Ci a ion: Wu, D.; Yao, Y.;
Ci uen es-Jimenez, C.C.; Sano, H.;
Ál a ez-Llo e , P.; Yamau i, M.;
Tomokiyo, A. Long-Te m Den in
Bonding Pe o mance o Uni e sal
Adhesi es: The E ec o HEMA
Con en and Bioac i e Resin
Composi e. J. Func . Bioma e . 2024,15,
379. h ps://doi.o g/10.3390/
j b15120379
Academic Edi o s: Ta jana Ma a ic,
Tijana Laino i´c and U oš Josi´c
Recei ed: 7 No embe 2024
Re ised: 10 Decembe 2024
Accep ed: 11 Decembe 2024
Published: 16 Decembe 2024
Copy igh : © 2024 by he au ho s.
Licensee MDPI, Basel, Swi ze land.
This a icle is an open access a icle
dis ibu ed unde he e ms and
condi ions o he C ea i e Commons
A ibu ion (CC BY) license (h ps://
c ea i ecommons.o g/licenses/by/
4.0/).
A icle
Long-Te m Den in Bonding Pe o mance o Uni e sal Adhesi es:
The E ec o HEMA Con en and Bioac i e Resin Composi e
Di Wu 1, Ye Yao 1, Ca olina Cecilia Ci uen es-Jimenez 2, Hidehiko Sano 1, Ped o Ál a ez-Llo e 3,
Monica Yamau i 1,4,*and A sushi Tomokiyo 1
1Depa men o Res o a i e Den is y, G adua e School o Den al Medicine, Hokkaido Uni e si y,
Sappo o 060-8586, Japan; [email p o ec ed] (D.W.); [email p o ec ed] (Y.Y.);
[email p o ec ed] (H.S.); [email p o ec ed] (A.T.)
2Depa men o S oma ology, Facul y o Den is y, Uni e si y o G anada, Campus de Ca uja, s/n,
18011 G anada, Spain; ca olinaccj@co eo.ug .es
3Depa men o Geology, Facul y o Geology, Uni e si y o O iedo, Campus de Llamaquique, s/n,
33005 O iedo, Spain; ped oal a [email p o ec ed]
4Depa men o Biomedical and Applied Sciences, School o Den is y, Indiana Uni e si y Indianapolis,
Indianapolis, IN 46202, USA
*Co espondence: [email p o ec ed]
Abs ac : This s udy in es iga ed he e ec s o esin composi es (RCs) con aining su ace p e- eac ed
glass ionome (S-PRG) ille on he den in mic o ensile bond s eng h (
µ
TBS) o HEMA- ee and
HEMA-con aining uni e sal adhesi es (UAs). Wa e so p ion (WS) and solubili y (SL), deg ee o
con e sion (DC), and ion elease we e measu ed. The UAs Beau iBond X eme (BBX; 0% HEMA),
Modi ied Adhesi e-1 (E-BBX1; 5% HEMA), Modi ied Adhesi e-2 (E-BBX2; 10% HEMA), and wo
2-s ep sel -e ch adhesi es (2-SEAs): FL-BOND II (FBII; wi h S-PRG ille ) and silica-con aining
adhesi e (E-FBII) we e used. Tee h we e es o ed wi h Beau i il Flow Plus F00 wi h S-PRG ille (BFP)
and lowable esin composi e wi h silica ille (E-BFP).
µ
TBS was e alua ed a e 24 h and 6 mon hs o
wa e s o age. WS and SL measu emen ollowed ISO 4049:2019; spec oscopy measu ed DC; ICP-MS
e alua ed ion elease. BBX and FBII p esen ed he highes DC. The adhesi es did no comply wi h he
WS ISO equi emen s, bu he bonding esin o 2-SEAs complied wi h he SL h eshold. BFP eleased
mo e ions han E-BFP. BFP posi i ely a ec ed he
µ
TBS o UAs, ega dless o HEMA concen a ion
a e 24 h, compa able o he 2-SEAs. The 6 mon hs
µ
TBS dec ease depended on he adhesi e and RC
combina ion. HEMA did no a ec he µTBS o UAs, while bioac i e esins had a posi i e impac .
Keywo ds: uni e sal adhesi e; S-PRG ille s; HEMA; deg ee o con e sion; wa e so p ion and
solubili y; ions elease; bond s eng h
1. In oduc ion
Uni e sal adhesi es (UAs) a e widely ecognized as adhesi e sys ems ha can be
applied in e ch- inse and sel -e ch modes o a ious den al issues and ma e ials u ilized in
di ec o indi ec es o a i e echniques [
1
]. Due o hei mul i unc ional ea u es, hei com-
posi ion is mo e complex han he p eceding all-in-one sel -e ch adhesi e sys ems. When
de eloping single-bo le UAs, an ideal mix u e o ac ylic esin monome s wi h di e ing
hyd ophilici y and hyd ophobici y, sol en wa e , silane, and unc ional monome s needed
o be blended and unc ion well in combina ion, ideally polyme ized o p oduce a du able
bonded in e ace [
2
]. Howe e , achie ing an ideal composi ion is highly echnique-sensi i e
since all adhesi e compounds blend, e en hough hey a e no always miscible [3].
A unc ional monome , 2-hyd oxye hyl me hac yla e (HEMA), is equen ly added o
UAs. HEMA is highly soluble in o he sol en s and wa e ; i s hyd ophilic and co-sol en
na u e imp o es s abili y and helps o keep hyd ophobic and hyd ophilic monome s in
a homogenous solu ion by educing phase sepa a ion [
4
]. Phase sepa a ion occu s when
J. Func . Bioma e . 2024,15, 379. h ps://doi.o g/10.3390/j b15120379 h ps://www.mdpi.com/jou nal/j b
J. Func . Bioma e . 2024,15, 379 2 o 18
he sol en e apo a es a mois bonding in e aces, especially when using adhesi es like
UAs ha con ain high wa e concen a ions [
1
]. Mo eo e , HEMA’s pola cha ac e is ics
and wa e -solubili y p ope ies inc ease we abili y and p omo e esin monome di usion
in o he den in collagen ib il ne wo k [
5
]. Howe e , uncu ed HEMA also lowe s wa e
apo p essu e in he adhesi e and may make i mo e challenging o e apo a e du ing
he ai -d ying s ep, impai ing polyme iza ion [
6
]. Due o i s high hyd ophilici y, HEMA
eadily abso bs wa e in i s uncu ed and polyme ized s a e [
7
]. High wa e so p ion can
cause a dec ease in mechanical p ope ies and con ibu e o he deg ada ion o den al
polyme ma ices [
5
]. A p e ious in es iga ion has also sugges ed ha HEMA hampe s he
in e ac ions be ween he phospha e g oups o 10-MDP and hyd oxyapa i e (HAp), which
could unde mine he bond s eng h o UAs con aining subs an ial amoun s o HEMA [
8
].
To inc ease he du abili y o he composi e es o a ion, manu ac u e s and esea che s ha e
a emp ed o educe he hyd ophilici y o UAs by adjus ing he concen a ions o HEMA
o inc ease he longe i y o he composi e es o a ion [
9
]. UAs could s ill be conside ed a
one-s ep adhesi e [2].
The so-called con o e sial bioac i i y has been ano he p ope y add essed in den-
al es o a i e ma e ials o a s able den in- esin bonding [
1
]. The la es de ini ion o
bioac i i y om FDI di ides he mechanisms in o h ee le els: pu ely biological, mixed
biological/chemical, o s ic ly chemical (e.g., h ough ion elease om bioac i e glass
ille s [
10
]). Recen ly, signi ican in e es has been d awn o using glass pa icles ha demon-
s a e a ious e ec s by eleasing mul iple ions [
11
]; among hem, he silana ed p e- eac ed
glass ionome (S-PRG) ille has been widely used in comme cial p oduc s. Acco ding o
he manu ac u e , he S-PRG ille is a mul ilaye ed, ul a ine glass pa icle wi h a SiO
2
coa ing on he ou e laye , a p e- eac ed glass-ionome phase in he middle, and a glass
co e ha could be eleased in o den al ha d issues and enhance hei mine aliza ion [12].
The cu ed adhesi e laye s in single-s ep adhesi es may ac as semi-pe meable mem-
b anes ha allow wa e di usion om he bonded hyd a ed den in o he in e mixed zone
be ween he adhesi e and he composi e [
13
]. A ecen s udy epo ed ha mul i-ions
eleased by S-PRG- illed esin composi e migh pe mea e oo h subs a es h ough adhe-
si es, hinde ing oo h demine aliza ion a ound composi e es o a ions [
14
]. To combine he
ad an ages o UAs and he p ope ies o S-PRG ille s, new esin-based p oduc s ha e been
de eloped and equi e in es iga ion. The e o e, his s udy aimed o in es iga e he e ec s
o a esin composi e (RC) con aining S-PRG ille on he den in bond s eng h o HEMA- ee
and HEMA-con aining UAs o e a pe iod o 6 mon hs. Two di e en wo-s ep sel -e ch
adhesi es (2-SEAs) we e used as e e ence g oups. Addi ionally, he wa e so p ion and
solubili y o he ma e ials, as well as hei deg ee o con e sion, we e in es iga ed. The
hypo heses we e ha (1) he e would be no signi ican di e ences in he deg ee o con e -
sion o ma e ials; (2) he e would be no di e ence in he wa e so p ion and solubili y o
adhesi e sys ems and RCs; (3) he e would be no di e ence in he ion elease o adhesi es
and RCs; (4) he s o age pe iod, adhesi e ypes, RCs, and hei combina ions would no
a ec he den in bond s eng h o den in.
2. Ma e ials and Me hods
2.1. S udy Design and E hical Conside a ions
This s udy ep esen s quan i a i e, quali a i e, and p ospec i e
in i o
esea ch. The
expe imen al ac o s we e adhesi e ype (5 le els), es o a i e esin (2 le els), and s o age
pe iod (2 le els—only o bond s eng h). The esponse a iables we e deg ee o con-
e sion, wa e so p ion and solubili y, and bond s eng h. The esea ch p o ocol and he
use o human ex ac ed ee h was app o ed by he Ins i u ion’s Human Resea ch E hics
Commi ee in he G adua e School o Den al Medicine, Hokkaido Uni e si y (P o ocol
#2018/9). The ee h we e p ese ed in an aqueous solu ion o 0.5% chlo amine-T a 4
◦
C
and used wi hin 6 mon hs o ex ac ion.
J. Func . Bioma e . 2024,15, 379 3 o 18
2.2. Deg ee o Con e sion o Adhesi es and Resin Composi es
The ma e ials used in he s udy a e lis ed in Table 1, along wi h hei manu ac u e s,
abb e ia ions, and ins uc ions. A modula con ocal Raman spec og aph was used o
in es iga e he deg ee o con e sion (DC) o he adhesi es unde non-polyme ized and
polyme ized condi ions. Raman spec a we e ob ained using a JASCO NRS-5100 (Jasco
Inc., Eas on, MD, USA) spec ome e wi h a cha ge-coupled de ec o (1024
×
256 pixels)
cooled by a Pel ie -e ec module. Two d ops o each adhesi e we e pou ed in o a ci cula
Te lon mold (10.0 mm diame e
×
4.0 mm dep h) and placed unde magni ica ion on
an XYZ s age. A nea -in a ed diode lase (785 nm) kep a 500 mW was employed o
induce he Raman sca e ing, ocusing he lase beam wi h a 20
×
lens (op ical mic oscope).
Spec a we e acqui ed in a ange be ween 1000 and 1800 cm
−1
using an exposu e ime o
5 s and 10 accumula ions wi h an a e age spec al esolu ion o 1.6 cm
−1
. The adhesi e
samples we e analyzed while non-polyme ized o ob ain he uncu ed monome spec a.
Subsequen ly, each adhesi e sample was ligh -ac i a ed using an LED cu ing uni wi h ligh
i adiance o 1200 mW/cm
2
(G-Ligh P ima-II Plus; GC Co p., Tokyo, Japan) ollowing he
manu ac u e ’s ins uc ions, and he polyme ized measu emen s we e aken. Ins umen
calib a ion was de e mined be o e da a acquisi ion by compa ison wi h he silicon s anda d
spec um o se he e e ence posi ion a 520 cm−1.
Table 1. Comme cial names, ba ch numbe s, abb e ia ions, composi ions, and manu ac u e ’s
ins uc ion o he ma e ials used in he s udy comme cial.
Adhesi es Abb e ia ions Composi ions Manu ac u e ’s Ins uc ions
Beau iBond X eme
(Sho u Inc., Kyo o, Japan,
Lo . 122012)
(Uni e sal Adhesi e)
BBX
Ace one, dis illed wa e , Bis-GMA, ca boxylic acid
monome , phospho ic acid monome , TEGDMA,
acid esis an silane coupling agen , o he s.
Apply bonding adhesi e o he den in su ace.
Apply gen le ai o 3 s and s ongly ai un il d y.
Ligh cu e o 5 s.
Modi ied Adhesi e 1
(Sho u Inc., Kyo o, Japan,
Lo . 230714)
(Uni e sal Adhesi e)
E-BBX1
HEMA (5 w %), ace one, dis illed wa e , Bis-GMA,
ca boxylic acid monome , phospho ic acid
monome , TEGDMA, acid esis an silane coupling
agen , o he s.
Apply bonding adhesi e o he den in su ace.
Apply gen le ai o 3 s and s ongly ai un il d y.
Ligh cu e o 5 s.
Modi ied Adhesi e 2
(Sho u Inc., Kyo o, Japan,
Lo . 230714)
(Uni e sal Adhesi e)
E-BBX2
HEMA (10 w %), ace one, dis illed wa e ,
Bis-GMA, ca boxylic acid monome , phospho ic
acid monome , TEGDMA, acid esis an silane
coupling agen , o he s.
Apply bonding adhesi e o he den in su ace.
Apply gen le ai o 3 s and s ongly ai un il d y.
Ligh cu e o 5 s.
FL-BOND II
(Sho u Inc., Kyo o, Japan,
Lo . 092130)
(Two-s ep, sel -e ch adhesi e)
FBII
P ime : wa e , e hanol, ca boxylic acid monome ,
phospho ic acid
monome and ini ia o
Adhesi e: SPRG based on
luo obo oaluminosilica e glass, UDMA,
TEGDMA, HEMA, polyme iza ion ini ia o .
Apply p ime o he den in su ace
and lea e o 10 s.
Apply gen le ai un il d y.
Apply bonding adhesi e o he den in su ace.
Ligh cu e o 10 s.
Silica-con aining adhesi e
(Sho u Inc., Kyo o, Japan,
Lo . HFLB01)
(Two-s ep, sel -e ch adhesi e)
E-FBII
UDMA, HEMA, TEGDMA, polyme iza ion
ini ia o , silica ille , o he s
P ime : wa e , e hanol, ca boxylic acid monome ,
phospho ic acid
monome and ini ia o .
Adhesi e: silica ille , UDMA, TEGDMA, HEMA,
polyme iza ion ini ia o , o he s.
Apply p ime o he den in su ace
and lea e o 10 s.
Apply gen le ai un il d y.
Apply bonding adhesi e o he den in su ace.
Ligh cu e o 10 s.
Resin Composi es Abb e ia ions Composi ions Manu ac u e ’s Ins uc ions
BEAUTIFIL Flow Plus F00
(Sho u Den al, Kyo o, Japan,
Lo . 122012)
(Flowable es o a i e esin
composi e)
BFP Bis-GMA, TEGDMA, S-PRG ille based on
luo obo oaluminosilica e glass, polyme iza ion
ini ia o , pigmen s, o he s.
Apply he ma e ial in laye s wi h a needle ip o build
up a 4 mm hickness esin block.
Each laye is no mo e han 2 mm hick,
and ligh cu e o 10 s.
Silica-con aining lowable
esin composi e
(Sho u Den al, Kyo o, Japan,
Lo . HBFP02)
(Flowable es o a i e esin
composi e)
E-BFP Bis-GMA, TEGDMA, silica ille , polyme iza ion
ini ia o , pigmen s, o he s.
Apply he ma e ial in laye s wi h a needle ip o build
up a 4 mm hickness esin block.
Each laye is no mo e han 2 mm hick,
and ligh cu e o 10 s.
Abb e ia ions: HEMA, 2-Hyd oxye hyl Me hac yla e; Bis-GMA, bisphenol A diglycidyl me hac yla e; TEGDMA,
ie hylene glycol dime hac yla e; S-PRG, su ace p e- eac ed glass-ionome ; UDMA, u e hane dime hac yla e.
Resin composi e samples we e p epa ed using a ci cula bipa i e Te lon mold
(10.0 mm diame e
×
1.0 mm hick) placed on op o a glass slide and analyzed using
J. Func . Bioma e . 2024,15, 379 4 o 18
a Fou ie ans o m in a ed (FTIR) JASCO 6200 (Jasco Inc., Eas on, MD, USA) spec ome e
equipped wi h a diamond- ip a enua ed o al e lec ion (ATR) accesso y (ATR P o ONE;
Jasco Inc.). The samples we e placed on he ATR glass holde , co e ing he su ace be o e
and a e polyme iza ion. All spec a we e acqui ed in abso bance mode be ween 600 and
4000cm
−1
spec al ange, wi h a esolu ion o 2cm
−1
and 124 scan accumula ions. Th ee
samples o each uncu ed adhesi e/composi e ma e ial we e analyzed.
The DC alues we e calcula ed by de e mining he a ea a io o he abso bance
alipha ic C=C a 1638 cm
−1
and he in e nal e e ence peak o a oma ic C=C a
1608 cm
−1
[
15
]. A egion o he spec a be ween 1590 and 1660 cm
−1
was selec ed and
baseline co ec ed; a e spec ome ic analyses, he DC was calcula ed as ollows:
DC (%)a ea = [1−Cu ed C =C 1638 cm−1/Cu ed C =C 1608 cm−1
Uncu ed C =C 1638 cm−1/Uncu ed C =C 1608 cm−1]×100
The a ea peak alues we e esol ed using cu e- i ing so wa e Peak i 4.12 (Sys a
So wa e, Chicago, IL, USA). The second de i a i e me hod was u ilized o he measu e-
men s o each peak wi hin he spec al egion. The deg ee o smoo hing was se a 20%
(Sa i zky–Golay algo i hm), and a mixed Gaussian-Lo en zian unc ion was used o adjus
he peak p o iles (i.e., cu e shape and wid h). Cu e i ing was accep ed when
2
eached
alues up o 0.995.
2.3. Wa e So p ion and Solubili y
A me al mold (15.0
±
0.1 mm diame e , 1.0
±
0.1 mm hick) was used o p epa e
esin disks (n= 6), and a silicone ubbe mold (6.0
±
0.1 mm diame e , 1.0
±
0.1 mm hick)
was used o p oduce adhesi e disks (n= 6). The measu emen and calcula ion o wa e
so p ion (WS) and solubili y (SL) ollowed he guidelines speci ied in ISO 4049:2019 [
16
].
A e polyme iza ion, he samples we e p omp ly ans e ed o a desicca o and mo ed o
a p e-condi ioning o en se a 37
◦
C. All samples we e d ied in a silica gel desicca o o
22 h a 37
±
2
◦
C and 2 h a 23
±
2
◦
C. The samples unde wen weigh ings a 24 h in e als
un il a s able mass (m1) was achie ed, indica ed by a luc ua ion o less han 100
µ
g o e
24 h o 3 days. The dimensions o he samples we e assessed u ilizing a digi al calipe , wi h
alues ounded o he nea es 0.01 mm, and hese measu emen s we e used o calcula e he
olume (V: mm
3
) o each sample. Subsequen ly, he samples we e indi idually in oduced
in o he me ically sealed glass ials, each con aining 10 mL ( o adhesi e disk) and 20 mL
( o esin disk) o deionized wa e wi h a pH o 7.2, and main ained a a empe a u e o
37
◦
C. Following a s o age pe iod o 7 days, he ials we e emo ed om he o en and
allowed o equilib a e a ambien empe a u e o 20 min. The samples we e washed using
unning wa e and gen ly wiped using so abso ben pape . Subsequen ly, he samples
we e weighed using an analy ical balance, iden i ied as m2. A e a s o age pe iod o 7 days
a ambien condi ions, he samples we e subjec ed o a d ying p ocess wi hin a desicca o
ha con ained newly eplenished silica gel. As p e iously explained, he samples we e
weighed daily un il hey a ained a s able mass (m3). The mass measu ed a e he ini ial
desicca ion p ocess (m1) was used o compu e he mass a ia ion a egula in e als du ing
7 days o wa e s o age. The kine ics o wa e abso p ion du ing he en i e du a ion o
wa e s o age we e de e mined by plo ing changes in mass agains he s o age pe iod. WS
and solubili y SL alues we e de e mined du ing 7 days o wa e s o age. The calcula ions
we e pe o med using he o mulas WS = (m2−m3)/Vand SL = (m1−m3)/V[16].
2.4. Measu emen o Ion Release
The 7-day imme sing solu ions o adhesi es and esin disks om he SL es we e
used o measu e ion elease (n= 6). The imme sion solu ions (0.5 mL) we e examined
using an induc i ely coupled plasma-mass spec ome e (ICP-MS; 8900 T iple Quad upole,
Agilen Co p, San a Cla a, CA, USA) o quan i y he le els o B, Na, Al, Si, and S ions. This
analysis u ilized a p e-es ablished calib a ion cu e ha ela es he spec ome y alues o
he s anda d concen a ion o mul iple elemen s (XSTC-622; Seishin T ading, Kobe, Japan).
J. Func . Bioma e . 2024,15, 379 5 o 18
The elease o F ions was examined using an ion ch oma og aphy de ice (Dionex™ ICS
1600; The mo Fishe Scien i ic Inc., Wal ham, MA, USA) a ached o a high-speed anion
ch oma og aphy column (TSKgel gua d column Supe IC-AHS; Tosoh Co p., Tokyo, Japan).
To achie e pH s abiliza ion, 0.7 mM Na
2
CO
3
bu e (37991-13; Kan o Chemical, Tokyo,
Japan) was in oduced in o he solu ion. The calib a ion cu e was cons uc ed by dilu ing
he anion mixed s anda d solu ion (01849-96, Kan o Chemical, Tokyo, Japan) wi h ul apu e
wa e [17].
2.5. Mic o ensile Bond S eng h (µTBS) and Failu e Mode
Eigh y sound human mola s we e andomly selec ed o he
µ
TBS es , checking o
he absence o ca i ies, issu es, o ac u es using a s e eoscope (Mo icam 1080; Shimadzu
Co p., Kyo o, Japan). Fla , occlusal den in su aces we e exposed using a gypsum model
imme (Model T imme MT 10; J. Mo i a MFG. Co p., Tokyo, Japan) unde wa e coolan .
The su aces we e hen checked wi h a s e eoscope o ensu e no enamel was emaining
on he su aces. The smea laye was s anda dized o 60 s using 600-g i silicon ca bide
pape (Fuji S a Type DDC, Sankyo Rikagaku Co., Sai ama, Japan) unde high- lowing
wa e polishing. Then, hey we e andomly di ided in o i e g oups acco ding o he
den al adhesi es: Beau ibond X eme (BBX), Modi ied Adhesi e 1 (E-BBX1), Modi ied
Adhesi e 2 (E-BBX2), FL-Bond II (FBII), silica-con aining adhesi e (E-FBII), which we e
applied ollowing he manu ac u e ’s ins uc ions (Table 1). Each bonded g oup (n= 16)
was u he di ided in o wo subg oups (n= 8) acco ding o he lowable esin composi e
used (Beau i il Flow Plus F00 [BFP] and silica-con aining lowable esin composi e [E-
BFP]). Each lowable esin composi e was applied inc emen ally (1 mm inc emen ) on
den in su aces o build up he esin blocks (4 mm hick) and ligh -cu ed wi h a blue
LED ligh -cu ing uni (G-Ligh P ima-II Plus; GC Co po a ion, Tokyo, Japan) wi h ligh
i adiance o 1200 mW/cm
2
. Acco ding o he manu ac u e ’s ins uc ions, when UAs
we e u ilized, he cu ing ime was 5 s, and he cu ing ime o he bonding esin o he
wo-s ep sel -e ch adhesi es was 10 s. The lowable esin composi e was ligh -cu ed o
10 s pe laye . The
µ
TBS es ollowed he Academy o Den al Ma e ials’ ecommenda ions
o he non- immed
µ
TBS es ing [
18
]. A e 24 h (24 h) o s o age in dis illed wa e a
37
◦
C, all ee h unde wen longi udinal sec ioning in wo pe pendicula di ec ions ac oss
he bonded in e ace. A low-speed diamond saw (Isome
®
1000; Buehle L d., Lake Blu ,
IL, USA) wi h wa e cooling was used o his p ocedu e, esul ing in beam s icks wi h a
c oss-sec ional a ea o abou 1 mm
2
. Following he sec ioning p ocedu e, hal o he beams
we e immedia ely subjec ed o es ing, while he o he hal we e s o ed o 6 mon hs (6 m) in
dis illed wa e a 37
◦
C. Acco ding o he speci ied s o age pe iod (24 h o 6 m), each beam
was ixed o a jig u ilizing a cyanoac yla e glue (Model Repai II Blue; Den sply-Sankin,
Tokyo, Japan) ins alled in a able op es ing machine (EZ-S es ; Shimadzu Co p., Tokyo,
Japan) o be es ed unde ension a a 1.0 mm/min c osshead speed. The bond s eng h
alue o each beam was calcula ed and exp essed in megapascals (MPa). Then, he mean
o he bond s eng h ob ained om all beams in each oo h was calcula ed, and “ oo h”
was used as he s a is ical measu e. The ac u ed beams we e obse ed wi h a s e eoscope
equipped wi h a digi al came a sys em (Mo icam 1080; Shimadzu Co p., Tokyo, Japan)
a a magni ica ion o 100
×
. Failu e modes we e ca ego ized as ollows: Adhesi e ailu e
(A): ailu e ha ook place in he adhesi e a ea; cohesi e ailu e in esin composi e (CC):
ailu e ha occu ed wi hin he esin composi e; cohesi e ailu e in den in (CD): ailu e
ha occu ed wi hin den in; and mixed ailu e (M): ailu e om he adhesi e in o esin
composi e and/o den in a ea [
9
]. Addi ionally, ep esen a i e beams, a e ac u e, om
each g oup (n= 24) we e placed on aluminum s ubs, and spu e -coa ed o 120 s wi h
P -Pd using an ion spu e ing machine (E-1030; Hi achi L d., Tokyo, Japan). The ac u ed
su aces we e obse ed using a ield emission scanning elec on mic oscope (SEM; S-4800,
Hi achi L d., Tokyo, Japan) a an accele a ing ol age o 10 kV.
Figu e 1illus a es he adhesi es’ and esin composi es’ sample p epa a ion o each
es ing me hod.
J. Func . Bioma e . 2024,15, 379 6 o 18
J. Func . Bioma e . 2024, 15, x FOR PEER REVIEW 6 o 21
µTBS es ollowed he Academy o Den al Ma e ials’ ecommenda ions o he non-
immed µTBS es ing [18]. A e 24 h (24 h) o s o age in dis illed wa e a 37 °C, all ee h
unde wen longi udinal sec ioning in wo pe pendicula di ec ions ac oss he bonded in-
e ace. A low-speed diamond saw (Isome ® 1000; Buehle L d., Lake Bluff, IL, USA) wi h
wa e cooling was used o his p ocedu e, esul ing in beam s icks wi h a c oss-sec ional
a ea o abou 1 mm2. Following he sec ioning p ocedu e, hal o he beams we e immedi-
a ely subjec ed o es ing, while he o he hal we e s o ed o 6 mon hs (6 m) in dis illed
wa e a 37 °C. Acco ding o he specified s o age pe iod (24 h o 6 m), each beam was
fixed o a jig u ilizing a cyanoac yla e glue (Model Repai II Blue; Den sply-Sankin, Tokyo,
Japan) ins alled in a able op es ing machine (EZ-S es ; Shimadzu Co p., Tokyo, Japan)
o be es ed unde ension a a 1.0 mm/min c osshead speed. The bond s eng h alue o
each beam was calcula ed and exp essed in megapascals (MPa). Then, he mean o he
bond s eng h ob ained om all beams in each oo h was calcula ed, and “ oo h” was used
as he s a is ical measu e. The ac u ed beams we e obse ed wi h a s e eoscope
equipped wi h a digi al came a sys em (Mo icam 1080; Shimadzu Co p., Tokyo, Japan) a
a magnifica ion o 100×. Failu e modes we e ca ego ized as ollows: Adhesi e ailu e (A):
ailu e ha ook place in he adhesi e a ea; cohesi e ailu e in esin composi e (CC): ail-
u e ha occu ed wi hin he esin composi e; cohesi e ailu e in den in (CD): ailu e ha
occu ed wi hin den in; and mixed ailu e (M): ailu e om he adhesi e in o esin com-
posi e and/o den in a ea [9]. Addi ionally, ep esen a i e beams, a e ac u e, om each
g oup (n = 24) we e placed on aluminum s ubs, and spue -coa ed o 120 s wi h P -Pd
using an ion spue ing machine (E-1030; Hi achi L d., Tokyo, Japan). The ac u ed su -
aces we e obse ed using a field emission scanning elec on mic oscope (SEM; S-4800,
Hi achi L d., Tokyo, Japan) a an accele a ing ol age o 10 kV.
Figu e 1 illus a es he adhesi es’ and esin composi es’ sample p epa a ion o each
es ing me hod.
Figu e 1. Schema ic illus a ion o sample p epa a ion o adhesi es and esin composi es o he
measu emen o deg ee o con e sion, wa e so p ion and solubili y, ions elease, mic o ensile bond
s eng h o den in, and ailu e mode.
Figu e 1. Schema ic illus a ion o sample p epa a ion o adhesi es and esin composi es o he
measu emen o deg ee o con e sion, wa e so p ion and solubili y, ions elease, mic o ensile bond
s eng h o den in, and ailu e mode.
2.6. S a is ical Analysis
All da a we e es ed o no mali y using he Shapi o–Wilk and homogenei y o a i-
ance using Le ene’s es s. The le el o signi icance was se a
α
= 0.05. The DC (%) da a
we e no mally dis ibu ed (p
≥
0.05), and he a iance was homogenous (p
≥
0.05); he e-
o e, a one-way ANOVA and independen sample - es we e pe o med o he adhesi es
and esin composi es. Pos hoc mul iple compa isons we e pe o med using he Bon e oni
es . As he WS, SL, and ion elease da e o he adhesi es and esin composi es we e no
no mally dis ibu ed, he K uskal–Wallis and Mann–Whi ney U es s we e conduc ed,
ollowed by pos hoc mul iple compa isons wi h a Bon e oni adjus men . Since he
µ
TBS
da a we e no mally dis ibu ed (p= 0.056) and he a iance was homogenous (p= 0.493),
he subsequen analyses we e ca ied ou using a h ee-way ANOVA ( ac o s: adhesi es,
composi es, and s o age pe iod) and Sidak pos hoc es s. The s a is ical analysis was con-
duc ed using he s a is ical so wa e package o medical science (SPSS Ve .27 o Windows,
SPSS Inc., Chicago, IL, USA).
3. Resul s
3.1. Deg ee o Con e sion
Table 2and Figu e 2desc ibe he DC o adhesi e sys ems and esin composi es. A
signi ican di e ence in he DC o adhesi es was obse ed (p= 0.011). E-BBX2 showed
he lowes DC (82.63
±
1.65%), which was in e io o he highes DC p esen ed by BBX
(97.22
±
1.09%). No s a is ically signi ican di e ences we e ound be ween he DCs o
esin composi es (p= 0.68).
J. Func . Bioma e . 2024,15, 379 7 o 18
Table 2. Deg ee o con e sion (DC: %) exp essed as Mean (SD) o adhesi es sys ems and esin
composi es (n= 3).
Adhesi e Sys ems (Abb e ia ion) DC
BBX 97.22 (1.09) A
E-BBX1 93.34 (2.96) A,B
E-BBX2 82.63 (1.65) B
FBII 92.87 (5.40) A,B
E-FBII 87.62 (6.41) A,B
Resin Composi es (Abb e ia ion) DC
BFP 79.78 (1.27) a
E-BFP 74.72 (3.29) a
Di e en uppe case le e s indica e s a is ically signi ican di e ences be ween adhesi es (p< 0.05), and he same
lowe case le e s e e o s a is ically signi ican simila i y in esin composi es (p> 0.05). BBX; Beau iBond X eme;
E-BBX1: Modi ied Adhesi e 1; E-BBX2: Modi ied Adhesi e 2; FBII: FL-BOND II; E-FBII: Silica-con aining adhesi e;
BFP: BEAUTIFIL Flow Plus (F00); E-BFP: silica con aining lowable esin.
J. Func . Bioma e . 2024, 15, x FOR PEER REVIEW 8 o 21
Figu e 2. Cu e-fiing analysis o a e age spec a om adhesi es and esin composi e. A ea alues
o he wo e e ence peaks we e calcula ed: 1608 cm−1 (in e nal s anda d a oma ic ca bon double
bond, C=C) and 1638 cm−1 (me hac yla e C=C). (A) BBX; Beau iBond X eme; (B) E-BBX1: Modified
Adhesi e 1; (C) E-BBX2: Modified Adhesi e 2; (D) FBII: FL-BOND II; (E) E-FBII: Silica-con aining
adhesi e; (F) BFP: BEAUTIFIL Flow Plus (F00); (G) E-BFP: silica con aining flowable esin.
3.2. Wa e So p ion and Solubili y
The WS and SL alues (µg/mm3) measu ed o he adhesi es and esin composi es
es ed a e shown in Table 3. The WS alues o all adhesi es did no comply wi h he ISO
4049:2019 h eshold (≤40 µg/mm3). No significan diffe ences in WS we e de ec ed be-
ween BBX, E-BBX1, E-BBX2, and FBII (p > 0.05). E-FBII p oduced he lowes WS (64.37 ±
1.86 µg/mm3), and his alue was significan ly lowe han hose o BBX (165.70 ± 65.03
Figu e 2. Cu e- i ing analysis o a e age spec a om adhesi es and esin composi e. A ea alues
o he wo e e ence peaks we e calcula ed: 1608 cm
−1
(in e nal s anda d a oma ic ca bon double
bond, C=C) and 1638 cm
−1
(me hac yla e C=C). (A) BBX; Beau iBond X eme; (B) E-BBX1: Modi ied
Adhesi e 1; (C) E-BBX2: Modi ied Adhesi e 2; (D) FBII: FL-BOND II; (E) E-FBII: Silica-con aining
adhesi e; (F) BFP: BEAUTIFIL Flow Plus (F00); (G) E-BFP: silica con aining lowable esin.
J. Func . Bioma e . 2024,15, 379 8 o 18
3.2. Wa e So p ion and Solubili y
The WS and SL alues (
µ
g/mm
3
) measu ed o he adhesi es and esin compos-
i es es ed a e shown in Table 3. The WS alues o all adhesi es did no comply wi h
he ISO 4049:2019 h eshold (
≤
40
µ
g/mm
3
). No signi ican di e ences in WS we e de-
ec ed be ween BBX, E-BBX1, E-BBX2, and FBII (p> 0.05). E-FBII p oduced he lowes WS
(64.37
±
1.86
µ
g/mm
3
), and his alue was signi ican ly lowe han hose o BBX (165.70
±
65.03
µ
g/mm
3
), E-BBX1 (127.58
±
13.21
µ
g/mm
3
), and E-BBX2 (150.62
±
41.13
µ
g/mm
3
).
The SL alues o BBX, E-BBX1, and E-BBX2 also did no comply wi h ha ISO equi emen
(
≤
7.5
µ
g/mm
3
). The SL o FBII (4.73
±
1.76
µ
g/mm
3
) and E-FBII (4.06
±
1.41
µ
g/mm
3
)
we e signi ican ly lowe han hose o BBX (71.54
±
32.86
µ
g/mm
3
) and E-BBX1 (51.96
±
13.20
µ
g/mm
3
) (p< 0.05), bu hey did no show a signi ican di e ence compa ed o
E-BBX2 (71.17
±
9.46
µ
g/mm
3
). No signi ican di e ence in SL was de ec ed among BBX,
E-BBX1, and E-BBX2 (p> 0.05). The alues o WS and SL in bo h esins complied wi h he
ISO 4049:2019. The WS and SL o BFP (31.29
±
1.19
µ
g/mm
3
and 2.99
±
0.45
µ
g/mm
3
) a e
signi ican ly highe han hose o E-BFP (21.3 ±0.72 and 1.4 ±0.28 µg/mm3) (p< 0.05).
Table 3. Wa e so p ion (WS) and solubili y (SL) exp essed as Mean (SD) in (
µ
g/mm
3
) o adhesi es
sys ems and esin composi es (n= 6).
Adhesi e Sys ems WS SL
BBX 165.70 (65.03) A71.54 (32.86) A
E-BBX2 150.62 (41.13) A71.17 (9.46) A
E-BBX1 127.58 (13.21) A51.96 (13.20) AB
FBII 81.11 (3.27) AB 4.73 (1.76) B
E-FBII 64.37 (1.86) B4.06 (1.41) B
Resin Composi es WS SL
BFP 31.29 (1.19) a2.99 (0.45) a
E-BFP 21.30 (0.72) b1.40 (0.28) b
Di e en uppe case le e s in each column indica e signi ican di e ences be ween he adhesi e, and di e en
lowe case le e s indica e signi ican di e ence be ween esin composi es (p < 0.05). BBX; Beau iBond X eme;
E-BBX1: Modi ied Adhesi e 1; E-BBX2: Modi ied Adhesi e 2; FBII: FL-BOND II; E-FBII: Silica-con aining adhesi e;
BFP: BEAUTIFIL Flow Plus (F00); E-BFP: silica con aining lowable esin.
3.3. Measu emen o Ion Release
The esul s o ion elease om each ma e ial a e shown in Table 4. F ion was only
de ec ed in he ma e ials wi h S-PRG ille s (FBII [0.165
µ
g/mL] and BFP [0.575
µ
g/mL]).
FBII had a highe B ion elease han he o he adhesi es (p< 0.05), and a highe Si ion
elease han BBX and E-BBX1 (p< 0.05). E-BBX1 showed signi ican ly highe Na ion elease
han BBX (p< 0.05). The esin composi e BFP eleased mo e B, Si, S , and F ions han E-BFP
(p< 0.05). The concen a ions o Al ions we e all below he de ec ion limi (<0.01 µg/mL).
Table 4. Ion elease esul s a e exp essed as median (minimum/maximum) in
µ
g/mL o adhesi es
sys ems and esin composi es (n= 6).
Adhesi e Sys ems B Na Si S F
BBX 1.60000 B
(1.45000/2.64000)
2.06000 B
(1.67000/3.51000)
0.08700 C
(0.07000/0.20200)
0.00325
(0.00060/0.00350) <de ec ion limi B
E-BBX1 2.35000 B
(2.06000/2.55000)
3.27000 A
(2.89000/3.68000)
0.11950 BC
(0.08300/0.17600)
0.00390
(0.00240/0.00450) <de ec ion limi B
E-BBX2 2.22500 B
(1.81000/2.83000)
3.07500 A
(2.64000/4.01000)
0.13750 ABC
(0.10300/0.47300)
0.00285
(0.00260/0.00320) <de ec ion limi B
FBII 3.41500 A
(1.96000/4.04000)
2.67500 AB
(2.38000/3.20000)
0.55500 A
(0.47600/0.84500)
0.01005
(<de ec ion
limi /0.12000)
0.16500 A
(<de ec ion
limi /0.27000)
J. Func . Bioma e . 2024,15, 379 9 o 18
Table 4. Con .
Adhesi e Sys ems B Na Si S F
E-FBII 1.72000 B
(1.37000/2.97000)
2.53000 AB
(2.29000/3.25000)
0.40950 AB
(0.35200/0.70400)
0.00005
(<de ec ion
limi /0.10800)
<de ec ion limi B
Resin
Composi es B Na Si S F
BFP 3.53500 a
(3.1300/3.8300)
2.66000
(2.32000/3.31000)
0.46300 a
(0.30800/0.76300)
0.75900 a
(0.32600/1.53000)
0.57500 a
(0.30000/1.00000)
E-BFP 1.57500 b
(0.60500/1.94000)
2.24500
(0.87900/2.74000)
0.25300 b
(0.12500/0.43600)
0.00205 b
(0.00100/0.00280) <de ec ion limi b
The concen a ions o Al ions we e all below he de ec ion limi (<0.01
µ
g/mL). Di e en uppe case/lowe case
le e s in each column indica e signi ican di e ences among he adhesi es/ esin composi es (p< 0.05). BBX;
Beau iBond X eme; E-BBX1: Modi ied Adhesi e 1; E-BBX2: Modi ied Adhesi e 2; FBII: FL-BOND II; E-FBII:
Silica-con aining adhesi e; BFP: BEAUTIFIL Flow Plus (F00); E-BFP: silica con aining lowable esin.
3.4. µTBS and F ac u e Mode
The
µ
TBS esul s a e shown in Table 5. A h ee-way ANOVA e ealed signi ican main
e ec s o adhesi e (F = 2.803, p= 0.028), s o age pe iod (F = 10.113, p= 0.002), and composi e
(F = 18.865, p< 0.001) on he bond s eng h. Howe e , he in e ac ion o hese h ee ac o s
was no s a is ically signi ican (F = 1.949; p= 0.106). Fu he mo e, s a is ically signi ican
in e ac ions we e ound be ween s o age pe iod and composi es (F = 12.764, p< 0.001).
Simple main e ec s analyses showed ha he 24 h
µ
TBS o BFP used wi h all adhesi es was
signi ican ly highe han ha o E-BFP (p< 0.001), bu hey did no s a is ically di e a e
6 m o s o age (p> 0.05). The highes bond s eng h esul s we e p oduced when BFP was
used o es o e he ee h ega dless o he adhesi e u ilized a 24 h es ing (p< 0.05). The
µ
TBS o BFP u ilized wi h E-BBX1, E-BBX2, and FBII was signi ican ly educed a e 6 m o
wa e s o age (p< 0.001). Pai wise compa isons showed ha a 24 h, E-BBX1 and E-BBX2
es o ed wi h BFP [50.61
±
10.10 MPa and 49.73
±
7.42 MPa, espec i ely] showed highe
bond s eng hs han hose es o ed wi h E-BFP (p< 0.001 and p= 0.006, espec i ely).
Table 5. Mic o ensile bond s eng h (
µ
TBS) is exp essed as Mean (SD) in MPa (n= 8). Fo each
adhesi e sys em, wo di e en es o a i e esin composi es we e es ed a e 24 h and 6 mon hs o
s o age in dis illed wa e .
Adhesi e Sys em Resin Composi e 24 h 6 Mon hs
BBX BFP 42.37 (4.60) Aa1 41.72 (3.24) Aa1
E-BFP 35.38 (4.12) Aa1 35.87 (11.19) Aa1
E-BBX1 BFP 50.61 (10.10) Aa1 39.65 (6.66) Ba1
E-BFP 36.15 (5.04) Ab1 41.39 (9.86) Aa1
E-BBX2 BFP 49.73 (7.42) Aa1 40.17 (7.32) Ba1
E-BFP 39.91 (4.01) Ab1 39.59 (4.94) Aa1
FBII BFP 50.60 (8.41) Aa1 35.35 (5.02) Ba1
E-BFP 44.24 (5.42) Aa1 41.99 (5.59) Aa1
E-FBII BFP 42.55 (8.04) Aa1 41.06 (8.71) Aa1
E-BFP 35.73 (6.42) Aa1 34.77 (8.87) Aa1
Di e en uppe case le e s indica e signi ican di e ences be ween 24 h and 6 m) o he same adhesi e- esin
combina ion (p< 0.05); di e en lowe case le e s indica e signi ican di e ences be ween esin composi es wi hin
each column (24 h o 6 m) o he same adhesi e (p< 0.05); di e en numbe s indica e signi ican di e ences
be ween adhesi es wi hin each column o he same esin composi e (p< 0.05). BBX; Beau iBond X eme; E-BBX1:
Modi ied Adhesi e 1; E-BBX2: Modi ied Adhesi e 2; FBII: FL-BOND II; E-FBII: Silica-con aining adhesi e; BFP:
BEAUTIFIL Flow Plus (F00); E-BFP: silica con aining lowable esin.
J. Func . Bioma e . 2024,15, 379 16 o 18
Funding: This s udy was pa ially suppo ed by Japanese Science and Technology Agency: JST
SPRING (G an Numbe JPMJSP2119); Japan Socie y o he P omo ion o Science: JSPS Kakenhi G an
Numbe JP24K12924, and he Eu opean Regional De elopmen Fund (ERDF)—Nex Gene a ion/EU
p og am.
Ins i u ional Re iew Boa d S a emen : The s udy was conduc ed in acco dance wi h he Decla a ion
o Helsinki, and app o ed by he Ins i u ional Re iew Boa d o Hokkaido Uni e si y Hospi al E hics
Commi ee (p o ocol code 2018/09 and da e o app o al 1 Feb ua y 2019).
In o med Consen S a emen : In o med consen was ob ained om all subjec s in ol ed in he s udy.
Da a A ailabili y S a emen : The o iginal con ibu ions p esen ed in he s udy a e included in he
a icle, u he inqui ies can be di ec ed o he co esponding au ho .
Acknowledgmen s: The au ho s acknowledge SHOFU Inc. o p o iding he ma e ials and he
Global Facili y Cen e (GFC, Hokkaido Uni e si y) o hei echnical suppo .
Con lic s o In e es : The au ho s decla e no con lic s o in e es .
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