A new X-ray diffractometer
for the online monitoring
of epitaxial processes
Der Fakult¨at f¨ur Naturwissenschaften
der Universit¨at Paderborn
zur Erlangung des akademischen Grades eines
Doktors der Naturwissenschaften (Dr. rer. nat.)
vorgelegte
Dissertation
von
Alexander Kharchenko
Paderborn, July 2003
Abstract
In this thesis I present an in situ X-ray diffractometer for X-ray diffraction analysis
of epitaxial layers during metal-organic chemical vapor deposition. The conception of
the in situ X-ray diffractometer, the model of data interpretation and the description
of the experimental setup are given in detail. The diffractometer has been constructed
and tested under laboratory conditions with wurtzite type AlGaN- and InGaN-based
materials. The results of tests show that the diffractometer allows to perform X-ray
diffraction measurements under conditions present in a metal-organic chemical vapor
deposition reactor and to obtain accurate information about the composition and relative
thickness (growth rate) of epitaxial layers. The results of measurements have been
compared with the results obtained by conventional high resolution X-ray diffractometer
and perfect agreement has been reached.
The diffractometer has been developed without a goniometer stage. It is not sen-
sitive to precise alignment of the samples before measurements and it has very short
data collection time (up to factor 100 less than by standard diffractometers). These
additional features of the X-ray diffractometer makes it well suited for extremely fast
post-growth diagnostics of multilayer semiconductor structures. This potential of the
diffractometer has been tested with different materials systems which are important
in the semiconductor industry today, namely wurtzite AlGaN single heterostructures,
wurtzite InGaN-based multiple quantum wells and SiGe heterostructures. The measure-
ments of the line scans as well as of reciprocal space maps are presented and analyzed
in terms of composition, periodicity of the multilayers and status of strain. All results
are in good agreement with the results obtained by conventional high resolution X-ray
diffraction.
Contents
1 Introduction 1
2 Some important aspects of high resolution X-ray diffraction 3
2.1 High resolution X-ray diffraction in real and reciprocal space . . . . . . . 3
2.2 Theory of X-ray diffraction . . . . . . . . . . . . . . . . . . . . . . . . . . 4
2.3 Use of reciprocal space mapping for evaluation of strain status . . . . . . 5
2.4 Use of reciprocal space mapping for determination of chemical composition 7
3 Conception of an in situ X-ray diffractometer 11
3.1 Requirements for IXRD and basic principles of an IXRD ........ 11
3.2 IXRD in terms of reciprocal space . . . . . . . . . . . . . . . . . . . . . 13
3.3 Interpretation of measurements with IXRD ................ 18
3.3.1 Choice of suitable diffraction geometry . . . . . . . . . . . . . . . 18
3.3.2 Determination of the vertical lattice parameter of crystalline struc-
tures.................................. 19
3.3.3 Determination of the lateral lattice parameter of crystalline struc-
tures.................................. 21
4 Experimental setup of IXRD 23
4.1 Experimental setup for laboratory tests . . . . . . . . . . . . . . . . . . . 23
4.2 Test of the optical properties of the Johansson monochromator . . . . . . 25
4.3 Performance test of the IXRD ....................... 28
5 Results of experiments under laboratory conditions 31
5.1 Use of the IXRD for fast ex situ characterization . . . . . . . . . . . . . . 31
5.1.1 Characterization of wurtzite AlGaN-, InGaN-based materials . . . 31
5.1.2 Measurements on SiGe . . . . . . . . . . . . . . . . . . . . . . . . 35
5.1.3 Fast reciprocal space mapping . . . . . . . . . . . . . . . . . . . . 37
i
ii Contents
5.2 Measurements under conditions in a MOCVD reactor . . . . . . . . . . . 42
5.2.1 Measurement conditions and principles of data collection . . . . . 42
5.2.2 Results of measurements. Detection and resolution limits of the
IXRD ................................. 44
6 Conclusions 51
A Lattice parameters and stiffness coefficients of relevant materials 53
B Examples of the evaluation of the IXRD spectra 55
Bibliography 58
List of Figures
2.1 Sketch of the diffraction geometry . . . . . . . . . . . . . . . . . . . . . . 4
2.2 The effect of strain on the asymmetrical reciprocal space maps . . . . . . 6
3.1 The principle of Johansson monochromator . . . . . . . . . . . . . . . . . 12
3.2 The geometry of the IXRD setup in real and reciprocal space . . . . . . . 14
3.3 The geometry of the IXRD setup in real and reciprocal space for two
measurementpoints.............................. 15
3.4 Illustration of measurement principles of the IXRD setup . . . . . . . . . 17
3.5 Sketch of reciprocal space for a crystalline structure . . . . . . . . . . . . 19
4.1 Experimental setup of the IXRD for measurements under laboratory con-
ditions..................................... 24
4.2 The arrangement of the setup for the investigation of the optical properties
of the Johansson monochromator . . . . . . . . . . . . . . . . . . . . . . 25
4.3 The distribution of intensity measured at different positions of the narrow
slit in front of the monochromator . . . . . . . . . . . . . . . . . . . . . . 27
4.4 The intensity diffracted from the Johansson monochromator plotted ver-
sus relative detection angle ∆ε........................ 28
4.5 Comparison of spectra measured by the IXRD setup and spectra extracted
from high resolution reciprocal space maps . . . . . . . . . . . . . . . . . 30
5.1 Sketch of the vertical layer structure of AlGaN/GaN single heterostructures 32
5.2 The spectra from AlGaN/GaN single heterostructures collected on the
IXRD and measured with the standard high resolution equipment . . . . 33
5.3 Schematic illustration of the vertical structures of tested InGaN/GaN mul-
tiplequantumwells.............................. 34
5.4 X-ray diffraction patterns of two different InGaN/GaN multiple quantum
wells measured by the IXRD and by the high resolution equipment . . . 35
5.5 Schematic illustration of the vertical structure of SiGe/Si sample . . . . . 36
iii
iv List of Figures
5.6 X-ray diffraction patterns of SiGe/Si measured by the IXRD and by the
high resolution X-ray diffractometer . . . . . . . . . . . . . . . . . . . . . 37
5.7 The procedure of reciprocal space mapping with the IXRD . . . . . . . . 38
5.8 The contours of constant scattered intensity of single heterostructures
measured by the IXRD and collected on the high resolution diffractometer 39
5.9 The reciprocal space maps from multiple quantum wells measured by the
IXRD and by X’Pert MRD diffractometer . . . . . . . . . . . . . . . . . 40
5.10 The (224) reciprocal space maps of SiGe/Si collected by the IXRD and
by the X’Pert MRD diffractometer . . . . . . . . . . . . . . . . . . . . . 42
5.11 The principle of X-ray measurement from rotating and wobbling sample . 44
5.12 X-ray spectra measured by the IXRD from rotating and wobbling In-
GaN/GaN and AlGaN/GaN samples . . . . . . . . . . . . . . . . . . . . 45
5.13 The spectra collected by the IXRD and by the X’Pert MRD from thin
InGaN and AlGaN layers grown on GaN . . . . . . . . . . . . . . . . . . 46
5.14 Dependence of full width at half maximum of the InGaN and AlGaN
peaks on inverse layer thicknesses . . . . . . . . . . . . . . . . . . . . . . 47
5.15 The resolution of the IXRD for the control of the chemical composition
oftheInGaNlayers.............................. 49
5.16 The resolution of the IXRD for the control of the chemical composition
oftheAlGaNlayers.............................. 50
B.1 The diffraction spectrum of AlGaN/GaN single heterostructure taken on
theIXRD ................................... 56
B.2 Measurement result of SiGe/Si sample . . . . . . . . . . . . . . . . . . . 57
List of Tables
3.1 Parameters cos(γ−β)/cos β,tanβ and structure factor Ffor some re-
flectionsofh-GaN............................... 20
3.2 Suitable reflections of some ”substrate crystals” for the determination of
the vertical lattice parameter of multilayer structures . . . . . . . . . . . 21
3.3 Parameters cos(γ−β)/sin β,cotβ and structure factor Ffor some re-
flectionsofh-GaN............................... 21
3.4 Suitable reflections of some ”substrate crystals” for the determination of
the vertical lattice parameter of multilayer structures . . . . . . . . . . . 22
A.1 Lattice a0, c0and stiffness C11, C13 constants for hexagonal GaN, InN and
AlN. ...................................... 53
A.2 Lattice a0, c0and stiffness C11, C12 constants for cubic Si and Ge. . . . . 53
v
vi List of Tables
1 Introduction
The importance of semiconductor structures for the fabrication of devices in electron-
ics and optoelectronics is obvious. Today, billions of transistors, LEDs and sensors are
manufactured weekly. Generally, the growth of semiconductor multilayer structures are
realized by metal-organic chemical vapor deposition (MOCVD) or molecular-beam epi-
taxy (MBE). The technological process of growth demands methods for characterization
and quality control. X-ray diffraction remains one of the important methods of charac-
terization because it is non-destructive, informative and has clear interpretation. Since
the discovery of X-rays in 1895 by Wilhelm Conrad Roentgen and the discovery of X-ray
diffraction by Max von Laue in 1912, X-ray diffraction has been developed into a powerful
tool for investigation of semiconductor materials. Nowadays, novel X-ray diffractome-
ters equipped with high power sources and high efficiency monochromators, detectors
and analysers are being produced in a large amount. They provide access to impor-
tant parameters of semiconductors such as composition, strain, thickness and structural
quality. There exist a huge amount of experimental and theoretical papers about the
X-ray analysis of different kinds of semiconductor materials, however, most of them are
dealing with post-growth characterization (see for instance reviews on high resolution
X-ray diffraction [1], [2]), i.e. X-ray measurements are performed after the growth of
the samples. Yet in situ characterization techniques are highly demanded especially for
the MOCVD technology, because high ambient pressure preclude the use of electron
diffraction, which is already well established for online monitoring of the MBE growth.
Furthermore, X-ray diffraction is attractive as in situ technique because of the simple
procedure of data interpretation. From the angular positions and shapes of diffraction
peaks the structural information becomes easily available.
Only a few experimental X-ray investigations of semiconductors during the growth
process have been reported ([3], [4], [5], [6], [7], [8], [9], [10], [11]). However, they all
were carried out with synchrotron radiation where a specially designed growth chamber
was brought to synchrotron sources. It is obvious that such studies are not applicable
to most commercial and scientific MOCVD reactors. The intention of this work was to
construct an in situ X-ray diffractometer (IXRD) which is suited for X-ray diffraction
1
21 Introduction
analysis of semiconductor layers during MOCVD growth. The apparatus has been built
and tested under laboratory conditions. The results of the tests show that our in situ
X-ray diffractometer fulfills all requirements which are important for an analysis of epi-
taxial layers during MOCVD growth: (1) no synchrotron radiation is needed for X-ray
measurements; (2) no parts of the diffractometer are necessary inside the growth reac-
tor; (3) the setup is able to collect X-ray patterns from rotating and wobbling samples;
(4) the data collection time from rotating samples is in the order of one minute and
corresponds to the deposition time of a 10 nm thick layer. Furthermore, the short data
collection time (about 100 times less than with commercially available diffractometers)
and the ability to measure X-ray diffraction without precise adjustment of the sample
makes the equipment also well suited for extremely fast post-growth characterization of
multilayer structures.
The thesis is organized as follows. Chapter 2 describes some important aspects of high
resolution X-ray diffraction. The conception of a new IXRD is introduced in chapter 3.
Chapter 4 describes the details of the experimental setup. Then I will proceed with chap-
ter 5 where I show the results of tests of the IXRD for fast post-growth characterization
as well as the results of measurements under conditions similar to those in a MOCVD
reactor. Finally, the main conclusions are given in chapter 6.
2 Some important aspects of high
resolution X-ray diffraction
2.1 High resolution X-ray diffraction in real and
reciprocal space
Bragg formulated [12] the condition of diffraction of X-rays by a periodic arrangement
of atoms in a solid state crystal:
2·dhkl ·sin(ΘB) = n·λ(2.1)
where dhkl is the spacing between lattice planes with Miller indices (hkl), ΘBis the
Bragg angle and λis the wavelength of X-rays.
It is a convenient and common way to describe X-ray diffraction in reciprocal space.
The reciprocal lattice is formed by the terminal points of reciprocal repetition vectors
~
b1,~
b2and ~
b3which are related to the primitive vectors of crystal lattice ~a1,~a2and ~a3by:
~
bi= 2 ·π·~aj×~ak
~a1·(~a2×~a3), i, j, k cycl. (2.2)
In reciprocal space the plane with Miller indices (hkl) is described by the reciprocal
vector which is given by:
~
Ghkl =h·~
b1+k·~
b2+l·~
b3(2.3)
The condition of diffraction 2.1 by the plane (hkl) can be reformulated in reciprocal
space (see for example [13]) in the form:
~
Q=~
Ghkl (2.4)
3
42 Some important aspects of high resolution X-ray diffraction
~
Qis the scattering vector defined as ~
Q=~
kε−~
kδwhere ~
kδand ~
kεare the wave vectors
of incident and diffracted waves as indicated in figure 2.1.
Figure 2.1: Sketch of the diffraction geometry. The exact Bragg condition for
(hkl) planes is fulfilled, if the end of scattering vector ~
Qends at a reciprocal
lattice point (hkl).
Thus in reciprocal space the diffraction plane is represented as a reciprocal lattice
point and the diffraction geometry defined by the incident and by the detection angles
is represented by the scattering vector. When the scattering vector ends at a reciprocal
lattice point (hkl) the exact Bragg condition is satisfied. Scattered X-ray intensity
around a reciprocal lattice point (RLP) is strongly influenced by the structural properties
of crystalline material. Therefore, the measurement and detailed analysis of diffracted
intensity around reciprocal lattice points is the subject of high resolution diffractometry.
The variation of incident and detection angles allows to scan scattered intensity around
the reciprocal lattice point. Depending on the required information the analysis of one
or two dimensional projections of the intensity distribution around reciprocal lattice
points is performed. Usually these are ω−2Θ, ωscans [1] or two dimensional intensity
distributions of reciprocal lattice points which are called reciprocal space maps.
2.2 Theory of X-ray diffraction
Generally there are two possible ways for the theoretical description of X-ray diffraction
in crystals which depend on the methods for representing a crystalline structure. In the
first method, the calculation of X-ray diffraction is performed by the summation of the
scattered intensity from separate atoms (see for example [13], [14]). In this case the
2.3 Use of reciprocal space mapping for evaluation of strain status 5
scattered intensity is proportional to the square of the structure factor given by:
F=Xfj·exp(i~
Q~
Rj) (2.5)
where fjare the atomic scattering factors and summation is performed over all atoms
in the unit cell. The theory of X-ray diffraction in such a form usually completely
neglects the dynamical effects of X-ray diffraction which is the multiple scattering effect
(extinction). For this reason it is called kinematical theory and it is not valid for a highly
perfect type of crystals. The dynamical effects have been taken into account only in the
theory of Darwin developed in 1914 [15].
In the second alternative formalism which has been proposed by Ewald [16] and Laue
[17] the X-ray diffraction theory involves the solution of the Maxwell equations in a
medium with a periodic dielectric function. In this case the electromagnetic field is rep-
resented by the Bloch functions and the dielectric constant is expressed by a Fourier
series. A general description of this theory can be found in [18]. The alternative descrip-
tion was developed by Takagi [19], [20] and Taupin [21] where the solution is represented
by Bloch functions with constant phases and with slowly varying amplitudes. Both for-
malisms are widely used for the calculation of X-ray diffraction spectra. In this work, I
have used the Takagi-Taupin formalism for the simulation of X-ray patterns in multilayer
structures which is described in [22].
2.3 Use of reciprocal space mapping for evaluation of
strain status
The growth of an epitaxial film on a thick substrate causes the modification of the lattice
parameter of the epilayer in growth direction due to the strain. Let aSand cSbe the
lattice parameters of a substrate crystal in direction perpendicular and parallel to the
sample surface. a0,c0and a,care in-plane and perpendicular lattice parameters of bulk
and grown layer respectively. Depending on the lattice mismatch between substrate
and layer crystals, one distinguishes between compressive (a0> aS) and tensile strains
(a0< aS). The lattice parameter cis increased for compressive strain and decreased for
tensile strain. If the layer thickness is below a so-called critical thickness the growth is
pseudomorphic and the layer is fully strained on the substrate. With increasing layer
thickness the elastic energy increases. If the layer thickness is above its critical value,
misfit dislocations are formed and the layer starts to relax.
Reciprocal space mapping offers the unique possibility to perform detailed investiga-
62 Some important aspects of high resolution X-ray diffraction
tion of the relaxation process. In figure 2.2 a) a two dimensional projection of reciprocal
space in the (Qk, Q⊥) plane is shown where Qkand Q⊥are components of the reciprocal
vector which are parallel and perpendicular to the sample surface.
Figure 2.2: a) the effect of strain on the asymmetrical reciprocal space maps is
illustrated. The positions 1, 2, 3 of the reciprocal lattice point correspond to
the strained, partially relaxed and relaxed layer. b) a tilt of the layer causes a
shift of reciprocal lattice points and can lead to a wrong data interpretation.
The information on the layer tilt can be obtained from a symmetrical reciprocal
space map.
We consider (hkl) reflection for which l6= 0 and hor k6= 0, because for this case the
position of reciprocal lattice point depends on both in-plane and perpendicular lattice
parameters. Point S is the reciprocal lattice point of the substrate crystal. The points
1, 2 and 3 correspond to the reciprocal lattice point of layer which has different states of
strain. Below the critical thickness the layer is fully strained. This means that in-plane
lattice parameters of layer and substrate are identical (a=aS) and the vertical lattice
parameter of the layer increases (c > c0). In reciprocal space this corresponds to posi-
tion 1 of the RLP of the layer. Due to the relaxation the strain is relieved therefore the
in-plane constant of layer increases and the perpendicular constant decreases (position
2) until finally the bulk lattice parameters are reached (position 3). The position of the
2.4 Use of reciprocal space mapping for determination of chemical composition 7
reciprocal lattice point of the layer depends on the lattice parameter and therefore recip-
rocal space mapping is an ideal method for strain analysis. However, the measurement
of only one asymmetrical reflection can lead to a wrong interpretation due to a possible
crystallographic tilt of the lattice planes. In figure 2.2 b we demonstrate the situation
in reciprocal space where the positions of layer reflections are shown with and without
tilt. It is not possible to distinguish between effect of strain and tilt of the layer. One
possibility to identify the crystallographic tilt of the layer is to measure a symmetrical
reflection (00l). As shown in figure 2.2 b, in case of a symmetrical reciprocal space map
a tilt of the layer causes the deviation of RLPs from the vertical axis Q⊥. The tilt angle
ωT ILT which can be determined from the symmetrical reflection allows to separate the
effect of strain and tilt of the layer. Thus, measuring both asymmetrical (hkl) and sym-
metrical (00l) reflections the effect of strain and crystallographic tilt can be investigated
in detail.
2.4 Use of reciprocal space mapping for determination
of chemical composition of ternary compounds
Let us assume that a ternary epilayer AxB1−xCis deposited on a substrate S. The epilayer
is an alloy of the binary compounds AC and BC. We consider the general situation when
alloy AxB1−xChas arbitrary status of strain so that AxB1−xCcan be relaxed, partially
relaxed or strained. Compound AC and BC have in-plane and perpendicular lattice
parameters aAC,cAC and aBC,cBC , respectively. Our considerations will be valid for
two type of structures which are of importance in this work: zincblende structures with
tetragonal symmetry and wurtzite type structures with hexagonal symmetry. For the
cubic symmetry the in-plane and perpendicular lattice parameters should be assumed
identical. By measuring the symmetrical and asymmetrical reciprocal space maps we get
reliable information about in-plane and perpendicular lattice parameters of epilayer a
and ctaking into account the effect of a possible crystallographic tilt as described in the
previous section. a0,c0are lattice parameters of the relaxed AxB1−xCalloy, i.e., lattice
parameters of unstrained layer. We assume that there is a linear relationship between
lattice parameters of the relaxed alloy AxB1−xCand the lattice parameters of AC,BC
compounds and the composition x (Vegard’s law):
82 Some important aspects of high resolution X-ray diffraction
a0=x·aAC + (1 −x)·aBC
c0=x·cAC + (1 −x)·cBC
(2.6)
In order to find the relationship between relaxed lattice parameters a0,c0of AxB1−xC
alloy and measured lattice parameters aand cthe effect of strain has to be considered.
It can be described using the elasticity theory [23], [24]. The deformation state of a
crystal is described by the strain tensor εij which is related to the stress tensor σij by
the tensor of stiffness constants. In the case of biaxial strain, the stress normal to the
film vanishes and the following relation between strain in the growth direction and the
in-plane strain is obtained:
c−c0
c0
=−ν(x)·a−a0
a0
(2.7)
where ν(x) is Poisson’s ratio which is:
ν(x) = 2 ·C12(x)
C11(x)for tetragonal symmetry,
ν(x) = 2 ·C13(x)
C33(x)for hexagonal symmetry.
Cij are the elements of the tensor of the elastic moduli (stiffness constants) in Voigt’s
notation which depend on the composition x. The general assumption is a linear de-
pendence of stiffness constants on the composition x. The chemical composition x is
obtained by substitution of expressions 2.6 for a0and c0in 2.7. In case of a linear de-
pendence of stiffness constants on the composition x, this leads to an equation of degree
four for x. The solution is possible only by numerical methods.
In the first-order approximation used in [25] a linear relation for Poisson’s ratio is
applied:
ν(x) = x·νAC + (1 −x)·νBC (2.8)
In this case a cubic equation for x is obtained. As shown in [25], in this case the
analytical solution is straightforward following the formula of Abramowitz and Stegun.
There are three real solutions, but only one physically meaningful value of x exists.
2.4 Use of reciprocal space mapping for determination of chemical composition 9
If the elastic constants of two compounds AC and BC do not differ too much or if x
is close to zero or unity it is a good approximation to assume that the elastic moduli do
not vary with the chemical composition. Then substitution of 2.6 for a0and c0in 2.7
results in a quadratic equation:
Px2+Qx +R= 0 (2.9)
where
P=ν·∆a·∆c+ ∆a·∆c,
Q=ν·∆a·cBC −ν·δa ·∆c+ ∆c·aBC −∆a·δc,
R=−ν·δa ·cBC −δc ·aBC ,
and ∆a=aAC −aBC,∆c=cAC −cBC , δa =a−aBC, δc =c−cBC .
The solution for x is unique and is given by:
x=−Q−√Q2−4·P·R
2·P(2.10)
In this thesis we have measured semiconductor structures with ternary layers with a
mole fraction x of less than 0.25. Therefore approximation 2.9 has been used for the
calculation of the chemical composition. The lattice parameters and stiffness constants
for the relevant materials are given in appendix A.
10 2 Some important aspects of high resolution X-ray diffraction
3 Conception of an in situ X-ray
diffractometer for online monitoring
of the MOCVD growth process
3.1 Requirements for IXRD and basic principles of an
IXRD
As I have mentioned in the introduction, X-ray diffraction is a very promising tool for
online controlling of the MOCVD growth process. However, the application of X-ray
diffraction for in situ monitoring of the MOCVD growth process is a challenging task.
The measurement conditions are complicated due to the construction of the growth re-
actor and the conditions of growth so that they are not ordinary for standard X-ray
diffractometers. There are two ways for the solution of this problem. Previously, spe-
cially designed growth chambers have been developed and brought to the synchrotron
laboratories ([3]-[11]). The drawback of such a solution is obvious, in situ X-ray diffrac-
tometers can not be widely used for commercial as well as for scientific purposes.
The second solution is the development of a specially designed X-ray diffractometer
which can be installed on a MOCVD reactor. Knowing the construction of a MOCVD
reactor and the conditions of growth we formulate below the requirements for such an
in situ X-ray diffractometer:
•no parts of the diffractometer for adjustment and positioning of the samples should
be necessary inside the growth chamber. That allows to avoid any complications to
the construction of the MOCVD reactor and any disturbances of the growth pro-
cess. For the X-ray diffraction setup this means that IXRD should not be sensitive
to the precise alignment of the samples and should not require the positioning of
the samples during measurements;
11
12 3 Conception of an in situ X-ray diffractometer
•the IXRD has to be able to collect spectra from rotating and wobbling sam-
ples. This requirement is especially important, because samples are rotated during
MOCVD and wobbling of the samples can not be excluded during the growth
process;
•the setup should provide a data collection time which is at least comparable to the
typical deposition time of several nanometer thick layers in a MOCVD reactor.
The design of an IXRD setup is the goal of this thesis. The key features of our IXRD
are: i) the use of focused monochromatic X-ray beams impinging onto the sample instead
of a goniometer system and ii) to collect the diffracted X-rays by a multichannel detector.
To get focused monochromatic beams we use a Johansson monochromator. The princi-
ples of the Johansson monochromator are described in the original paper of T. Johansson
[26]. The diffracting planes of a crystal are bent with a radius 2R and the surface of the
crystal forms a cylinder with a radius R as indicated in figure 3.1.
Figure 3.1: The principle of the Johansson monochromator. The beams coming
from a X-ray source S are monochromized and focused at the point F by the
Johansson monochromator.
When the X-ray source is located at point S on the circle R which is usually called
Rowland circle, all beams strike the lattice planes of the crystal at the same angle. All
3.2 IXRD in terms of reciprocal space 13
reflected beams are focused at point F lying on the Rowland circle. Thus the Johansson
monochromator allows to get monochromatic and focused X-ray beams provided two
conditions are fulfilled. Firstly, X-ray source, monochromator crystal and sample are
placed on the Rowland circle. Secondly, the angle of incidence equals the Bragg angle of
the monochromator crystal. The second condition gives the relation between the radius
of the Rowland circle, Bragg angle and the distance between X-ray source and the center
of the monochromator:
D= 2 ·sin(ΘB)·R(3.1)
The sample to be investigated with the IXRD setup is placed at the focusing point F.
After diffraction the scattered X-rays are collected by a multichannel detector.
3.2 IXRD in terms of reciprocal space
The scattering geometry of IXRD in real space is schematically illustrated in figure 3.2
a. Here we have to distinguish between two important angles: incident angle δand
detection angle ε. Incident angle δis the angle between incident beam and the sample
surface. Detection angle εcorresponds to the angle between direction of the detection of
scattered intensity and the sample surface. The formation of the measurement point in
IXRD is indicated in figure 3.2 (a): the bunch of monochromatic X-rays with incident
angles between δand δ+ Ω strikes the sample. The scattered beams are measured by
one certain channel of a multichannel detector under a detection angle ε.
Figure 3.2 (b) shows the geometry of IXRD in reciprocal space. The beam with the
incident angle δand the beam with the detection angle εare described in reciprocal
space by the wave vectors ~
kδand ~
kε, respectively. Because the incident beams are
monochromatic and we are interested in an elastic scattering, the lengths of wave vectors
~
kδand ~
kεare the same. In reciprocal space the scattered intensity is plotted as a function
of the scattering vector which is defined as ~
Q=~
kε−~
kδ. In our setup one measurement
point is accomplished by the wave vector ~
kεand the endpoints of the incident wave vectors
between ~
kδand ~
kδ+Ω as indicated in figure 3.2 b. The corresponding scattering vectors
~
Qdescribe in reciprocal space a line depicted in figure 3.2 b as ”detection window”. The
construction in reciprocal space shows that the intensity measured by one channel of the
detector array is the sum of scattered intensity distributed in reciprocal space within the
”detection window”.
In figure 3.3 (a) we consider two different measurement points 1 and 2. The scattered
14 3 Conception of an in situ X-ray diffractometer
Figure 3.2: The geometry of the IXRD setup in real (a) and reciprocal (b)
space. One measurement point in the IXRD setup is described in angular space
by the certain detection angle εand by the bunch of incident waves with angular
aperture Ω. In reciprocal space this configuration corresponds to the line called
”detection window”.
intensity at two different channels which correspond to the detection angles ε1and ε2.
Figure 3.3 b demonstrates the situation in reciprocal space: the corresponding scatter-
ing vectors ~
Q1and ~
Q2describe lines ”detection window 1” and ”detection window 2”,
respectively. In this case, the intensities of measurement points 1 and 2 in IXRD setup
are the intensities distributed within ”detection window 1” and ”detection window 2”,
respectively. The centers of the ”detection windows” are located on the line shown in
3.2 IXRD in terms of reciprocal space 15
Figure 3.3: The geometry of the IXRD setup in real (a) and reciprocal (b) space
for two measurement points. The different measurement points are described in
angular space by the two different detection angles ε1and ε2. In reciprocal space
each measurement point can be associated with the line ”detection window”.
The direction of measurement in the IXRD setup is described by the line ”scan
direction”.
figure 3.3 b as ”scan direction”. This means that the change in the detection angle ε
results in a shift of the scattering vectors along the ”scan direction”.
In figure 3.4 a, b we show the measurement results of an AlGaN/GaN heterostructure
performed with the IXRD setup and the intensity distribution in reciprocal space mea-
sured by a conventional high resolution equipment. The X-ray intensity measured with
16 3 Conception of an in situ X-ray diffractometer
the IXRD setup is plotted as a function of the relative detection angle ∆ε. The zero
value of the ∆εangle is set to the position of the GaN peak. Each measurement point
in the IXRD setup can be associated with the ”detection window” in reciprocal space as
shown for two arbitrary points 1 and 2 in figure 3.4. The angular distance ∆εbetween
two points 1 and 2 in the IXRD spectrum is related to the distance ∆QIXRD along the
”scan direction” in reciprocal space.
The reciprocal space coordinates are related to the incident angle δand the detection
angle εby the following expressions:
Qx=2·π
λ·(cos(ε)−cos(δ))
Qz=2·π
λ·(sin(ε) + sin(δ)) (3.2)
Distance ∆QIXRD along the ”scan direction” is formed by keeping fixed the incident
angle δ=δoand varying the detection angle from εbr to εbr +∆εwhere εbr is the detection
angle corresponding to the Bragg reflection of GaN. Therefore ∆QIXRD corresponds to
the change of coordinates Qxand Qzby the values ∆Qxand ∆Qzwhich are given by:
∆Qx=2·π
λ·(cos(εbr + ∆ε)−cos(εbr))
∆Qz=2·π
λ·(sin(εbr + ∆ε)−sin(εbr))
If the relative detection angle ∆εis small we can use:
∆Qx=−2·π
λ·sin(εbr)·∆ε
∆Qz=2·π
λ·cos(εbr)·∆ε
The length ∆QIXRD is thus:
∆QIXRD =q∆Q2
x+ ∆Q2
z=2·π
λ·∆ε(3.3)
The expression 3.3 connects the angle between measurement points in the IXRD spec-
trum and the corresponding distance ∆QIXRD in reciprocal space along the ”scan direc-
tion”. It should be emphasized that the orientation of ”scan direction” and ”detection
window” in reciprocal space strongly depends on the diffraction geometry of the IXRD
setup. Therefore the information which can be obtained by the IXRD setup is different
for different scattering geometry. To find out the diffraction geometry which is suitable
for the determination of vertical and lateral lattice parameters, a model for the interpre-
tation of measurements with the IXRD setup will be developed in the next section.
3.2 IXRD in terms of reciprocal space 17
Figure 3.4: Illustration of measurement principles of the IXRD setup. a) inten-
sity measured by the IXRD setup plotted as a function of the relative detection
angle ∆ε, b) the intensity distribution in reciprocal space measured by a stan-
dard high resolution equipment. The relative detection angle ∆εis related to
the distance ∆QIXRD in reciprocal space along the ”scan direction”.
18 3 Conception of an in situ X-ray diffractometer
3.3 Interpretation of measurements with IXRD
3.3.1 Choice of suitable diffraction geometry
Our aim is to investigate a certain multilayer crystal structure with the IXRD setup. Let
us consider the general situation in reciprocal space shown in figure 3.5. We assume that
there is a crystal present in a multilayer structure which lattice parameters are known.
This means that we know the position of the reciprocal lattice point of this crystal in
reciprocal space. We will denote this crystal as a ”substrate crystal” and will use it as
a reference point in reciprocal space. The point ”S” is the center of distribution of the
intensity diffracted from this crystal.
For simplicity reasons we restrict ourselves to the consideration of only one reflection
”M” which is the result of scattering from a multilayer structure. It can be, for example, a
reflection from a crystalline layer included in a multilayer structure or a satellite peak of a
superlattice structure, etc. As full lines we depict the ”detection windows” corresponding
to different measurement points of the detector and the bold dashed line denotes the
”scan direction”.
As described in the previous section the IXRD setup provides information about the
distance ∆QIXRD. However, the distances between reflections along the Qzand Qxaxes
(hereafter vertical ∆Qzand lateral ∆Qxdistances, respectively) are required because
they provide access to the lateral and vertical lattice parameters of crystalline layers. In
case of a single layer, for example, they directly provide the lattice parameters parallel
and perpendicular to the sample surface. In case of a superlattice structure they yield the
average lattice parameter of barrier and well layers. Furthermore, in case of a periodical
structure the distances between reflections in Qzand Qxdirections can additionally
provide information about the periodicity of the structure.
Thus our aim is to find the vertical distance ∆Qzand the lateral distance ∆Qxusing
the distance ∆QIXRD which is measured with the IXRD setup. From geometrical con-
siderations we get the following relations between the vertical distance ∆Qz, the lateral
distance ∆Qx, and the distance ∆QIXRD:
∆Qz= ∆QIXRD ·cos(γ−β)
cos(β)+ ∆Qx·tan(β) (3.4)
3.3 Interpretation of measurements with IXRD 19
∆Qx=−∆QIXRD ·cos(γ−β)
sin(β)+ ∆Qz·cot(β) (3.5)
Figure 3.5: Sketch of reciprocal space for a crystalline structure. Points ”S”
and ”M” are the centers of diffraction from ”substrate crystal” and multilayer
structure, respectively.
where βand γare the angles given by:
β=π
2−δbr, γ =εbr
δbr and εbr are the incident and the detection angles for the exact Bragg diffraction of
the ”substrate crystal”. From equations 3.4 - 3.5 it follows that the relation between
the measured parameters ∆QIXRD and ∆Qz, ∆Qxdepends on the incident and on
the detection Bragg angles of the ”substrate crystal”. Therefore, for the ”substrate
crystal” the suitable reflections must be found depending on the required information.
We analyze equations 3.4 - 3.5 for two important cases: 1) determination of the vertical
lattice parameter and 2) determination of the lateral lattice parameter.
3.3.2 Determination of the vertical lattice parameter of crystalline
structures
From relation 3.4 it follows that we need to consider two parameters. The first one is
parameter cos(γ−β)/cos βwhich describes the resolution of the setup for the vertical
20 3 Conception of an in situ X-ray diffractometer
distance. In order to get optimized measurement conditions this parameter should be
close or less than unity. Otherwise, the measured distance ∆QIXRD will be smaller than
the distance ∆Qzand the setup is not sensitive to small ∆Qz, for example, in case of
a small lattice mismatch between substrate and layer crystals. The second parameter is
tanβ which describes how the reflection depends on the lateral distance ∆Qx. If we have
no information about this distance, i.e. information about the lateral lattice parameter
of the structure, this parameter multiplied by the value of the lateral distance, gives
the systematic error in the determination of the vertical lattice parameter. In order to
decrease the systematic error, this parameter has to be close to zero or a symmetrical
reflection which does not depend on the lateral lattice parameter should be used. Table
3.1 shows these two parameters and structure factor Ffor some reflections of h-GaN.
Table 3.1: Parameters cos(γ−β)/cos β,tanβ and structure factor Ffor some
reflections of h-GaN
cos(γ−β)/cos(β) tan β F
(¯
2024) 4.78 4.96 11.5
(¯
1¯
124) 5.22 5.21 24.5
(0002) 1.91 3.21 48.5
(20¯
24) 0.95 −0.14 11.5
(11¯
24)0.99 0.02 24.5
Table 3.1 is not a full list of all possible reflections, here we intend to illustrate the
most important reflections to understand the criteria for the choice of the reflection.
The table shows that in case of asymmetrical reflections with small incident angles
(reflections (¯
2024) and (¯
1¯
124)) both parameters do not satisfy the requirements for the
vertical mismatch determination. They have poor resolution for the ∆Qzand depend
strongly on the lateral mismatch. The symmetrical reflections for which the sensitivity
to the lateral mismatch is not important (because in this case ∆Qx= 0) have a low
resolution in ∆Qz. After analyzing all possible reflections we conclude that the reflection
with a large incident angle (11¯
24) is most suitable for the determination of the vertical
lattice parameter of structures grown on h-GaN. In table 3.2 we have summarized the
suitable reflections of some ”substrate crystals” for the determination of the vertical
lattice parameter of multilayer structures.
3.3 Interpretation of measurements with IXRD 21
Table 3.2: Suitable reflections of some ”substrate crystals” for the deter-
mination of vertical lattice parameter of multilayer structures. Parameters
cos(γ−β)/cos β,tanβ and structure factors Fare shown.
”substrate crystal” reflection cos(γ−β)/cos(β) tan β F
Si (224) 1.02 0.19 55.8
GaAs (135) 0.96 0.07 82.0
c-GaN (224) 0.92 −0.03 59.7
3.3.3 Determination of the lateral lattice parameter of crystalline
structures
For the determination of the lateral lattice parameter two parameters, namely, cos(γ−
β)/sin βand cot βare of importance. These parameters describe the resolution in Qx-
direction and the dependence of the chosen reflection on the vertical distance, respec-
tively. We illustrate these two parameters and structure factor Ffor some reflections of
h-GaN in table 3.3.
Table 3.3: Parameters cos(γ−β)/sin β,cotβ and structure factors Ffor some
reflections of h-GaN.
cos(γ−β)/sin(β) cot β F
(20¯
24) −6.98 −7.32 11.5
(11¯
24) 61.78 62.72 24.5
(0002) 0.59 0.31 48.5
(¯
2024) 0.96 0.20 11.5
(¯
1¯
124)1.00 0.19 24.5
The asymmetrical reflections with large incident angles which are well suited for the
vertical lattice parameter determination are not appropriate for determination of the
lateral lattice parameter. This means that it is not possible to use only one geometry
of the IXRD for simultaneous determination of lattice parameters in both directions:
parallel and perpendicular to the sample surface. From table 3.3 we see that the (¯
1¯
124)
reflection is the most appropriate for the determination of lateral lattice parameter of
a structure grown on h-GaN. In table 3.4 we have summarized the suitable reflections
22 3 Conception of an in situ X-ray diffractometer
of some ”substrate crystals” for the determination of the lateral lattice parameter of
multilayer structures.
Table 3.4: Suitable reflections of some ”substrate crystals” for the deter-
mination of vertical lattice parameter of multilayer structures. Parameters
cos(γ−β)/sin β,cotβ and structure factors Fare shown.
”substrate crystal” reflection cos(γ−β)/sin(β) cot β F
Si (¯
1¯
13) 0.83 0.05 55.8
GaAs (¯
1¯
13) 0.82 0.03 119.8
c-GaN (¯
1¯
33) 0.99 0.02 58.7
4 Experimental setup of IXRD
4.1 Experimental setup for laboratory tests
The experimental setup of the IXRD for laboratory tests is schematically shown in figure
4.1. The main parts of the setup are X-ray tube, movable slit, Johansson monochromator,
sample stage and multichannel detector.
The X-ray beams are generated by a Cu 2.2 kW ceramic tube which has the possibility
to change between point and line focuses. For our experiments we have used line focus.
The size of line focus is 0.4 mm in the scattering plane and 12 mm in direction perpen-
dicular to the scattering plane. The controller type ”PW3100/00” which consist of a
generator (high tension tank and waterflow control) and electronics rack with CPU as
well as the X-ray tube type ”PW3373/00” have been produced and supplied by ”Philips
Analytical”.
The X-radiation from the X-ray tube is monochromized and focused by the Johansson
monochromator. We have applied a [111]-oriented Si monochromator crystal produced
by INRAD (USA). The (333) reflection is used. The radius of the Rowland circle is
339 mm. Referring to equation 3.1 the distance between X-ray source and center of the
monochromator and between center of the monochromator and center of the sample is
500 mm. The size of the monochromator is 50 mm (curved) x 15 mm (flat). As will be
shown in the next section, the effective angular acceptance range of the monochromator
is about two degrees.
The monochromatic X-beams are focused to the sample position as shown in figure 4.1.
The use of a focused beam as well as of a multichannel detector allows to implement X-ray
measurements without alignment of the samples and without positioning them during
the measurements. Therefore the sample stage was constructed without goniometer.
However, in order to realize conditions present in a MOCVD reactor, the sample holder
has been equipped with a motor which allows to rotate the sample in azimuth direction.
For the collection of diffracted spectra we use the multichannel detector. The multi-
23
24 4 Experimental setup of IXRD
Figure 4.1: Experimental setup of the IXRD for measurements under laboratory
conditions. The beams from the X-ray tube are monochromized and focused
onto the sample. The diffracted beams are collected by the multichannel de-
tector. The setup is additionally equipped with a movable slit in front of the
monochromator and with a motor for azimuth rotation of the sample during
measurement.
channel detector type ”PW3015/xx” X’Celerator was produced and supplied by ”Philips
Analytical”. Following the product abbreviation of ”Philips Analytical” the detector will
be called X’Celerator.
Figure 4.1 shows that the setup is designed in such a way that it is possible to install
the X’Celerator in two positions. In position A the diffraction measurements can be
performed. Position B is intended for the measurements of X-ray radiation coming
directly from the Johansson monochromator. In the next section we use the position
B of the X’Celerator for the investigation of diffractive and focusing properties of the
Johansson monochromator.
Additionally, we have installed a movable slit in front of the monochromator. The
movable slit equipped with a motion controller allows to perform fast measurements of
4.2 Test of the optical properties of the Johansson monochromator 25
reciprocal space maps as will be shown in chapter 5.1.
4.2 Test of the optical properties of the Johansson
monochromator
The monochromatic and focused X-ray beams are provided by the Johansson monochro-
mator. The efficiency of the whole setup is influenced by the quality of the monochroma-
tor. The production of the Johansson monochromator is complicated due to the bending
radius of the crystal planes and the grinding radius of the crystal surface. Any deviations
from the ideal parameters decrease the quality of the monochromator.
To investigate the properties of the monochromator we used the arrangement of the
setup shown in figure 4.2. Using the narrow slit we pick up a narrow beam which incidents
Figure 4.2: The arrangement of the setup for the investigation of optical prop-
erties of the Johansson monochromator. For each position of the movable slit
the diffracted beams are measured with the X’Celerator at position B.
on the monochromator. By moving the narrow slit we cause an angular deviation of the
26 4 Experimental setup of IXRD
incident beam by the value ∆αas is shown in figure 4.2 for two different beams 1 and 2
corresponding to two different slit positions.
After the reflection by the monochromator the beam is focused at the focusing point.
The change of direction of the incident beam by angle ∆αcauses the angular deviation
∆δof the reflected beam at the focusing point. In case of a monochromator with perfect
optical properties, the relative deviation of the reflected beam ∆δshould be equal to the
relative deviation of the incident beam ∆α.
The deviation of the reflected beam at the focusing point can be detected by the
X’Celerator at position B as detection angle ∆ε. The change in direction of the incident
beam ∆αcan be calculated from the position of the movable slit.
Thus measuring the angular shift ∆εof the diffracted beam for each position of the
movable slit we can check the quality of the monochromator. The results of the measure-
ments can be represented as a two-dimensional contour plot shown in figure 4.3 where
the measured intensity is plotted versus the relative incident angle ∆αand the relative
detection angle ∆ε. Zero value of the relative incident angle corresponds to the position
of the beam at the middle of the monochromator. Zero value of the relative detection
angle ∆εis set to the maximum of the diffraction spectrum measured at ∆α= 0.
For the monochromator with perfect diffractive and focusing properties the scattered
intensity should be uniformly distributed along the black line shown in figure 4.3. Figure
4.3 shows that there is a strong deviation of the direction of the diffracted beams from the
ideal line as well as a decrease of the scattered intensity at both sides of the monochro-
mator. The angular acceptance range of the monochromator is about two degrees which
is less than four degrees specified by the producer of the crystal.
This can be also verified by the measurement of intensity diffracted by the Johansson
monochromator without the slit. Figure 4.4 shows the distribution of intensity coming
directly from the Johansson monochromator. The non-ideality of the monochromator
causes the decrease of the active optical area of the monochromator and the variation of
the reflected intensity by approximately a factor of two.
4.2 Test of the optical properties of the Johansson monochromator 27
Figure 4.3: The distribution of intensity measured at different positions of
narrow slit in front of the monochromator as a function of relative incident
angle ∆αand relative detection angle ∆ε. There are deviations of the direction
of the diffracted beams as well as the diffracted intensity from the ideal form
at both sides of the monochromator.
28 4 Experimental setup of IXRD
Figure 4.4: The intensity diffracted from the Johansson monochromator plotted
versus relative detection angle ∆ε. The imperfection of the monochromator
causes the decrease of the active diffractive area of the monochromator and the
variation of the diffracted intensity by approximately a factor two.
4.3 Performance test of the IXRD
In this section we describe the performance check of the IXRD. One way to do it is to
compare the results of IXRD measurements with the measurements performed with a
conventional high resolution diffractometer.
In section 3.2 we have explained the formation of IXRD spectra in reciprocal space.
Referring to figure 3.4 we see that the measurement point in the IXRD setup can be
obtained from the intensity distribution in reciprocal space (reciprocal space map) by
summation of the intensity located within so-called ”detection windows”. The distance
between different ”detection windows” corresponding to different measurement points
is determined by the distance between pixels of the detector. We have developed a
procedure which allows to obtain a spectrum which is identical to that measured by
the IXRD. The procedure is the following. The measurement point in the IXRD setup
4.3 Performance test of the IXRD 29
is performed at a certain detection angle ε. For this detection angle εand a series of
incident angles δcontinuously varying between δbr −Ω/2 and δbr +Ω/2 (Ω is the angular
aperture of the monochromator, δbr is the incident angle under Bragg condition) we
calculate the positions of points in reciprocal space located in the ”detection windows”
according to the expressions 3.2. For each measurement point we take into account the
width of the ”detection window” which is determined by the size of detector pixels in the
scattering plane. Therefore in our procedure the detection angle εis taken in the range
between ε−εd/2 and ε+εd/2 where εdis the angular width of the detector pixels. After
the summation of the intensities of reciprocal space points located within the ”detection
window” for each detection angle εwe obtain the spectrum which is identical to that
measured by the IXRD setup.
In figure 4.5 the dots show the results of measurements with the IXRD setup from two
different AlGaN/GaN heterostructures. The full lines are the curves extracted from re-
ciprocal space maps using the procedure described above. The high resolution reciprocal
space maps were measured on the Philips X’Pert-MRD diffractometer in triple axis mode
using the hybrid monochromator with a primary beam divergence of 18-25 arc seconds.
Figure 4.5 shows that there is good agreement between measured and extracted spectra
so that we can conclude that the IXRD setup has a good performance.
30 4 Experimental setup of IXRD
Figure 4.5: Comparison of spectra measured by the IXRD setup (dotted lines)
and spectra extracted from reciprocal space maps (full lines). Two different
AlGaN/GaN heterostructures with different Al content have been measured in
a test of the IXRD.
5 Results of experiments under
laboratory conditions
5.1 Use of the IXRD for fast ex situ characterization
5.1.1 Characterization of wurtzite AlGaN-, InGaN-based materials
In this section we focus on the potential of the IXRD for fast ex situ characterization of
semiconductor multilayers. We concentrate mostly on the measurements of III-V nitride
films which are wurtzite type AlGaN- and InGaN-based structures. Enormous progress
in the development of wide-gap III-V nitride semiconductors (see for instance [27],[28])
has recently led to the commercial production of high-brightness light-emitting diodes.
Therefore the structural characterization of these materials is highly demanded.
All tested multilayers are fully strained on the GaN layer so that only the vertical
lattice parameter of the layers is of main interest. In case of strained ternary compounds
the information about the vertical lattice parameter gives access to the chemical com-
position of the layers. Therefore all measurements with the IXRD setup were performed
around the (11¯
24) reflection which is the most appropriate for analysis of the vertical
features of the structures as described in section 3.3.
We have performed the first tests with two different AlGaN/GaN single heterostruc-
tures #1 and #2 which had different Al content. The vertical layer structure of both
samples is the same and is schematically illustrated in figure 5.1.
In figure 5.2 at the left hand side we show the results of measurements performed with
the IXRD setup for both samples. The diffractometer can clearly resolve both GaN and
AlGaN peaks and provides the angular separation ∆εof AlGaN and GaN diffraction
peaks. The detailed description of the interpretation of measurement result is given in
Appendix B. We depict the evaluated compositions of AlGaN layers in figure 5.2.
Figure 5.2 shows that the increase in the Al content of the AlGaN layer of about 4
31
32 5 Results of experiments under laboratory conditions
Figure 5.1: Sketch of the vertical layer structure of the single heterostructures
#1 and #2.
percent leads to a considerable shifting of the AlGaN peak away from the substrate peak.
The measurement time was 4 seconds for each sample.
For comparison we have performed measurements with the conventional high reso-
lution equipment. The ω- 2Θ measurements are commonly used for the composition
measurements of alloy semiconductors. The high resolution measurements were per-
formed with the Philips X’Pert-MRD diffractometer in triple axis mode using the hybrid
monochromator with a primary beam divergence of 18-25 arc seconds. In figure 5.2 at
the right hand side we show ω- 2Θ scans from samples #1 and #2 around the (0002)
reflection. The relative position of the AlGaN peak with respect to the substrate peak
provide the chemical composition of both samples. The measurement time is consider-
ably longer than for the IXRD setup and is about 30 minutes for each sample.
These results demonstrate that measurements with the IXRD setup give the same
chemical composition of alloy semiconductors as the standard high resolution equipment.
A slight change in Al composition can be clearly resolved by the IXRD setup. As a big
advantage the IXRD setup offers significantly shorter measurement times (more than
two orders of magnitude less than the standard equipment) and absence of alignment of
the samples before measurements.
The next tests are measurements of two different multiple quantum wells (MQWs).
The vertical structures of the investigated MQWs are schematically illustrated in figure
5.3. Samples #3 and #4 consist of 5 and 10 periods of InGaN (well) and GaN (barrier)
layers, respectively. The samples have different periodicity (well thickness + thickness
of barrier). They differ as well in the In content of the active InGaN layers. In figure
5.4 at the left hand side we illustrate the results of measurements with the IXRD. The
X-ray patterns show clearly resolved zero- and first-order superlattice peaks. For our
5.1 Use of the IXRD for fast ex situ characterization 33
Figure 5.2: The spectra of single heterostructures #1 and #2 collected on the
IXRD (at the left hand side) and measured on the standard high resolution
equipment (at the right hand side). The information about the Al content is
identical for both methods within experimental error. The time of measurement
is significantly shorter for the IXRD.
IXRD setup it was not possible to observe higher order superlattice peaks, because the
acceptance angle of the primary beam is only about two degrees. The measurement
time was 40 seconds for each sample. The angular position of the zero-order superlattice
peak corresponds to a lattice parameter determined by (dwcw+dbcb)/(dw+db) where
dw, cwand db, cbare the thicknesses and lattice parameters of the well and the barrier
layers, respectively. Knowing the thicknesses of well and barrier layers from the growth
conditions and the lattice parameter of the GaN layer we get the lattice parameter of
the well layer, i.e., the information about the composition of the well layer. The relative
position of neighboring peaks yield the information about the periodicity D=dw+db
of the structure.
34 5 Results of experiments under laboratory conditions
Figure 5.3: Schematic illustration of the vertical structures of tested multiple
quantum wells.
In figure 5.2 at the right hand side we show the results of (0002) ω-2Θ scans of samples
#3 and #4. Following the procedure of interpretation of such measurements [1] we
determine the In content and the periodicity of the structures for both samples. There
is an perfect agreement between the results obtained by the IXRD and by standard high
resolution equipment.
5.1 Use of the IXRD for fast ex situ characterization 35
Figure 5.4: X-ray diffraction patterns of two different multiple quantum wells
#3 and #4 measured by the IXRD are shown at the left hand side. The chemical
composition of active InGaN layers and the periodicity of the structures were
obtained from the angular position of the zero-order peak and relative position
of neighboring superlattice peaks. For comparison at the right hand side we
show ω−2θscans measured by the high resolution equipment.
5.1.2 Measurements on SiGe
It is likely that SiGe will form the basis of high speed transistor devices. Due to the
successful and rapid development of the growth technology, SiGe structures exhibit very
sharp peaks in X-ray diffraction spectra and X-ray characterization of these materials
usually demand advanced high resolution technique. The question is what is the potential
of the IXRD for fast post-growth characterization of this industrially important material
system. In figure 5.5 we show the sketch of a sample which consists of a Si1−xGexalloy
layer grown on a bulk Si substrate (sample #5).
36 5 Results of experiments under laboratory conditions
Figure 5.5: Schematic illustration of the vertical structure of sample #5.
The left side of figure 5.6 shows the (224) diffraction spectrum measured with the
IXRD. The IXRD allows to resolve the diffraction peak of SiGe alloy which can be
clearly separated from the Si diffraction peak. The angular distance between Si1−xGex
and Si reflection peaks provides the composition x following the procedure described in
Appendix B. Beside the main Si1−xGexand Si diffraction peaks the IXRD diffraction
pattern exhibits interference fringes (or Pendell¨osung fringes). This phenomenon is sim-
ilar to the diffraction pattern of light falling on a narrow slit (details see for instance in
[1] or [24]). The angular distance between fringes is directly connected to the thickness
of Si1−xGexalloy. We show the evaluation of the thickness of the epilayer in Appendix
B.
Both parameters, the composition x and thickness d gathered from X-ray pattern are
shown in figure 5.6. The additional diffraction peak at the right side of the Si peak
results from the diffraction of the Kα2line which is presented in the beams reflected
from the Johansson monochromator.
The right side of figure 5.6 shows the (004) ω−2Θ scan measured by the X’pert MRD
diffractometer. The simulation of X-ray pattern performed by the dynamical theory of
X-ray diffraction gives the composition x and thickness d of the Si1−xGexlayer.
Beside the fact that the results obtained by the IXRD and by the X’Pert MRD diffrac-
tometer are identical, the IXRD offers significantly shorter data collection time.
5.1 Use of the IXRD for fast ex situ characterization 37
Figure 5.6: Left side of the picture shows the (224) diffraction scan of Si1−xGex
alloy grown on the Si substrate measured by the IXRD. The substrate and alloy
peaks as well as interference fringes are clearly resolved and provide composition
x and thickness d of the layer. For comparison the (004) X-ray diffraction
pattern and theoretical curve (full line) are shown at the right hand side of the
picture.
5.1.3 Fast reciprocal space mapping
A more comprehensive analysis of the structural properties can be performed by X-
ray diffraction reciprocal space mapping. Reciprocal space mapping is the collection
of scattered intensity around the reciprocal lattice points of layered structures, and it
is usually performed by series of diffractometer scans. The resulting reciprocal space
map (RSM) represents the contours of constant scattered intensity as a function of
reciprocal space coordinates. The RSMs offer information about the status of strain
and the structural quality of semiconductor multilayers which is not obtainable in ω
- 2Θ measurements [2]. However, the use of the standard X-ray equipment for the
measurement of RSMs demands long data collection times which are in the order of
several hours. Our IXRD allows to measure a RSM in several minutes. The measurement
procedure is explained in figure 5.7.
By moving the narrow slit in front of the monochromator we change the angle of inci-
dence of monochromatic X-rays onto the sample as shown in figure 5.7 for two different
positions 1 and 2 of the slit. Collecting the diffracted beams by the X’Celerator for
different positions of the slit we simultaneously vary both the incident angle δand the
38 5 Results of experiments under laboratory conditions
Figure 5.7: The procedure of reciprocal space mapping with the IXRD. By
moving the narrow slit in front of the monochromator and by collecting the
diffracted spectra by a multichannel detector at different detection angle εwe
collect the distribution of intensity in reciprocal space.
detection angle ε. The intensity of the diffracted X-ray radiation is then represented as a
function of reciprocal space coordinates which are calculated from incident and detection
angles according to equations 3.2.
In figure 5.8 we show (11¯
24) reciprocal space maps measured by the IXRD setup
(at the left hand side) and by the high resolution diffractometer (at the right hand
side) of the single heterostructures #1 and #2. The standard high resolution RSMs
were derived from a series of 2Θ scans performed at different ωangles. The dashed
lines show the calculated locations of fully strained and fully relaxed AlGaN layers of
varying Al content. From figure 5.8 it is obvious what potential is offered for immediate
identification of the strain status of structures by reciprocal space mapping. Both IXRD
and the high resolution diffractometer give the same positions of the Bragg reflexes in
reciprocal space and provide identical compositions of the fully strained layers.
In figure 5.9 we illustrate the reciprocal space maps of the multiple quantum wells #3
and #4 measured by the IXRD setup (at the left right hand) and by the standard high
resolution diffractometer (at the left right hand). The superlattice reflections are clearly
observed with both methods. The dashed lines show the calculated locations of the fully
5.1 Use of the IXRD for fast ex situ characterization 39
Figure 5.8: The (11¯
24) contours of constant scattered intensity of single het-
erostructures #1 and #2 measured by IXRD (at the left side) and collected
on the high resolution diffractometer (at the right side) are shown. The iso-
intensity contours correspond to 0.5, 0.25, 0.1, 0.03 of the maximal diffracted
intensity. The information about strain state and the composition of alloys
are the same whereas the measurement time for IXRD setup is considerably
shorter.
strained and the fully relaxed InGaN layers of varying In content. In this case the strain
status, In content of active layer and the periodicity of the structures are obtained.
40 5 Results of experiments under laboratory conditions
Figure 5.9: The reciprocal space maps from multiple quantum wells #3 and #4
measured by the IXRD (at the left hand side) and by X’Pert MRD diffractome-
ter (at the right hand side) are shown. The iso-intensity contours correspond to
0.5, 0.1, 0.01, 0.001, 0.0005, 0.0002 of the maximal diffracted intensity. The re-
sults of reciprocal space mapping performed by the X’Pert MRD diffractometer
are consistent with those obtained by the IXRD.
In figure 5.10 we illustrate the (224) reciprocal space maps of Si1−xGexalloy #5 mea-
sured by the IXRD (at the left side of the picture) and by the X’Pert MRD diffractometer
5.1 Use of the IXRD for fast ex situ characterization 41
(at the right side of the picture). In contrast to the RSM measured by the X’pert MRD
diffractometer the reciprocal space map collected on the IXRD exhibits a significant
broadening of the main Si and Si1−xGexreflexes as well as of the reflexes due to inter-
ference. There are several reasons for this broadening: i) Due to the use of the narrow
slit in front of the monochromator we can not obtain an ideal parallel beam. For our
experiments we have used a slit of 0.2 mm width. Geometrical estimations show that in
this case the divergence of the primary beam is about 92 arc seconds. The X’Pert MRD
diffractometer has a divergence of the primary beam of only 18-25 arc seconds. This
divergence is responsible for the broadening of reflexes along the Qxaxis. ii) The finite
size of the source of 0.4 mm in the scattering plane reduces the instrumental resolution
∆λ/λ of the IXRD. X-rays emitted from the source which have incidence angles different
from the exact Bragg angle are still reflected by the Johansson monochromator but at
another wavelength. Due to this fact the IXRD has lower instrumental resolution than
the high resolution diffractometer as has been shown in [29]. The presence of a Kα2-line
in IXRD spectrum can not be excluded. iii) The angular resolution of the IXRD in
the ”scan direction” is limited by the size of the detector pixels and by the distance
between the sample and the detector. In the IXRD the angular resolution is about 36
arc seconds which is less than in the case of the high resolution diffractometer which
in triple axis configuration has a resolution of 12 arc seconds. The reduced resolution
causes additional broadening in the ”scan direction” which is almost parallel to the Qz
axis.
This makes the IXRD less suitable for a detailed analysis of the intensity distribution
around reciprocal space lattice points of layered structures with high crystalline perfec-
tion like SiGe/Si or AlGaAs/GaAs. However, the positions of the reflections in IXRD
measurement are consistent with those obtained by the X’Pert MRD diffractometer so
that the structural information on composition, thickness and strain of the epilayers is
identical.
From the series of measurements described in this subsection we can conclude that
the IXRD can perform reciprocal space mapping in significantly shorter times than a
standard X-ray diffractometer. The structural information on composition, thickness
and strain obtained by the IXRD and X’pert diffractometer is identical within the ex-
perimental error.
42 5 Results of experiments under laboratory conditions
Figure 5.10: The reciprocal space maps of SiGe/Si collected by the IXRD and
by X’Pert MRD diffractometer. The iso-intensity contours corresponding to 0.5,
0.1, 0.01, 0.001, 0.0005, 0.0001 of the maximal diffracted intensity are shown.
The required information on the strain status, composition and thickness of the
alloy is identical for both methods.
5.2 Measurements under conditions in a MOCVD
reactor
5.2.1 Measurement conditions and principles of data collection
In this section we describe the abilities of the IXRD for X-ray analysis of crystalline layers
under conditions similar to that in a MOCVD reactor. The MOCVD growth process is
accompanied by a rotation of the sample in a gas flow. Furthermore, the gas flow can
cause a wobble of the sample around the rotation axis. The rotation and wobble during
growth are the most critical points for the in situ X-ray setup, because it can lead to a
deviation of the sample from an angular condition of diffraction and to a reduction of
the diffracted X-ray intensity. In our experiments we have realized the conditions met in
the MOCVD growth reactor Aixtron. In this growth reactor the rotation speed depends
on the flow rate and can be different for different growth modes. However, in average the
rotation speed is about 1 rotation per second, possible fluctuations are not significant
5.2 Measurements under conditions in a MOCVD reactor 43
and can be easily taken into account by the measuring procedure of the IXRD. To clarify
the situation regarding the wobble of the samples, we measured the deflection of a laser
beam during MOCVD growth and found out that the wobble of the sample induces an
angular deviation of the sample rotation axis of about 0.3 degree at maximum.
To simulate these conditions in the laboratory we have equipped the sample stage of
our IXRD setup with an electrical motor which allows to rotate the sample with the
rotation speed of 1 rotation per second. A misalignment of the rotation axis leads to
a wobble of the sample by 0.7 degree at maximum. Thus, we have realized the same
conditions as the conditions present in the real MOCVD growth system.
The use of a focused beam and the multichannel detector in the IXRD setup allows
to get diffraction conditions and to collect the spectra even if a sample deviates from
the exact Bragg condition. We have developed a measurement procedure which allows
to collect X-ray data from rotating and wobbling samples.
In figure 5.11 we demonstrate the principle of data collection from rotating and wob-
bling single heterostructure #1. A multichannel detector collects one X-ray spectrum
within a time interval of 0.15 sec. This time corresponds to the time between two reflec-
tions from different azimuth positions of the wurtzite type crystal ( (hhil) diffractions in
the wurtzite type structures can occur at six different azimuth positions). Taking several
spectra and shifting the maximum of each spectrum to the same position and adding all
spectra together results in the pattern shown in figure 5.11 at the right hand side. The
total measuring time is about 90 sec and exceeds the expected time of 15 sec (equals
100 times 0.15 sec) because of the time needed to transfer the data between the detector
interface board and the computer.
44 5 Results of experiments under laboratory conditions
Figure 5.11: The principle of X-ray measurement from rotating and wobbling
samples. Single shot spectra which are shifted to the maximum peak position
are added. The result is depicted on the right hand side.
5.2.2 Results of measurements. Detection and resolution limits of
the IXRD
In order to analyze the potentials of the IXRD for the X-ray analysis under conditions
in a MOCVD reactor, we have performed X-ray measurements of different InGaN and
AlGaN layers grown on GaN. Our aim is to find out the abilities and restrictions of the
IXRD for X-ray analysis of rotating and wobbling samples.
The left hand side of figure 5.12 shows the (11¯
24) diffraction patterns taken on the
IXRD of samples #6 and #7 which are InGaN and AlGaN layers grown on GaN, re-
spectively. Each X-ray spectrum was obtained by collecting and adding 100 single shot
scans and the total collection time was 90 seconds.
In order to find the accurate positions of the alloy (InGaN or AlGaN) and the GaN
peaks, we have fitted each measured profile with two Pseudo-Voigt functions. The
Pseudo-Voigt functions for GaN and alloy peaks as well as the total fits are plotted
in figure 5.12 as full lines. The fits allow to obtain the relative angular positions ∆εof
alloy peaks in respect to the GaN peak. Using the procedure of composition determina-
tion described in Appendix B for the case of non-rotating layers, we get the In and Al
contents of layers which are indicated in figure 5.12.
At the right side of figure 5.12 we plot the (0002) ω−2Θ scans of samples #6 and
#7 measured with the high resolution diffractometer X’Pert MRD. The full lines are
the calculations performed by means of the dynamical theory of X-ray diffraction. The
5.2 Measurements under conditions in a MOCVD reactor 45
Figure 5.12: At the left hand side the X-ray spectra measured by the IXRD from
rotating and wobbling InGaN/GaN and AlGaN/GaN samples are shown. The
information about the chemical composition of the layers is obtained. (0002)
ω−2Θ measurements of the samples performed by standard high resolution
equipment and dynamical calculations shown at the right hand side provide
accurate thickness d and composition x of the layers.
theoretical simulations provide accurate chemical compositions and thicknesses of InGaN
and AlGaN layers. The collection time for (0002) ω−2Θ was one hour for each sample.
The results of the tests indicated in figure 5.12 demonstrate that the IXRD provides
accurate information about the chemical composition of InGaN and AlGaN layers even
when the samples are rotating and wobbling during measurement. The measurement
time of 90 seconds corresponds approximately to the MOCVD of a 10 nm thick layer
so that under real growth conditions the IXRD averages structural information with a
resolution of about 10 nm.
46 5 Results of experiments under laboratory conditions
Figure 5.13 depicts the spectra measured by the IXRD (at the left hand side) and by
the X’Pert MRD diffractometer (at the right hand side) from samples #8 and #9 which
had the thinnest InGaN and AlGaN layers measured in our tests.
Figure 5.13: The spectra collected by the IXRD (at the right hand side) and
by the X’Pert MRD (at the left hand side) from thin InGaN and AlGaN layers
grown on GaN. The IXRD is able to implement X-ray measurements from 42.5
and 27.5 nm thick InGaN and AlGaN layers.
From the measurements with the IXRD setup we can draw two main conclusions. i)
if we compare the measurement results of samples #8, #9 with the X-ray patterns of
samples #6, #7, we see that the thickness of the alloy strongly influences the width of
the diffraction peak, namely, the decrease of the layer thickness causes the broadening of
the alloy peak. This finite broadening of the diffraction peaks is in a first approximation
proportional to the inverse layer thickness [1], [24].
In figure 5.14 the full width at half maximum (FWHM) of all investigated AlGaN and
5.2 Measurements under conditions in a MOCVD reactor 47
InGaN diffraction peaks is plotted versus the inverse layer thickness. The plot shows a
linear dependence of the FWHMs of the diffraction peaks on the inverse layer thickness.
Thus linear dependence of FWHMs of diffraction peaks on the thickness can be used
for the determination of the relative increase of the thickness during growth, i.e. for the
measurement of the growth rate. The interesting point to note is that the extrapolation
of the curve to the values corresponding to the infinite thick layers results in a FWHM
which equals to that of GaN measured with our IXRD setup. This means that the
broadening of diffraction peaks of alloys due to imperfections is the same as in thick
GaN. On the other hand the quality of GaN buffers predefines the quality of the alloys.
Figure 5.14: Dependence of full width at half maximum of the InGaN and
AlGaN peaks from inverse layer thicknesses.
ii) the broadening of the diffraction peaks and the decrease of the scattered X-ray
intensity from thin layers limit the minimal layer thickness which can be detected by the
IXRD. The X-ray spectra from samples #8 and #9 shown in figure 5.13 indicate that 30
nm thick layers seem to be the detection limit of our IXRD. This means that the IXRD
is able to perform online monitoring starting from 30 nm thick InGaN or AlGaN layers.
The detection limit can be extended to thinner layers by improving the quality of the
Johansson monochromator and increasing the power of the X-ray tube.
As we have shown above, the IXRD offers the potential to obtain information about
chemical composition and relative thickness of layers under conditions present in a
MOCVD reactor. The chemical composition of epilayers is one of the most important
48 5 Results of experiments under laboratory conditions
value, because it defines its optical and electrical properties. It is important to be able
to identify changes in the chemical composition of the layers during growth in order to
influence and correct the growth conditions directly in the growth process. Therefore
we have also investigated minimal differences in the composition of layers which can
be detected by the IXRD. The resolution in composition determination of the IXRD
is limited by the angular resolution of the X’Celerator. The angular resolution of the
X’Celerator depends on the distance between pixels of the detector and on the distance
between the sample and the detector. The angular resolution of the X’Celerator is 0.01
degree and it corresponds to the resolution in composition determination of AlGaN and
InGaN alloys of 0.003 for a chosen reflection. We have measured different InGaN and
AlGaN layers which slightly differ in chemical composition. Figure 5.15 shows the results
of measurements of samples #10 and #11 which are InGaN layers with a difference in In
content of a half percent. We have checked the chemical composition of InGaN alloys by
dynamical simulations of high resolution (0002) ω−2Θ scans shown at the right hand
side of figure 5.15. The shifting of the InGaN peak due to the change in In content is
clearly resolved by the IXRD. Thus these measurement results show that the IXRD has
the resolution in chemical composition even better than half percent.
We have performed the same analysis of the resolution limits for AlGaN layers. The
X-ray pattern of AlGaN/GaN samples #12 and #13 with a difference in Al content
of a half percent are illustrated in figure 5.16. The difference in the position of the
AlGaN diffraction peaks is the limit of capabilities of the IXRD, thus half percent is the
resolution for the determination of chemical composition of AlGaN alloys.
The difference in resolution of the IXRD setup for InGaN and AlGaN layers is due to
the bigger lattice mismatch between InN and GaN lattices than between AlN and GaN.
5.2 Measurements under conditions in a MOCVD reactor 49
Figure 5.15: The resolution of the IXRD for the control of the chemical com-
position of the InGaN layers is analyzed. Two InGaN layers which differ in
only half percent of In content can be distinguished by the IXRD. The results
of IXRD measurements are consistent with the high resolution (0002) ω−2Θ
measurements illustrated on the right hand side of the picture.
50 5 Results of experiments under laboratory conditions
Figure 5.16: The X-ray patterns measured by the IXRD setup (at the left hand
side) and by the X’Pert MRD diffractometer (at the right hand side). The
difference in the Al content of half percent is still resolved by the IXRD setup
and is the limit of IXRD resolution for the control of the chemical composition
of AlGaN alloys.
6 Conclusions
A new X-ray diffractometer which allows to perform in situ control of the MOCVD
growth process using Bragg diffraction of monochromatic X-rays has been realized in
this thesis. The principles of work of the new diffractometer and the description of the
experimental setup are given in detail. We have developed a model for the interpretation
of X-ray spectra taken on the IXRD and have analyzed the possible configuration of
the IXRD for controlling the vertical and in-plane features of layered semiconductor
structures. We show that the IXRD has a good performance for the diagnostics of
epitaxially grown multilayer structures which are used in modern semiconductor industry.
The diffractometer has been tested under conditions typically present in a MOCVD
reactor - with rotation and wobble of the samples during measurements. A procedure
of X-ray measurements of rotating and wobbling samples has been developed. We have
tested our IXRD on different wurtzite type AlGaN and InGaN layers. These materials
were chosen because of their successful use for the fabrication of optoelectronic devices.
Furthermore, today most of these devices are produced by the MOCVD technology. The
tested epilayers were different in composition and thickness allowing to test the IXRD
in different aspects. The results show that the IXRD is able to perform the monitoring
of the layers with a thickness exceeding 30 nm. The IXRD provides composition and
growth rate of the growing layers. We have demonstrated that the IXRD has the same
accuracy and the same resolution for composition monitoring as standard high resolu-
tion X-ray diffractometers which, however, need much longer measurement times and
accurate adjustment of the samples. In the future, the thickness detection limit of 30
nm can be even extended to thinner layers by improving the quality of the Johansson
monochromator and increasing the power of the X-ray tube.
Additionally, the particularities of the IXRD allow to use it for fast post-growth char-
acterization of semiconductor materials. We have tested this potential of the IXRD
with materials which are important for semiconductor industry today and are grown
on a high volume scale. These are InGaN/GaN multiple quantum wells, AlGaN/GaN
single heterostructures and SiGe/Si samples. The structural information obtained from
51
52 6 Conclusions
the line scans and from reciprocal space maps is in excellent agreement with that gath-
ered from high resolution X-ray diffraction measurements. The IXRD offers advantages
which are decisive for the use of the apparatus for fast post-growth diagnostics: very
short data collection time, insensitivity to alignment of the samples before measurement
and absence of any positioning of the samples during measurement.
We have shown that X-ray diffraction measurements taken on the IXRD provide im-
portant structural information even under conditions in a MOCVD reactor. Since this
information is not obtainable by other methods, IXRD paves the way for an extensive
in situ diagnostics of epitaxial processes.
A Lattice parameters and stiffness
coefficients of relevant materials
The tables A.1 and A.2 contain lattice and elastic constants of materials relevant for
this thesis. For wurtzite type related materials we have used the data reported by O.
Ambacher in his review article on group III - nitrides [30]. For SiGe we have applied the
data published in [31].
Table A.1: Lattice a0, c0and stiffness C11, C13 constants for hexagonal GaN,
InN and AlN.
a0(˚
A) c0(˚
A) C11(GPa)C13(GPa)
GaN 3.189 5.185 374 70
InN 3.54 5.705 190 121
AlN 3.112 4.982 345 120
Table A.2: Lattice a0, c0and stiffness C11, C12 constants for cubic Si and Ge.
a0(˚
A) C11(GPa)C12(GPa)
Si 5.431 165.8 63.9
Ge 5.6575 128.5 48.3
53
54 A Lattice parameters and stiffness coefficients of relevant materials
B Examples of the evaluation of the
IXRD spectra
In this part of the appendix we describe the procedure of data interpretation of the
measurements performed with the IXRD diffractometer. As examples we consider the
IXRD measurements of the AlGaN/GaN single heterostructure as well as of the SiGe/Si
sample and give the detailed explanation of how we get the structural information from
the spectra measured on the IXRD.
In figure B.1 we depict the (11¯
24) diffraction spectrum of AlGaN/GaN single het-
erostructure #1 collected on the IXRD. The angular separation between the diffraction
peaks of AlGaN and GaN is 0.35 ±0.01 degree. The accuracy in determination of the
angular distance is limited by the resolution of the X’Celerator detector. The distance
between the pixels of the detector and the distance between sample and detector cor-
respond to the angular distance between measurement points of 0.01 degree and we
consider this angle as a systematic error in determination of the angular position. Fol-
lowing equation 3.3 we calculate the distance ∆QIXRD = 0.0249 ±0.0007 ˚
A−1between
reflexes of AlGaN and GaN in reciprocal space. This distance equals the vertical dis-
tance ∆Qzbetween AlGaN and GaN reflexes multiplied by the geometrical factor of
0.99 for the (11¯
24) reflection as shown in section 3.2. Therefore the vertical position of
the AlGaN reflex in reciprocal space is given by QzL=QzS+ (0.99 ·∆QIXRD) where
QzSis the vertical position of the GaN reflex which can be calculated for the (11¯
24)
reflection by QzS= (8 ∗π)/cS= (8 ∗π)/5.185 = 4.8472 ˚
A−1. The vertical position of
the AlGaN reflex is QzL= 4.8719 ˚
A−1and gives access to the vertical lattice parameter
of AlGaN layer cL= (8 ∗π)/QzL= (8 ∗π)/4.8719 = 5.1588 ±0.0008 ˚
A. Thus assuming
that the AlGaN layer is fully strained on GaN we have in-plane aL= 3.189 ˚
A and lattice
parameter cL= 5.1588 ±0.0008 ˚
A perpendicular to the sample surface. Following the
formula 2.10 we find the chemical composition of the layer x= 0.105 ±0.003.
The next example is the evaluation of the (224) diffraction spectrum of SiGe/Si sample
#5 shown in figure B.2 which includes the determination of the composition and the
55
56 B Examples of the evaluation of the IXRD spectra
Figure B.1: The diffraction spectrum of an AlGaN/GaN single heterostructure
taken on the IXRD. The angular distance between AlGaN and GaN peaks
provides the composition of the layer according to the procedure described in
the text.
thickness of the SiGe layer. The angular distance between SiGe and Si peaks is 0.76±0.01
degree. Referring to equation 3.3 we find the distance ∆QIXRD = 0.0541 ±0.0007 ˚
A−1
between reflexes of SiGe alloy and Si in reciprocal space. From our considerations in
section 3.2 and from table 3.2 we know that for the (224) reflection the vertical distance
∆Qzbetween the SiGe alloy and the Si reflexes equals ∆QIXRD distance multiplied by
the geometrical factor of 1.02. Knowing the vertical position of the Si reflex in reciprocal
space QzS= 4.62765 ˚
A−1we find the vertical position of the reciprocal lattice point of
alloy according to QzL=QzS−(1.02 ·∆QIXRD)=4.5725 ±0.0007 ˚
A−1. The vertical
lattice parameter cLof the SiGe layer is directly connected to the vertical position QzL
and equals cL= (8 ∗π)/QzL= (8 ∗π)/4.5726 = 5.4965 ±0.0008 ˚
A. Assuming that the
layer is fully strained (aL=aS= 5.431 ˚
A) we have both the vertical cL= 5.4965 ±
0.0008 ˚
A and the in-plane aL= 5.431 ˚
A lattice parameters of the alloy. According to
the formula 2.10 we find the chemical composition of the layer to be x= 0.163 ±0.003.
The angular distance between two subsequent thickness oscillations is 0.17±0.01 degree.
This corresponds to the distance in reciprocal space ∆QIXRD = 0.0121 ±0.0007 ˚
A−1
and to the vertical distance ∆Qz= 1.02 ·∆QIXRD = 0.0123 ±0.0007 ˚
A−1. The vertical
distance between thickness oscillations in reciprocal space gives the thickness of the layer
by D= (2 ∗π)/∆Qz= (2 ∗π)/0.0123 = 51 ±3nm.
B Examples of the evaluation of the IXRD spectra 57
Figure B.2: Measurement result of a SiGe/Si sample. The angular distances
between Si, SiGe peaks as well as between two subsequent thickness oscillations
give access to the composition and thickness of the alloy.
We follow the same procedure of data interpretation for the measurements of In-
GaN/GaN multiple quantum wells described in this thesis.
58 B Examples of the evaluation of the IXRD spectra
Bibliography
[1] G. Bauer and W. Richter, Optical Characterization of Epitaxial Semiconductor Lay-
ers (Springer-Verlag, Berlin Heidelberg New York, 1996).
[2] V. Holy, U. Pietsch, and T. Baumbach, High resolution X-ray scattering from thin
films and multilayers (Springer-Verlag, Berlin, 1999).
[3] D. W. Kisker, P. H. Fuoss, S. Brennan, G. Renaud, K. L. Tokuda, and J. L. Kahn,
J. Crystal Growth 101, 42 (1990).
[4] P. H. Fuoss, D. W. Kisker, G. Renaud, K. L. Tokuda, S. Brennan, and J. L. Kahn,
Phys. Rev. Lett. 63, 2389 (1989).
[5] P. H. Fuoss, D. W. Kisker, F. J. Lamelas, G. B. Stephenson, P. Imperatori, and S.
Brennan, Phys. Rev. Lett. 69, 2791 (1992).
[6] R. L. Headrick, S. Kycia, Y. K. Park, A. R. Woll, and J. D. Brock, Phys. Rev. B
54, 14 686 (1996).
[7] R. L. Headrick, S. Kycia, A. R. Woll, J. D. Brock, and M. V. Ramana Murty, Phys.
Rev. B 58, 4818 (1998).
[8] G. B. Stephenson, J. A. Eastman, C. Thompson, O. Auciello, L. J. Thompson, A.
Munkholm, P. Fini, S. P. DenBaars, and J. S. Speck, Appl. Phys. Lett. 74, 3326
(1999).
[9] M. V. Ramana Murty, S. K. Streiffer, G. B. Stephenson, J. A. Eastman, G. R.
Bai, A. Munkholm, O. Auciello, and Carol Thompson, Appl. Phys. Lett. 80, 1809
(2002).
[10] A. Munkholm, Carol Thompson, M. V. Ramana Murty, J. A. Eastman, O. Auciello,
G. B. Stephenson, P. Fini, S. P. DenBaars, and J. S. Speck, Appl. Phys. Lett. 77,
1626 (2000).
59
60 Bibliography
[11] P. Fini, A. Munkholm, Carol Thompson, G. B. Stephenson, J. A. Eastman, M. V.
Ramana Murty, L. Zhao, S. P. DenBaars, and J. S. Speck, Appl. Phys. Lett. 76,
3893 (2000).
[12] W. L. Bragg, Proc. Cambridge Phil. Soc. 17, 43 (1913).
[13] B. E. Warren, X-ray diffraction (Dover Publications, Inc., New York, 1990).
[14] M. A. Krivoglaz, X-ray and neutron diffraction in nonideal crystals (Springer-Verlag,
Berlin, 1980).
[15] C. G. Darwin, Phil. Mag. 27, 675 (1914).
[16] P. P. Ewald, Ann. Physik 54, 519 (1916).
[17] M. von Laue, Ergeb. d. exakt. Naturw. 10, 133 (1931).
[18] Z. G. Pinsker, Dynamical Scattering of X-rays in Crystals (Springer Verlag, Berlin
Heidelberg New York, 1978).
[19] S. Takagi, Acta Cryst. 15, 1311 (1962).
[20] S. Takagi, J. Phys. Soc. Japan 26, 1239 (1969).
[21] D. Taupin, Bull. Soc. Fr. Mineral. Crystallogr. 87, 469 (1964).
[22] V. I. Punegov and A. V. Kharchenko, Crystallography Reports 43, 1020 (1998).
[23] J. F. Nye, Physical Properties of Crystals, Their representation by tensors and ma-
trices (Oxford University Press, London, 1957).
[24] A. Pesek, Ph.D. thesis, Johannes Kepler University, Linz, Austria, 1993.
[25] M. Schuster, P. O. Gervais, B. Jobst, W. Hsler, R. Averbeck, H. Riechert, A. Iberl,
and R. Stmmer, J. Phys. D: Appl. Phys. 32, A56 (1999).
[26] T. Johansson, Z. Phys. 82, 507 (1933).
[27] S. Nakamura, M. Senoh, S. Nagahama, N. Iwasa, T. Yamada, T. Matsushita, Y.
Sugimoto, and H. Kiyoku, Appl. Phys. Lett. 69, 4056 (1996).
[28] M. Kneissl, D. Bour, C. Van de Walle, L. Romano, J. Northrup, R. Wood, M. Teepe,
and M. Johnson, Appl. Phys. Lett. 75, 581 (1999).
[29] U. Niggemeier, Ph.D. thesis, University of Paderborn, Paderborn, Germany, 1999.
Bibliography 61
[30] O. Ambacher, J. Phys. D: Appl. Phys. 31, 2653 (1998).
[31] Properties of strained and relaxed Silicon Germanium, edited by E. Kasper (IN-
SPEC, the Institution of Electrical Engineers, London, United Kingdom, 1995).
List of Publications
A. Pawlis, A. Khartchenko, O. Husberg, D. J. As, K. Lischka, D. Schikora,
”Large room temperature Rabi-splitting in a ZnSe/(Zn, Cd)Se semiconductor microcav-
ity structure”. Solid State Communications 123, 235 (2002)
A. Tabata, L. K. Teles, L. M. R. Scolfaro, J. R. Leite, A. Khartchenko, T. Frey, D. J.
As, D. Schikora, K. Lischka, J. Furthm¨uller, and F. Bechstedt,
”Phase separation suppression in InGaN epitaxial layers due to biaxial strain”. Appl.
Phys. Lett. 80, 769 (2002)
O. Husberg, A. Khartchenko, H. Vogelsang, D. J. As, K. Lischka, O. C. Noriega, A.
Tabata, L. M. R. Scolfaro, J. R. Leite,
”Photoluminescence associated with quantum dots in cubic GaN/InGaN/GaN double
heterostructures”. Physica E 13, 1090 (2002)
O. C. Noriega, J. R. Leite, E. A. Meneses, J. A. N. T. Soares, S. C. P. Rodrigues, L.
M. R. Scolfaro, G. M. Sipahi, U. K¨ohler, D. J. As, S. Potthast, A. Khartchenko, and K.
Lischka,
”Photoluminescence and Photoreflectance Characterization of Cubic GaN/AlxGa1−xN
Quantum Wells”. phys. stat. sol. (c) 0, 528 (2002)
O. Husberg, A. Khartchenko, D. J. As, K. Lischka, E. Silvera, O. C. Noriega, J. R. L.
Fernandez, and J. R. Leite,
”Thermal Annealing of Cubic InGaN/GaN Double Heterostructures”. phys. stat. sol.
(c) 0, 293 (2002)
D. J. As, U. K¨ohler, S. Potthast, A. Khartchenko, K. Lischka, V. Potin, and D.
Gerthsen,
”Cathodoluminescence, High-Resolution X-ray Diffraction and Transmission-Electron-
Microscopy Investigations of Cubic AlGaN/GaN Quantum Wells”. phys. stat. sol. (c)
0, 253 (2002)
U. K¨ohler, D. J. As, S. Potthast, A. Khartchenko, K. Lischka, O. C. Noriega, E. A.
Meneses, A. Tabata, S. C. P. Podrigues, L. M. R. Scolfaro, G. M. Sipahi, and J. R. Leite,
”Optical characterization of cubic AlGaN/GaN Quantum Wells”. phys. stat. sol. (a)
192, 129 (2002)
O. Husberg, A. Khartchenko, D. J. As, H. Vogelsang, T. Frey, D. Schikora, and K.
Lischka, O. C. Noriega, A. Tabata, and J. R. Leite,
”Photoluminescence from quantum dots in cubic GaN/InGaN/GaN double heterostruc-
tures”. Appl. Phys. Lett. 79, 1243 (2001)
A. Pawlis, O. Husberg, A. Khartchenko, K. Lischka, and D. Schikora,
”Structural and Optical Investigations of ZnSe Based Semiconductor Microcavities”.
phys. stat. sol. (a) 188, 983 (2001)
A. Kharchenko, U. Englisch, Th. Geue, J. Grenzer, U. Pietsch, R. Siebrecht,
”Investigation of Partially Deuterated Organic Multilayers by Means of X-ray and Po-
larized Neutron Reflectometry”. Neutron News 11, 29 (2000)
V. I. Punegov, A.V. Kharchenko,
”Effect of Multiple Diffuse Scattering on the Dynamical Diffraction of X-rays in Non
uniform Layer Crystals Containing Microdefects”. Crystallography Reports 43, 1020
(1998)
Acknowledgements
First and foremost, I would like to thank sincerely Prof. Dr. Klaus Lischka for the
possibility to work in his group, for valuable advises and discussions during my work on
this PhD thesis.
I thank appl. Prof. Dr. Donat As for helpful discussions.
Special thanks go to S. Igges for his suggestions during the construction of X-ray
diffractometer.
J. Bethke , J. Woitok (PANalytical B.V., The Netherlands) for a good cooperation
during European Project.
K. Schmidegg and Prof. H. Sitter (University of Linz, Austria) for a good cooperation
during the work at University of Linz.
I also want to thank B. Volmer, I. Zimmermann for their help in solving bureaucratical
and technical problems.
I would like to express my gratitude to the PhD students O. Husberg, A. Pawlis, S.
Potthast, Shunfeng Li and to the master degree student J. Sch¨ormann for their helpful
discussions.