Integral equation mei applied to three-dimensional arbitrary surfaces
Abstract
The authors present a new formulation of the integral equation of the measured equation of invariance (MEI) as a confined field integral equation discretised by the method of moments, in which the use of numerically derived testing functions results in an approximately sparse linear system with storage memory requirements and a CPU time for computing the matrix coefficients proportional to the number of unknowns.
Full text
In Table 1, we show he aul co e age as he numbe o
unscanned lip- lips in ci cui S5378 inc eases.
As
shown in Table
1, he aul co e age does no d op signi ican ly un il as many as
50 lip- lops a e scanned.
Table
2
Faul co e age wi h unscanned lip- lops
To al O iginal Sel Unscanned Unscanned
FFs
co e age loop FFs a io
Ci cui Faul
co e age
I
S27
13
S298 114
I
100
3
2
66.7 100
100 14 2 14.3 93.57
In Table
2,
we show he aul co e age o each ci cui wi h he
gi en numbe o lip- lops unscanned. The hi d column gi es he
ull scan aul co e age using ou implemen a ion o he o iginal
FAN algo i hm. The i h column gi es he numbe o unscanned
lip- lops. The se en h column gi es he aul co e age. We
s opped unscanning when he aul co e age d opped signi ican ly.
When he ci cui con ains enough sel -loop ee lip- lops, he p o-
posed pa ial scan selec ion me hod allows mo e han 20%
lip-
lops o be unscanned wi h li le dec ease in he aul co e age.
Fo he 838 ci cui , wi h only one unscanned lip- lop, he aul
co e age d opped om 100 o 91.74%, bu when we assumed he
p ese signal a he unscanned lip- lop, we we e able o ob ain
100% aul co e age.
S382
s444
Conclusion:
We ha e in oduced an in e es ing pa ial scan es
me hod wi h no da a holding o e head. The expe imen al esul s
show ha he p oposed me hod can achie e almos ull scan aul
co e age while ha ing a signi ican numbe o lip- lops
unscanned. The p oposed es me hod will be mos e ec i ely used
o ci cui s
in
which he a ea occupied by memo y elemen s
domi-
na es. These kinds o ci cui s a e p e alen in mul imedia applica-
ions. We will s udy he pa ial scan selec ion algo i hm mo e and
will imp o e he ATPG algo i hm by adop ing a ious echniques
o mo e ad anced ATPGs [l,
21.
21 100 15 4 19.0 95.32
21 97.34 15
3
14.3 90.11
0
IEE
1997
Elec onics Le e s Online
No:
19971414
Dong
Ho
Lee and Hyun Chul Noh
(School
o ’
Elec onics and
Elec ical Enginee ing, KyungPook Na ional Uni e si y, Tuegu, 701-
702,
Ko ea)
26
Augus 1997
Re e ences
POMERANZ,
I.,
REDDY,
L.N.,
and
REDDY,
s.M.: ‘COMPACTEST:
A
me hod o gene a e compac es se s o combina ional ci cui s’.
P oc. In . Tes Con ., 1991, pp. 194203
SCHULZ,
M., TRISCHLER,
E., and
SARFERT,
T.:
‘SOCRATES: A highly
e icien au oma ic es pa e n gene a ion sys em’. P oc. In . Tes
Con ., 1987, pp. 101&1026
CHENG,
K.T.,
and
AGRAWAL,
.D.:
‘A pa ial scan me hod
o
sequen ial ci cui s wi h eedback‘,
IEEE T ans.,
1990,
C-39,
pp.
546548
LEE,
D.H., and
REDDY,
s.M.:
‘On
de e mining scan lip- lops in
pa ial scan designs’. P oc. In . Con . Compu e -Aided Design,
No embe
1990,
pp.
322-325
PARIKH,
P.s., and
ABRAMOVICI,
M.:
‘Tes abili y-based pa ial scan
analysis’,
J.
Elec on. Tes .,
1995,
7,
pp. 61-70
FUJIWARA,
H., and
SHIMONO,
T.:
‘On
he accele a ion o es
gene a ion algo i hms’. P oc. 13 h In . Symp. Faul Tole an
Compu ing, 1983, pp. 98-105
In eg al equa ion
ME1
apiplied o h ee-
dimensional a bi a y su aces
J.M.
Rius,
J.
Pa on,
E.
Ubeda
and
J.R.
Mosig
Indexing e m: Me hod
o
mom m s, Bounda y elemen me hod,
Nume ical me hods, Elec omagne ic wa e sca e ing
The au ho s p esen a new o mula ion
o
he in eg al equa ion o
he measu ed equa ion
o
in a iance as a con ned ield in eg al
equa ion disc e ised by he me hod o momen , in which he use
o nume ically de i ed es ing unc ions
esul s
in an
app oxima ely spa se linea sys em wi h s o age memo y
equi emen s and a CPU ime o compu ing he ma ix
coe icien s p opo ional o he numbe o unknowns.
In oduc ion:
Bounda y elemen me hods (BEMs) a e widely used
o he nume ical analysis o elec omagne ic adia ion and sca -
e ing. Howe e , hei applica ion is limi ed o elec ically small o
esonan size objec s due o he ac ha he compu a ional
equi emen s inc ease apidly wi h 1.he elec ical size. One ecen
app oach o achie ing mo e e icien BEMs is he in eg al equa-
ion o mula ion o he measu ed equa ion o in a iance (IE-MEI)
[l
-
31.
This
Le e p esen s he o mula ion o he IE-ME1 o 3D a bi-
a y sca e ing su aces as a special case o a combined ield in e-
g al equa ion (CFIE), disc e ised Iby he me hod o momen s
(MOM), in which he choice o di e en es ing unc ions o he
elec ic and magne ic ields esul s i i an app oxima ely spa se lin-
ea sys em o sol e o he induced cu en , whe e mos o he
ma ix elemen s can be neglec ed. These new es ing unc ions a e
nume ically de i ed
by a p ocedu e bo owed om he measu ed
equa ion o in a iance (MEI) me hod [4] o iginally de eloped o
nume ically ind he unca ion bounda y coe icien s o ini e di -
e ence and ini e elemen meshes [5].
A
signi ican ea u e o
nume ically de i ed es ing unc ions is ha hey a e
adap i e,
i.e.
speci ic o he pa icula shape o he sca e e bounda y and o
he loca ion o he unc ion in he bounda y.
Fo mula ion:
The elec ic ield in eg al equa ion (EFIE) and he
magne ic ield in eg al equa ion (MIFIE) disc e ised by he MOM
may each be exp essed in ma ix o m, espec i ely, as
I
di
a e he (subdomain) basis unc ions,
J’,
=
Zi
c,
2,
and
Gm
a e he (subdomain) es ing unc ions, he ma ix elemen s in eqn.
1 a e
em
=
(Gm,Ei)
zEi
=
(Gm,lA~~C )
d,i
=
(Gm,.i;Z)
whe e
LEJ
and
LHJ
a e, espec i ely, he linea ope a o s ha
ob ain he elec ic and magne ic ields due o an elec ic cu en .
We le -mul iply he EFIE and he MFIE in eqn.
1
by wo a bi-
a y ma ices [A] and
[B],
espec i ely, and add he wo equa ions
o o m a CFIE
-[E9
=
[ZE][C]
-
[W]
=
([ZH]
-
[D])
[C]
(I)
+.
+.
hk
=
(Gm, i
x
E L)
z,”;
=
(Gm, i
x
LHJGZ)
(2)
-[AI[@]
-
[Bl[Hil
=
([Al[ZEl
+
[Bl[ZHl
-
[BI[Dl)
[Cl
(3)
Le -mul iplica ion o he EFIE o he MFIE by
a
ma ix is equi -
alen o changing he es ing unc ions. Fo ins ance:
m
m
I
sugges s ha he new es ing unc ions a e
Zm
a,,,
$,
o he EFIE
and
Zm
b,,,
G,
o he MFIE. The ows o [A] and
[B]
ma ices a e
he coe icien s o he new es ing unc ions expanded in he old
ones
w,.
Spa se
[A],
[B]
ma ices ep esen subdomain es ing
unc ions: he ze os co espond o o iginal es ing unc ions (col-
LUIUI
index) ha do no o e lap wi h he new ones ( ow index).
We
de me
he ‘combined impedance
ma ix’
as
[Zq
=
[A][Zq
+
[B][Zq.
Now, eqn. 3 becomes
--
-[AlP 1
-
PI[W
=
ELECTRONICS LETTERS
20 h
No embe
1997
Vol.
33
No.
24
2029
whe e ma ix
[Zc]
is ull,
[D]
is spa se (because
2
and
2,
a e sub-
domain unc ions) and
[A]
and
[B]
a e a bi a ily chosen as
spa se
and such ha
[Zq[Cl
=
0.
The e o e, eqn. 5 can be app oxima ed
by he spa se sys em o equa ions
whe e
[Cj
is
he unknown ec o .
The abo e is he 3D o mula ion o he IE-MEI, equi alen o a
CFIE- ype equa ion wi h di e en es ing o he EFIE and he
MFIE, such ha he elec ic and magne ic impedance ma ices
cancel each o he . The 2D o mula ion o he IE-ME1 [I, 21,
[q
=
[B]-'
[A][EI
+
[w,
is a special case o eqn.
6
wi h
[D]
=
[I]
(iden i y
ma ix), due o he use o pulse basis and del a es ing.
[AI[E"l
+
PI[ 7
=
[BI[DI[Cl
(6)
Coe Jicien compu a ion (MEIme hod):
In eqn.
5,
we need
[Zq[q
0.
Since
[E]
=
[Zq[q
and
[PI
=
[Zq[q,
whe e
[E]
and
[PI
a e, espec i ely, he disc e isa ion o elec ic and magne ic sca -
e ed ields, i ollows ha
[Zq[q
=
[A][E]
+
[BI[Hsl
=
0.
To
nume ically ind he coe icien s o ma ices
[A]
and
[B],
he
ME1
me hod en o ces
[A][E;]
+
[B][H;]
=
0,
whe e
[E;]
=
[Z7[opl,,
[Hi]
=
[Zq[o]
a e he disc e isa ion o he ields due o
P
a bi a y
cu en s
%p
called
me ons.
[CY
J
is a ma ix whose columns a e he
disc e isa ion o he me ons
2
o
p
=
1,
...,
P.
The esul is
a
se
o linea sys ems, one o each ow
o
he ma ix equa ion
[Al[ZE1[%l
+
[Bl[aHI[%l
=
[ZC1[.Pl
=
0
(7)
whe e he unknowns a e he elemen s o
[A]
and
[B]
ma ices.
Ob iously, eqn. 7 does no gua an ee ha
[Zc}
[q
0,
especially
I
he sys ems (eqn. 7) a e o e de e mined and canno be exac ly
sa is ied. Howe e , i has been obse ed ha in he 2D case, some
me on se s p oduce
a
negligible esidual
[Zq[q
in
he IE-ME1
eqn. 6 [1, 2, 6, 71 o in he equi alen unca ion bounda y condi-
ion
[4,
81.
Me ons:
Fo
3D
a bi a y sca e e su aces, he easies me ons
o implemen a e
del a
me ons. Each del a me on is equal o
a
basis unc ion,
.',
=
zp,
and hus
[CYJ
=
[I].
Wi h his se o me -
ons, eqn. 7 becomes
[Zq
=
0.
Row
n
o eqn. 7 co esponds o he
linea sys em
CL,,^:,
+
bnmzii)
=
z,",
=
0
i
=
1,
...,
N
(8)
m
whe e he non-ze os o
a,,
and
b,,
a e he unknowns. To a oid
he i ial solu ion, one o he coe icien s mus be a bi a ily se ,
o ins ance
a,,
=
1. Since i is desi able ha ma ices
[A]
and
[B]
a e spa se, he numbe
o
unknowns in eqn.
8
is much smalle
han
N.
Con e sely, he e a e
N
del a me ons, and hus
N
equa-
ions in he sys em eqn.
8.
This
makes he sys em o e de e mined
and, in gene al, i canno be sol ed exac ly,
[Z,q
#
0.
The mini-
mum
~~[Zn~~~*
is ob ained by he leas squa es p ocedu e.
I mus be no ed ha del a me ons a e equi alen o he
G*
me ons o Jb ic and Lee
[SI,
aking in o accoun he ac ha he
combined impedance ma ix
Zc
plays he ole o he null- ield
En",,
in
[8].
2.5
al
m
0.
-
2
1.5
c
._
I
.
7x
1
.o
'
c
0
0.5
.
0'
I
-200
-1
00
0
100
200
e
187411
Fig.
1
Induced cu en in a sphe e
o
diame e
2h
o
inciden plane
wa e
IE-ME1 esul s compa ed wi h analy ical solu ion
analy ical
IE-ME1
____
Wi h del a me ons, he ope a ion coun o ob ain
[A]
,
[B]
ma ices is p opo ional o
Nz:
Fo each ow o
[A]
and [B], a sys-
em o
N
simul aneous equa ions (eqn.
8)
mus be sol ed by leas
squa es wi h an ope a ion coun o he o de o
aN
x
1Mz
+
/3M,
whe e
M
is he numbe o
a,,,
On,
coe icien s o compu e.
Howe e , we ha e ound ha o cing
z,",
=
0
only
o he
P
-
2M
basis unc ions
i
closes o es ing unc ion
n
leads o he same
alues o coe icien s
a,,,
ba n.
Tha is, o cing
z,"I
=
0
only o
nea ield mu ual impedances makes i also ue o a ield ones.
Now, he numbe o simul aneous equa ions
P
does no inc ease
wi h he numbe o
unknowns
N:
we need
aP
x
Mz
+
pM3
=
AF
ope a ions o each ow o [A],
[B]
and he o al ope a ion coun is
hus p opo ional o
N.
Resul s:
The p oposed IE-ME1 echnique has been applied o se -
e al sca e ing
3D
p oblems. I has been ound ha he accu acy
ob ained wi h ou cu en o mula ion is p oblem-dependen ,
which con iis ha he selec ion o he me on se is he c i ical
s ep.
As
a ypical-case example, Fig.
1
shows he cu en induced
in a sphe e o diame e 2
h
by a plane wa e inciden along he
z
axis, wi h he elec ic ield pola ised along he
2
di ec ion. The IF-
ME1 esul s a e compa ed wi h he analy ical solu ion. The plo
co esponds o
a
cu o
J,
in he
yz
plane, wi h he o igin a he
cen e o he sphe e. The su ace has been disc e ised in
2048
i-
angles wi h sides anging om 0.1
h
o 0.15
h.
The numbe o
unknowns
o Rao, Wil on
&
Glisson basis unc ions
[9]
is
N
=
3072.
The spa si y o
[A], [B]
ma ices is 1.2%. The o al amoun
o memo y used is 6MB.
The accu acy o he IE-ME1 esul is easonably good, bu
poin wise accu acy could no be enough o some angles. Fo
hese cases, a subs an ial imp o emen could ce ainly be ob ained
by using
a
di e en se o me ons ha p oduces
a
smalle esidual
[ZTCl.
Acknowledgmen s:
The au ho is indeb ed o
K.K.
Mei
o
Ci y
Uni e si y
o
Hong Kong o he aluable discussions on he ME1
me hod.
This
wo k was pa ially suppo ed by he Spanish
'Comisibn In e minis e ial de Ciencia
y
Tecnologia' (CICYT)
unde p ojec TIC 95-0983. Pa o he wo k was done a Ci y
Uni e si y o Hong Kong, whe e J.M. Rius was a isi ing ellow
om Janua y
4
o Feb ua y 3, 1997. G adua e s uden s J. Pa bn
and
E.
Ubeda a e suppo ed by he Gene ali a de Ca alunya,
Comissiona pe a Uni e si a s i Rece ca, unde g an s 1997
FI
00679 and 1997 FI 00747, espec i ely.
0
IEE 1997
Elec onics Le e s Online
Nol:
19971419
J.M.
Rius,
J.
Pa on and E. Ubeda
(Depa men
o
TSC, Ed$ci
0-3,
Uni e si a Poli &cnica de Ca alunya, Jo di Gi ona
1-3,
08034
Ba celona, Spain)
5
Augus
1997
J.R.
Mosig
(LEMA,
ELB, Ecole Poly echnique
FkdP ale
de Lausanne
(EPFL),
CH-IO15
Lausanne, Swi ze land)
Re e ences
1
RIUS, J.M.:
'In eg al o mula ion o he measu ed equa ion
o
in a iance',
Elec on. Le .,
1996,
32,
(l),
pp. 23-25
2
RIUS,
J.M.,
POUS,
R.,
and
CARDAMA,
A.:
'In eg al o mula ion o he
measu ed equa ion o in a iance: a no el spa se-ma ix bounda y
elemen me hod',
ZEEE T ans.
Magn.,
1996,
32,
(3),
pp. 962-967
3
RIUS,
J.M.,
CARPINTERO, c.P., CARDAMA,
A.,
and
MOSIG, J.R.:
'F quency ex apola ion in
he
in eg al equa ion MEI',
Elec on.
Le .,
1996,
32,
(25),
pp.
2324-2326
4 MEI,
KK.,
POUS,
R.,
CHEN,
z.,
LIU,
Y.W,
and
PROUTY,
M.D.:
'The
measu ed equa ion o in a iance:
a
new concep in ield
compu a ions',
IEEE T ans. An ennas P opag.,
1994,
42,
(3),
pp.
320-328
abso bing bounda y condi ions',
IEEE T ans. An ennas P opag.,
1995,
43,
(5), pp. 478437
6
RIUS,
J.M.,
CARPINTERO, c.P., CARDAMA, A.,
and
MOSIG, J.R.:
'The
heo e ical e o in he in eg al equa ion MEI',
Elec on. Le .,
1996,
32,
(23),
pp. 2131-2132
7
RIUS,
J
M.,
CARPINTERO,
c
P
,
CARDAMA,
A.,
and
MICHALSKI, K.A.:
'Analysis o elec ically la ge conca e sca e e s wi h he in eg al
equa ion MEI',
Mic ow. Op . Technol. Le .,
1997,
14,
(5),
pp. 287-
289
5
STUPFEL,
B.,
and
MITTRA, R.:
'A heo e ical s udy
O
nume ical
2030
ELECTRONICS LETTERS
20 h
No embe
7997
Vol.
33
No.
24
8
JEVTIC,
J.O.,
and
LEE,
R.:
'A
heo e ical and nume ical analysis
o
he
measu ed equa ion o in a iance',
IEEE T ans. An ennas P opag.,
9
RAO,
s.M.,
WILTON,
D.R.,
and
GLISSON,
A.w.:
'Elec omagne ic
sca e ing by su aces o a bi a y shape',
IEEE T ans. An ennas
P opag.,
1982,
30,
(3),
pp. 409418
1994,
42,
(8),
pp. 1097-1105
Measu ing image edge de ec o accu acy
using ealis ically simula ed edges
R.C.
S aun on
Indexing e ms: Edge de ec ion, Image p ocessing
Edge de ec o es s using edges de i ed om he acquisi ion
sys em's edge sp ead unc ion a e desc ibed. The es edges used
a e he mos di icul ha could exis in a p ac ical sys em. The
esul s we e signi ican ly di e en o hose ob ained by adi ional
me hods, indica ing ha simple de ec o s may
su ice
o some
applica ions.
In oduc ion:
The analogue on end componen s o a digi al
imaging sys em lowpass il e he signals hey p ocess. The cam-
e a's lens and i s cha ge coupled de ice (CCD) a ay a e wo-
dimensional (2D) il e s, whe eas he came a elec onics and he
digi ise 's an ialiasing d e a e one-dimensional (ID). Thei com-
bined e ec , he on end modula ion ans e unc ion (MTF),
can be measu ed in 2D [I] and has been used he e o enable he
simula ion o ealis ic edges on which o es and compa e de ec-
o s.
Edge
model: S ep edges a e conside ed o be he mos di icul
edges o de ec accu a ely [2] and, a e modi ica ion o allow o a
pixel shaped windowing o he da a while sampling, ha e been
used o es de ec o s
[3,
41.
He e, he windowing is eplaced by a
ealis ic physical model o modi ying he s ep edge based
on
he
sys em's edge sp ead unc ion (ESF). The ESF can be measu ed
uniquely o each sys em and is one s ep in he calcula ion o he
MTF. Resul s om he wo edge models ha e been compa ed
he e,
as
ha e he g adien and angula accu acy o a numbe o
commonly used i s -o de de ec o s. The high esolu ion ESF was
scanned e ically h ough
a
2D space o p oduce an e ec i ely
con inuous image o an edge.
A
sampling g id was hen applied a
en housand andom posi ions and o ien a ions wi h espec o
~
A
60
50
40
30
20
signal- o-noise a io,
dB
Fig.
I
E ec o noise
on
SD
o g adien es ima ion (each mean alue
scaled
o
100)
(i)
s anda d cubic ace
5
x
5
(ii) Sobel
3
X
3
(iii) P ewi 5
X
5
(i ) Sobel 5
X
5
( ) In eg a ed di ec ional de i a i e (IDD) 5
X
5
( i) IDD 7
X
7
Edge con as
=
255 uni s
ELECTRONICS LETTERS
20 h
No embe
1997
Vol.
his edge. The esampled images we e cons ained
so
ha he edge
always passed h ough he cen al pixel, and we e used o p o ide
accu a e es da a.
The new edge model was ob ained om he
ID
ESF
by com-
bining he esul s om many CCD elemen s, and he es da a
we e easonably noise ee. Gaussian dis ibu ed andom noise
was added o he sampled in ensi y alues. The signal- o-noise
a io was de ined as
SNR
=
2010g,,
(5)
[dB]
CT
whe e
c
=
255 is he edge con as and
CJ
he s anda d de ia ion
(SD)
o
he noise.
L
ioo
.-
I
.-
a
l
I
( i)
_,.,
,"
I
,"
60
50
40
30
20
signal- o-mise m io
1764/2/
Fig. 2
E ec o noise
on
SD
o angle
ewe
T aces labelled as in Fig. 1. Edge con as
=
255 uni s
Ope a o pe o mance:
Fo i s de i a i e de ec o s, e o s occu
in g adien and angle measu emen s. Pai s o de ec o s we e used
o e u n ho izon al and e ical g adlien ec o s. These we e ana-
lysed in he usual way o p o ide he magni ude
o
he edge g adi-
en and he angle in o ma ion. The 2D MTF o he acquisi ion
sys em
[I]
was consul ed in choosing he mos sui able ESF, he
sha pes and hence mos di icul o de ec , on which o es he
ope a o s. The ope a o empla es aned
in
size om
3
x
3
o
7
x
7
pixels and a e desc ibed
in
[4]. A
1,a ge empla e should ha e a
highe noise immuni y and p oduce mo e accu a e esul s, bu
may ake longe o compu e.
10'
a
?i
C
.-
I
'5
U
E
U
m
c
L
OI
-
ioo
60
50
4CI
30
20
signal- o-noise a io,
dB
/7Mi3]
Pig.
3
Compa ison o e ec o noise
on
SD
o g adien es ima ion o
wo edge models (each mean alue scaled o
100)
Pixel a e age model:
(i) Sobel
3
x
3
(ii) IDD
5
x
5
(iii) IDD 7
x
7
ESF model:
(i ) Sobel
3
X
3
( ) IDD 5
X
5
( i) IDD 7
X
7
33
No.
24
203
1