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Eu opean Con e ence on EDGE AI
Technologies and Applica ions - EEAI
20-22 Oc obe 2025, Naples, I aly
The in e sec ion o imagina ion and
execu ion, whe e edge AI lea ns o
c ea e, eason, and ac .
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Eu opean Con e ence on EDGE AI
Technologies and Applica ions - EEAI
Milan, I a20-22 Oc obe 2025 Naples, I aly
2
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O idiu Ve mesan, SINTEF AS, No way
Edge AI Re e ence A chi ec u e
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P esen a ion Ou line
•Re e ence Edge AI Sys em A chi ec u e
•Re e ence Sys em A chi ec u e Role
•Edge AI Technology S ack
•Edge AI Laye s and Planes
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Re e ence Edge AI Sys em A chi ec u e
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•A e e ence edge AI a chi ec u e is
a s anda dised, applica ion-
agnos ic model o amewo k ha
de ines he undamen al
componen s, hei oles, and how o
deploy and manage edge AI
sys em wo kloads.
•I se es as a bluep in o guide he
c ea ion, design, and build o
conc e e and speci ic, eal-wo ld
edge AI sys ems, ensu ing he
quali y p ope ies and unc ional
equi emen s o he edge AI
sys em.
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Re e ence Edge AI Sys em A chi ec u e Role
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•The e e ence edge AI sys em a chi ec u e ea u es
mul iple iews, each de ined a a ying le els o de ail
and abs ac ion.
•P o ides a common language/ ocabula y o he di e en
s akeholde s in ol ed in he a ea, assu es he consis ency o
implemen a ion o he edge AI echnology s ack o sol e
he echnical challenges, and s eng hens he e i ica ion,
alida ion, es ing, and benchma king o solu ions agains
a e e ence amewo k.
•Suppo s he commi men o use common s anda ds,
speci ica ions, and pa e ns o implemen ing he di e en
use cases when applying edge AI echniques and me hods
in a ious applica ions o indus y domains.
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Re e ence Edge AI Sys em A chi ec u e Role
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•The e e ence edge AI sys em a chi ec u e aims o o e a
high-le el pa e n/ empla e solu ion o edge AI-based
applica ions ac oss he indus ial domains, suppo ing a
common ocabula y wi h which o discuss
implemen a ions in a ious use cases, analyse
commonali ies, and iden i y speci ici ies and gaps.
•The use o he e e ence edge AI sys em a chi ec u e
se es as he basis o p o iding a me hodology and se
o p ac ices and empla es ha gene alise a se o
p e ious solu ions used in indus ial domains.
•The solu ions a e hen applied o a ious use cases,
gene alised, and e i ied, alida ed, es ed, and
benchma ked o use in di e en indus ial domains.
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Re e ence Edge AI Sys em A chi ec u e Func ions
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oSuppo s HW/SW pa i ioning
and, a a lowe le el, enables
he in e ac ions o
p ocedu es (o me hods)
wi hin an edge AI-based
embedded IoT/IIoT, agen ic
AI, and gene a i e AI sys em
designa ed o pe o m a
speci ic ask.
oAllows acing he
da a/knowledge lows and
s eams be ween he a ious
a chi ec u al laye s and
iden i ying he use o
common da a/knowledge
o ma s as an in eg a ion
me hod o a oid e e y
connec o /in e ace ha ing o
con e da a o/ om he
di e en o ma s o e e y
componen , as well as he
use o in e aces and APIs
be ween componen s.
oI can be applied o edge AI
dis ibu ed sys ems ha
sha e he compu ing
unc ions and ac as a
cohe en sys em o he
o e all applica ion.
oThe implemen a ion,
including agen ic edge AI,
allows he use o
au onomous componen s
ha in e ac and collabo a e
o implemen in elligen
unc ions a he sys em
le el.
HW/SW pa i ioning Dis ibu ed sys ems Da a/knowledge lows
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Re e ence Edge AI Sys em A chi ec u e Use
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Ex e nal He e ogenei y
In e nal he e ogenei y is de ined as he
abili y o he sys em o accommoda e
nume ous ypes o componen s and
in e aces (using he same o di e en
p og amming languages), as well as o he
algo i hms/so wa e modules om
a ious sou ces.
Ex e nal he e ogenei y is de ined as he
abili y o he edge AI sys em o adjus o
and le e age a ious HW/SW pla o ms,
ne wo k p o ocols, ope a ing sys ems,
middlewa e in as uc u es, and
algo i hms o mee he edge AI sys em
equi emen s.
In e nal He e ogenei y
The e e ence edge AI sys em a chi ec u e is applied o dis ibu ed and he e ogeneous edge AI sys ems in
he desc ip ions o a ious use cases ac oss di e en indus ial domains.
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Edge AI Technology S ack
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E en O ganise s
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The objec i es o LoLiPoP IoT (Long Li e Powe Pla o ms o In e ne o Things) a e o
de elop ene gy ha es ing-based inno a i e Long Li e Powe Pla o ms ha enable
e o i o wi eless senso ne wo k edge de ices o asse acking, condi ion and
pe o mance moni o ing. www.lolipop-io .eu
LoLiPoP IoT
EdgeAI-T us
AIMS5.0
SC4EU
SC4EU is a unique Chips JU "Inno a ion Ac ion" p ojec o ake he supply chain
managemen o semiconduc o p oduc ion in Eu ope o a new le el. A ue demand
pla o m, along wi h i s on ology as a o mal desc ip ion o all in o ma ion wi hin he
chain, acili a es close in e ac ion and smoo h, anspa en collabo a ion, making e en
highly complex supply chains esilien , lexible, and agile. h ps://sc4.eu/
EdgeAI-T us add esses an ad anced, us wo hy edge AI ecosys em h ough cu ing-
edge ha dwa e, so wa e, and ools. The p ojec aims o enhance decen alized EdgeAI
ope a ions ha a e secu e, eliable, and sus ainable. By in eg a ing AI-based
algo i hms, de ices, and APIs, EdgeAI-T us os e s in e ope abili y and secu e da a
exchange ac oss di e se pla o ms. om senso -ac ua ed de ices o cloud sys ems, all
wi hin a dynamic ze o us en i onmen . h ps://www.edgeai- us .eu/
AIMS5.0 aims o boos he economy by adop ing, ex ending, and implemen ing AI-
enabled HW and SW componen s and sys ems ac oss he en i e indus ial alue chain.
New echnologies om IoT and based on Seman ic Web on ologies, ML and AI help
Eu opean manu ac u e s o shi om Indus y 4.0 o Indus y 5.0, c ea ing human-
cen ic wo kplace condi ions and a clima e- iendly p oduc ion. h ps://aims50.eu/
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Suppo ing O ganiza ions
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The Eu opean Technology Pla o m on Sma Sys ems In eg a ion is an indus y-
d i en policy ini ia i e, de ining esea ch, de elopmen and inno a ion needs as
well as policy equi emen s ela ed o Sma Sys ems In eg a ion and in eg a ed
Mic o- and Nanosys ems. The main objec i e is o de elop a ision and o se up a
S a egic Resea ch Agenda. www.sma -sys ems-in eg a ion.o g
Inside Indus y Associa ion is he Eu opean Technology Pla o m o esea ch,
design and inno a ion on In elligen Digi al Sys ems and hei applica ions. The
Associa ion is a membe ship o ganisa ion o he Eu opean esea ch and
inno a ion ac o s wi h mo e han 200 membe s and associa es om all o e
Eu ope. www.inside-associa ion.eu
Chips Join Unde aking suppo s esea ch, de elopmen , inno a ion, and u u e
manu ac u ing capaci ies in he Eu opean semiconduc o ecosys em. Launched as
pa o he Chips o Eu ope Ini ia i e, i con on s semiconduc o sho ages and
s eng hens Eu ope's digi al au onomy, engaging a signi ican EU,
na ional/ egional and p i a e indus y unding o nea ly €11 billion.
h ps://po al.chips-ju.eu opa.eu/
EU
AENEAS
EPoSS
INSIDE
Chips JU
AENEAS s anding o Associa ion o Eu opean NanoElec onics Ac i i ieS, is an
indus ial Associa ion, es ablished in 2006, p o iding unpa alleled ne wo king
oppo uni ies, policy in luence & suppo ed access o unding o all ypes RD&I
pa icipan s in he ield o mic o and nanoelec onics enabled componen s and
sys ems. h ps://aeneas-o ice.o g/
