Recen Inno a ions in Mecha onics (RIiM) Vol. 3. (2016). No. 1-2.
DOI: 10.17667/ iim.2016.1-2/12.
1
Fu he De elopmen o a Lase In e e ome e
László Rónai
Robe Bosch Depa men o Mecha onics
Uni e si y o Miskolc
Miskolc, Hunga y
[email protected]
Abs ac —A mo e han 25 yea old lase in e e ome e has
been u he de eloped in o de o handle he signals also by
compu e s. A TTL signal con e e has been buil in using an
analog compa a o uni ype LM319. A Na ional Ins umen s
6341 OEM measu emen ca d was implemen ed oo. The
mode nized lase in e e ome e has been e i ied wi h a p ecise
Renishaw XL-80 in e e ome e . A ib ome e uni has been also
calib a ed wi h he upda ed in e e ome e .
Keywo ds—lase in e e ome e ; measu emen ; ib ome e ;
analog compa a o
I. INTRODUCTION
The his o y o he lase s is ela i ely sho , he i s lase
was made in 1960, which was a solid ( uby) lase . The
heo e ical basis o he lase s was in en ed ea lie by Albe
Eins ein [7]. The e m o lase [2], [3], [7] is de i ed om he
Ligh Ampli ica ion by S imula ed Emission o Radia ion
wo ds ini ial le e . Nowadays lase sys ems a e used in a e y
wide ield, e.g., labo a o y esea ches, measu emen s, ma e ial
p ocessing. One can ead u he in o ma ion abou lase s, e.g.,
in [2] and [8].
In his pape u he de elopmen o a lase in e e ome ic
mo ion analyse (LIMA) is discussed. The aim o he
de elopmen is o handle he signals also by compu e s.
Fu he mo e he uni will be used in demons a ion and
educa ional pu poses. In his a icle compa a i e
measu emen s a e pe o med wi h he in es iga ed de ice and
a so called Lase Dopple Vib ome e [9] (LDV) and a
Renishaw XL-80 [12] lase in e e ome e . This esea ch was
accomplished a he Ins i u e o Physics [4] in collabo a ion
wi h he Wigne Resea ch Cen e o Physics. The Renishaw
in e e ome e was p o ided by he Robe Bosch Depa men
o Mecha onics. The p ecision measu emen s o ib a ions
a e p o ided by he lase in e e ome y.
Th ee di e en lase sys ems a e desc ibed in Sec ion 2.
The designing s eps o he u he de elopmen , e.g., on
panel, analog compa a o ci cui a e gi en in Sec ion 3. The
manu ac u ing s eps a e w i en in Sec ion 4. The las wo
Sec ions a e deal wi h he es ing p ocess and he p ac ical
ib a ion measu emen s. The u u e plans a e men ioned in
Conclusion.
II. LASER SYSTEMS
The applica ion o lase s a e ela i ely popula . The lase
beams a e highly monoch oma ic and spa ially cohe en .
Fu he mo e lase s p o ide high spec al powe densi y ( he
ene gy is concen a ed in o one poin ) and li le di e gence.
The i s in e e ome e was c ea ed by Albe Ab aham
Michelson in 1881, o measu e he speed o he Ea h
compa ed o he ’e he ’ in 1887.
The op omechanical scheme o he in es iga ed lase
in e e ome e is desc ibed in Fig. 1.
He-Ne lase
S abilize De ec o
S a iona y
mi o
Beam
spli e
Mo ing
mi o
Measu emen
uni
Head uni
Fig. 1. Op omechanical scheme o LIMA
The sys em is mo e han 20 yea old, which has go a He-
Ne gas lase . The emi ed lase beam is passing h ough a
beam spli e , hus he beam is di ided in o wo pe pendicula
pa . The in ensi y o he wo beams a e emaining he same
[1]. The ea e one beam is passing h ough he s a iona y
mi o and he o he beam is passing o e a mo ing mi o .
The wo lase beams a e coming ac oss he spli e uni , hen i
will e u n o he de ec o in he head uni . The phase
ela ionship o he beams a e de e mined by he pa h leng h
di e ence [1]. The pa h leng h di e ence mus be wi hin he
cohe ence ange o he lase uni .
The o iginal measu emen and da a p ocessing module is
ou da ed, which is shown in Fig. 2. The main speci ica ions o
he LIMA a e gi en in Table I.
Recen Inno a ions in Mecha onics (RIiM) Vol. 3. (2016). No. 1-2.
DOI: 10.17667/ iim.2016.1-2/12.
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TABLE I. SPECIFICATIONS OF THE LASER UNIT
Name o he pa ame e
Value o he pa ame e
Lase ype
He-Ne Uniphase-1007 [6]
Cohe ence leng h
3 m
The empe a u e o he lase
uni in s abilized s a e
51°C
Ope a ing empe a u e
15°C-25°C
Lase equency
4.7375·1014 Hz
The communica ion be ween he head uni and he
measu emen uni is p o ided by a DB 9 connec o .
Fig. 2. The o iginal ou da ed measu emen uni
Fo e i ica ion pu poses a Renishaw XL-80 ype lase
in e e ome e is used. The accu acy o he uni is ~1 nm, he
measu emen ange is expandable o 80 m. The uni
communica es wi h pe sonal compu e s ia an USB cable.
This sys em is applicable o calib a ion o machine ools, e.g.,
milling s a ions, u ning machines. The p ecision o he
measu emen is ensu ed by co ec ion uni s, e.g., humidi y,
empe a u e and p essu e senso s.
The hi d lase uni is an LDV, which is a Poly ec PDV
100 [10]. The uni is capable o measu e he speed and he
equency componen s o he ib a ions wi h con ac less way.
The s uc u e o he LDV is compac , hus i is no expandable.
The head uni o he sys em is a He-Ne ype gas lase , he
wa eleng h o he beam is λ=632.8 nm, he e o e he emi ed
ligh is isible. The dis ance o he measu emen is a iable
wi hin a ange o 0.1-30 m. The uni has some main bene i s,
e.g., he mobili y and he simple ope a ion. Easy o analyze
objec s which a e ha d o each. The ope a ion o he sys em is
based on he Dopple E ec . This e ec was disco e ed in
1843 by Ch is ian And eas Dopple . The essence o he
phenomenon is ha i he obse e and/o he sou ce o he
wa e mo e(s) ela i e o each o he , changes o he wa e a e
de ec ed in he wa eleng hs and he equencies. The
phenomenon can also be obse ed in as onomy, he ed/blue
shi ela ion [11].
III. DESIGNING PROCESSES
The designing p ocesses and ma e ials o he measu emen
sys em o he LIMA a e desc ibed in he sequel. Powe supply
uni s and clamping elemen s o he box a e selec ed in
acco dance wi h he ou da ed module and he measu ed
cu en s.
The Kon ak a measu emen box ype 19” was selec ed o
build he measu emen uni . The box had no on panel, hus
he designing p ocess has been expanded wi h planning o he
layou o he on panel.
The de ec o o he head uni sends signals o he
measu emen box, he e o e an analog compa a o ci cui is
designed o p o ide TTL signals o he measu emen ca d,
which is a Na ional Ins umen s ype 6341 OEM ca d. The
abo e men ioned compa a o ci cui has been made in he
Eagle p in ed ci cui boa d (PCB) designe so wa e upon he
a ailable li e a u e o he old measu emen box. The i s s ep
is o c ea e he schema ic o he ci cui , he ea e he PCB
model o he boa d had o be gene a ed in Fig. 3.
Fig. 3. The gene a ed model o he PCB
The posi ions o he bo es and cu ing posi ions o he on
panel a e designed in he F on Design so wa e. The layou o
he bo es and he labels a e shown in Fig. 4.
Fig. 4. The layou o he on panel
Recen Inno a ions in Mecha onics (RIiM) Vol. 3. (2016). No. 1-2.
DOI: 10.17667/ iim.2016.1-2/12.
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IV. THE MANUFACTURING PROCESSES
The s eps o he cons uc ing phases a e desc ibed in his
Sec ion. Fi s ly he p oduc ion o he PCB o he analog
compa a o uni is deal wi h. Secondly he milling and he
labeling p ocesses o he on panel a e discussed.
Pe o ming he milling and he solde ing he eadymade
boa d wi hou analog compa a o s is shown in he Fig. 5.
Fig. 5. The eadymade PCB
The hickness o he on panel is 4 mm, which consis s
bo es wi h Ø 3 mm diame e . The labels o he panel a e
p in ed on a anspa en adhesi e ilm oil. The ea e he inal
assembly and es ing o he measu emen sys em ha e been
pe o med.
V. THE BUILDING AND TESTING OF THE MEASUREMENT BOX
A he i s s ep he clamping o he AC connec o s, cu en
me e and some o he connec o s a e made. The oppo uni y o
he na u al en ila ion is an impo an ea u e o a oid
o e hea ing, hus he dis ance o he elemen s a e designed
ela i ely la ge. Space s a e made o ix he subassemblies in o
he measu emen box. To assembly he sys em some Ø 3 mm
diame e bo es had o be d illed hen ollowed by Ø 6 mm
diame e lowe ing.
The eadymade measu emen and da a p ocessing uni is
shown in Fig. 6.
Fig. 6. The mode nized measu emen sys em
The u he de eloped sys em is useable wi h a PC o
pe o m p ecision measu emen s. The da a o he
measu emen s a e di ec ly e alua ed in a PC [5].
VI. PRECISION MEASUREMENT OF VIBRATIONS AND
CALIBRATION OF THE LDV UNIT
The ope a ional accu acy o he u he de eloped
measu emen uni can be checked by he Renishaw sys em.
The calib a ion p ocess o he LDV uni has been done by he
in es iga ed lase in e e ome e . The measu emen s o he
displacemen s a e aken place a he same ime wi h he LIMA
and he Renishaw sys em. The a angemen o he
measu emen is shown in Fig. 7.
Fig. 7. The a angemen o he displacemen measu emen
A p og am had o be w i en in Scilab so wa e o c ea e
he equency spec um and he displacemen - ime diag am o
he ib a ions o he shocks. The esul s and he e alua ion o
he measu emen s we e in es iga ed in de ail in he scien i ic
s uden wo k [13]. In his pape only some esul s o he
measu emen be ween he in es iga ed in e e ome e and he
Renishaw XL-80 uni a e discussed. The esul s o one o he
measu emen s a e shown in Fig. 8. I is impo an , ha he wo
in e e ome ic sys ems measu e he opposi e side o he
objec able, which is he explana ion o he opposi e signs
ob ained o he displacemen s. Since he e e ence imes o
he wo measu emen uni s a e no ha monized, he e o e he
ime axis is shi ed ela i ely o each o he .
The wo main equency componen s had o be calcula ed
(1) and (2) be ween he wo black lines, which a e shown in
Fig. 8.
The eloci y da a o he LIMA and he LDV uni a e
di e en . The eloci y esul s o he LDV a e 3.5 imes bigge
han he calcula ed esul s o LIMA [9]. Du ing he calib a ing
p ocess, he ecommended alue o he scaling ac o , which
was gi en by he manu ac u e had o be modi ied.
Recen Inno a ions in Mecha onics (RIiM) Vol. 3. (2016). No. 1-2.
DOI: 10.17667/ iim.2016.1-2/12.
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Fig. 8. Pa ial esul o he measu emen s
VII. CONCLUSION
In he esea ch his pape was dealing wi h he
de elopmen o a lase in e e ome ic measu emen and da a
p ocessing uni , which could be used o ib a ion
measu emen s and also o demons a i e pu poses. Upon he
a ailable li e a u e he o iginal measu emen uni was
e iewed, which helped o design i s mode niza ion. Du ing
he planning session he schema ic o an analog compa a o
ci cui was made and om his a p in ed ci cui boa d (PCB)
was also designed. As he nex s ep he plan o he on panel
and i s labelling we e designed wi h a so wa e called
F on Design. Then he posi ion o he bo es and cu ing
posi ions o he panel we e manu ac u ed. The analog
compa a o ci cui was manu ac u ed o con e he signals o
TTL.
The compa a i e p ecision ib a ion measu emen s
ealized wi h a Renishaw XL-80 compac in e e ome e . The
LIMA could be pe ec ly used o ca ying ou p ecision
displacemen measu emen s up o µm esolu ion. I was s a ed
ha he in e e ome e and he ib ome e also could show he
dominan equency componen s. P oblems [9] wi h he
calib a ion o he ib ome e we e sol ed. The calib a ion was
ealized wi h he upda ed in e e ome e .
Two mode n, ope able measu ing and da a-p ocessing
modules we e success ully made o he lase in e e ome e
head uni a he Ins i u e o Physics in collabo a ion wi h he
Wigne Resea ch Cen e o Physics.
The de elopmen o he so wa e o he uni and he
op imiza ion o he beam expansion o he head uni a e
amongs my plans o he u u e. Also mo e p ecise de ices
will be used o adjus ing he p isms ins ead o he ecen ly
u ilized ones.
ACKNOWLEDGMENT
This esea ch was ca ied ou in he amewo k o ha
Cen e o Excellence o Mecha onics and Logis ics a he
Uni e si y o Miskolc.
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