sus ainabili y
Re iew
Co-Wo d Analysis and Academic Pe o mance o he Te m
TPACK in Web o Science
Rebeca Sole -Cos a 1, An onio-JoséMo eno-Gue e o 2, Jesús López-Belmon e 2,* and
José-An onio Ma ín-Ma ín3


Ci a ion: Sole -Cos a, R.;
Mo eno-Gue e o, A.-J.;
López-Belmon e, J.; Ma ín-Ma ín,
J.-A. Co-Wo d Analysis and
Academic Pe o mance o he Te m
TPACK in Web o Science.
Sus ainabili y 2021,13, 1481. h ps://
doi.o g/10.3390/su13031481
Academic Edi o : Massimo A ia
Recei ed: 11 Janua y 2021
Accep ed: 27 Janua y 2021
Published: 1 Feb ua y 2021
Publishe ’s No e: MDPI s ays neu al
wi h ega d o ju isdic ional claims in
published maps and ins i u ional a il-
ia ions.
Copy igh : © 2021 by he au ho s.
Licensee MDPI, Basel, Swi ze land.
This a icle is an open access a icle
dis ibu ed unde he e ms and
condi ions o he C ea i e Commons
A ibu ion (CC BY) license (h ps://
c ea i ecommons.o g/licenses/by/
4.0/).
1Depa men o Educa ional Sciences, Uni e si y o Za agoza, 50009 Za agoza, Spain; sole @uniza .es
2Depa men o Didac ics and School O ganiza ion, Uni e si y o G anada, 51001 Ceu a, Spain;
ajmo eno@ug .es
3Depa men o Didac ics and School O ganiza ion, Uni e si y o G anada, 18071 G anada, Spain;
jma in@ug .es
*Co espondence: jesuslopez@ug .es
Abs ac :
The p og ess o echnology has led o he eme gence o new eaching me hods, among
which Technological Pedagogical Con en Knowledge (TPACK) can be ound in an a emp o p omo e
he in eg a ion o echnology and knowledge, combining echnology, pedagogy and heo e ical
con en . The aim o his esea ch is o analyze he signi icance and e olu ion o he TPACK concep
in he publica ions con ained in Web o Science (WoS). The esea ch me hod chosen is based on
bibliome ics, speci ically on he analysis o academic pe o mance and on he analysis o co-wo ds.
The o al numbe o documen s analyzed is 471. The esul s show ha esea ch on TPACK is on he
ise, inc easing p og essi ely in ecen yea s. The main a ea o esea ch is educa ion and educa ional
esea ch, wi h a icles, w i en in English, being he medium used by esea che s o p esen hei
esul s. I can be concluded ha , al hough he e is an es ablished esea ch base, he e is no single
line o esea ch. In his case, he main lines o esea ch a e “ amewo k- amewo k-TPACK” and
“ echnology-pedagogy-belie s”. I can be de e mined ha he s udies on TPACK deal wi h he
in eg a ion o echnological esou ces and he analysis o hei pe cep ion in s uden lea ning.
Keywo ds:
eaching–lea ning s a egies; eache p o essional de elopmen ; 21s cen u y abili ies;
li elong lea ning; scien i ic mapping; bibliome ic analysis; SciMAT; TPACK
1. In oduc ion
Technological ad ances in he 21s cen u y ha e looded all ace s o socie y, om
comme ce o educa ion, om li e a u e (e-books) o social ela ions (social ne wo ks such
as Facebook, Twi e o Ins ag am). In he case o educa ion, all o e he wo ld, in o ma ion
and communica ion echnologies (ICTs) unde pin he discou se o coun less educa ion
e o m mo emen s [
1
,
2
]. Educa ional policymake s, s akeholde s, esea che s and educa-
o s a gue ha he shi om schools o he digi al age is c ucial o s uden s’ pa icipa ion
in con empo a y socie y [
3
]. In his sense, as a as p e-se ice eache s a e conce ned,
esea ch has shown ha a i udes owa ds he use o ICTs in educa ion play a c ucial ole in
he in en ion o use hem [
4
]. The same applies o he p epa a ion o schools, i.e., suppo ,
esou ces, pe cep ion o he impo ance o ICT in eg a ion and exchange o ideas among
eache s. These a e all i al aspec s o ICT in eg a ion [5].
Fo his eason, he aining o u u e eache s is a anscenden al issue because o
hei in ol emen in e ec i ely in eg a ing echnology in o hei u u e class ooms [
6
–
8
].
In many cases, his aining is ca ied ou h ough speci ic echnological esou ce p og ams
o aining h ough online pla o ms [
9
]. Howe e , ecen esea ch sugges s he need
o aining s a egies o ha e a mo e in eg a i e and holis ic app oach [
10
]. F om his
pe spec i e, he mos cu en app oaches o he de elopmen o eache compe ence in
echnology in eg a ion ha e made echnological knowledge alone less impo an . In his
Sus ainabili y 2021,13, 1481. h ps://doi.o g/10.3390/su13031481 h ps://www.mdpi.com/jou nal/sus ainabili y
Sus ainabili y 2021,13, 1481 2 o 20
case, hey ha e ocused on he essen ial connec ions be ween echnology, pedagogy and
con en knowledge (TPACK) [11,12].
TPACK is a amewo k o he in eg a ion o echnology and eache knowledge ha
combines echnology, pedagogy and con en [
11
]. I is based on Schulman’s concep o
pedagogical con en knowledge (PCK) [
13
] whe e con en and pedagogy a e combined o
unde s and how a gi en con en equi es speci ic pedagogical s a egies o i s eaching.
TPACK [
14
,
15
] has also been desc ibed as a amewo k used o explain and desc ibe
eache s’ knowledge and skills in ela ion o echnology in eg a ion. The au ho s o
Re . [
16
] de ine i as “Knowledge o how o combine di e en a eas, how o use app op ia e
pedagogical app oaches o ce ain con en wi h app op ia e ICT”.
The li e a u e ela ed o TPACK ep esen s his in eg a ion amewo k wi h a Venn
diag am in which he h ee p ima y o ms o eache knowledge a e ela ed: “con en
knowledge (CK)”, “pedagogical knowledge (PK)” and “ echnological knowledge (TK)”.
The in e sec ion o hese h ee ypes o knowledge p omo es ou o he componen s com-
p ising con en knowledge o echnology (TCK), pedagogical con en knowledge (PCK),
pedagogical knowledge o echnology (TPK) and TPACK. The la e would appea in
he cen e o he diag am a he in e sec ion o he h ee eache ’s p ima y knowledge
ci cles (Figu e 1). In ela ion o he di e en elemen s ha make up his amewo k, some
esea che s a gue ha he domains o basic knowledge in he TPACK amewo k a e
p edic o s o eache s’ TPACK. PK has he g ea es impac on eache s’ TPACK p io o
pe o mance [
17
]. O he esea che s sugges ha , al hough TK, PK and CK a e co ela ed
wi h TPACK, TK is no a signi ican p edic o o TPACK [18].
Sus ainabili y 2021, 13, x FOR PEER REVIEW 2 o 20
in echnology in eg a ion ha e made echnological knowledge alone less impo an . In
his case, hey ha e ocused on he essen ial connec ions be ween echnology, pedagogy
and con en knowledge (TPACK) [11,12].
TPACK is a amewo k o he in eg a ion o echnology and eache knowledge ha
combines echnology, pedagogy and con en [11]. I is based on Schulman’s concep o
pedagogical con en knowledge (PCK) [13] whe e con en and pedagogy a e combined o
unde s and how a gi en con en equi es speci ic pedagogical s a egies o i s eaching.
TPACK [14,15] has also been desc ibed as a amewo k used o explain and desc ibe each-
e s’ knowledge and skills in ela ion o echnology in eg a ion. The au ho s o Re . [16]
de ine i as “Knowledge o how o combine di e en a eas, how o use app op ia e peda-
gogical app oaches o ce ain con en wi h app op ia e ICT”.
The li e a u e ela ed o TPACK ep esen s his in eg a ion amewo k wi h a Venn
diag am in which he h ee p ima y o ms o eache knowledge a e ela ed: “con en
knowledge (CK)”, “pedagogical knowledge (PK)” and “ echnological knowledge (TK)”.
The in e sec ion o hese h ee ypes o knowledge p omo es ou o he componen s com-
p ising con en knowledge o echnology (TCK), pedagogical con en knowledge (PCK),
pedagogical knowledge o echnology (TPK) and TPACK. The la e would appea in he
cen e o he diag am a he in e sec ion o he h ee eache ’s p ima y knowledge ci cles
(Figu e 1). In ela ion o he di e en elemen s ha make up his amewo k, some e-
sea che s a gue ha he domains o basic knowledge in he TPACK amewo k a e p e-
dic o s o eache s’ TPACK. PK has he g ea es impac on eache s’ TPACK p io o pe -
o mance [17]. O he esea che s sugges ha , al hough TK, PK and CK a e co ela ed
wi h TPACK, TK is no a signi ican p edic o o TPACK [18].
Figu e 1. Technology, pedagogy and con en knowledge (TPACK) amewo k.
S udies conduc ed o e he pas decade on he in eg a ion o echnology in o educa-
ion h ough he TPACK amewo k suppo he alidi y o his model o eache educa-
ion [3,9,19–22]. The esul s o hese s udies show ha he g ea es p og ess is made in
knowledge o educa ional con en . Fu he mo e, imp o emen s a e g ea e in a eas e-
la ed o pedagogical knowledge han in a eas ela ed o echnology o con en knowledge.
Howe e , in a eas wi hou pedagogical knowledge, he changes a e mo e mode a e. Sim-
ila ly, i is clea om his esea ch ha eache s in aining need con inuous eedback and
assessmen o hei skills. This is necessa y o help hem u he de elop hei knowledge,
skills and a i udes ela ed o he use o ICT in he class oom [23,24]. Thus, he e is a need
o p o ide hem wi h oppo uni ies o design lessons wi h ICTs, bo h in hei eache ain-
ing cou ses and in hei ield expe iences [25]. This would help hem o de elop hei skills
in he e ec i e use o echnology in hei class ooms.
Figu e 1. Technology, pedagogy and con en knowledge (TPACK) amewo k.
S udies conduc ed o e he pas decade on he in eg a ion o echnology in o ed-
uca ion h ough he TPACK amewo k suppo he alidi y o his model o eache
educa ion
[3,9,19–22]
. The esul s o hese s udies show ha he g ea es p og ess is made
in knowledge o educa ional con en . Fu he mo e, imp o emen s a e g ea e in a eas
ela ed o pedagogical knowledge han in a eas ela ed o echnology o con en knowledge.
Howe e , in a eas wi hou pedagogical knowledge, he changes a e mo e mode a e. Simi-
la ly, i is clea om his esea ch ha eache s in aining need con inuous eedback and
assessmen o hei skills. This is necessa y o help hem u he de elop hei knowledge,
skills and a i udes ela ed o he use o ICT in he class oom [
23
,
24
]. Thus, he e is a need o
p o ide hem wi h oppo uni ies o design lessons wi h ICTs, bo h in hei eache aining
cou ses and in hei ield expe iences [
25
]. This would help hem o de elop hei skills in
he e ec i e use o echnology in hei class ooms.
Sus ainabili y 2021,13, 1481 3 o 20
The TPACK model is used in a a ie y o impo an eaching and lea ning si ua ions,
such as o eign languages [
14
], p o essional de elopmen o eache s o he inclusion o
speci ic so wa e in social science classes [
26
], inclusion in special educa ion schools o
s uden s wi h isual impai men [
27
], de elopmen o s uden s’ emo ional in elligence [
28
]
o aining h ough i ual lea ning en i onmen s [29].
As we ha e seen, he impo ance o he TPACK model o aining and lea ning
using echnology is a ac . This s udy aims o highligh he ele ance o his model
h ough he s udy o co-wo ds in he a icles indexed in he Web o Science da abase and
o p o ide a conc e e amewo k o esea ch ca ied ou using his aining model. To
his end, he p esen manusc ip begins wi h an in oduc ion ha se es as a heo e ical
amewo k whe e he alidi y o he TPACK model is de ined and explained. In a second
sec ion, he bibliome ic analysis sys em o be ollowed and he objec i es o he s udy a e
jus i ied. Nex , he ma e ials and he me hod ollowed in he esea ch a e p esen ed. The
ollowing sec ion is de o ed o he esul s, ocusing on h ee aspec s in pa icula : scien i ic
pe o mance and p oduc ion, s uc u al and hema ic de elopmen and he au ho s wi h
he highes ele ance index. In he inal phase o he s udy, he discussion, conclusions and
implica ions a e de eloped.
2. Jus i ica ion and Objec i es
This esea ch add esses he analysis o he e m TPACK in he educa ional ield om
a bibliome ic app oach. Fo his pu pose, he documen s indexed in he Web o Science
(WoS) da abase we e used. This da abase has been chosen because i is conside ed one
o he la ges da abases ha ela es o he ield o social sciences, wi h educa ion being
encompassed in his ield o knowledge. Fu he mo e, Jou nal Ci a ion Repo s d aws on
his da abase. So, WoS s udies o impac and scien i ic ele ance a e epo ed [30].
The no el y ha his s udy has wi h espec o p e ious s udies [
31
] ocuses on an
inno a i e echnique o documen a y analysis. In pa icula , in his wo k, an analysis
o he pe o mance and a scien i ic mapping o he publica ions ela ed o he selec ed
cons uc ha e been used. This s udy has ollowed he analy ical s uc u e o di e en
impac publica ions wi h he pu pose o ca ying ou e ec i e esea ch unde a alida ed
model [30,32].
Speci ically, his s udy ocuses on analyzing he signi icance and e olu ion o he
TPACK concep in he publica ions con ained in WoS. To he bes o ou knowledge, no
s udy has been epo ed ha analyzes his concep unde he bibliome ic echnique o
scien i ic mapping. The e o e, his esea ch is de eloped om an explo a o y pe spec i e
wi h he in en ion o showing he scien i ic communi y he p og ess achie ed by TPACK
in WoS documen s and i s u u e lines o ends. This will educe he gap ound in he
li e a u e on he s a e o he a and build he basis o u u e esea ch. The e o e, he
objec i es o mula ed in his s udy a e he ollowing:
•To know he pe o mance o scien i ic p oduc ion on TPACK in WoS.
•To de e mine he scien i ic e olu ion in WoS o he e m TPACK.
•
To disco e he mos ele an opics abou TPACK in he scien i ic li e a u e indexed
in WoS.
•To ind he mos ep esen a i e au ho s in WoS who s udy he TPACK model.
3. Ma e ials and Me hods
3.1. Resea ch Design
To de elop he s udy and achie e he p oposed objec i es, esea ch based on a biblio-
me ic me hodology has been designed [
33
,
34
]. This me hodology assumes a ele an ole
in he quan i ica ion and in eg al e alua ion o scien i ic documen s [
35
,
36
]. This esea ch
design allows o e icien ly ca ying ou he ac ions o sea ching, egis a ion, analysis and
p edic ion o he scien i ic li e a u e [37,38].
The esea ch me hod chosen was based on a co-wo d analysis [
39
], as well as on
he h, g, hg and q2 indices [
40
,
41
]. The analysis o co-wo ds allows us o analyze he
Sus ainabili y 2021,13, 1481 4 o 20
keywo ds epo ed om he di e en scien i ic documen s, wi h he pu pose o looking o
connec ions be ween he opics s udied on he s a e o he ques ion, as well as p edic ing
he issues ha could po en ially be conside ed in he nea u u e [
42
]. This analy ical
app oach has allowed he c ea ion o maps wi h nodes o ep esen yield, he loca ion o
e minological subdomains and hema ic de elopmen [
43
] on TPACK in he documen s
egis e ed in WoS.
3.2. P ocedu e
The esea ch has ollowed a s ic and s uc u ed p ocedu e in di e en phases, in o -
de o educe he appea ance o bias in he s udy, as equi ed by his ype o analysis
[44,45].
•Fi s ly, he da abase o be analyzed (WoS) was selec ed.
•
Secondly, he keywo ds ha would allow he p oduc ion o a documen a y epo we e
de ined (“TPACK”, “TPCK” and “ echnology pedagogy and con en knowledge”).
•
Thi dly, he ollowing sea ch equa ion was de eloped: (“TPACK” OR “TPCK” OR
“ echnological pedagogy and con en knowledge” OR “ echnology pedagogy con en
knowledge”) TITLE. This equa ion was used o sea ch he i les o WoS publica ions.
This sea ch equa ion was applied in he main WoS collec ion, since he ield o ed-
uca ion is implici in he concep analyzed. The sea ch and epo ing p ocess ook place
in No embe 2020. In he inal documen epo , i was decided o choose all ypes o
documen s and languages o encompass all he WoS li e a u e on he s a e o he issue.
These ac ions esul ed in a o al o 556 publica ions. The pu i ica ion o his docu-
men a y olume was ca ied ou by es ablishing di e en c i e ia. The ollowing we e
es ablished as exclusion c i e ia: documen s published in he yea 2020 ( o no ha ing
inished he yea ); documen s epea ed o badly indexed in WoS. The inclusion c i e ion is
e e ing o he abo e-men ioned subjec ma e . The applica ion o hese c i e ia p oduced
a inal uni o analysis o 471 scien i ic documen s. The ac ions ollowed a e shown in he
ollowing low cha acco ding o he PRISMA decla a ion and he p o ocol de i ed om i
(Figu e 2). This igu e shows he di e en ac ions included in he s anda dized p o ocol o
PRISMA, whe e he ini ial epo o documen s on he analyzed cons uc is es ablished
and he educ ions su e ed by he ini ial olume a e he applica ion o he ma ix c i e ia,
un il eaching he inal uni o analysis es ablished in his s udy.
3.3. Da a Analysis
Da a analysis was pe o med using he p og ams Analyze Resul s, C ea ion Ci a ion
Repo and SciMAT [
46
]. The i s wo we e used o collec and s udy he yea , au ho ship,
coun y, ype o documen , ins i u ion, language, medium and mos ci ed documen s. The
inclusion c i e ia o show he da a we e: yea o publica ion (all excep 2020); language
(x
≥
2); publica ion a ea (x
≥
10); ype o documen s (x
≥
10); o ganiza ions (x
≥
15);
au ho s (x
≥
9); sou ces o o igin (x
≥
14); coun ies (x
≥
40); he eigh mos ci ed documen s
(x
≥
271). These c i e ia a e associa ed wi h a numbe ing ha e e s o he numbe ha
mus be me in each case (c i e ion) o he publica ions o be included in he analy ical
ables p esen ed in his wo k. O he wise, he gene a ed ables would be e y long. I mus
be speci ied ha all he li e a u e has been analyzed, bu only he documen s ha mee he
c i e ia a e es ablished in he ables o his manusc ip .
Sus ainabili y 2021,13, 1481 5 o 20
Sus ainabili y 2021, 13, x FOR PEER REVIEW 5 o 20
Figu e 2. Flowcha acco ding o he PRISMA decla a ion.
Co-wo d analysis was pe o med wi h SciMAT using he ollowing p ocesses [49,50]:
 Recogni ion: The keywo ds o he epo ed WoS documen s we e analyzed (n = 1061).
Co-occu ence node maps we e made. A s anda dized co-wo d ne wo k was de-
signed and he mos signi ican keywo ds (n = 1000) we e ex ac ed. The mos ou -
s anding opics and e ms we e de e mined wi h a clus e ing algo i hm.
 Rep oduc ion: Di e en hema ic ne wo ks we e gene a ed (Figu e 3a, 3b), whe e he
connec ions be ween a main ocus and i s de i ed concep ual associa ions a e isu-
ally e lec ed, as well as s a egic diag ams o place each o he cons uc s acco ding
o hei p ojec ion. These we e di ided (Figu e 3a) in o ou quad an s (Q): op igh
(Q1) = d i ing and ele an issues; op le (Q2) = deep- oo ed and isola ed p oblems;
bo om le (Q3) = eme ging o disappea ing p oblems; bo om igh (Q4) = c oss-
cu ing and unde de eloped issues. The p inciples o densi y and cen ali y we e e-
spec ed. Densi y measu es he in e nal s eng h o he ne wo k. Cen ali y measu es
he le el o connec ion o a ne wo k wi h o he s [51].
 De e mina ion: The documen a y epo was a icula ed in di e en pe iods wi h he
pu pose o analyzing he p og ession o he nodes in di e en pe iods o ime. Spe-
ci ically, h ee pe iods we e es ablished (P1 = 2006–2014; P2 = 2015–2017; P3 = 2018–
2019). The c i e ion aken o his empo al con igu a ion was based on he achie e-
men o simila i y in he numbe o documen s be ween he di e en pe iods. How-
e e , o he au ho - ocused analysis, we simply de e mined an o e all pe iod ha
encompasses he en i e empo ali y o publica ions (PX = 2006–2019). To ind he
s eng h o he associa ion be ween pe iods, he numbe o keywo ds o subjec s in
common be ween hem was aken as a e e ence.
Figu e 2. Flowcha acco ding o he PRISMA decla a ion.
SciMAT was used o ma e ialize he s uc u al and dynamic de elopmen o publi-
ca ions om a longi udinal pe spec i e. Tha is, i analyzes he e olu ion o a keywo d
ans o med in o a heme in es ablished pe iods o e ime. No e ha his ollows he
conside a ions o p e ious s udies [47,48].
Co-wo d analysis was pe o med wi h SciMAT using he ollowing p ocesses [
49
,
50
]:
•
Recogni ion: The keywo ds o he epo ed WoS documen s we e analyzed (n= 1061).
Co-occu ence node maps we e made. A s anda dized co-wo d ne wo k was designed
and he mos signi ican keywo ds (n= 1000) we e ex ac ed. The mos ou s anding
opics and e ms we e de e mined wi h a clus e ing algo i hm.
•
Rep oduc ion: Di e en hema ic ne wo ks we e gene a ed (Figu e 3a,b), whe e he
connec ions be ween a main ocus and i s de i ed concep ual associa ions a e isually
e lec ed, as well as s a egic diag ams o place each o he cons uc s acco ding o
hei p ojec ion. These we e di ided (Figu e 3a) in o ou quad an s (Q): op igh
(Q1) = d i ing and ele an issues; op le (Q2) = deep- oo ed and isola ed p oblems;
bo om le (Q3) = eme ging o disappea ing p oblems; bo om igh (Q4) = c oss-
cu ing and unde de eloped issues. The p inciples o densi y and cen ali y we e
espec ed. Densi y measu es he in e nal s eng h o he ne wo k. Cen ali y measu es
he le el o connec ion o a ne wo k wi h o he s [51].
•
De e mina ion: The documen a y epo was a icula ed in di e en pe iods wi h he
pu pose o analyzing he p og ession o he nodes in di e en pe iods o ime. Speci i-

Sus ainabili y 2021,13, 1481 6 o 20
cally, h ee pe iods we e es ablished (P
1
= 2006–2014; P
2
= 2015–2017; P
3
= 2018–2019).
The c i e ion aken o his empo al con igu a ion was based on he achie emen o
simila i y in he numbe o documen s be ween he di e en pe iods. Howe e , o he
au ho - ocused analysis, we simply de e mined an o e all pe iod ha encompasses
he en i e empo ali y o publica ions (P
X
= 2006–2019). To ind he s eng h o he
associa ion be ween pe iods, he numbe o keywo ds o subjec s in common be ween
hem was aken as a e e ence.
•
Pe o mance: Se e al p oduc ion indica o s associa ed wi h he inclusion c i e ia [
52
]
(Table 1) we e es ablished and he hemes de eloped o e he es ablished ime pe iods
we e analyzed (Figu e 3c).
Sus ainabili y 2021, 13, x FOR PEER REVIEW 6 o 20
 Pe o mance: Se e al p oduc ion indica o s associa ed wi h he inclusion c i e ia [52]
(Table 1) we e es ablished and he hemes de eloped o e he es ablished ime pe i-
ods we e analyzed (Figu e 3c).
Figu e 3. (a) S a egic diag am; (b) Thema ic ne wo k; (c) Thema ic e olu ion [40].
Table 1. P oduc ion indica o s and inclusion c i e ia.
Con igu a ion
Values
Analysis uni
Keywo ds au ho s, keywo ds Web o Science (WoS)
F equency h eshold
Keywo ds: P1 = (2), P2 = (2), P3 = (2)
Au ho s: PX = (2)
Ne wo k ype
Co-occu ence
Co-occu ence union alue
h eshold
Keywo ds: P1 = (2), P2 = (2), P3 = (1)
Au ho s: PX = (2)
No maliza ion measu e
Equi alence index: eij = cij2/Roo (ci − cj)
Clus e ing algo i hm
Maximum size: 9; Minimum size: 3
E olu iona y measu e
Jacca d index
O e lapping measu e
Inclusion a e
4. Resul s
4.1. Scien i ic Pe o mance and P oduc ion
The e a e a o al o 471 documen s on s udies ela ed o he e m TPACK in he WoS
da abase. The p oduc ion o hese documen s began o be egis e ed in his da abase in
2006. Speci ically, wo manusc ip s, which e e o he pedagogical inno a ion in ol ed
in he use o ICT in educa ion [53], and he quali ies o eache s who use ICT in aining
p ocesses [54]. This shows ha i is a ela i ely young ield o esea ch. F om 2006 o 2019,
p oduc ion has been inc easing, wi h wo no able p oduc ion peaks; one s ands ou in
2013 and ano he in 2017. As can be seen in Figu e 4, he e m TPACK may be p e en ed
om gaining mo e in e es in he scien i ic communi y. I is ue ha he olume o p o-
duc ion does no exceed 90 manusc ip s in any o he yea s analyzed. Al hough he e o-
lu ion is upwa d in e ms o he numbe o publica ions, i is ema kable ha he ascend-
ing e olu ion is no egula .
Taking in o accoun wha is es ablished in Table 2, i can be indica ed ha English is
he language chosen by he scien i ic communi y o p esen s udies ela ed o TPACK. I
is ollowed by Spanish. Wi h espec o he ype o documen , a icles a e he mos used
by he esea che s. This is ollowed by p oceedings pape s. In e ms o o ganiza ion, Nan-
yang Technological Uni e si y s ands ou abo e he es , al hough i is ollowed, a a sho
dis ance, by he Na ional Ins i u e o Educa ion (NIE) Singapo e.
Figu e 3. (a) S a egic diag am; (b) Thema ic ne wo k; (c) Thema ic e olu ion [40].
Table 1. P oduc ion indica o s and inclusion c i e ia.
Con igu a ion Values
Analysis uni Keywo ds au ho s, keywo ds Web o Science (WoS)
F equency h eshold Keywo ds: P1= (2), P2= (2), P3= (2)
Au ho s: PX= (2)
Ne wo k ype Co-occu ence
Co-occu ence union alue h eshold Keywo ds: P1= (2), P2= (2), P3= (1)
Au ho s: PX= (2)
No maliza ion measu e Equi alence index: eij = cij2/Roo (ci −cj)
Clus e ing algo i hm Maximum size: 9; Minimum size: 3
E olu iona y measu e Jacca d index
O e lapping measu e Inclusion a e
4. Resul s
4.1. Scien i ic Pe o mance and P oduc ion
The e a e a o al o 471 documen s on s udies ela ed o he e m TPACK in he WoS
da abase. The p oduc ion o hese documen s began o be egis e ed in his da abase in
2006. Speci ically, wo manusc ip s, which e e o he pedagogical inno a ion in ol ed
in he use o ICT in educa ion [
53
], and he quali ies o eache s who use ICT in aining
p ocesses [
54
]. This shows ha i is a ela i ely young ield o esea ch. F om 2006 o 2019,
p oduc ion has been inc easing, wi h wo no able p oduc ion peaks; one s ands ou in 2013
and ano he in 2017. As can be seen in Figu e 4, he e m TPACK may be p e en ed om
gaining mo e in e es in he scien i ic communi y. I is ue ha he olume o p oduc ion
does no exceed 90 manusc ip s in any o he yea s analyzed. Al hough he e olu ion
is upwa d in e ms o he numbe o publica ions, i is ema kable ha he ascending
e olu ion is no egula .
Sus ainabili y 2021,13, 1481 7 o 20
Sus ainabili y 2021, 13, x FOR PEER REVIEW 7 o 20
Figu e 4. E olu ion o scien i ic p oduc ion.
Table 2. Language, ype o documen s and o ganiza ion in he ield o TPACK esea ch.
Language
Publica ions
O ganiza ions
Publica ions
English
470
Nanyang Technological Uni e si y
39
Spanish
18
Na ional Ins i u e o Educa ion (NIE) Singapo e
29
Tu kish
8
Na ional Taiwan Uni e si y o Science Technology
20
Type o documen s
Publica ions
A icle
337
P oceedings pape
97
Book chap e
25
In ela ion o he a ea o publica ion, esea ch ela ed o TPACK is mainly ound in
educa ion and educa ional esea ch. The es o he a eas a e a e . Wi h espec o he
au ho s, i is Chai, C.S. ha accumula es he mos p oduc ion in his ype o s udy. He is
ollowed, a a conside able dis ance, by Koh, J.H.L. In ela ion o he sou ce o p oduc ion,
he e a e mainly wo, he Aus alasian Jou nal o Educa ional Technology and Compu e s &
Educa ion. Among he coun ies wi h mo e p oduc ion, he Uni ed S a es is he na ion ha
esea ches mos in his ield o s udy. I is ollowed, a a conside able dis ance, by Tu key
(Table 3).
Table 3. A eas o knowledge, au ho s, sou ces and coun ies in he ield o TPACK esea ch.
A eas o Knowledge
Publica ions
Au ho
Publica ions
Coun ies
Publica ions
Educa ion and Educa ional Resea ch
421
Chai, C.S.
37
Uni ed S a es
124
Educa ion Scien i ic Disciplines
52
Koh, J.H.L.
27
Tu key
80
Compu e Science In e disciplina y Applica ions
51
Tsai, C.C.
18
Taiwan
51
Compu e Science Theo y Me hods
15
Tondeu , J.
9
China
49
Linguis ics
11
Sou ces
Publica ions
Aus alasian Jou nal o Educa ional Technology
25
Compu e s & Educa ion
23
Jou nal o Resea ch on Technology in Educa ion
22
Jou nal o Educa ional Compu ing Resea ch
20
0
10
20
30
40
50
60
70
80
90
100
2006 2008 2009 2010 2011 2012 2013 2014 2015 2016 2017 2018 2019
Numbe o manusc i p
Yea o publica ion
TPACK
Figu e 4. E olu ion o scien i ic p oduc ion.
Taking in o accoun wha is es ablished in Table 2, i can be indica ed ha English
is he language chosen by he scien i ic communi y o p esen s udies ela ed o TPACK.
I is ollowed by Spanish. Wi h espec o he ype o documen , a icles a e he mos
used by he esea che s. This is ollowed by p oceedings pape s. In e ms o o ganiza ion,
Nanyang Technological Uni e si y s ands ou abo e he es , al hough i is ollowed, a a
sho dis ance, by he Na ional Ins i u e o Educa ion (NIE) Singapo e.
Table 2. Language, ype o documen s and o ganiza ion in he ield o TPACK esea ch.
Language Publica ions O ganiza ions Publica ions
English 470 Nanyang Technological Uni e si y 39
Spanish 18 Na ional Ins i u e o Educa ion (NIE) Singapo e 29
Tu kish 8 Na ional Taiwan Uni e si y o Science Technology 20
Type o documen s Publica ions
A icle 337
P oceedings pape 97
Book chap e 25
In ela ion o he a ea o publica ion, esea ch ela ed o TPACK is mainly ound in
educa ion and educa ional esea ch. The es o he a eas a e a e . Wi h espec o he
au ho s, i is Chai, C.S. ha accumula es he mos p oduc ion in his ype o s udy. He is
ollowed, a a conside able dis ance, by Koh, J.H.L. In ela ion o he sou ce o p oduc ion,
he e a e mainly wo, he Aus alasian Jou nal o Educa ional Technology and Compu e s &
Educa ion. Among he coun ies wi h mo e p oduc ion, he Uni ed S a es is he na ion ha
esea ches mos in his ield o s udy. I is ollowed, a a conside able dis ance, by Tu key
(Table 3).
Sus ainabili y 2021,13, 1481 8 o 20
Table 3. A eas o knowledge, au ho s, sou ces and coun ies in he ield o TPACK esea ch.
A eas o Knowledge Publica ions Au ho Publica ions Coun ies Publica ions
Educa ion and Educa ional Resea ch 421 Chai, C.S. 37 Uni ed S a es 124
Educa ion Scien i ic Disciplines 52 Koh, J.H.L. 27 Tu key 80
Compu e Science In e disciplina y Applica ions 51 Tsai, C.C. 18 Taiwan 51
Compu e Science Theo y Me hods 15 Tondeu , J. 9China 49
Linguis ics 11
Sou ces Publica ions
Aus alasian Jou nal o Educa ional Technology 25
Compu e s & Educa ion 23
Jou nal o Resea ch on Technology in Educa ion 22
Jou nal o Educa ional Compu ing Resea ch 20
Among he mos ci ed a icles on s udies ela ed o TPACK, he s udy by Mish a
and Koehle (2006) s ands ou mainly due o i s la ge numbe o ci a ions, wi h a o al o
2238 ci a ions. This s udy e e s o he es ablishmen o a concep ual amewo k ela ed o
educa ional echnology and he o mula ion o [
11
] on “pedagogical con en knowledge”.
The nex mos ci ed a icle is by [
55
], wi h a o al o 380 ci a ions. This esea ch ocuses on
de e mining and speci ying he di e en pedagogical models ela ed o he de elopmen
o he ICT-TPCK model (Table 4).
Table 4. TPACK: mos ci ed a icles.
Re e ence Ci a ions
Mish a, P.; Koehle , M. (2006). Technological Pedagogical Con en Knowledge: A F amewo k o Teache
Knowledge [11]2238
Angeli, C.; Valanides, N. (2009). Epis emological and me hodological issues o he concep ualiza ion, de elopmen ,
and assessmen o ICT-TPCK: Ad ances in echnological pedagogical con en knowledge (TPCK) [55]380
Schmid , D.A.; Ba an, E.; Thompson, A.D.; Mish a, P.; Koehle , M.J.; Shin, T.S. (2009). Technological Pedagogical
Con en Knowledge (TPACK): The De elopmen and Valida ion o an Assessmen Ins umen o P ese ice
Teache s [56]
378
Ha is, J.; Mish a, P.; Koehle , M. (2009). Teache s’ Technological Pedagogical Con en Knowledge and Lea ning
Ac i i y Types: Cu iculum-based Technology In eg a ion Re amed [57]272
Voog , J.; Fisse , P.; Roblin, N-P.; Tondeu , J.; Van B aak, J. (2013). Technological pedagogical con en knowledge-a
e iew o he li e a u e [58]205
G aham, C.R. (2011). Theo e ical conside a ions o unde s anding echnological pedagogical con en knowledge
(TPACK) [59]190
Tsai, C.C.; Lee, M.H. (2010). Explo ing eache s’ pe cei ed sel e icacy and echnological pedagogical con en
knowledge wi h espec o educa ional use o he Wo ld Wide Web [60]187
A chambaul , L.M.; Be ne , J.H. (2010). Re isi ing echnological pedagogical con en knowledge: Explo ing he
TPACK amewo k [61]181
4.2. S uc u al and Thema ic De elopmen
The e olu ion o he keywo ds be ween he di e en es ablished ime pe iods shows
he le el o coincidence o keywo ds. The in o ma ion p o ided includes he numbe o
keywo ds ha a e no longe p esen in he nex pe iod ( ep esen ed by an upwa d and
oblique a ow), he keywo ds ha a e included as new, compa ed o a p e ious pe iod, in
he new pe iod ( ep esen ed by a downwa d and oblique a ow), he keywo ds ha exis
in a gi en pe iod ( ep esen ed wi hin a ci cle) and he ma ching pe cen age o keywo ds
be ween pe iods ( ep esen ed by a ho izon al a ow poin ing o he igh ). In his case,
Figu e 5shows ha he ield o s udy on TPACK has a solid esea ch base. In o he wo ds,
he scien i ic communi y o ien s i s esea ch on ela ed aspec s. This is con as ed by he
ac ha he le el o coincidence o keywo ds be ween pe iods is o e 35%. In addi ion,
he e is a highe le el o awa eness be ween he i s and second pe iod han be ween
he second and hi d pe iod. This may indica e a change in he lines o esea ch by he
scien i ic communi y.
Sus ainabili y 2021,13, 1481 9 o 20
Sus ainabili y 2021, 13, x FOR PEER REVIEW 8 o 20
Among he mos ci ed a icles on s udies ela ed o TPACK, he s udy by Mish a and
Koehle (2006) s ands ou mainly due o i s la ge numbe o ci a ions, wi h a o al o 2238
ci a ions. This s udy e e s o he es ablishmen o a concep ual amewo k ela ed o ed-
uca ional echnology and he o mula ion o [11] on “pedagogical con en knowledge”.
The nex mos ci ed a icle is by [55], wi h a o al o 380 ci a ions. This esea ch ocuses on
de e mining and speci ying he di e en pedagogical models ela ed o he de elopmen
o he ICT-TPCK model (Table 4).
Table 4. TPACK: mos ci ed a icles.
Re e ence
Ci a ions
Mish a, P.; Koehle , M. (2006). Technological Pedagogical Con en Knowledge: A F amewo k o Teache
Knowledge [11]
2238
Angeli, C.; Valanides, N. (2009). Epis emological and me hodological issues o he concep ualiza ion,
de elopmen , and assessmen o ICT-TPCK: Ad ances in echnological pedagogical con en knowledge
(TPCK) [55]
380
Schmid , D.A.; Ba an, E.; Thompson, A.D.; Mish a, P.; Koehle , M.J.; Shin, T.S. (2009). Technological Ped-
agogical Con en Knowledge (TPACK): The De elopmen and Valida ion o an Assessmen Ins umen
o P ese ice Teache s [56]
378
Ha is, J.; Mish a, P.; Koehle , M. (2009). Teache s’ Technological Pedagogical Con en Knowledge and
Lea ning Ac i i y Types: Cu iculum-based Technology In eg a ion Re amed [57]
272
Voog , J.; Fisse , P.; Roblin, N-P.; Tondeu , J.; Van B aak, J. (2013). Technological pedagogical con en
knowledge-a e iew o he li e a u e [58]
205
G aham, C.R. (2011). Theo e ical conside a ions o unde s anding echnological pedagogical con en
knowledge (TPACK) [59]
190
Tsai, C.C.; Lee, M.H. (2010). Explo ing eache s’ pe cei ed sel e icacy and echnological pedagogical
con en knowledge wi h espec o educa ional use o he Wo ld Wide Web [60]
187
A chambaul , L.M.; Be ne , J.H. (2010). Re isi ing echnological pedagogical con en knowledge: Explo -
ing he TPACK amewo k [61]
181
4.2. S uc u al and Thema ic De elopmen
The e olu ion o he keywo ds be ween he di e en es ablished ime pe iods shows
he le el o coincidence o keywo ds. The in o ma ion p o ided includes he numbe o
keywo ds ha a e no longe p esen in he nex pe iod ( ep esen ed by an upwa d and
oblique a ow), he keywo ds ha a e included as new, compa ed o a p e ious pe iod,
in he new pe iod ( ep esen ed by a downwa d and oblique a ow), he keywo ds ha
exis in a gi en pe iod ( ep esen ed wi hin a ci cle) and he ma ching pe cen age o key-
wo ds be ween pe iods ( ep esen ed by a ho izon al a ow poin ing o he igh ). In his
case, Figu e 5 shows ha he ield o s udy on TPACK has a solid esea ch base. In o he
wo ds, he scien i ic communi y o ien s i s esea ch on ela ed aspec s. This is con as ed
by he ac ha he le el o coincidence o keywo ds be ween pe iods is o e 35%. In ad-
di ion, he e is a highe le el o awa eness be ween he i s and second pe iod han be-
ween he second and hi d pe iod. This may indica e a change in he lines o esea ch by
he scien i ic communi y.
Figu e 5. Con inui y o keywo ds be ween con iguous in e als.
Figu e 5. Con inui y o keywo ds be ween con iguous in e als.
The academic pe o mance o he es ablished pe iods p esen s he mos ele an
hemes and wi h he mos alues in he bibliome ic indices, among which a e he h index,
he g index, he hg index and he q2 index. On he o he hand, he in e al diag am ies o
show he le el o impo ance o each o he analyzed subjec s in he subjec pe o mance. To
his end, i akes in o accoun a p ocess o g ouping, by means o he Callon index [
62
]. This
indica o analyzes he deg ee o in e ac ion o a ne wo k wi h espec o o he ne wo ks,
om wo pe spec i es: cen ali y, which measu es he s eng h o ex e nal links wi h o he
opics, being he measu e o he impo ance o a opic in he de elopmen o a ce ain ield
o esea ch; and densi y, which analyzes he in e nal s eng h o he ne wo k, iden i ying
he in e nal links be ween all he keywo ds ha a e g ouped a ound a speci ic opic, hus
o e ing he deg ee o de elopmen o he ield o s udy analyzed.
As es ablished in Figu e 6, in he i s pe iod (2006–2014), he heme wi h he highes
academic pe o mance, ha is, he one wi h he mos bibliome ic alues, is “ amewo k”.
I is ollowed, a a e y conside able dis ance, by “ eache -educa ion” and “ eache s”.
In addi ion, he “ amewo k” heme is conside ed in his pe iod as he d i ing heme,
since i is loca ed in he Q1 quad an . This heme is ela ed o “sel -e icacy”, “belie s”,
“educa ion”, “model”, “ pack”, “ICT”, “pedagogical-con en -knowledge” and “science”. I
can be indica ed, he e o e, ha in his pe iod, s udies on TPACK ocused on he model
i sel , on he echnological esou ces used o i s applica ion and on he pe cep ion o i s
alidi y by hose in ol ed in he eaching and lea ning p ocesses.
In he second pe iod (2015–2017), he amewo k heme is again he one wi h he
highes bibliome ic le els. I is ollowed, a behind, by he hemes o “ echnology in e-
g a ion”, “in eg a ion” and “ espec ”. In his pe iod, wo hemes a e conside ed o be he
d i ing o ces, he case o “ amewo k”, which is epea ed, and “ espec ”. In his case,
he “ amewo k” heme is ela ed o “science”, “educa ion”, “ma hema ics”, “pe cep ion”,
“ echnology”, “ pack”, “ICT” and “pedagogical-con en -knowledge”. The heme “ espec ”,
on he o he hand, ela es o “DEEP”, “ eliabili y”, “p eschool- eache s”, “science- eache s”,
“ eache s”, “ins umen ”, “ alida ion” and “cons uc ”. I is he e o e shown ha his sec-
ond pe iod ollows he lines o in es iga ion se ou in he i s pe iod, bu wi h some mino
nuances. In his pe iod o ime, esea ch is ex ended o he ield o ma hema ics, in addi ion
o es ablishing ins umen s o he analysis o his me hod o s udy (Figu e 7).
In he hi d and las pe iod (2018–2019), he e is a change o end wi h espec o
he wo p e ious pe iods. The heme wi h he highes bibliome ic alue is “TPACK”,
ollowed by “educa ion”. In his ime in e al, he hemes conside ed o be d i ing o ces
a e “ alidi y” which is ela ed o “con i ma o y- ac o -analysis”, “FIT”, “scale”, “sel -
e icacy”, “ espec ”, “ins umen ”, “e icacy” and “quali y”; “educa ion” which is ela ed
o “design- hinking”, “s uc u al-equa ion-modelling”, “inqui y”, “a i udes”, “design”,
“p e-se ice- eache s”, “ amewo k” and “suppo ”; “ eache -belie s” which ela es o
“in eg a ion”, “cons uc ion”, “online- eaching”, “class oom”, “concep ualiza ion”, “p o-
g am”, “p o essional-de elopmen ” and “achie emen ”; and “TPACK” which ela es o
“ echnology-in eg a ion”, “pedagogical-con en -knowledge”, “ eache -educa ion”, “pe -
cep ions”, “p e-se ice- eache s”, “ eache s”, “ echnology” and “ICT”. In o he wo ds,
Sus ainabili y 2021,13, 1481 16 o 20
I should also be no ed ha he e olu ion o keywo ds clea ly indica es he exis ence
o a consolida ed esea ch base. In ac , his bibliome ic s udy allows us o a i m ha he
pe iod be ween 2006 and 2014, ha is, he i s pe iod, includes he subjec ma e wi h
he highes academic pe o mance, wi h “ amewo k” as he subjec ma e wi h he mos
bibliome ic alues. This is ollowed by “ eache -educa ion” and “ eache s”. This shows
ha in his pe iod, he s udies on he TPACK me hod we e ocused on he in eg a ion o
echnological esou ces and on he analysis o hei pe cep ion in s uden lea ning.
Thus, he second pe iod (2015–2017) shows ha he amewo k heme con inues o
be by a he one wi h he highes academic pe o mance. The undamen al di e ence is
ha his pe iod also seems o be cha ac e ized by he hemes “ echnology-in eg a ion”,
“in eg a ion” and “ espec ”. Fu he mo e, i ep esen s a con inua ion o he line o esea ch
al eady begun in he p e ious pe iod wi h he sys ema ic e olu ion o o he esea ch in he
a ea o ma hema ics. Las , bu no leas , he hi d pe iod (2018–2019) shows a adical change
o end, and now he subjec ha shows he highes index o ep esen a ion is “TPACK”,
oge he wi h “educa ion”. This indica es ha he lines o esea ch o his pe iod change
subs an ially o ocus on he alida ion o he assessmen ins umen s o he TPA
CK mod
el.
Howe e , his bibliome ic s udy allows us o a i m ha he e is no a heme ha is
epea ed in a sys ema ic way in he h ee pe iods, ha is o say, he line o in es iga ion
“ amewo k- amewo k- pack” is consolida ed as he line ha acqui es mo e s eng h, and
he line “ echnology-pedagogy-belie s” also g ows. This clea ly shows ha he esea ch
ca ied ou in hese pe iods is ocused on he same p edominan heme.
6. Conclusions
In summa y, his s udy o he TPACK model om he bibliome ic analysis allows
he esea che o o e a se o ends in he opics ha he scien i ic communi y gene a es
as new and necessa y. Thus, i shows an epis emological and e minological knowledge
ha , oge he wi h he scien i ic one, con ibu es o i s di usion as a eaching me hod. The
p ospec i e o his esea ch allows us o a i m ha he esul s can help many esea che s o
alue he inclusion o his model in he eaching–lea ning p ocesses. Al hough educa ional
echnologies wi h his model con ibu e o he dissemina ion o pedagogical knowledge,
hey also equi e cons an eache aining p ocesses o ob ain he bes esul s.
P ima ily, in his s udy, we ha e shown ha he TPACK model can add ess he chal-
lenge o sus ainabili y, ha i can imp o e he aims o u u e esea ch and how i can
p o ide new indings o o e come epis emological and e minological eme ging needs.
Once again, he alue o his model is unques ionable because i can help di e en p o es-
sionals in he de elopmen o aining p ocesses.
The limi a ions o his esea ch include he debugging o he WoS da a. We need o
insis on he ac ha his esea ch only ocuses on a single da abase and, o his eason, his
cons i u es one s udy limi a ion. Fu he mo e, he e a e epea ed documen s, and o he s
ha a e no ela ed o he subjec o he s udy. On he o he hand, i is wo h men ioning
ha he ime pe iods a e no egula ly main ained, i.e., he analyzed documen s show g ea
di e ences depending on he analysis in e al. Finally, he pa ame e s o his esea ch ha e
been se based on he esea che s’ own c i e ia, always wi h he aim o showing consis en
esul s. Fo his eason, i is conside ed ha he da a analyzed can be ex apola ed o o he
esea ch, bu his should be done wi h cau ion. Al hough u he esea ch can be en iched,
i can also coun e ac he pa ame e s and modi y he connec ions in he subjec s analyzed.
As o u u e lines o esea ch, i should be s a ed ha i would be con enien and necessa y
o ca y ou a s udy on he TPACK me hod in o he speci ic a eas o knowledge, such as,
o example, he social sciences. In pa icula , in hese a eas o knowledge, i would be
highly bene icial o know da a o his ype.
7. Implica ions o he S udy
This s udy is he i s wo k ha has analyzed he TPACK model om a deepe biblio-
me ic pe spec i e, h ough he scien i ic mapping o he concep . The esul s achie ed in

Sus ainabili y 2021,13, 1481 17 o 20
his esea ch ha e gi en ise o a ious heo e ical and p ac ical implica ions. A a heo e i-
cal le el, he p esen wo k con ibu es o he inc ease in he scien i ic li e a u e on TPACK.
In addi ion, he indings ob ained ha e allowed de e mining he ends unning h ough
he ield o s udy on he s a e o he a . This allows he scien i ic communi y o be guided
on he main ocuses o in e es ha esea che s ha e been aking du ing hei scien i ic
p oduc ion and whe e esea ch is heading. Likewise, he esul s ha e made i possible o
e eal he p o ile o he s udies ca ied ou on TPACK, alluding o he a ious bibliome ic
indica o s analyzed. These can se e as a guide and suppo o u u e wo k by o he
scien is s who need o consul in o ma ion, wi h ha on languages, ins i u ions, media
and a eas o publica ion, au ho s and mos ci ed documen s among he mos p ominen .
Addi ionally, wi hin he heo e ical spec um, he li e a u e e lec s wi h special ele ance
he alida ion o ques ionnai es abou he di e en applica ions o he TPACK model. In
his sense, he publica ions show he pedagogical p ospec s his model acqui es in he ield
o educa ion. The main pu pose is o o ien a e u u e esea ch and se e as a heo e ical and
concep ual amewo k o he eaching communi y in i s applicabili y o lea ning spaces.
On he o he hand, his s udy lea es a se ies o p ac ical implica ions o in e es o
a ious g oups ela ed o he educa ional ield. This anges om eache s, esea che s
and s uden s, o en i ies and ins i u ions in cha ge o aining and he de elopmen o
inno a i e educa ional ools. Among he indings mo e ocused on eaching p ac ice, he
scien i ic li e a u e shows he main pedagogical me hods ca ied ou in di e en con ex s,
as well as hei esul s and bene i s in he applica ion o he TPACK model. Along he
same lines, he s udies ca ied ou o da e show he po en ial ha educa ional echnology
has ob ained in i s applica ion in lea ning spaces and how eache s ha e in eg a ed i in o
hei p o essional p ac ice. In addi ion, he esea ch ca ied ou includes he belie s and
pe cep ions o bo h eache s and s uden s ega ding he TPACK model. This acqui es a
sup eme alue, since i s accep ance by he di e en membe s o he educa ional communi y
will allow i s p omo ion and deploymen . All his will lead o he de elopmen o aining
ac ions and he imp o emen o a eaching and lea ning p ocess ypical o a echnological
e a. Finally, he esul s ob ained can se e as a guide o he en i ies and ins i u ions in
cha ge o de eloping aining plans and digi al applica ions, wi h he pu pose o knowing
he educa ional eali y o his model and de eloping p oposals ha con ibu e o i s
de elopmen and in eg a ion in he aining p ocesses.
Au ho Con ibu ions:
Concep ualiza ion, J.-A.M.-M. and R.S.-C.; me hodology, J.L.-B.; so wa e,
A.-J.M.-G.; alida ion, A.-J.M.-G.; o mal analysis, A.-J.M.-G.; in es iga ion, J.-A.M.-M., R.S.-C.,
A.-J.M.-G. and J.L.-B.; da a cu a ion, A.-J.M.-G.; w i ing—o iginal d a p epa a ion, J.-A.M.-M.,
R.S.-C., A.-J.M.-G. and J.L.-B.; w i ing— e iew and edi ing, J.-A.M.-M., R.S.-C., A.-J.M.-G. and J.L.-B.;
isualiza ion, J.-A.M.-M., R.S.-C., A.-J.M.-G. and J.L.-B.; supe ision, J.-A.M.-M., R.S.-C., A.-J.M.-G.
and J.L.-B. All au ho s ha e ead and ag eed o he published e sion o he manusc ip .
Funding:
This esea ch was unded by he p ojec I+D+i OTRI: Ac i e me hodologies o lea n-
ing h ough echnological esou ces o he de elopmen o socie y (CNT-4315), Uni e si y o
G anada (Spain).
Da a A ailabili y S a emen : Da a a e con ained wi hin he a icle.
Acknowledgmen s: To he esea ch g oup AREA (HUM-672) o he Uni e si y o G anada (Spain).
Con lic s o In e es : The au ho s decla e no con lic o in e es .
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