice o he nozzle/ ane and he oll su ace. I is no a
no mal dis ance, bu dis ance aligned wi h he je axis. The es s we e done wi h he eed-
ing p essu e o 0.3, 0.5 and 0.8 MPa. The angen ial eloci y o he oll was 1 m/s. The
labo a o y con igu a ion o he solid je nozzles, he de lec ing anes and he oll su ace
is shown in Figu e 4. The pho o in Figu e 4 (le ) was aken wi h a low wa e p essu e
because he iew is o he wise obscu ed by he e lec ed wa e . The CAD pe spec i e iew
on he igh in Figu e 4 explains wha is seen in he pho o on he le .
Figu e 2.
A cooling sec ion con igu a ion: (
a
) ypical posi ion o he sp ay, (
b
) he op imal posi ion,
and (c) he new design.
Me als 2021,11, 1061 4 o 7
Me als 2021, 11, 1061 4 o 8
Figu e 2. A cooling sec ion con igu a ion: (a) ypical posi ion o he sp ay, (b) he op imal posi ion,
and (c) he new design.
Figu e 3. An example o di e en anes used o a con e sion o solid je s in o la ans ( he size o
he g ay ane is 50 × 50 × 24 mm
3
).
3. Cooling E iciency
The labo a o y es s we e used o compa e he cooling e iciency o he p oposed
anes (Figu e 2c) and s anda d la an nozzles (Figu e 2b) in he espec i e con igu a ions
depic ed. A single ow o i e anes was conside ed, as shown a he op o Figu e 3. Solid
je nozzles wi h he o i ice diame e o 4 mm and la an nozzles we e selec ed o ha e an
iden ical low a e a a gi en p essu e. Fu he mo e, he sp ay angle o he la an nozzle
was nea ly iden ical o ha p oduced by he ane (30°). The dis ance be ween he solid je
o i ice and he anes was 215 mm. The sp ay heigh was 170 mm. The sp ay heigh is
de ined as dis ance be ween he o i ice o he nozzle/ ane and he oll su ace. I is no a
no mal dis ance, bu dis ance aligned wi h he je axis. The es s we e done wi h he eed-
ing p essu e o 0.3, 0.5 and 0.8 MPa. The angen ial eloci y o he oll was 1 m/s. The
labo a o y con igu a ion o he solid je nozzles, he de lec ing anes and he oll su ace
is shown in Figu e 4. The pho o in Figu e 4 (le ) was aken wi h a low wa e p essu e
because he iew is o he wise obscu ed by he e lec ed wa e . The CAD pe spec i e iew
on he igh in Figu e 4 explains wha is seen in he pho o on he le .
Figu e 3.
An example o di e en anes used o a con e sion o solid je s in o la ans ( he size o
he g ay ane is 50 ×50 ×24 mm3).
3. Cooling E iciency
The labo a o y es s we e used o compa e he cooling e iciency o he p oposed
anes (Figu e 2c) and s anda d la an nozzles (Figu e 2b) in he espec i e con igu a ions
depic ed. A single ow o i e anes was conside ed, as shown a he op o Figu e 3. Solid
je nozzles wi h he o i ice diame e o 4 mm and la an nozzles we e selec ed o ha e an
iden ical low a e a a gi en p essu e. Fu he mo e, he sp ay angle o he la an nozzle
was nea ly iden ical o ha p oduced by he ane (30
◦
). The dis ance be ween he solid
je o i ice and he anes was 215 mm. The sp ay heigh was 170 mm. The sp ay heigh is
de ined as dis ance be ween he o i ice o he nozzle/ ane and he oll su ace. I is no
a no mal dis ance, bu dis ance aligned wi h he je axis. The es s we e done wi h he
eeding p essu e o 0.3, 0.5 and 0.8 MPa. The angen ial eloci y o he oll was 1 m/s. The
labo a o y con igu a ion o he solid je nozzles, he de lec ing anes and he oll su ace
is shown in Figu e 4. The pho o in Figu e 4(le ) was aken wi h a low wa e p essu e
because he iew is o he wise obscu ed by he e lec ed wa e . The CAD pe spec i e iew
on he igh in Figu e 4explains wha is seen in he pho o on he le .
Me als 2021, 11, 1061 5 o 8
Figu e 4. A pho o o he labo a o y es (le ) and he co esponding CAD iew ( igh ); a ho izon al
ow o he solid je nozzles a he op; he solid je s eaching i e anes; he e lec ed la ans exi ing
om anes impinging on o he oll su ace nea he olling gap.
The expe imen al equipmen used is shown in Figu e 5. The essen ial pa is he in-
s umen ed segmen o he oll wi h he mocouples (g ey in-line spo s) eco ding empe -
a u e in dep h o 0.4 mm unde he su ace. The segmen is made o aus eni ic s eel 20 mm
hick, he emaining su ace o he oll is o med by a hin s eel shee . The segmen is
ini ially hea ed up o a uni o m empe a u e. Then, he oll s a s o a ing. Once he p e-
sc ibed speed o 1 m/s is eached, he sp ay cooling is ac i a ed. Tempe a u es om all
he mocouples and he ins an aneous angen ial posi ion o he oll a e con inuously ec-
o ded in o he da alogge H 800. The expe imen is ollowed by sol ing he in e se hea
conduc ion p oblem (IHCP), which ou pu s he econs uc ed he mal bounda y condi-
ion namely su ace empe a u es and hea ans e coe icien s (HTC). The calcula ed
HTC can be plo ed as a unc ion o ime, he angen ial posi ion (de ined in Figu e 5) and
he su ace empe a u e. The expe imen and he IHCP a e de ailed in [9] and [10,15] e-
spec i ely.
Figu e 5. The oll es bench wi h wa e sp ays in blue, he segmen in o ange, he da alogge in
b own and he hea e in he back. Ins umen ed segmen is ho , and hea e is mo ed ou o he ea
posi ion.
A compa ison o da a om he expe imen wi h he la an nozzle and he ane is
shown in Figu e 6. The su ace empe a u e and HTC a e plo ed as a unc ion o he ime.
Only i e e olu ions o he oll a e shown o make he plo eadable. The cooling in en-
si ies a e e iden ly e y simila . To show he HTC as a unc ion o he angen ial posi ion,
he HTC mus be a e aged o e a ange o su ace empe a u es. Figu e 7 shows HTC
Figu e 4.
A pho o o he labo a o y es (
le
) and he co esponding CAD iew (
igh
); a ho izon al
ow o he solid je nozzles a he op; he solid je s eaching i e anes; he e lec ed la ans exi ing
om anes impinging on o he oll su ace nea he olling gap.
The expe imen al equipmen used is shown in Figu e 5. The essen ial pa is he
ins umen ed segmen o he oll wi h he mocouples (g ey in-line spo s) eco ding em-
pe a u e in dep h o 0.4 mm unde he su ace. The segmen is made o aus eni ic s eel
20 mm hick, he emaining su ace o he oll is o med by a hin s eel shee . The segmen
Me als 2021,11, 1061 5 o 7
is ini ially hea ed up o a uni o m empe a u e. Then, he oll s a s o a ing. Once he
p esc ibed speed o 1 m/s is eached, he sp ay cooling is ac i a ed. Tempe a u es om
all he mocouples and he ins an aneous angen ial posi ion o he oll a e con inuously
eco ded in o he da alogge H 800. The expe imen is ollowed by sol ing he in e se hea
conduc ion p oblem (IHCP), which ou pu s he econs uc ed he mal bounda y condi ion
namely su ace empe a u es and hea ans e coe icien s (HTC). The calcula ed HTC
can be plo ed as a unc ion o ime, he angen ial posi ion (de ined in Figu e 5) and he
su ace empe a u e. The expe imen and he IHCP a e de ailed in [9,10,15] espec i ely.
Me als 2021, 11, 1061 5 o 8
Figu e 4. A pho o o he labo a o y es (le ) and he co esponding CAD iew ( igh ); a ho izon al
ow o he solid je nozzles a he op; he solid je s eaching i e anes; he e lec ed la ans exi ing
om anes impinging on o he oll su ace nea he olling gap.
The expe imen al equipmen used is shown in Figu e 5. The essen ial pa is he in-
s umen ed segmen o he oll wi h he mocouples (g ey in-line spo s) eco ding empe -
a u e in dep h o 0.4 mm unde he su ace. The segmen is made o aus eni ic s eel 20 mm
hick, he emaining su ace o he oll is o med by a hin s eel shee . The segmen is
ini ially hea ed up o a uni o m empe a u e. Then, he oll s a s o a ing. Once he p e-
sc ibed speed o 1 m/s is eached, he sp ay cooling is ac i a ed. Tempe a u es om all
he mocouples and he ins an aneous angen ial posi ion o he oll a e con inuously ec-
o ded in o he da alogge H 800. The expe imen is ollowed by sol ing he in e se hea
conduc ion p oblem (IHCP), which ou pu s he econs uc ed he mal bounda y condi-
ion namely su ace empe a u es and hea ans e coe icien s (HTC). The calcula ed
HTC can be plo ed as a unc ion o ime, he angen ial posi ion (de ined in Figu e 5) and
he su ace empe a u e. The expe imen and he IHCP a e de ailed in [9] and [10,15] e-
spec i ely.
Figu e 5. The oll es bench wi h wa e sp ays in blue, he segmen in o ange, he da alogge in
b own and he hea e in he back. Ins umen ed segmen is ho , and hea e is mo ed ou o he ea
posi ion.
A compa ison o da a om he expe imen wi h he la an nozzle and he ane is
shown in Figu e 6. The su ace empe a u e and HTC a e plo ed as a unc ion o he ime.
Only i e e olu ions o he oll a e shown o make he plo eadable. The cooling in en-
si ies a e e iden ly e y simila . To show he HTC as a unc ion o he angen ial posi ion,
he HTC mus be a e aged o e a ange o su ace empe a u es. Figu e 7 shows HTC
Figu e 5.
The oll es bench wi h wa e sp ays in blue, he segmen in o ange, he da alogge in
b own and he hea e in he back. Ins umen ed segmen is ho , and hea e is mo ed ou o he
ea posi ion.
A compa ison o da a om he expe imen wi h he la an nozzle and he ane is
shown in Figu e 6. The su ace empe a u e and HTC a e plo ed as a unc ion o he
ime. Only i e e olu ions o he oll a e shown o make he plo eadable. The cooling
in ensi ies a e e iden ly e y simila . To show he HTC as a unc ion o he angen ial
posi ion, he HTC mus be a e aged o e a ange o su ace empe a u es. Figu e 7shows
HTC dis ibu ion a e aged in he ange o su ace empe a u e be ween 220
◦
C and 50
◦
C.
A e aged alues o su ace in e al
±
100 mm om he impac poin a e summa ized in
Table 1.
Me als 2021, 11, 1061 6 o 8
dis ibu ion a e aged in he ange o su ace empe a u e be ween 220 °C and 50 °C. A -
e aged alues o su ace in e al ± 100 mm om he impac poin a e summa ized in
Table 1.
Table 1. HTC alues, a e aged be ween su ace empe a u es o 220 °C and 50 °C.
P essu e (MPa) Flow Ra e Pe One Noz-
zle (l min−1)
A g. HTC o De lec ing Vanes
(W m−2 K−1)
A g. HTC o Fla Fan Noz-
zles (W m−2 K−1)
0.3 24.5 9002 9774
0.5 31.6 9541 10,008
0.8 40.0 10,841 10,752
Figu e 6. Su ace empe a u es and hea ans e coe icien (HTC) o expe imen s wi h la an
nozzles and wi h de lec ed je s by anes, es s wi h 0.5 MPa eeding p essu e.
Figu e 7. An a e age HTC dis ibu ion o compa ed con igu a ions, es p essu e 0.5 MPa.
4. Conclusions
The new me hod o cooling o olls in he ho olling is in oduced wi h he applica-
bili y o o he p ocesses. By using specially shaped anes, he sp aying je is eme ging
om loca ions ha a e o he wise un hinkable wi h he s anda d cooling ins umen s. I
allows he cooling je o hi he oll su ace a he op imal angle nea he olling gap so ha
he cooling in ensi y is maximized.
The p oposed me hod consis s o solid je nozzles moun ed o a common wa e sup-
ply in as uc u e and he anes. The la e con e s he cylind ical je in o a la an, which
is edi ec ed o he op imal spo on he oll su ace. The labo a o y expe imen s con i med
ha cooling in ensi y o he e lec ed je is simila o ha o he la an nozzle. Howe e ,
he la e is moun ed in he posi ion impossible in he plan . Nex , he e lec ed je does
Figu e 6.
Su ace empe a u es and hea ans e coe icien (HTC) o expe imen s wi h la an
nozzles and wi h de lec ed je s by anes, es s wi h 0.5 MPa eeding p essu e.

Me als 2021,11, 1061 6 o 7
Me als 2021, 11, 1061 6 o 8
dis ibu ion a e aged in he ange o su ace empe a u e be ween 220 °C and 50 °C. A -
e aged alues o su ace in e al ± 100 mm om he impac poin a e summa ized in
Table 1.
Table 1. HTC alues, a e aged be ween su ace empe a u es o 220 °C and 50 °C.
P essu e (MPa) Flow Ra e Pe One Noz-
zle (l min−1)
A g. HTC o De lec ing Vanes
(W m−2 K−1)
A g. HTC o Fla Fan Noz-
zles (W m−2 K−1)
0.3 24.5 9002 9774
0.5 31.6 9541 10,008
0.8 40.0 10,841 10,752
Figu e 6. Su ace empe a u es and hea ans e coe icien (HTC) o expe imen s wi h la an
nozzles and wi h de lec ed je s by anes, es s wi h 0.5 MPa eeding p essu e.
Figu e 7. An a e age HTC dis ibu ion o compa ed con igu a ions, es p essu e 0.5 MPa.
4. Conclusions
The new me hod o cooling o olls in he ho olling is in oduced wi h he applica-
bili y o o he p ocesses. By using specially shaped anes, he sp aying je is eme ging
om loca ions ha a e o he wise un hinkable wi h he s anda d cooling ins umen s. I
allows he cooling je o hi he oll su ace a he op imal angle nea he olling gap so ha
he cooling in ensi y is maximized.
The p oposed me hod consis s o solid je nozzles moun ed o a common wa e sup-
ply in as uc u e and he anes. The la e con e s he cylind ical je in o a la an, which
is edi ec ed o he op imal spo on he oll su ace. The labo a o y expe imen s con i med
ha cooling in ensi y o he e lec ed je is simila o ha o he la an nozzle. Howe e ,
he la e is moun ed in he posi ion impossible in he plan . Nex , he e lec ed je does
Figu e 7. An a e age HTC dis ibu ion o compa ed con igu a ions, es p essu e 0.5 MPa.
Table 1. HTC alues, a e aged be ween su ace empe a u es o 220 ◦C and 50 ◦C.
P essu e
(MPa)
Flow Ra e Pe One
Nozzle (L min−1)
A g. HTC o De lec ing
Vanes (W m−2K−1)
A g. HTC o Fla Fan
Nozzles (W m−2K−1)
0.3 24.5 9002 9774
0.5 31.6 9541 10,008
0.8 40.0 10,841 10,752
4. Conclusions
The new me hod o cooling o olls in he ho olling is in oduced wi h he applicabil-
i y o o he p ocesses. By using specially shaped anes, he sp aying je is eme ging om
loca ions ha a e o he wise un hinkable wi h he s anda d cooling ins umen s. I allows
he cooling je o hi he oll su ace a he op imal angle nea he olling gap so ha he
cooling in ensi y is maximized.
The p oposed me hod consis s o solid je nozzles moun ed o a common wa e supply
in as uc u e and he anes. The la e con e s he cylind ical je in o a la an, which is
edi ec ed o he op imal spo on he oll su ace. The labo a o y expe imen s con i med
ha cooling in ensi y o he e lec ed je is simila o ha o he la an nozzle. Howe e ,
he la e is moun ed in he posi ion impossible in he plan . Nex , he e lec ed je does
no lose he kine ic ene gy in compa ison o he je p oduced by he la nozzle wi h he
iden ical eeding p essu e and low a e. The di e ences in he cooling in ensi ies a e small.
The a e age HTC o he e lec ed je is lowe by 8% wi h he wa e p essu e o 0.3 MPa. I
becomes nea ly iden ical wi h he wa e p essu e o 0.8 MPa I is es ima ed by nume ical
me hods ha shi ing he cooled a ea om a ci cum e en ial posi ion o 90
◦
close o he
olling gap o he posi ion 45
◦
can inc ease he cooling in ensi y by 27%. This conclusion is
alid o iden ical HTC and app op ia e su ace empe a u es behind he olling gap.
The au ho s o his communica ion gi e labo a o y- e i ied in o ma ion o he plan
expe s and designe s. The e ec i e cooling can be shi ed close o he olling gap. One
ow o solid je nozzles can be added o he exis ing cooling heade . The anes can be
ixed o he wipe a he exi side o a olling mill. Thus, a collision wi h s anda d cooling
ins umen s is p e en ed.
5. Pa en s
The na ional pa en has been app o ed in he Czech Republic.
Me als 2021,11, 1061 7 o 7
Au ho Con ibu ions:
Concep ualiza ion, M.R. and J.B.; me hodology, P.K.; so wa e, J.B.; alida ion,
M.R., J.B. and P.K.; o mal analysis, M.R.; in es iga ion, J.B.; esou ces, M.R.; da a cu a ion, J.B.;
w i ing—o iginal d a p epa a ion, M.R. and J.B.; w i ing— e iew and edi ing, M.R.; isualiza ion,
J.B.; supe ision, M.R.; p ojec adminis a ion, P.K.; unding acquisi ion, M.R. All au ho s ha e ead
and ag eed o he published e sion o he manusc ip .
Funding: This esea ch ecei ed no ex e nal unding.
Ins i u ional Re iew Boa d S a emen : No applicable.
In o med Consen S a emen : No applicable.
Da a A ailabili y S a emen : No applicable.
Acknowledgmen s:
Labo a o y wo k p esen ed in his pape was suppo ed by he in e nal g an o
he B no Uni e si y o Technology ocused on speci ic esea ch and de elopmen No. FSI-S-20-6478.
Con lic s o In e es : The au ho s decla e no con lic o in e es .
Re e ences
1. S e ens, P.G.; I ens, K.P.; Ha pe , P. Inc easing wo k- oll li e by imp o ed oll-cooling p ac ice. J. I on S eel Ins . 1971,209, 1–11.
2.
Solimani, M.R.; Ba bosa, R.A.; Leocadio Junio , H. Analysis o hea ans e o wo k oll cooling in ho olling. Technol. Me al.
Ma e . Min. 2013,10, 191–199. [C ossRe ]
3.
Tseng, A.A.; Lin, F.; Gunde ia, A.; Ni, D. Roll cooling and i s ela ionship o oll li e. Me all. T ans. A
1989
,20, 2305–2320.
[C ossRe ]
4. Tseng, A.A.; Gunde ia, A.; Sun, P. Cooling o oll s ip in s eel olling. S eel Res. 1991,62, 207–215. [C ossRe ]
5. Da enpo , C.J.; Smi h, J.K. Imp o ing oll cooling on cold andem mills. S eel Times In . 2008,32, 17–19.
6.
Saha, J.; Kundu, S.; Chand a, S.; Sinha, S.; Singhal, U.; Das, A.; Saha, J. Ma hema ical modelling o oll cooling and oll su ace
s ess. ISIJ In . 2005,45, 1641–1650. [C ossRe ]
7.
Hu, K.; Xia, Y.; Zhu, F. E alua ion o he mal b eakage in bime allic wo k oll conside ing hea ea ed esidual s ess combined
wi h he mal s ess du ing ho olling. S eel Res. In . 2018,89, 1700368. [C ossRe ]
8.
Hu, K.; Zhu, F.; Chen, J.; Noda, N.-A.; Han, W.; Sano, Y. Simula ion o he mal s ess and a igue li e p edic ion o high speed
s eel wo k oll du ing ho olling conside ing he ini ial esidual s ess. Me als 2019,9, 966. [C ossRe ]
9.
Ho sky, J.; Raudensky, M.; Pohanka, M. Expe imen al s udy o hea ans e in ho olling and con inuous cas ing. Ma e . Sci.
Fo um 2004,473, 347–354.
10.
Amigo, F.J.; U bikain, G.; Pe ei a, O.; Fe nandez-Lucio, P.; Fe nandez-Valdi ielso, A.; Lopez de Lacalle, L.N. Combina ion o high
eed u ning wi h c yogenic cooling on Haynes 263 and Inconel 718 supe alloys. J. Manu . P ocess.
2020
,58, 208–222. [C ossRe ]
11.
Lin, T.; Song, H.-W.; Zhang, S.-H.; Cheng, M.; Liu, W.-J. Cooling Sys ems Design in Ho S amping Tools by a The mal-Fluid-
Mechanical Coupled App oach. Ad . Mech. Eng. 2015,2014, 545727. [C ossRe ]
12.
Nu nbe ge , F.; Diekamp, M.; Mo i z, J.; Wol , L.; Hubne , S.; Beh ens, B.-A. Sp ay cooling o Ea ly Ex ac ed Ho S amped Pa s.
In P oceedings o he TMS 2014: 143 d Annual Mee ing & Exhibi ion, San Diego, CA, USA, 16–20 Feb ua y 2014; pp. 983–990.
13.
Rod iguez, A.; Lopez de Lacalle, L.N.; Pe ei a, O.; Fe nandez, A.; Ayes a, I. Iso opic inishing o aus empe ed i on cas ing
cylind ical pa s by olle bu nishing. In . J. Ad . Manu . Technol. 2020,110, 753–761. [C ossRe ] [PubMed]
14.
Yamaga a, H.; Kimu a, T. E ec o sp ay-cooling a e on he die-li e o an HPDC die. Ad . Ma e . P ocess. Technol.
2017
,3, 274–285.
[C ossRe ]
15.
Ond ousko a, J.; Pohanka, M.; Ve ae , B. Hea - lux compu a ion om measu ed- empe a u e his o ies du ing ho olling. Ma e .
Technol. 2013,47, 85–87.