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Best Practice Guide for Planar S-Parameter Measurements using Vector Network Analysers : EMPIR - 14IND02 PlanarCal

Arz, Uwe,Probst, Thorsten,Kuhlmann, Karsten,Ridler, Nick,Shang, Xiaobang,Mubarak, Faisal,Hoffmann, Johannes,Wollensack, Michael,Zeier, Markus,Phung, Gia Ngoc,Heinrich, Wolfgang,Lomakin, Konstantin,Gold, Gerald,Helmreich, Klaus,Lozar, Roger,Dambrine, Gille

Abstract

In the European project PlanarCal a major effort has been undertaken to characterise components and devices for eventual use in high-speed and microwave applications (e.g. wireless communications, automotive radar and medical sensing) with known measurement uncertainties. It is the purpose of this Best Practice Guide to give an overview of the major outcomes of this project together with useful information on recommended measurement practice, different sources of uncertainty and the determination of uncertainties. This Best Practice Guide is not intended to replace available literature which offers comprehensive introductions to the subject of on-wafer measurements and deembedding. Instead, this Guide aims to present useful best practice recommendations together with key takeaways developed from the research performed in PlanarCal during the project’s lifetime from 2015 until 2018.

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EMPIR – 14IND02 Plana Cal Bes P ac ice Guide o Plana S-Pa ame e Measu emen s using Vec o Ne wo k Analyse s Uwe A z, Tho s en P obs , Ka s en Kuhlmann, PTB Nick Ridle , Xiaobang Shang, NPL Faisal Muba ak, VSL Johannes Ho mann, Michael Wollensack, Ma kus Zeie , METAS Gia Ngoc Phung, Wol gang Hein ich, FVB Kons an in Lomakin, Ge ald Gold, Klaus Helm eich, FAU Roge Loza , FhG Gilles Damb ine, Kamel Haddadi, Uni -Lille1 Ma co Spi i o, TUD Roland Cla ke, ULE h ps://plana cal.p b.de Sep embe 2018 This Guide has been p oduced wi hin he EURAMET p ojec en i led Mic owa e mea- su emen s o plana ci cui s and componen s. Mo e in o ma ion abou his collabo a i e esea ch p ojec can be ound on he p ojec ’s websi e h ps://plana cal.p b.de . Disclaime Any men ion o comme cial p oduc s wi hin his Guide is o in o ma ion only; i does no imply ecommenda ion o endo semen by he pa ne s in his p ojec . The iews exp essed in his Guide a e hose o he au ho s and o he EMPIR 14IND02 p ojec eam. Acknowledgemen o unding The p oduc ion o his Guide was unded by he Eu opean Me ology P og amme o Inno- a ion and Resea ch (EMPIR). The EMPIR ini ia i e is co- unded by he Eu opean Union’s Ho izon 2020 Resea ch and Inno a ion P og amme and he EMPIR Pa icipa ing S a es. Au ho ship P epa a ion o his Guide was led by Uwe A z o he Physikalisch-Technische Bundesans al (PTB), B aunschweig (Ge many) wi h ex ensi e inpu om all membe s o he EMPIR 14IND02 p ojec eam. The discussion and inpu o all he pa ne s in he p ojec and hei colleagues a e g ea ly app ecia ed. Sugges ion o he quo a ion o he e e ences A z, Uwe ; P obs , Tho s en ; Kuhlmann, Ka s en ; Ridle , Nick ; Shang, Xiaobang ; Muba ak, Faisal ; Ho mann, Johannes ; Wollensack, Michael ; Zeie , Ma kus ; Phung, Gia Ngoc ; Hein ich, Wol gang ; Lomakin, Kons an in ; Gold, Ge ald ; Helm eich, Klaus ; Loza , Roge ; Damb ine, Gilles ; Haddadi, Kamel ; Spi i o, Ma co ; Cla ke, Roland. Bes P ac ice Guide o Plana S-Pa ame e Measu emen s using Vec o Ne wo k Analyse s : EMPIR — 14IND02 Plana Cal, 2018. Physikalisch-Technische Bundesans al (PTB). DOI: h ps://doi.o g/10.7795/530.20190424B This documen and all pa s con ained he ein a e p o ec ed by copy igh and a e subjec o he C ea i e Commons use license CC by 4.0 (h ps://c ea i ecommons.o g/licenses/ by/4.0/). Bes P ac ice Guide o Plana S-Pa ame e Measu emen s using Vec o Ne wo k Analyse s Con en s P e ace 4 1 In oduc ion 6 1.1 P obe and Calib a ion Subs a e Selec ion . . . . . . . . . . . . . . . . . . . 6 1.2 Selec ion o Calib a ion Algo i hm . . . . . . . . . . . . . . . . . . . . . . . . 8 1.2.1 Selec ion Be ween Basic Calib a ion Algo i hms . . . . . . . . . . . . 8 1.2.2 Calib a ion algo i hm in ol ing eigen alue p oblems . . . . . . . . . . 8 1.3 Selec ion o Measu emen Bounda y Condi ions . . . . . . . . . . . . . . . . 9 1.4 VNACha ac e iza ion .............................. 9 1.4.1 Noise Floo /T ace Noise . . . . . . . . . . . . . . . . . . . . . . . . . 9 1.4.2 Linea i y.................................. 10 1.4.3 E o Te mD i ............................. 10 1.5 CableMo emen ................................. 11 1.6 Connec ion Repea abili y . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 1.7 DUT Unce ain y/C oss alk . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 2 On-wa e measu emen s up o 110 GHz 13 2.1 Resul s om a h ee-pa y on-wa e measu emen in e compa ison . . . . . . 13 2.1.1 In luence o p obe pi ch . . . . . . . . . . . . . . . . . . . . . . . . . 13 2.1.2 Impo ance o measu emen speed/ins umen d i . . . . . . . . . . 14 2.2 Limi s o es ablished echniques o ans e ing unce ain ies . . . . . . . . . 15 2.2.1 Subs a e pe mi i i y compensa ion . . . . . . . . . . . . . . . . . . 15 2.2.2 Residual e o co ec ion . . . . . . . . . . . . . . . . . . . . . . . . . 20 2.3 T ans e o unce ain ies wi h he aid o ISS . . . . . . . . . . . . . . . . . . 24 3 On-wa e measu emen s abo e 110 GHz 30 3.1 Recommended good p ac ice o making on-wa e measu emen s a highe equencies..................................... 30 3.2 Summa y o high- equency pa asi ic e ec s . . . . . . . . . . . . . . . . . . 31 3.3 Su ace oughness e ec s . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32 3.4 Impo ance o posi ioning accu acy . . . . . . . . . . . . . . . . . . . . . . . 39 4 Nanode ice measu emen s 40 4.1 Sol ing he impedance misma ch p oblem . . . . . . . . . . . . . . . . . . . 40 4.2 Add essing he scale misma ch challenge . . . . . . . . . . . . . . . . . . . . 41 4.3 In e e ome ic me hods . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41 4.3.1 Passi eme hods ............................. 42 4.3.2 Ac i eMe hods.............................. 44 2 5 Unce ain ies in on-wa e measu emen s 48 5.1 In oduc ion.................................... 48 5.2 VNA Tools II on-wa e example . . . . . . . . . . . . . . . . . . . . . . . . . 49 5.2.1 In oduc ion................................ 49 5.2.2 New p ojec and basic de ini ions . . . . . . . . . . . . . . . . . . . . 49 5.2.3 Measu emen s............................... 50 5.2.4 Calib a ion con igu a ion . . . . . . . . . . . . . . . . . . . . . . . . . 53 5.2.5 E o co ec ion.............................. 53 5.2.6 Da aExplo e ............................... 53 5.3 Unce ain y budge examples . . . . . . . . . . . . . . . . . . . . . . . . . . 56 5.3.1 Expanded unce ain ies . . . . . . . . . . . . . . . . . . . . . . . . . . 56 5.3.2 Unce ain y budge s . . . . . . . . . . . . . . . . . . . . . . . . . . . 57 6 Conclusions and Ou look 58 7 Acknowledgemen s 58 Re e ences 59 3 P e ace In he Eu opean p ojec Plana Cal [1] a majo e o has been unde aken o cha ac e ise componen s and de ices o e en ual use in high-speed and mic owa e applica ions (e.g. wi eless communica ions, au omo i e ada and medical sensing) wi h known measu emen unce ain ies. I is he pu pose o his Bes P ac ice Guide o gi e an o e iew o he majo ou comes o his p ojec oge he wi h use ul in o ma ion on ecommended measu emen p ac ice, di e en sou ces o unce ain y and he de e mina ion o unce ain ies. This Bes P ac ice Guide is no in ended o eplace a ailable li e a u e such as [2], [3], o [4] – jus o name a ew. All hese ex books o e comp ehensi e in oduc ions o he subjec o on-wa e measu emen s and deembedding, which a e sui able o beginne s as well as ad anced use s in indus y and academia. Such in o ma ion will no be eplica ed in his Guide. Ins ead, his Guide aims o p esen use ul bes p ac ice ecommenda ions oge he wi h key akeaways de eloped om he esea ch pe o med in Plana Cal du ing he p ojec ’s li e ime om 2015 un il 2018. The esea ch in Plana Cal has been ocussed on passi e one- and wo-po on-wa e measu emen s on ypical mic owa e subs a es such as GaAs, Al2O3(alumina) and used silica o equencies up o 325 GHz, including nanode ice measu emen s. To his end, pa asi ic modes as well as e ec s occu ing a highe equencies such as adia ion, dispe sion and su ace oughness ha e been in es iga ed oge he wi h he impac o he p obe i sel and i s neighbo hood. The in luence o he neighbo hood on coplana wa eguides (CPWs) used as s anda ds o mul iline Th u-Re lec -Line (TRL) calib a ions [5] was demons a ed o CPWs on GaAs and alumina subs a es in [6] and [7], espec i ely. The la e in es iga ion included di e en p obe geome ies and sugges ed measu es o supp ess he occu ence o subs a e modes. In [8], a simila in es iga ion was pe o med o hin- ilm mic os ip lines. The impac o adia ion losses due o mul imode p opaga ions on TRL calib a ions in he WR10 band was desc ibed in [9]. All he in es iga ions con i med ha he measu emen esul depends on he en i onmen as well as on he speci ic combina ion o subs a e ma e ial, plana wa eguide ype, and p obes. Only o such ully speci ied combina ions, and only when single-mode p opaga ion is ensu ed, eliable unce ain ies o on-wa e S-pa ame e s can be s a ed. This Bes P ac ice Guide is o ganized as ollows. In he In oduc ion we gi e an o e iew o commonly used e minology and ecommenda ions o he choice o measu emen equip- men . As Vec o Ne wo k Analyze s (VNAs) a e an indispensable pa o each on-wa e measu emen se up, we also gi e ecommenda ions on how o cha ac e ize he pe o mance o such ins umen s and gi e ypical numbe s o one speci ic se up. In Sec ion 2 we summa ize key indings o on-wa e measu emen s pe o med in he equency ange up o 110 GHz. In his equency ange, aceabili y was ecen ly demon- s a ed o de ices ab ica ed in memb ane echnology [10]. A he end o he p ojec , he me hodology o [10] could also be ex ended o used silica [11], pa ing he way o aceabili y o mos commonly used mic owa e ma e ials. The bigges challenge emains he ans e o he (supposedly low) unce ain ies ob ained on a e e ence subs a e o a di e en subs a e inco po a ing he de ices unde es (DUTs) o be measu ed. Some esul s om echniques de eloped o his end will also be gi en in his Sec ion. Finally, he Sec ion concludes wi h a ecommenda ion o ans e ing unce ain ies om a e e ence cus om calib a ion o indus ial DUT en i onmen s making use o comme cially a ailable impedance s anda d subs a es (ISS). In Sec ion 3 we add ess he di icul ies associa ed wi h measu emen s abo e 110 GHz. This includes he conside a ion o su ace oughness, a sho summa y o high- equency pa asi ic e ec s and an excu sion on he impo ance o p obe posi ioning accu acy. Mo e de ails on high- equency pa asi ic e ec s can be ound in a di e en documen de eloped in Plana Cal, named “Guidelines o he design o calib a ion subs a es, including he sup- 4 p ession o pa asi ic modes o equencies up o and including 325 GHz”, which is also publically a ailable om he Plana Cal websi e [1]. Sec ion 4 con ains use ul ad ice o cha ac e izing nanode ices o e a wide equency ange, looking bo h in o he di icul ies o size and impedance misma ch compa ed o o dina y on-wa e measu emen s. Also, an o e iew o in e e ome ic me hods is gi en. Sec ion 5 inally co e s he subjec o unce ain ies in on-wa e measu emen s. Wi hou dedica ed so wa e, i is i ually impossible o ake in o accoun all he ele an sou ces o unce ain y. To his end, he VNATools so wa e package [12] de eloped by METAS has been ex ended o include unce ain ies in on-wa e measu emen s. In his Sec ion, also an in oduc ion o he main ea u es and use o VNATools is gi en. To achie e aceabili y, PTB has de eloped an unce ainy budge o mul iline TRL calib a ions in Ma lab based on he same measu emen model and unce ain y p opaga ion engine [13] as he one used in VNATools. Typical examples om he unce ain y budge calcula ions a e gi en in Sec ion 5, illus a ing he ela i e impo ance o he di e en sou ces o unce ain y in on-wa e measu emen s. 5 1 In oduc ion Design and cha ac e iza ion o high equency elec onics elies upon accu a ely de ining he e e ence plane o he calib a ion p ocess, and in gene al placing i as close as possible o he DUT o emo e all unwan ed pa asi ic. In o de o de ine such e e ence planes and emo e all he sys ema ic e o s o he measu emen se up (i.e., cable and ecei e con e sion losses, ampli ude and phase acking e o s, and o he e o s), a calib a ion p ocedu e [14] needs o be ca ied ou p io o he measu emen . Calib a ion echniques o on-wa e measu emen s ypically consis o a p obe-le el cal- ib a ion ( i s - ie ) pe o med on a low-loss subs a e (i.e., alumina o used silica) [15, 16, 17, 5]. This p obe-le el calib a ion is hen ans e ed o he en i onmen whe e he DUT is embedded in and o en, o inc ease he measu emen accu acy, his calib a ion is augmen ed wi h a second- ie on-wa e calib a ion o de-embedding s ep. This allows mo ing he e e - ence plane as close as possible o he DUT, by de-embedding he pa asi ics associa ed o he con ac pads and he de ice-access ias [18]. The p ocess o ans e ing he i s - ie cali- b a ion o ano he s uc u e assumes ha he del a capaci ance in oduced by changing he subs a e unde he p obes (i.e., bounda y condi ions) is negligible. As i was shown in [19] his capaci ance is dependen on he p obe opology and subs a e cha ac e is ic, c ea ing a coupling which inc eases wi h equencies. To emo e he e o s a ising om neglec ing o imp ope ly emo ing his del a capaci ance, he calib a ion ki should be implemen ed in he same en i onmen o he DUT. 1.1 P obe and Calib a ion Subs a e Selec ion Calib a ion subs a es a e p o ided by di e en endo s o pe o m p obe-le el calib a ion ( i s - ie ). The subs a es a e ealized as a slab o a single ma e ial p o iding low dispe sion (i.e., pe mi i i y change e sus equency) and low dielec ic losses. The models o he s anda ds p o ided in mos o he a ailable calib a ion subs a es a e based on simple (i.e., equency in a ian ) C, L and R, as shown in Fig. 1. Figu e 1 Equi alen ci cui s o he plana open, sho and load s anda ds. When calib a ion echniques using ull knowledge o he s anda ds a e employed (i.e., SOL based) he accu acy o he calib a ion can be imp o ed by using mo e accu a e ( e- quency dependen ) s anda d models. This can be achie ed using an expe imen al app oach as shown in [20, 21, 22], o a simula ion based (EM) one as shown in [23]. The choice o he op imum pi ch o he p obe o be employed in a gi en equency ange is dependen on he p obe echnology implemen a ion and ollows he same equi emen s o low dispe sion used in CPW lines. Fo his eason, assuming ha he inal pa o he p obe ansi ion is implemen ed as a CPW line design, as is he case o he Dominion p obe shown in Fig. 2, he choice o he max ip o ip spacing is bounded by he λ/4 a he maximum desi able equency o ope a ion and he e ec i e pe mi i i y o he line sec ion. When selec ing mic o-machined p obes (i.e., using silicon as ca ie ) i is impo an o conside he high pe mi i i y o he ma e ial (i.e., 11.9) when compu ing he e ec i e pe mi i i y o he CPW sec ion. 6 Figu e 2 SEM images o he mic o-machined p obe ips a e 3000 con ac s ( om [24]). When some ma e ial p ope ies o he p obe ip a e known he dispe sion cha ac e is ics o a CPW e sus gap wid h can be used as a ool o de ine he maximum p obe pi ch o be employed. When selec ing p obes o a gi en es ci cui s ew hings should be kep in mind: 1. The ska ing a ea wid h and leng h ex ension a e dependen on he p obe make, and should be analysed and ound compa ible wi h he pad sizes a ailable, o op imized when ull cus om designs a e made (see Fig. 3). Figu e 3 Landing a ea o p obe model om company #1 o he WR10 a), WR5 b) and WR3 c) equency band, p obe model om company #2 o he WR3 d) and p obe model om company #3 o he WR3 e). 2. When p obing on aluminium pads special p obe ip alloy should be used, i.e., nickel alloy p obe ips, o educe he con ac esis ance and imp o e he p obe li e ime. 3. When using comme cial echnologies, he educ ion o he e ec i e pad opening due he sc a ch p o ec ion, as shown in he ske ch gi en in Fig. 4, is educed om he d awn pad dimension o 1-3um, depending on he echnology. Figu e 4 C oss sec ional ske ch iew o pad opening and sc a ch p o ec ion. 7 1.2 Selec ion o Calib a ion Algo i hm Any on-wa e measu emen equi es he applica ion o a calib a ion p ocedu e o co ec o unwan ed bu una oidable pe u ba ion o he da a due o he en i onmen , he p obes, and he ins umen a ion i sel . This calib a ion p ocess is supposed o e eal he “ ue” pe o mance o he DUT. In he ollowing, basic and ad anced calib a ion algo ihms will be e iewed. 1.2.1 Selec ion Be ween Basic Calib a ion Algo i hms The e m basic calib a ion algo i hm e e s o calib a ion algo i hms which a e simple o execu e. The equi emen s in e ms o s anda ds a e di e en o all conside ed me hods and hus i is in e es ing o compa e he ield o applica ion o each algo i hm, he achie able accu acy and esul s. Ano he ac o which has o be conside ed when choosing a calib a ion algo i hm is he amoun o eal es a e on he wa e equi ed by each me hod. The i s calib a ion ou ine in es iga ed in Plana Cal was he sho open load h u (SOLT) ou ine. I equi es, as he name insinua es, sho , open, load and h u as s anda ds. I can be qui e easily applied o low equencies (≈15 GHz) down o DC. A c ucial poin is o en he de ini ion o he load s anda d. The SOLT echnique is mo e obus agains bad de ini ions o s anda ds. The second calib a ion algo i hm in es iga ed was he line e lec ma ch (LRM) algo i hm which equi es a ansmission line, a e lec (ei he open o sho ) and a load. In e ms o equency i has a simila ange o applica ion as he SOLT algo i hm. Again a c ucial poin is he de ini ion o he load s anda d. The LRM echnique equi es he leas connec ions and s anda ds compa ed o SOLT and LRRM echniques. The hi d calib a ion algo i hm was line e lec e lec ma ch (LRRM). I equi es a ansmission line, a i s e lec (e.g. an open), a second e lec (e.g. a sho ) and a load. The applicable ange o equencies is om medium equencies (≈40 GHz) down o DC. In his me hod an induc i e componen o he load is de e mined du ing calib a ion. This induc i e componen has i s o igin in he design o he load i sel bu as well in he leng h o he line leading o he load. This leng h is no easy o con ol because o p obe ska ing when con ac ing he load. Thus o loads which a e no well de ined he LRRM echnique can yield good esul s. No e ha he implemen a ion o he LRRM algo i hm can di e be ween di e en so wa e packages, e.g. VNA Tools II [25, 12] has a di e en implemen a ion han WinCal [26]. The p e ious ema ks a e only applicable o si ua ions whe e he de ini ion o s anda ds o he espec i e calib a ion comes om he manu ac u e o om geome y and ma e- ial p ope ies. All h ee ypes o calib a ions yield simila esul s in si ua ions whe e he de ini ion o s anda ds is de i ed om ano he p e ious calib a ion. 1.2.2 Calib a ion algo i hm in ol ing eigen alue p oblems Calib a ion algo i hms o VNAs which equi e only pa ially known s anda ds pose p oblems o unce ain y calcula ion. Examples a e LRM and TRL calib a ions whe e he e lec i i y o he line can no be speci ied because in he algo i hm i is assumed ha he line has a cha ac e is ic impedance o 50 Ω. In eali y he line in use will no ha e exac ly he equi ed cha ac e is ic impedance and hus his needs o be aken in o accoun o unce ain y compu- a ion. The algo i hm p esen ed in [27] is a gene aliza ion o calib a ion schemes wi h pa ly unknown s anda ds, including [5]. The gene aliza ion consis s o cons uc ing an eigen alue p oblem o each calib a ion scheme. One ob ious ad an age is ha he same algo i hm can be used o di e en schemes as TRM, LRM, TRL and LRL. Ano he ad an age is ha pa ly unknown lines can now be desc ibed wi h non-ze o e lec ion and unce ain y, which is a clea imp o emen o e he adi ional TRL algo i hm. O e -de e mined calib a ion wi h 8 2.2 Limi s o es ablished echniques o ans e ing unce ain ies In his sec ion we epo on me hods o ans e unce ain ies om e e ence calib a ion subs a es o wo king calib a ion subs a es. The aim is o p ese e he low unce ain ies in S-pa ame e measu emen s achie ed on cus om-made e e ence calib a ion subs a es e en when using low-cos wo king calib a ion subs a es, such as e.g. impedance s anda d sub- s a es, which can be pu chased om se e al on-wa e endo s. Recommenda ions o he ans e o unce ain ies will be gi en a he end o he sec ion. 2.2.1 Subs a e pe mi i i y compensa ion In [33], a simple capaci ance model was de eloped o accoun o he e ec o a change in subs a e pe mi i i y on coplana wa eguide TRL calib a ions pe o med on di e en subs a e ma e ials. Fo all calib a ions, he e e ence plane was mo ed o he p obe ip and he e e ence impedance was se o 50 Ω. Whe eas in [33] all c oss-sec ional dimensions o he CPWs on he di e en subs a es we e assumed iden ical, he in es iga ion in [34] demons a ed ha also he measu emen e o caused by di e ences in he conduc o geom- e y can be accoun ed o . As he measu emen s in [33] and in [34] we e limi ed o he 40 GHz equency ange, we in es iga ed he pe o mance o his compensa ion echnique using cus om-made used silica and Al2O3subs a es up o 110 GHz. 0 10 20 30 40 50 60 70 80 90 100 110 F equency (GHz) 0 0.05 0.1 0.15 0.2 0.25 Uppe bound on |Sij-Sij)| Silica MTRL 50 Ohm s. Al2O3 MTRL 50 Ohm Silica MTRL 50 Ohm s. Al2O3 MTRL 50 Ohm /w pe mi i i y compensa ion Figu e 8 Wo s -case e o bounds calcula ed by calib a ion compa ison me hod [32]. Figu e 8 shows he wo s -case e o bounds calcula ed o mul iline TRL calib a ions using [32] on he wo di e en wa e s be o e (blue) and a e ( ed) applying he subs a e pe mi i i y compensa ion echnique o [33]. The ed cu e shows a signi ican educ ion o he e o bound a e applying he pe mi i i y compensa ion. As he calib a ion compa ison echnique [32] ends o o e es ima e he ac ual e o s in he measu emen s, we decided o in es iga e he ac ual de ia ions om he e e ence measu emen esul be o e and a e applying he subs a e pe mi i i y compensa ion. 15 To his end, we in es iga ed measu emen s o di e en de ices ab ica ed on he Al2O3 wa e in he equency ange om 1 o 110 GHz (see Figs. 9-13). The mul iline TRL cali- b a ion on he Al2O3wa e gi es he mos accu a e esul (black cu es), while he mul iline TRL calib a ion on he used silica wa e (b own cu es) will in oduce a sys ema ic e o due o he di e ences in subs a e pe mi i i y and conduc o geome ies. The ed cu es show he esul o he mul iline TRL calib a ion on he used silica wa e a e applying he subs a e pe mi i i y compensa ion echnique o [33]. In he ollowing igu es, he e o - co ec ed e lec ion and ansmission measu emen a e shown on he le -hand side, while he di e ences wi h ega d o he e e ence calib a ion a e shown on he igh -hand side. In he case o one-po de ices only he esul s o e lec ion a e shown. In Fig. 9, he esul s o an a enua o de ice a e displayed. While he pe mi i i y compensa ion only sligh ly imp o es he e o in magni ude o S11 and S21, he e is a angible imp o emen in he phase o e he en i e equency ange. Fo equencies abo e 60 GHz, he e o s in he magni ude o S21 canno be compensa ed by he simple capaci ance model o [33]. Figu e 10 shows he esul s o a 11.4 mm long CPW line on Al2O3subs a e. Fo S11, he pe mi i i y compensa ion does no o e any no able imp o emen o e he used silica calib a ion. In he phase o S21, he e is a angible imp o emen o e he en i e equency ange. Figu e 11 shows he esul s o a misma ched CPW line on Al2O3subs a e. He e, he pe mi i i y compensa ion leads o an imp o emen in bo h S11 and S21. As is e iden om he le -hand side, he esonance equencies o he black and ed cu e line up a e 0 20 40 60 80 100 F equency /GHz -20 -15 -10 |S11|/dB 0 20 40 60 80 100 F equency /GHz -2 0 2 |S11|/dB-|S11| e /dB 0 20 40 60 80 100 F equency /GHz -100 -50 0 S11/° 0 20 40 60 80 100 F equency /GHz -20 -10 0 S11/° - S11/° e 0 20 40 60 80 100 F equency /GHz -16 -15 -14 |S21|/dB 0 20 40 60 80 100 F equency /GHz -0.5 0 0.5 |S21|/dB-|S21| e /dB 0 20 40 60 80 100 F equency /GHz -200 -100 0 S21/° 0 20 40 60 80 100 F equency /GHz -10 -5 0 5 S21/° - S21/° e Figu e 9 le : e lec ion and ansmission measu emen o a enua o de ice on Al2O3subs a e igh : measu emen no malized o MTRL esul on Al2O3 colo s: MTRL on Al2O3(black), on used silica, on used silica a e pe m. comp. 16 0 20 40 60 80 100 F equency /GHz -60 -40 -20 0 |S11|/dB 0 20 40 60 80 100 F equency /GHz -20 0 20 40 |S11|/dB-|S11| e /dB 0 20 40 60 80 100 F equency /GHz -400 -200 0 200 S11/° 0 20 40 60 80 100 F equency /GHz -400 -200 0 200 S11/° - S11/° e 0 20 40 60 80 100 F equency /GHz -4 -2 0 |S21|/dB 0 20 40 60 80 100 F equency /GHz -0.4 -0.2 0 0.2 |S21|/dB-|S21| e /dB 0 20 40 60 80 100 F equency /GHz -400 -200 0 200 S21/° 0 20 40 60 80 100 F equency /GHz -5 0 5 S21/° - S21/° e Figu e 10 le : e lec ion and ansmission measu emen o 11.4 mm long CPW line on Al2O3 igh : measu emen no malized o MTRL esul on Al2O3 colo s: MTRL on Al2O3(black), on used silica, on used silica a e pe m. comp. applying he compensa ion. Again, he co ec i e e ec o he pe mi i i y compensa ion is mo e no eable in he phase, and o equencies abo e 60 GHz, he e o s in he magni ude o S21 canno be compensa ed by he echnique o [33]. Figu e 12 shows he esul s o a one-po de ice, an o se open. The pe mi i i y compensa ion only imp o es he phase o S11. The compensa ion does no wo k o he magni ude o S11, and again, o equencies abo e 60 GHz, he sys ema ic e o s in he magni ude o S11 s a o inc ease wi h equency. Figu e 13 shows he esul s o a 0.4 mm long h u line on Al2O3subs a e. Fo S11, he pe mi i i y compensa ion ha dly o e s any imp o emen o e he used silica calib a- ion. The e is a angible imp o emen in he phase o S21 o e he en i e equency ange. Fo equencies abo e 60 GHz, he sys ema ic e o s in he magni ude o S21 canno be compensa ed by he echnique o [33]. In summa y, one can s a e he pe mi i i y compensa ion echnique o [33] mos ly im- p o es on he phase e o in oduced by he o -wa e calib a ion on used silica. The e ec is gene ally mo e no eable in S21 compa ed o S11. Wi h ega d o he magni ude e o , which d as ically inc eases o equencies abo e 60 GHz in S21, almos no imp o emen can be ound. 17 0 20 40 60 80 100 F equency /GHz -60 -40 -20 0 |S11|/dB 0 20 40 60 80 100 F equency /GHz -20 -10 0 10 |S11|/dB-|S11| e /dB 0 20 40 60 80 100 F equency /GHz -100 0 100 S11/° 0 20 40 60 80 100 F equency /GHz -200 -100 0 100 S11/° - S11/° e 0 20 40 60 80 100 F equency /GHz -2 -1 0 |S21|/dB 0 20 40 60 80 100 F equency /GHz -0.4 -0.2 0 0.2 |S21|/dB-|S21| e /dB 0 20 40 60 80 100 F equency /GHz -400 -200 0 200 S21/° 0 20 40 60 80 100 F equency /GHz -10 -5 0 5 S21/° - S21/° e Figu e 11 le : e lec ion and ansmission measu emen o misma ched line on Al2O3 igh : measu emen no malized o MTRL esul on Al2O3 colo s: MTRL on Al2O3(black), on used silica, on used silica a e pe m. comp. 0 20 40 60 80 100 F equency /GHz -1 -0.5 0 0.5 |S11|/dB 0 20 40 60 80 100 F equency /GHz -0.5 0 0.5 |S11|/dB-|S11| e /dB 0 20 40 60 80 100 F equency /GHz -150 -100 -50 0 S11/° 0 20 40 60 80 100 F equency /GHz -10 -5 0 S11/° - S11/° e 0 20 40 60 80 100 F equency /GHz -80 -60 -40 -20 |S21|/dB 0 20 40 60 80 100 F equency /GHz -2 -1 0 1 |S21|/dB-|S21| e /dB 0 20 40 60 80 100 F equency /GHz -400 -200 0 200 S21/° 0 20 40 60 80 100 F equency /GHz -6 -4 -2 0 S21/° - S21/° e Figu e 12 le : e lec ion and ansmission measu emen o open de ice on Al2O3 igh : measu emen no malized o MTRL esul on Al2O3 colo s: MTRL on Al2O3(black), on used silica, on used silica a e pe m. comp. 18 0 20 40 60 80 100 F equency /GHz -80 -60 -40 -20 |S11|/dB 0 20 40 60 80 100 F equency /GHz -20 0 20 40 |S11|/dB-|S11| e /dB 0 20 40 60 80 100 F equency /GHz -400 -200 0 200 S11/° 0 20 40 60 80 100 F equency /GHz -400 -200 0 200 S11/° - S11/° e 0 20 40 60 80 100 F equency /GHz -0.4 -0.2 0 0.2 |S21|/dB 0 20 40 60 80 100 F equency /GHz -0.4 -0.2 0 0.2 |S21|/dB-|S21| e /dB 0 20 40 60 80 100 F equency /GHz -150 -100 -50 0 S21/° 0 20 40 60 80 100 F equency /GHz -5 0 5 S21/° - S21/° e Figu e 13 le : e lec ion and ansmission measu emen o h u line on Al2O3 igh : measu emen no malized o MTRL esul on Al2O3 colo s: MTRL on Al2O3(black), on used silica, on used silica a e pe m. comp. 19 2.2.2 Residual e o co ec ion A mo e gene al app oach o compensa ing sys ema ic e o s in oduced by he VNA cali- b a ion is he de e mina ion o esidual e o s and he applica ion o a second-o de e o co ec ion a e wa ds. In [35], a me hod o de e mining complex esidual e o s o wo-po VNA calib a ions was p esen ed which makes use o a ime-domain app oach. The esid- ual e o s a e ex ac ed om a dis ance- equency sys em model using a special es ima ion algo i hm based on he quasi-op imal unscen ed Kalman il e . Since he me hod equi es only h ee measu emen condi ions, i is pa icula ly sui ed o on-wa e applica ions, as hese condi ions can be ob ained om using only one e i ica ion line. In [36], he same measu emen condi ions a e exploi ed, bu since he esidual e o e ms a e now es ima ed by applying a leas -mean-squa es me hod he calcula ion ime is signi ican ly educed. He e, we de e mined he esidual e o s o calib a ed wo-po on-wa e measu emen s up o 110 GHz wi h he me hod o [36], u ilizing he comme cial calib a ion subs a e GGB CS5 and GGB100 mic owa e p obes. As e i ica ion line, line 10 wi h a leng h o 6600 µm was used. As DUTs lines o di e en leng hs we e used. By analyzing he e o -co ec ed mea- su emen s o he DUTs, we compa ed he accu acy o SOLT calib a ions wi h cha ac e ized s anda ds o SOLT calib a ions wi h manu ac u e de ini ions and o second-o de -co ec ed SOLT calib a ions wi h manu ac u e de ini ions. In he ollowing igu es, he e o -co ec ed e lec ion and ansmission measu emen a e shown on he le -hand side, while he di e - ences wi h ega d o he e e ence calib a ion (SOLT wi h cha ac e ized s anda ds) a e shown on he igh -hand side. Figu es 14-16 show he esul s o lines wi h leng hs in he ange 550 . . . 1500 µm. One ob ious disad an age o he second-o de e o co ec ion becomes appa en o equen- cies below 10 GHz: addi ional e o s a e in oduced leading o unphysical beha io in bo h e lec ion and ansmission. Fo highe equencies, howe e , he second-o de co ec ion is mos ly wo king as expec ed. In he measu ed e lec ions, he second-o de e o co ec ion is bene icial in bo h magni ude and phase, as can be seen om he ed S11 cu es app oaching he black S11 cu es in a ange o app oxima ely 20 . . . 110 GHz. In he measu ed ansmis- sion, he e is almos no imp o emen o he magni ude o S21, while he phase o S21 e en de e io a es sligh ly by means o he second-o de e o co ec ion. In summa y one can s a e ha he second-o de e o co ec ion o [36] shows some p omise bu is cu en ly limi ed by he accu acy wi h which he esidual e o s can be de e mined. A he edges o he equency ange (ca. 5% o he equency band), he e o o he il e ing algo i hm inc eases. This applies o measu emen s o bo h ansmission and e lec ion coe icien s. In p inciple, he e ec can be educed by applying a e i ica ion line wi h a longe leng h. The cu en s udy was limi ed by he numbe o DUTs and he e i ica ion line a ailable on he comme cial calib a ion subs a e. Fu u e in es iga ions should y o ex end he s udy o be e unde s and and o e come he cu en limi a ions o he me hod o [36]. 20 0 20 40 60 80 100 F equency /GHz -80 -60 -40 -20 |S11|/dB 0 20 40 60 80 100 F equency /GHz -20 0 20 40 |S11|/dB-|S11| e /dB 0 20 40 60 80 100 F equency /GHz -400 -200 0 200 S11/° 0 20 40 60 80 100 F equency /GHz -200 -100 0 100 S11/° - S11/° e 0 20 40 60 80 100 F equency /GHz -0.4 -0.2 0 0.2 |S21|/dB 0 20 40 60 80 100 F equency /GHz -0.2 0 0.2 |S21|/dB-|S21| e /dB 0 20 40 60 80 100 F equency /GHz -200 -100 0 S21/° 0 20 40 60 80 100 F equency /GHz -10 -5 0 S21/° - S21/° e Figu e 14 le : SOLT-co ec ed e lec ion and ansmission o 550 µm long line on GGB CS5 igh : measu emen no malized o SOLT wi h cha ac e ized s anda ds colo s: cha ac e ized s anda ds (black), manu ac u e de ini ions, manu ac u e de i- ni ions a e esidual e o co ec ion 21 0 20 40 60 80 100 F equency /GHz -60 -40 -20 |S11|/dB 0 20 40 60 80 100 F equency /GHz -20 0 20 |S11|/dB-|S11| e /dB 0 20 40 60 80 100 F equency /GHz -400 -200 0 200 S11/° 0 20 40 60 80 100 F equency /GHz -400 -200 0 200 S11/° - S11/° e 0 20 40 60 80 100 F equency /GHz -0.5 0 0.5 |S21|/dB 0 20 40 60 80 100 F equency /GHz -0.2 0 0.2 |S21|/dB-|S21| e /dB 0 20 40 60 80 100 F equency /GHz -400 -200 0 200 S21/° 0 20 40 60 80 100 F equency /GHz -10 -5 0 S21/° - S21/° e Figu e 15 le : SOLT-co ec ed e lec ion and ansmission o 1000 µm long line on GGB CS5 igh : measu emen no malized o SOLT wi h cha ac e ized s anda ds colo s: cha ac e ized s anda ds (black), manu ac u e de ini ions, manu ac u e de i- ni ions a e esidual e o co ec ion 22 0 20 40 60 80 100 F equency /GHz -60 -40 -20 |S11|/dB 0 20 40 60 80 100 F equency /GHz -20 0 20 |S11|/dB-|S11| e /dB 0 20 40 60 80 100 F equency /GHz -400 -200 0 200 S11/° 0 20 40 60 80 100 F equency /GHz -400 -200 0 200 S11/° - S11/° e 0 20 40 60 80 100 F equency /GHz -1 -0.5 0 0.5 |S21|/dB 0 20 40 60 80 100 F equency /GHz -0.2 0 0.2 |S21|/dB-|S21| e /dB 0 20 40 60 80 100 F equency /GHz -400 -200 0 200 S21/° 0 20 40 60 80 100 F equency /GHz -10 -5 0 S21/° - S21/° e Figu e 16 le : SOLT-co ec ed e lec ion and ansmission o 1500 µm long line on GGB CS5 igh : measu emen no malized o SOLT wi h cha ac e ized s anda ds colo s: cha ac e ized s anda ds (black), manu ac u e de ini ions, manu ac u e de i- ni ions a e esidual e o co ec ion 23 2.3 T ans e o unce ain ies wi h he aid o ISS In [22] i was demons a ed ha p ope ly cha ac e ized s anda ds can be used o accoun o di e ences be ween he comme cial ISS and he a ge DUT measu emen si ua ion. The esul s o a e e ence MTRL calib a ion using cus om s anda ds we e in essence duplica ed wi h he aid o cha ac e ized ISS s anda ds and a much simple calib a ion, in his case SOLT. This cons i u es a big imp o emen o e any o he app oaches discussed in he wo p e ious subsec ions, whe e a sys ema ic e o wi h ega d o he e e ence esul emained. The e o e, in o de o ans e unce ain ies o indus ial applica ions whe e comme cial ISS subs a es and simple calib a ion algo i hms ha e o be used, one has o i s cha ac e ize he s anda ds in a manne which is adequa e o he a ge applica ion. This equi es building cus om calib a ion s anda ds on he a ge DUT wa e , which se e o cha ac e izing he ISS calib a ion s anda ds app op ia ely. In he ollowing, we demons a e his app oach wi h he cus om-made Al2O3wa e as he a ge DUT wa e and he GGB CS5 calib a ion subs a e as comme cially a ailable ISS subs a e. Recen ly, PTB de eloped a aceabili y pa h o on-wa e S-pa ame e measu emen s based on he MTRL calib a ion algo i hm [10]. The me hodology o [10] o es ablishing a comp ehensi e unce ain y budge can also be applied o o he subs a es, as long as he wideband ma e ial p ope ies a e known and single-mode p opaga ion can be assumed. Fo he cus om-made Al2O3wa e used in ou s udies, he la e condi ion is s ic ly ul illed only o equencies below ca. 70 GHz. Fo highe equencies, he e ec s o dispe sion and in e ac ion wi h highe -o de and o he pa asi ic modes a e cu en ly no ully cap u ed in he unce ain y budge . None heless we used his p elimina y unce ain y budge and ea ed he Al2O3wa e as e e ence calib a ion wa e o cha ac e izing he s anda ds on he GGB CS5 subs a e. Figu es 17 and 18 show he esul o cha ac e izing he Open/Sho /Load/Th u s an- da ds by means o a e e ence mul iline TRL calib a ion on he cus om-made Al2O3wa e . The igu es also show he expanded unce ain y in e als comp ising he in luences o MTRL calib a ion s anda d unce ain ies, unce ain ies om he ins umen a ion used, cabling in- luences and epea abili y e ec s. I may appea su p ising ha some o he cha ac e ized s anda ds show gain e en hough hey a e passi e de ices. This can easily be explained by he ac ha he dis ance be ween he p obe ips on he CS5 s anda ds was smalle han he dis ance be ween he calib a ion e e ence planes on he Al2O3wa e . None heless he cha - ac e ized CS5 s anda ds can be used as ans e s anda ds o accu a ely measu ing DUTs on he Al2O3wa e . Fig. 19 compa es he measu emen esul s o an a enua o DUT and a misma ched line DUT ab ica ed on he Al2O3wa e . The black cu es show he e lec ion and ansmission when using he e e ence MTRL calib a ion on he Al2O3subs a e, he ed cu es show he co esponding esul s o he SOLT calib a ion wi h he cha ac e ized CS5 s anda ds. The shaded a eas indica e he expanded unce ain y in e als. I can be clea ly seen ha he nominal alues coincide o bo h calib a ions, p o ing he consis ency o he app oach. The only di e ences appea in he expanded unce ain ies, which a e usually sligh ly inc eased o he calib a ion wi h he cha ac e ized s anda ds. Exempla y unce ain y budge alues o he DUTs co ec ed ia he SOLT calib a ion wi h cha ac e ized CS5 s anda ds a e gi en in he Tables 5-8. These ables show he unce - ain y budge composi ion o he magni ude o S11 and he phase o S21 o he DUTs a a equency o 65 GHz. The calib a ion s anda d unce ain ies a e designa ed wi h PTB ML in he beginning, poin ing o he ac ha he cha ac e iza ion was pe o med wi h he PTB mul iline calib a ion. The ables clea ly show ha he budge s a e mos ly domina ed by he calib a ion s anda d unce ain ies. Fo he phase o S21, also cable e ec s and DUT unce ain y p o ide signi ican con ibu ions o he o al unce ain y a 65 GHz. 24 exhibi highe -o de modes abo e 50 GHz, depending on he bounda y condi ions abo e and below he subs a e. I is good p ac ice o use an abso bing ma e ial (wi h simila dielec ic cons an as he subs a e) be ween he me allic wa e chuck and he DUT, which will supp ess unwan ed modes. The DUT is e ec i ely a di e en s uc u e (elec omagne ically) wi h and wi hou his abso be , and measu emen esul s can di e widely depending on whe he o no i is used. Some imes he p esence o sys ema ic e o s in he measu emen s can be de ec ed espe- cially when non-physical beha iou is obse ed – e.g. when he obse ed linea magni ude o he e lec ion coe icien is g ea e han uni y. This is indica i e o an inapp op ia e e e ence s anda d used du ing calib a ion. Addi ionally, he p esence o signi ican ipple on some measu emen aces sugges pe haps he use o an in e io calib a ion echnique. Gene ally, he choice o e e ence calib a ion subs a e can ha e a majo impac on he achie ed measu emen s. This is because he di e en calib a ion subs a es p o ide di e - en calib a ion e e ence alues (e.g. due o he use o di e en subs a e ma e ials o he calib a ion subs a e). This means ha e en he same unco ec ed measu emen da a o a gi en de ice unde es (DUT) will gi e ise o di e en co ec ed S-pa ame e alues due o di e en e e ence alues being used du ing he calib a ion p ocess. This occu s when a VNA is calib a ed using s anda ds ound on one wa e (e.g. a comme cial impedance s an- da d subs a e), and hen measu emen s a e made subsequen ly o DUTs on ano he wa e (e.g. he wa e con aining he de ices ha need es ing). Fo his eason, when making on-wa e S-pa ame e measu emen s ha a e no SI aceable, i is e y impo an o s a e wha e e ences we e used du ing calib a ion. In ac , as a gene al ule, i is good p ac ise o s a e e e y hing abou he measu emen se up ha migh ha e an impac on he ob ained measu emen esul s – e.g. VNA, p obes (including p obe pi ch) and associa ed calib a- ion ha dwa e and so wa e (i.e. he calib a ion subs a e, he calib a ion me hod and he calib a ion s anda ds used). Whene e possible, i is p e e able o ab ica e some app op ia e e e ence s anda ds on he same wa e as he DUT. As a minimum, some leng hs o CPW line and some high- e lec ing s anda ds (usually sho -ci cui s) a e needed. These enable he use o one o he calib a ion echniques de i ed om he TRL app oach [44, 5] which make use o he CPW lines o acqui e a e e ence alue which is de e mined by he p ope ies o he DUT subs a e ma e ial. These echniques a e gene ally supe io o he mo e con en ional Sho - Open-Load-Th u (SOLT) echnique, and a e less dependen on accu a e and epea able p obe-placemen . Fo manual p obe s a ions, his can be a signi ican sou ce o e o a highe equencies i he calib a ion me hod equi es known alues o he phase o he calib a ion s anda ds. 3.2 Summa y o high- equency pa asi ic e ec s When ope a ing in he mm-wa e equency ange (i.e., in he con ex o his sec ion abo e 110 GHz), he calib a ion e o s a ising om he inaccu acy o s anda d models and mul- imode p opaga ion s a o se e ely impac he calib a ion accu acy ha can be achie ed. Fo his eason a guideline o in o m he eade on hese po en ial p oblems and he means o minimize hem was compiled in he EMPIR Plana Cal p ojec , namely, “Guidelines o he design o calib a ion subs a es, including he supp ession o pa asi ic modes o equen- cies up o and including 325 GHz ”. The in e es ed eade is in i ed o amilia ize himsel wi h hese e ec s using he abo e men ioned documen . In he ollowing a selec ion o he sugges ions p o ided in he documen is gi en: Choice o subs a e hickness (Guideline #1) Compu e he c i ical equency ( c) o pa asi ic modes (e.g. highe o de modes and subs a e modes) [45] o he calib a ion subs a e employed in he gi en con igu a ion (i.e., me allic 31 o dielec ic chuck) and selec hose in which cis ou side he calib a ion equency o only occu s in he uppe calib a ion ange, o a oid excessi e coupling o powe o unwan ed modes. Impac o g ound- o-g ound spacing in CPWs (Guideline #4) The in luences o CPW g ound wid h and o g ound- o-g ound spacing, a e con ibu ing o pa asi ic e ec s in he calib a ed esul s, in his case a dip in S-pa ame e s a a ce ain equency. To al CPW wid h de e mines he equency whe e his dip occu s, and g ound- o-g ound spacing in luences he s eng h o he dip beha io . Thus, he bes way o mi iga e he impac o his dip is o keep he o al CPW wid h smalle han he o mula gi en in [45], which equi es a adeo be ween he CPW o al wid h, he used ma e ial and he uppe equency limi max. Chuck opology (Guideline #5) Using o he chuck a ma e ial which has a pe mi i i y alue simila o he calib a ion subs a e educes he e ec s which con ibu e o he deg ada ion o he accu acy o CPW mTRL calib a ions. Fu he in es iga ions ha e shown ha his is ue also o a chuck ma e ial wi h a pe mi i i y la ge han ha o he wa e , because such a laye ed s uc u e does no suppo su ace wa es ei he . In luence o in-line and side-way neighbou ing s uc u es (Guideline #6) One should keep sensi i e egions o he p obe shadow ee o s uc u es o a oid p obe coupling o neighbo ing s uc u es, as shown in he igu e below (in es iga ions pe o med up o 70 GHz). Cus om designed TRL ki (Guideline #8) When designing cus om ki s o LRM/TRL calib a ion he e lec should be ealized as an o se one, keeping he minimum dis ance be ween he e ec i e e lec and he cen e o he h u line (in insic calib a ion plane) o a oid equi ing sign changes in he solu ion o he calib a ion equa ions. 3.3 Su ace oughness e ec s Su ace oughness is one among di e en pa asi ic e ec s ha a ec signal in eg i y o p op- aga ing signals on ansmission lines. While adia ion mainly inc eases he a enua ion α, dispe sion e ec s ha e a di ec in luence on he phase eloci y ph and only indi ec ly a ec a enua ion by inc easing he line capaci ance and hus, dielec ic loss. In con as he e o, su ace oughness has shown o di ec ly impac ing on bo h, a enua ion and phase eloci y. The impac magni ude depends on he ac ual oughness on he one hand and he ope a- ion equency on he o he . Al hough i is a an ine i able p ope y o eal su aces and can be app op ia ely aken in o accoun by modeling and simula ion, o many p ac ical applica ions an impac o only li le su ace oughness causing de ia ions be ween ough and 32 smoo h esponses wi hin <5 % in a enua ion αand <0.5 % in phase coe icien βmay be conside ed as negligible. Table 9 F equency Bands and Wa eguide De ini ions. Band Wa eguide F equency Limi s W WR10 75 −110 GHz F WR08 90 −140 GHz D WR06 110 −170 GHz G WR05 140 −220 GHz Y WR04 170 −260 GHz Y WR03 220 −325 GHz Y WR02 325 −500 GHz Y WR01.5 500 −750 GHz Fo his pu pose, his sec ion p o ides ma gins o he oo -mean-squa e (RMS) oughness Rqwhich mee hese equi emen s o e he equency bands om W- o Y-Band as shown in Table 9 in e ms o bo h, a gene al conside a ion and speci ic applica ion o ce ain ansmission lines. −0.4−0.3−0.2−0.1 0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1 0 0.2 0.4 0.6 0.8 1 dep h x( µ m) No malized σand H σ(x)/σDC ˆ=CDF |B0,ideal| |B0, ough| Figu e 20 Conduc i i y p o ile and skin e ec on smoo h and ough su ace a 50 GHz wi h Rq= 1 µ m By making use o he G adien Model [46], he pene a ing magne ic ield can be cal- cula ed o a gi en su ace which is ep esen ed ei he by a measu ed bea ing a ea cu e (BAC) o Rqas shown in Fig. 20. As explained in [46], hese esponses may be used o de- i e e ec i e ma e ial pa ame e s which in u n accoun o he impac o su ace oughness in ansmission line models such as e.g. [45] o a CPW o [47] o ec angula wa eguides (RWG). While he magni ude and a io o su ace oughness impac on αand ph depend on he ype, speci ic c oss sec ion geome y and ma e ials o he ansmission line, he su - ace impedance as desc ibed in [46] p o ides an independen app oach o illus a ion and compa ison: Z=1 σe δ(σe )+j1 σDCδ(µ ,e )= πµ0µ σe +j πµ0µ ,e σDC =R+jωLi,(1) whe e σDC is he bulk conduc i i y as a ma e ial p ope y o he conduc o (e.g. 58 MS/m in case o bulk coppe ) and σe and µ ,e deno e e ec i e, equency dependen ma e ial 33 pa ame e alues de i ed om he G adien Model app oach which ep esen he impac o su ace oughness. While he eal pa o Za ec s he a enua ion and is he e o e ela ed o R, i s imagina y pa in luences ph and is ela ed o Li,, which is he inne induc ance. 0 2 4 6 8 10 12 14 16 18 20 22 24 26 28 30 32 34 36 38 40 0 5 10 15 20 25 Rq(nm) ∆< {Z}(%) 110 GHz 140 GHz 170 GHz 220 GHz 260 GHz 325 GHz 500 GHz 750 GHz Figu e 21 Rela i e de ia ion ∆< {Z}be ween ough and smoo h case in % 0 2 4 6 8 10 12 14 16 18 20 22 24 26 28 30 32 34 36 38 40 0 100 200 300 400 Rq(nm) ∆= {Z}(%) 110 GHz 140 GHz 170 GHz 220 GHz 260 GHz 325 GHz 500 GHz 750 GHz Figu e 22 Rela i e de ia ion ∆= {Z}be ween ough and smoo h case in % Figs. 21 and 22 show he ela i e de ia ion be ween he ough and smoo h Zdepending on Rq o he conside ed equency band limi s. F om he eal pa , a 5 % ma gin can he e o e be de i ed o each band, indica ing he need o lowe Rqwi h inc easing ope a ion equencies. Al hough he de ia ion wi hin he imagina y pa o Zin Fig. 22 exceeds 100 % o ela i ely small Rqal eady, i is wo h o men ion, ha i only con ibu es o he inne induc ance e m Liwhich is much smalle han he ou e induc ance Lo(LiLo) and is he e o e only a ac ion o he o al induc ance o mos p ac ical ansmission lines. Fu he mo e, he 5 % limi in < {Z}is no di ec ly ela ed o he a enua ion o a speci ic ansmission line, since he conduc o ci cum e ence mus be conside ed acco ding o he c oss sec ion geome y [48]. While he layou o a CPW allows o a ious implemen a ions depending on he subs a e ma e ial, manu ac u ing aspec s and o he s, ec angula wa eguides a e ypically p oduced 34 in s anda dized dimensions acco ding o hei iden i ie WR-XX in Table 9. This allows o p ecise p edic ions o he su ace oughness impac which is shown in Figs. 23 and 24. 0 5 10 15 20 25 30 35 40 45 50 0 5 10 15 20 Rq(nm) ∆α(%) WR10 WR08 WR06 WR05 WR04 WR03 WR02 WR01.5 Figu e 23 Rela i e de ia ion ∆αbe ween ough and smoo h RWG in %. 0 5 10 15 20 25 30 35 40 45 50 0 2 4 6 8 10 Rq(nm) ∆β(o / oo) WR10 WR08 WR06 WR05 WR04 WR03 WR02 WR01.5 Figu e 24 Rela i e de ia ion ∆βbe ween ough and smoo h RWG in o / oo. No e, ha he de ia ion in βis p o ided in o / oo as i is a he small as compa ed o he impac on α. Howe e , i comes along wi h a small shi o he cu o equency c owa ds lowe alues. The Rq-ma gins o CPWs can be p o ided o ce ain cases only, since CPW lines can be ab ica ed in a much g ea e a ie y compa ed o s anda dized RWG. Exempla ily, a CPW implemen ed on Al2O3subs a e (ε = 9.7) is conside ed wi h he c oss sec ion geome y as p o ided in Fig. 25. In addi ion o he phase coe icien β, in his case, also he e ec i e ela i e pe mi i i y is conside ed acco ding o: ε ,e =c0 ph 2 (2) The co esponding Rqma gins a e p o ided in Figs. 26 o 31 o a enua ion and phase coe icien o di e en subs a e hicknesses o h= 100 µ m and h= 10 mm, espec i ely. 35 wc= 50 µ m wg= 270 µ mwg= 270 µ m s= 25 µ ms= 25 µ m = 5 µ m h Figu e 25 C oss sec ion geome y o a CPW s uc u e as conside ed in his compa ison. 10 12 14 16 18 20 22 24 26 28 30 32 34 36 38 40 42 44 46 48 50 0 5 10 15 Rq(nm) ∆α(%) 110 GHz 140 GHz 170 GHz 220 GHz 260 GHz 325 GHz Figu e 26 Rela i e de ia ion ∆αbe ween ough and smoo h CPW in % o h= 100 µ m. 10 12 14 16 18 20 22 24 26 28 30 32 34 36 38 40 42 44 46 48 50 0.2 0.4 0.6 0.8 1 Rq(nm) ∆β(%) 110 GHz 140 GHz 170 GHz 220 GHz 260 GHz 325 GHz Figu e 27 Rela i e de ia ion ∆βbe ween ough and smoo h CPW in % o h= 100 µ m. 36 10 12 14 16 18 20 22 24 26 28 30 32 34 36 38 40 42 44 46 48 50 0.5 1 1.5 2 Rq(nm) ∆ε ,e (%) 110 GHz 140 GHz 170 GHz 220 GHz 260 GHz 325 GHz Figu e 28 Rela i e de ia ion ∆ε ,e be ween ough and smoo h CPW in % o h= 100 µ m. 10 12 14 16 18 20 22 24 26 28 30 32 34 36 38 40 42 44 46 48 50 0 2 4 6 Rq(nm) ∆α(%) 110 GHz 140 GHz Figu e 29 Rela i e de ia ion ∆αbe ween ough and smoo h CPW in % o h= 10 mm. 10 12 14 16 18 20 22 24 26 28 30 32 34 36 38 40 42 44 46 48 50 0.2 0.4 0.6 0.8 1 Rq(nm) ∆β(%) 110 GHz 140 GHz Figu e 30 Rela i e de ia ion ∆βbe ween ough and smoo h CPW in % o h= 10 mm. 37 10 12 14 16 18 20 22 24 26 28 30 32 34 36 38 40 42 44 46 48 50 0.5 1 1.5 2 Rq(nm) ∆ε ,e (%) 110 GHz 140 GHz Figu e 31 Rela i e de ia ion ∆ε ,e be ween ough and smoo h CPW in % o h= 10 mm. 38 3.4 Impo ance o posi ioning accu acy Con en ional RF es s uc u es equi e p obing pads whose dimensions a e a ound 50×50 µm2 o accommoda e he p obe ip geome y (example: pi ch o 100 µm, con ac a ea o 30×30 µm2). The manual posi ioning o he p obe on o he CPW es s uc u e gene a es misalignmen measu emen e o s ha impac no ably on he measu ed impedance. In pa icula , hese measu emen e o s inc ease in he millime e -wa e and sub-millime e -wa e egimes. The posi ioning accu acy is also c ucial when measu emen o high impedance de ices such as nanoscale s uc u es a e conside ed. Indeed, phase-shi and magni ude e o s inhe en o he posi ioning accu acy o se he impedance o be measu ed. Consequen ly, piezo-based nano-posi ioning (X-Y-Z con ols) and s ain-sensing (Z con ol) s a egies a e used o p o- ide au oma ed and accu a e con ol o he p obe landing on o he es s uc u e [49, 50]. 39 4 Nanode ice measu emen s 4.1 Sol ing he impedance misma ch p oblem Vec o ne wo k analyze s ha e been in oduced in he se en ies o measu e he elec ical p ope ies o ma e ials and ci cui s. Since hen, he e has been conside able wo k o ex end hei measu emen capabili ies such as equency co e age om low RF o hund eds o GHz, mul i-po de ices cha ac e iza ion, balanced, di e en ial, ha monic, modula ion and pulsed measu emen s. Nowadays, he e is an u gen need o u he ex end he ne wo k analyze capabili ies o mee he speci ic needs o cha ac e iza ion ools o impedances clea ly highe han he 50 Ω e e ence impedance o he VNA. In pa icula , he elec ical cha ac e iza ion o high impedance nanode ices is a well-known scien i ic challenge. The main measu emen limi a ion in hese applica ions is he impedance misma ch be ween he e e ence impedance o he ne wo k analyze close o 50 Ω ha is oo di e en compa ed o he impedance o nanode ices ha is in he ange o ens o hund eds o kΩ. Indeed, when high impedances a e conside ed, he VNA is insensi i e o he a ia ions o he e lec ion coe icien . The issue o dealing wi h ex eme impedance measu emen has yielded a a ie y o mea- su emen echniques. In 2005, he i s measu emen s o he high equency conduc ance o a me allic single walled nano ube (SWNT) wi h esis ance below 200 kΩ inse ed in a coplana wa eguide (CPW) ansmission line we e pe o med up o 10 GHz [51]. In 2010, o imp o e he VNA sensi i i y, an indi idual SWNT iwas inse ed in a speci ic high impedance Whea s one b idge ha helps o educe he impedance misma ch be ween he VNA and he high-impedance nanode ice [52]. Among he al e na i es o hese s udies, he in e e ome ic p inciple commonly used in op ics h ough Michelson o Mach Zende con igu a ions has gained he in e es om he mic owa e esea ch communi y o measu e small complex impedance con as s. Basically, a monoch oma ic signal is spli wi h one pa a eling a ixed pa h and he o he a a iable one. The wo esul ing signals a e euni ed, ampli ied i necessa y, and p oduce he well- known in e e ence. In 1949, a Michelson- ype mic owa e in e e ome e was in oduced o he i s ime a he ee-space wa eleng h o 3.2 cm o ee-space dielec ic cha ac e iza ion [53]. In 2007, mic owa e in e e ome y was applied o he i s ime o he measu emen o high impedance de ices a ound 1.8 GHz [54, 55]. In pa icula , he se up included a ec o ne wo k analyze in e aced wi h an in e e ome ic se up buil up wi h a hyb id couple associa ed o low noise ampli ie s. In 2011, a mechanically unable in e e ome ic ma ching ne wo k in he ange 1-18 GHz buil up wi h a powe di ide , a a iable a enua o and a sliding-sho was applied o high impedance measu emen s [56]. To u he enhance he sensi i i y in a b oadband equency ange, an in e e ome e buil up wi h a high- esolu ion p og ammable delay line and a mo o -d i en a iable a enua o has been de eloped [57]. In 2015, an I/Q-mixe -based in e e ome ic echnique is de eloped o speed ope a ion [58]. These s udies ha e p o en ha RF in e e ome ic echniques a e candida es o ackle he p oblem o impedance misma ch. The ecommenda ion o high impedance measu emen s is o inse a uning ma ching ne wo k be ween he measu emen po o he ec o ne wo k analyze and he measu emen o he po o he de ice unde es . The uning ma ching ne wo k based on mic owa e in e e ome y emains he mos e icien me hod. This la e can be buil up easily wi h coaxial o guided comme cial equipmen (couple s, powe di ide s, a iable a enua o s and phase-shi e s). In addi ion, he me hod o e s b oadband equency measu emen s. 40 po -4. Subsequen ly, he s abili y be ween a1and ain signals in single-sou ce in e e ome e is e alua ed using po -1 o he VNA o p o ide he a1signal sou ce and o se e as inpu o he single-sou ce in e e ome e as shown in Fig. 32(b). Again, bo h signals a e subsequen ly measu ed by he ecei e s o po -2 and po -4. In bo h expe imen s, he powe le el o each signal sou ce is se o -10 dBm, and subse- quen ly 20 ·103measu emen alues a e ex ac ed a 3 GHz om bo h ecei e s (po -2 and po -4). F om hese alues, he a io ain /a1is calcula ed and no malized o demons a e he s abili y be ween he wo signals. Figu e 36 Measu emen esul s om [68] showing he cancella ion sensi i i y o he phase- componen ealized wi h wo ac i e in e e ome e opologies a 3 GHz (dual-sou ce: blue ci cles; single-sou ce: ed squa es, and inse ). The black line depic s phase- componen s abili y o b-wa e measu ed using me hod ou lined in (9). The linea magni ude s abili y o ain /a1 o bo h me hods is ound o be compa able and smalle han 1 ·10−4. The esul o he ela i e phase s abili y be ween a1and ain signals is shown in Fig. . As expec ed, hese esul s demons a e he much highe phase s abili y o he single-sou ce con igu a ion compa ed o he dual-sou ce me hod [64]. Mo eo e , as shown in Fig. 36, he model p edic ions, plo ed as black dashed line, accu a ely co ela e wi h he expe imen ally ound phase luc ua ions o he dual-sou ce me hod. 47 5 Unce ain ies in on-wa e measu emen s 5.1 In oduc ion The e alua ion o unce ain ies in VNA measu emen s is a challenging ask because o 1. he mul i a ia e na u e o he measu and. S-pa ame e s a e wo-dimensional quan i- ies, exp essed ei he in magni ude and phase o complex- alued wi h eal and imagi- na y componen s. 2. he mul is ep measu emen p ocess wi h calib a ion and e o co ec ion. This leads o an elabo a e measu emen model. 3. The ela i ely la ge numbe o da a poin s. I is no unusual o collec da a a se e al hund ed equency poin s and he unce ain y migh show a p onounced equency dependence. The e has been signi ican p og ess in he las yea s o imp o e unce ain y e alua ion in VNA measu emen s. A supplemen [69] o he GUM [70] has been published, speci ically dealing wi h mul i a ia e and complex- alued quan i ies. This documen se es as he basic guideline o de e mine unce ain ies associa ed wi h es ima es o S-pa ame e s. Jus e- cen ly a e ised e sion o he EURAMET VNA Guide [28] has been published emb acing he p inciples o he GUM supplemen and p omo ing an unce ain y e alua ion based on a measu emen model, which ep esen s he en i e measu emen p ocess and akes quan i ies in luencing he measu emen in o accoun . The EURAMET VNA Guide has been p ima - ily w i en o coaxial measu emen s, bu i s basic p inciples a e applicable o on-wa e measu emen s as well. An essen ial pa o unce ain y e alua ion is he cha ac e isa ion o in luence quan i ies. This is discussed in some de ail in [28] and he same in luences need o be conside ed in on-wa e measu emen s oo. The cha ac e isa ion p ocedu es gi en in [28] can gene ally be applied wi h li le and s aigh o wa d modi ica ions. Unde connec o epea abili y di e en con ibu ions speci ic o on-wa e posi ioning and alignmen can be summa ized, by pe o ming he ollowing cha ac e iza ions 1. Repea ed connec ions by keeping p obes a same posi ion and mo ing sample in z. 2. Repea ed posi ioning o p obe s a ion o each measu emen o same s anda d a same posi ion. 3. Repea ed measu emen o same s anda d a sligh ly di e en con ac poin s. On-wa e measu emen s a e a ec ed mo e by c oss alk compa ed o coaxial measu emen s. The e ec is s ongly dependen on he dis ance be ween p obes and he e o e on he de ice unde es . One way o acknowledge his e ec in he unce ain y e alua ion is o come up wi h an addi ional DUT unce ain y (as shown in he example in he nex sec ion), which can be cha ac e ized by he ansmission coe icien as a unc ion o dis ance when measu ing wo one-po s anda ds. O he app oaches migh be possible. In he mul i a ia e case he p opaga ion o measu emen unce ain ies is mo e in ol ed, see [71]. I co ela ions should be aken in o accoun p ope ly i is una oidable o use specialized so wa e. Sui able so wa e solu ions, which a e able o handle he unce ain y p opaga ion o complex- alued quan i ies, a e a ailable nowadays [72, 73]. These ools p o- ide gene al amewo ks o ealize cus om-buil implemen a ions o S-pa ame e unce ain y e alua ion. Fo so wa e solu ions ha a e speci ically a ge ing S-pa ame e measu emen s see [12, 74]. These solu ions al eady con ain he VNA measu emen models and suppo di e en calib a ion algo i hms, i.e. p og amming is no necessa y. 48 Figu e 37 Basic se up o new p ojec . One o hese solu ions is he so wa e VNA Tools II. O iginally de eloped o coaxial VNA measu emen s i has been ecen ly ex ended o suppo on-wa e measu emen s as well. In he nex sec ion he di e en s eps in an on-wa e measu emen wi h VNA Tools II a e explained. An o e iew o he ea u es o VNA Tools II is gi en in [75]. Fu he in o ma ion and use guidance can be ound a [12]. Measu emen models, calcula ions and da a o ma s a e documen ed in publicly a ailable documen s, which can be downloaded om he websi e as well. 5.2 VNA Tools II on-wa e example 5.2.1 In oduc ion This example shows he use o he VNA Tools so wa e o pe o m an SOLT on-wa e mea- su emen . The ollowing ypical s eps a e co e ed: 1. De ini ion o a new p ojec . 2. Collec ion o measu emen da a and eco d o he measu emen p ocess in he Mea- su emen Jou nal. 3. Con igu a ion o VNA calib a ion and compu a ion o e o coe icien s. 4. E o co ec ion o he aw measu emen da a. 5. Use o da a explo e o isualiza ion. 5.2.2 New p ojec and basic de ini ions The i s s ep in VNA Tools II is o de ine a new p ojec . This de ines he loca ion, whe e he da a iles o he p ojec a e s o ed and some basic se ings. I can be speci ied in he na iga ion ba on he op. By selec ing New P ojec he dialog in Fig. 37 opens. The en ies unde Name and Loca ion will de ine he global oo pa h. Unde VNA Se up a VNA 49 Figu e 38 VNA Se ings. de ice, es po cable and p obe can be selec ed. In his example a Tes VNA is selec ed, which usually se es jus o es pu poses. Clicking OK will s o e hese en ies and close he dialog. By selec ing VNA Se ings VNA de ice pa ame e s can be se in a sepa a e dialog, see Fig. 38. The dialog allows o se some pa ame e s and speci y he sweep mode, which in his case is a segmen ed sweep. The sweep is de ined by he en ies in he segmen a- ble, e.g. he maximum equency is se o 50 GHz and he IFBW o 10 Hz. By clicking Se Segmen Table he alues will be sa ed o he VNA. By clicking OK he VNA Se ings a e sa ed o he measu emen jou nal. Selec ing Cus om DUT Unc in New DUT Unc opens he dialog in Fig. 39 o accoun o c oss alk be ween p obes du ing measu emen s. The alues en e ed as ansmission unce - ain ies a e dependen on dis ance and p obe ype. In his example all measu emen s a e done on he same subs a e, wi h he same p obes and he same dis ance be ween p obes. The size o he unce ain y con ibu ion is he e o e he same o each measu emen , bu unco ela ed when changing om one s anda d o ano he . When clicking OK he i s wo en ies, VNA Se ings and Cus om DUT Unc can be seen in he measu emen jou nal. 5.2.3 Measu emen s Fo he simul aneous measu emen o he opens o bo h po s an unce ain y con ibu ion due o c oss alk be ween p obes needs o be aken in o accoun . This is gene a ed by clicking on New DUT Unc and selec ing om he d op-down menu Cus om, see Fig. 40. Inc ease he numbe in he Index ield when measu ing a new s anda d. Use same index i measu ing he same s anda d again. This keeps ack o he co ela ion. Click OK o gene a e he unce - ain y con ibu ion. I will show up in he measu emen jou nal. To s a he measu emen he boxes unde New Connec ion need o be checked o bo h po s, see Fig. 41. Because bo h p obes a e kep a a ixed posi ion du ing he measu emen s no unce ain y con ibu- ions due o cable mo emen need o be accoun ed o . The boxes unde Cable Mo emen 50 Figu e 39 Se ing cus om DUT unce ain y. Figu e 40 Selec ing cus om DUT unce ain y o c ea e an unce ain y con ibu ion due o c oss alk. 51 Figu e 41 Cable mo emen s and new connec ions be o e measu emen s a e indica ed by checking boxes. Figu e 42 Measu emen dialog box. he e o e emain unchecked. As soon as one o he p obes is mo ed be o e a measu emen he co esponding box needs o be checked. Selec ing Open nex o he VNA De ice ield, see Fig. 41, will open he connec ion o VNA. Selec ing Measu emen opens he dialog in Fig. 42. In his dialog he se up needs o be speci ied in he d op-down menu Se up, in his case Sx,x Po s: 1,2. Clicking on Measu e will ini ia e he measu emen and he da a will be displayed in he g aph. The measu emen o he open in his example is showing noise con ibu ions o S21 and S12. When sa is ied wi h he measu emen he da a can be s o ed wi h Sa e Da a. The same p ocedu e will be epea ed o he measu emen o sho , load and h ough. In he inal measu emen s ep he DUT, in his case a line, is measu ed, see Fig. 43. When he measu emen s a e inished he measu emen jou nal can be sa ed by clicking Sa e Jou nal. 52 Figu e 43 A e inal measu emen o DUT pe o med. 5.2.4 Calib a ion con igu a ion A e clicking on he abs Calib a ion Con ig and New Con ig we selec SOLT in he d op- down menu as he calib a ion ype, see Fig. 44 A e clicking on OK he empla e can be illed in by linking measu emen da a, in column Raw Measu emen , and de ini ions, in column De ini ion, o he calib a ion s anda ds, see Fig. 45. In he same dialog he measu emen jou nal needs o be speci ied, in his case Jou nal 01. nalog. Wi h Sa e Con ig he calib a- ion con igu a ion can be sa ed o a ile SOLT 01.calc g. By clicking on S a Compu a ion he e o coe icien s a e compu ed and s o ed as SOLT 01.calb. 5.2.5 E o co ec ion A e selec ing he ab E o Co ec ion he dialog in Fig. 46 opens The ields need o be popula ed wi h he loca ion o measu emen jou nal, e o coe icien s, aw measu e- men s and ou pu olde . Wi h Sa e Con ig he con igu a ion will be sa ed o a ile SOLT 01.co c g. Clicking on S a Compu a ion will ini ia e he e o co ec ion and s o e e o co ec ed S-pa ame e iles in SOLT 01 ou . 5.2.6 Da a Explo e By selec ing he ab Da a Explo e he measu emen esul s can be isualized as shown in Fig. 47. The Da a Explo e has a da a b owse on he le . By clicking on da a iles hey will be displayed on he igh . The e a e di e en basic display modes, which can be selec ed wi h G aph,Table,Poin and Co a iance. As o se up and o ma he e a e a ious selec ions as well. Unce ain ies can be uned on o o . Da a can as well be expo ed o o he ile o ma s. 53 Figu e 44 Selec ion o calib a ion ype. Figu e 45 Calib a ion Con igu a ion. 54 Figu e 46 E o Co ec ion. Figu e 47 Da a Explo e . 55 5.3 Unce ain y budge examples In he ollowing unce ain y esul s o h ee ypical de ices on a used silica subs a e a e shown o he case o a mul iline TRL calib a ion ( om [11]), co e ing a la ge po ion o he impedance ange measu able by a VNA: a nominally 15 dB ma ched a enua o ( e med ‘a enua o ’), a 7065 µm-long misma ched line ( e med ‘misma ch’), and a 2-po open (high- e lec de ice, e med ‘open’)). 5.3.1 Expanded unce ain ies 10 20 30 40 50 60 70 80 90 100 110 F equency (GHz) -0.04 -0.02 0 0.02 0.04 |S11| (exp. unc.) a enua o misma ched line open 10 20 30 40 50 60 70 80 90 100 110 F equency (GHz) -15 -10 -5 0 5 10 15 (S11)/°(exp. unc.) a enua o misma ched line open 10 20 30 40 50 60 70 80 90 100 110 F equency (GHz) -0.05 0 0.05 |S21| (exp. unc.) a enua o misma ched line open Figu e 48 Expanded unce ain y in e als a a co e age p obabili y o 95% (k=2). 56 [60] K. Haddadi, A. E. Fellahi, J. Ma zouk, S. A sco , C. Boya al, T. Las i, and G. Damb ine, “Robo ic on-wa e p obe s a ion o mic owa e cha ac e iza ion in a scan- ning elec on mic oscope,” in 2015 IEEE MTT-S In e na ional Mic owa e Symposium, May 2015, pp. 1–3. [61] A. E. Fellahi, K. Haddadi, J. Ma zouk, S. A sco , C. Boya al, T. Las i, and G. Damb ine, “In eg a ed MEMS RF P obe o SEM S a ion—Pad Size and Pa asi ic Capaci ance Reduc ion,” IEEE Mic owa e and Wi eless Componen s Le e s, ol. 25, no. 10, pp. 693–695, Oc 2015. [62] K. Da e, J. Ma zouk, A. E. Fellahi, T. Xu, C. Boya al, S. Elie , B. G andidie , S. A - sco , G. Damb ine, and K. Haddadi, “Nano-p obing s a ion inco po a ing MEMS p obes o 1D de ice RF on-wa e cha ac e iza ion,” in 2017 47 h Eu opean Mic owa e Con e ence (EuMC), Oc 2017, pp. 831–834. [63] M. Randus and K. Ho mann, “A Me hod o Di ec Impedance Measu emen in Mi- c owa e and Millime e -Wa e Bands,” IEEE T ansac ions on Mic owa e Theo y and Techniques, ol. 59, no. 8, pp. 2123–2130, Aug 2011. [64] H. Vo si, C. Li, P. H. Aaen, and N. M. Ridle , “An Ac i e In e e ome ic Me hod o Ex eme Impedance On-Wa e De ice Measu emen s,” IEEE Mic owa e and Wi eless Componen s Le e s, ol. 27, no. 11, pp. 1034–1036, No 2017. [65] J. C. Tippe and R. A. Speciale, “A Rigo ous Technique o Measu ing he Sca e ing Ma ix o a Mul ipo De ice wi h a 2-Po Ne wo k Analyze ,” IEEE T ansac ions on Mic owa e Theo y and Techniques, ol. 30, no. 5, pp. 661–666, May 1982. [66] M. Da ido i z, “Recons uc ion o he S-ma ix o a 3-po using measu emen s a only wo po s,” IEEE Mic owa e and Guided Wa e Le e s, ol. 5, no. 10, pp. 349–350, Oc 1995. [67] R. R. M. Spi i o, F. Muba ak and L. Gala o, An in e e ome ic IQ-mixe /DAC so- lu ion o ac i e, high speed ec o ne wo k analyse impedance eno maliza ion, eu . Pa en PCT/NL2018/050055, Jan. 25, 2017. [68] F. Muba ak, R. Romano, L. Gala o, V. Mascolo, G. Rie eld, and M. Spi i o, “Noise Beha io and Implemen a ion o In e e ome e Module Based B oadband VNA,” sub- mi ed o IEEE T ansac ions on Mic owa e Theo y and Techniques. [69] E alua ion o measu emen da a - Supplemen 2 o he ”Guide o he exp ession o unce ain y in measu emen ” - Ex ension o any numbe o ou pu quan i ies, BIPM, IEC, IFCC, ILAC, ISO, IUPAC, IUPAP and OIML, 2011, jCGM 102:2011; a ailable a h p://www.bipm.o g/en/publica ions/guides/. [70] E alua ion o Measu emen Da a - Guide o he exp ession o unce ain y in measu e- men , BIPM, IEC, IFCC, ILAC, ISO, IUPAC, IUPAP and OIML, 2008, jCGM 100:2008; a ailable a www.bipm.o g/en/publica ions/guides/gum.h ml. [71] M. Ga elli and A. Fe e o, “A Uni ied Theo y o S-Pa ame e Unce ain y E alua ion,” IEEE T ans. Mic owa e Theo y & Tech., ol. 60, no. 12, pp. 3844 – 3855, 2012. [72] M. Zeie , J. Ho mann, and M. Wollensack, “Me as.UncLib - a measu emen unce ain y calcula o o ad anced p oblems,” Me ologia, ol. 49, pp. 809 – 815, 2012. [73] B. D. Hall, “Objec -o ien ed so wa e o e alua ing measu emen unce ain y,” Meas. Sci. Technol., ol. 24, p. 055004, 2013. 63 [74] NIST Mic owa e Unce ain y F amewo k, a ailable a www.nis .go /c l/ - echnology/ ela ed-so wa e.c m. [75] M. Zeie , J. Ho mann, J. Rue enach , and M. Wollensack, “Con empo a y e alua ion o measu emen unce ain ies in ec o ne wo k analysis,” m - Technisches Messen, ol. 84, no. 5, pp. 348 – 358, 2017. [76] R. B. Ma ks and D. F. Williams, “Cha ac e is ic impedance de e mina ion using p op- aga ion cons an measu emen ,” IEEE Mic owa e and Guided Wa e Le e s, ol. 1, no. 6, pp. 141–143, June 1991. [77] D. F. Williams and R. B. Ma ks, “T ansmission line capaci ance measu emen ,” IEEE Mic owa e and Guided Wa e Le e s, ol. 1, no. 9, pp. 243–245, Sep 1991. [78] W. Hein ich, “Quasi-TEM desc ip ion o MMIC coplana lines including conduc o -loss e ec s,” IEEE T ansac ions on Mic owa e Theo y and Techniques, ol. 41, no. 1, pp. 45–52, Jan. 1993. 64