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Transparent Layer Compensation at the Active Triangulation Systems

Janáková, Ilona; Šedivá, Soňa; Beneš, Petr

Abstract

The paper deals with an active triangulation technique of non-contact optical measurement of 3D properties. The basic features of the method - principle, advantages and disadvantages - are described first. But the main part of the paper is concerned with the impossibility of using the basic principle of the method for measured objects, which are covered by a layer of transparent material of unknown thickness. Most often it is a layer of oil for the preservation of metal products. This layer distorts the measured value due to the light refraction. In this work, a method of eliminating this distortion based on the use of two sensors is proposed. Experimental verification of this proposal is also presented. (C) 2019, IFAC (International Federation of Automatic Control) Hosting by Elsevier Ltd. All rights reserved.

Full text

IFAC Pape sOnLine 52-27 (2019) 508–513 ScienceDi ec A ailable online a www.sciencedi ec .com 2405-8963 © 2019, IFAC (In e na ional Fede a ion o Au oma ic Con ol) Hos ing by Else ie L d. All igh s ese ed. Pee e iew unde esponsibili y o In e na ional Fede a ion o Au oma ic Con ol. 10.1016/j.i acol.2019.12.714 © 2019, IFAC (In e na ional Fede a ion o Au oma ic Con ol) Hos ing by Else ie L d. All igh s ese ed. 10.1016/j.i acol.2019.12.714 2405-8963 T anspa en Laye Compensa ion a he Ac i e T iangula ion Sys ems I. Janako a*, S. Sedi a**, P. Benes*** Depa men o Con ol and Ins umen a ion, Facul y o Elec ical Enginee ing and Communica ion, B no Uni e si y o Technology, B no, Czech Republic *(+420 541 146 390, e-mail: janako a@ eec. u b .cz) **(+420 541 146 418, e-mail: sedi a@ eec. u b .cz) ***(+420 541 141 152, e-mail: benes@ eec. u b .cz) Abs ac : The pape deals wi h an ac i e iangula ion echnique o non-con ac op ical measu emen o 3D p ope ies. The basic ea u es o he me hod - p inciple, ad an ages and disad an ages - a e desc ibed i s . Bu he main pa o he pape is conce ned wi h he impossibili y o using he basic p inciple o he me hod o measu ed objec s, which a e co e ed by a laye o anspa en ma e ial o unknown hickness. Mos o en i is a laye o oil o he p ese a ion o me al p oduc s. This laye dis o s he measu ed alue due o he ligh e ac ion. In his wo k, a me hod o elimina ing his dis o ion based on he use o wo senso s is p oposed. Expe imen al e i ica ion o his p oposal is also p esen ed. Keywo ds: 3D ision, op ical dis ance measu emen , ac i e iangula ion, image p ocessing, anspa en laye , oil compensa ion. 1. INTRODUCTION Op ical non-con ac dis an measu ing echniques ha e ound widesp ead use in many a eas, o example in a ic, a chi ec u e, obo na iga ion, objec ecogni ion, o in indus y in he p oduc ion inspec ion (Kalo á and Lisz wan, 2006). Thei expansion was suppo ed no only by he g ea de elopmen o echnics (elec onics, op ics), bu also by he p og ess made in echniques o da a and image p ocessing. The ad an ages o op ical me hods a e ha hey can be e y accu a e and as and agains o he p inciples ha a e non- con ac and non-des uc i e. I is also easie o econ igu e he sys em o ano he dimension o ype o p oduc s. In s anda d p ojec i e imaging, one dimension (usually he dep h in o ma ion) om 3D scenes is los . Wi hou he use o a special echnique, i is no possible o de e mine his in o ma ion e oac i ely. Fo una ely, depending on he speci ic equi emen s, di e en echnical app oaches can be used o op ical dis ance measu emen (Be ko ic and Sha i , 2012). The mos used app oaches a e based on one o h ee basic p inciples: iangula ion, ime-o - ligh (ToF) o op ical in e e ome y (Schwa e e al., 1999). Among he mos impo an pa ame e s o selec ing he mos app op ia e me hod include he equi ed ange o measu ed dis ances (dimensions o measu ed objec and he wo king dis ance), esolu ion, measu ing ime, opology (conca i ies, p o usions, edges) and su ace p ope ies ( oughness, specula e lec ions) o he measu ed objec , p ope ies o su ounding ligh ing, size o measu ing sys em, possibili ies o calib a ion, and also cos s. The mos widely used echnique o op ical o m measu emen s is iangula ion. T iangles a e he basis o many measu emen echniques. The ollowing a ian s, which look g ea ly di e en , bu use same p inciple can be dis inguished: ac i e iangula ion echniques wi h di e en illumina ion, passi e iangula ion echniques on he basis o digi al pho og amme y and s e eoscopy, heodoli e measu ing sys ems, shape om shading echniques and ocus echniques. The ac i e iangula ion echnique is e y o en used in p ac ice due o i s obus ness and e iciency, bu i also has se e al limi a ions and disad an ages. In pa icula , his a icle ocuses on he limi a ions o using his me hod o objec s ha a e co e ed wi h a anspa en laye , such as p ese ing oil. 2. ACTIVE TRIANGULATION 2.1 P inciple The ac i e iangula ion echnique is based on a pho og amme ic econs uc ion o he measu ed objec by illumina ion i s su ace and con empo aneous scanning by a senso (mos ly PSD module o CCD o CMOS came a). The p inciple o his echnique is shown in Fig. 1. The ligh sou ce, he de ec o and he illumina ed pa o he measu ed objec o m a iangle. The join b be ween he ligh sou ce and he de ec o is called a iangula ion op ical basis. The ligh sou ce ay angle α is ixed whe eas he angle on he de ec o side β changes depending on he a iable dis ance z and i is de ined by an illumina ed poin on he came a chip, espec i ely by a b igh poin on a p oduced image. I he in es iga ed objec is si ua ed a he away om he came a and ligh sou ce, he angle β is bigge so he e lec ed ligh ay is p ojec ed o he pixel mo e up (acco ding o he T anspa en Laye Compensa ion a he Ac i e T iangula ion Sys ems I. Janako a*, S. Sedi a**, P. Benes*** Depa men o Con ol and Ins umen a ion, Facul y o Elec ical Enginee ing and Communica ion, B no Uni e si y o Technology, B no, Czech Republic *(+420 541 146 390, e-mail: janako a@ eec. u b .cz) **(+420 541 146 418, e-mail: sedi a@ eec. u b .cz) ***(+420 541 141 152, e-mail: benes@ eec. u b .cz) Abs ac : The pape deals wi h an ac i e iangula ion echnique o non-con ac op ical measu emen o 3D p ope ies. The basic ea u es o he me hod - p inciple, ad an ages and disad an ages - a e desc ibed i s . Bu he main pa o he pape is conce ned wi h he impossibili y o using he basic p inciple o he me hod o measu ed objec s, which a e co e ed by a laye o anspa en ma e ial o unknown hickness. Mos o en i is a laye o oil o he p ese a ion o me al p oduc s. This laye dis o s he measu ed alue due o he ligh e ac ion. In his wo k, a me hod o elimina ing his dis o ion based on he use o wo senso s is p oposed. Expe imen al e i ica ion o his p oposal is also p esen ed. Keywo ds: 3D ision, op ical dis ance measu emen , ac i e iangula ion, image p ocessing, anspa en laye , oil compensa ion. 1. INTRODUCTION Op ical non-con ac dis an measu ing echniques ha e ound widesp ead use in many a eas, o example in a ic, a chi ec u e, obo na iga ion, objec ecogni ion, o in indus y in he p oduc ion inspec ion (Kalo á and Lisz wan, 2006). Thei expansion was suppo ed no only by he g ea de elopmen o echnics (elec onics, op ics), bu also by he p og ess made in echniques o da a and image p ocessing. The ad an ages o op ical me hods a e ha hey can be e y accu a e and as and agains o he p inciples ha a e non- con ac and non-des uc i e. I is also easie o econ igu e he sys em o ano he dimension o ype o p oduc s. In s anda d p ojec i e imaging, one dimension (usually he dep h in o ma ion) om 3D scenes is los . Wi hou he use o a special echnique, i is no possible o de e mine his in o ma ion e oac i ely. Fo una ely, depending on he speci ic equi emen s, di e en echnical app oaches can be used o op ical dis ance measu emen (Be ko ic and Sha i , 2012). The mos used app oaches a e based on one o h ee basic p inciples: iangula ion, ime-o - ligh (ToF) o op ical in e e ome y (Schwa e e al., 1999). Among he mos impo an pa ame e s o selec ing he mos app op ia e me hod include he equi ed ange o measu ed dis ances (dimensions o measu ed objec and he wo king dis ance), esolu ion, measu ing ime, opology (conca i ies, p o usions, edges) and su ace p ope ies ( oughness, specula e lec ions) o he measu ed objec , p ope ies o su ounding ligh ing, size o measu ing sys em, possibili ies o calib a ion, and also cos s. The mos widely used echnique o op ical o m measu emen s is iangula ion. T iangles a e he basis o many measu emen echniques. The ollowing a ian s, which look g ea ly di e en , bu use same p inciple can be dis inguished: ac i e iangula ion echniques wi h di e en illumina ion, passi e iangula ion echniques on he basis o digi al pho og amme y and s e eoscopy, heodoli e measu ing sys ems, shape om shading echniques and ocus echniques. The ac i e iangula ion echnique is e y o en used in p ac ice due o i s obus ness and e iciency, bu i also has se e al limi a ions and disad an ages. In pa icula , his a icle ocuses on he limi a ions o using his me hod o objec s ha a e co e ed wi h a anspa en laye , such as p ese ing oil. 2. ACTIVE TRIANGULATION 2.1 P inciple The ac i e iangula ion echnique is based on a pho og amme ic econs uc ion o he measu ed objec by illumina ion i s su ace and con empo aneous scanning by a senso (mos ly PSD module o CCD o CMOS came a). The p inciple o his echnique is shown in Fig. 1. The ligh sou ce, he de ec o and he illumina ed pa o he measu ed objec o m a iangle. The join b be ween he ligh sou ce and he de ec o is called a iangula ion op ical basis. The ligh sou ce ay angle α is ixed whe eas he angle on he de ec o side β changes depending on he a iable dis ance z and i is de ined by an illumina ed poin on he came a chip, espec i ely by a b igh poin on a p oduced image. I he in es iga ed objec is si ua ed a he away om he came a and ligh sou ce, he angle β is bigge so he e lec ed ligh ay is p ojec ed o he pixel mo e up (acco ding o he T anspa en Laye Compensa ion a he Ac i e T iangula ion Sys ems I. Janako a*, S. Sedi a**, P. Benes*** Depa men o Con ol and Ins umen a ion, Facul y o Elec ical Enginee ing and Communica ion, B no Uni e si y o Technology, B no, Czech Republic *(+420 541 146 390, e-mail: janako a@ eec. u b .cz) **(+420 541 146 418, e-mail: sedi a@ eec. u b .cz) ***(+420 541 141 152, e-mail: benes@ eec. u b .cz) Abs ac : The pape deals wi h an ac i e iangula ion echnique o non-con ac op ical measu emen o 3D p ope ies. The basic ea u es o he me hod - p inciple, ad an ages and disad an ages - a e desc ibed i s . Bu he main pa o he pape is conce ned wi h he impossibili y o using he basic p inciple o he me hod o measu ed objec s, which a e co e ed by a laye o anspa en ma e ial o unknown hickness. Mos o en i is a laye o oil o he p ese a ion o me al p oduc s. This laye dis o s he measu ed alue due o he ligh e ac ion. In his wo k, a me hod o elimina ing his dis o ion based on he use o wo senso s is p oposed. Expe imen al e i ica ion o his p oposal is also p esen ed. Keywo ds: 3D ision, op ical dis ance measu emen , ac i e iangula ion, image p ocessing, anspa en laye , oil compensa ion. 1. INTRODUCTION Op ical non-con ac dis an measu ing echniques ha e ound widesp ead use in many a eas, o example in a ic, a chi ec u e, obo na iga ion, objec ecogni ion, o in indus y in he p oduc ion inspec ion (Kalo á and Lisz wan, 2006). Thei expansion was suppo ed no only by he g ea de elopmen o echnics (elec onics, op ics), bu also by he p og ess made in echniques o da a and image p ocessing. The ad an ages o op ical me hods a e ha hey can be e y accu a e and as and agains o he p inciples ha a e non- con ac and non-des uc i e. I is also easie o econ igu e he sys em o ano he dimension o ype o p oduc s. In s anda d p ojec i e imaging, one dimension (usually he dep h in o ma ion) om 3D scenes is los . Wi hou he use o a special echnique, i is no possible o de e mine his in o ma ion e oac i ely. Fo una ely, depending on he speci ic equi emen s, di e en echnical app oaches can be used o op ical dis ance measu emen (Be ko ic and Sha i , 2012). The mos used app oaches a e based on one o h ee basic p inciples: iangula ion, ime-o - ligh (ToF) o op ical in e e ome y (Schwa e e al., 1999). Among he mos impo an pa ame e s o selec ing he mos app op ia e me hod include he equi ed ange o measu ed dis ances (dimensions o measu ed objec and he wo king dis ance), esolu ion, measu ing ime, opology (conca i ies, p o usions, edges) and su ace p ope ies ( oughness, specula e lec ions) o he measu ed objec , p ope ies o su ounding ligh ing, size o measu ing sys em, possibili ies o calib a ion, and also cos s. The mos widely used echnique o op ical o m measu emen s is iangula ion. T iangles a e he basis o many measu emen echniques. The ollowing a ian s, which look g ea ly di e en , bu use same p inciple can be dis inguished: ac i e iangula ion echniques wi h di e en illumina ion, passi e iangula ion echniques on he basis o digi al pho og amme y and s e eoscopy, heodoli e measu ing sys ems, shape om shading echniques and ocus echniques. The ac i e iangula ion echnique is e y o en used in p ac ice due o i s obus ness and e iciency, bu i also has se e al limi a ions and disad an ages. In pa icula , his a icle ocuses on he limi a ions o using his me hod o objec s ha a e co e ed wi h a anspa en laye , such as p ese ing oil. 2. ACTIVE TRIANGULATION 2.1 P inciple The ac i e iangula ion echnique is based on a pho og amme ic econs uc ion o he measu ed objec by illumina ion i s su ace and con empo aneous scanning by a senso (mos ly PSD module o CCD o CMOS came a). The p inciple o his echnique is shown in Fig. 1. The ligh sou ce, he de ec o and he illumina ed pa o he measu ed objec o m a iangle. The join b be ween he ligh sou ce and he de ec o is called a iangula ion op ical basis. The ligh sou ce ay angle α is ixed whe eas he angle on he de ec o side β changes depending on he a iable dis ance z and i is de ined by an illumina ed poin on he came a chip, espec i ely by a b igh poin on a p oduced image. I he in es iga ed objec is si ua ed a he away om he came a and ligh sou ce, he angle β is bigge so he e lec ed ligh ay is p ojec ed o he pixel mo e up (acco ding o he T anspa en Laye Compensa ion a he Ac i e T iangula ion Sys ems I. Janako a*, S. Sedi a**, P. Benes*** Depa men o Con ol and Ins umen a ion, Facul y o Elec ical Enginee ing and Communica ion, B no Uni e si y o Technology, B no, Czech Republic *(+420 541 146 390, e-mail: janako a@ eec. u b .cz) **(+420 541 146 418, e-mail: sedi a@ eec. u b .cz) ***(+420 541 141 152, e-mail: benes@ eec. u b .cz) Abs ac : The pape deals wi h an ac i e iangula ion echnique o non-con ac op ical measu emen o 3D p ope ies. The basic ea u es o he me hod - p inciple, ad an ages and disad an ages - a e desc ibed i s . Bu he main pa o he pape is conce ned wi h he impossibili y o using he basic p inciple o he me hod o measu ed objec s, which a e co e ed by a laye o anspa en ma e ial o unknown hickness. Mos o en i is a laye o oil o he p ese a ion o me al p oduc s. This laye dis o s he measu ed alue due o he ligh e ac ion. In his wo k, a me hod o elimina ing his dis o ion based on he use o wo senso s is p oposed. Expe imen al e i ica ion o his p oposal is also p esen ed. Keywo ds: 3D ision, op ical dis ance measu emen , ac i e iangula ion, image p ocessing, anspa en laye , oil compensa ion. 1. INTRODUCTION Op ical non-con ac dis an measu ing echniques ha e ound widesp ead use in many a eas, o example in a ic, a chi ec u e, obo na iga ion, objec ecogni ion, o in indus y in he p oduc ion inspec ion (Kalo á and Lisz wan, 2006). Thei expansion was suppo ed no only by he g ea de elopmen o echnics (elec onics, op ics), bu also by he p og ess made in echniques o da a and image p ocessing. The ad an ages o op ical me hods a e ha hey can be e y accu a e and as and agains o he p inciples ha a e non- con ac and non-des uc i e. I is also easie o econ igu e he sys em o ano he dimension o ype o p oduc s. In s anda d p ojec i e imaging, one dimension (usually he dep h in o ma ion) om 3D scenes is los . Wi hou he use o a special echnique, i is no possible o de e mine his in o ma ion e oac i ely. Fo una ely, depending on he speci ic equi emen s, di e en echnical app oaches can be used o op ical dis ance measu emen (Be ko ic and Sha i , 2012). The mos used app oaches a e based on one o h ee basic p inciples: iangula ion, ime-o - ligh (ToF) o op ical in e e ome y (Schwa e e al., 1999). Among he mos impo an pa ame e s o selec ing he mos app op ia e me hod include he equi ed ange o measu ed dis ances (dimensions o measu ed objec and he wo king dis ance), esolu ion, measu ing ime, opology (conca i ies, p o usions, edges) and su ace p ope ies ( oughness, specula e lec ions) o he measu ed objec , p ope ies o su ounding ligh ing, size o measu ing sys em, possibili ies o calib a ion, and also cos s. The mos widely used echnique o op ical o m measu emen s is iangula ion. T iangles a e he basis o many measu emen echniques. The ollowing a ian s, which look g ea ly di e en , bu use same p inciple can be dis inguished: ac i e iangula ion echniques wi h di e en illumina ion, passi e iangula ion echniques on he basis o digi al pho og amme y and s e eoscopy, heodoli e measu ing sys ems, shape om shading echniques and ocus echniques. The ac i e iangula ion echnique is e y o en used in p ac ice due o i s obus ness and e iciency, bu i also has se e al limi a ions and disad an ages. In pa icula , his a icle ocuses on he limi a ions o using his me hod o objec s ha a e co e ed wi h a anspa en laye , such as p ese ing oil. 2. ACTIVE TRIANGULATION 2.1 P inciple The ac i e iangula ion echnique is based on a pho og amme ic econs uc ion o he measu ed objec by illumina ion i s su ace and con empo aneous scanning by a senso (mos ly PSD module o CCD o CMOS came a). The p inciple o his echnique is shown in Fig. 1. The ligh sou ce, he de ec o and he illumina ed pa o he measu ed objec o m a iangle. The join b be ween he ligh sou ce and he de ec o is called a iangula ion op ical basis. The ligh sou ce ay angle α is ixed whe eas he angle on he de ec o side β changes depending on he a iable dis ance z and i is de ined by an illumina ed poin on he came a chip, espec i ely by a b igh poin on a p oduced image. I he in es iga ed objec is si ua ed a he away om he came a and ligh sou ce, he angle β is bigge so he e lec ed ligh ay is p ojec ed o he pixel mo e up (acco ding o he T anspa en Laye Compensa ion a he Ac i e T iangula ion Sys ems I. Janako a*, S. Sedi a**, P. Benes*** Depa men o Con ol and Ins umen a ion, Facul y o Elec ical Enginee ing and Communica ion, B no Uni e si y o Technology, B no, Czech Republic *(+420 541 146 390, e-mail: janako a@ eec. u b .cz) **(+420 541 146 418, e-mail: sedi a@ eec. u b .cz) ***(+420 541 141 152, e-mail: benes@ eec. u b .cz) Abs ac : The pape deals wi h an ac i e iangula ion echnique o non-con ac op ical measu emen o 3D p ope ies. The basic ea u es o he me hod - p inciple, ad an ages and disad an ages - a e desc ibed i s . Bu he main pa o he pape is conce ned wi h he impossibili y o using he basic p inciple o he me hod o measu ed objec s, which a e co e ed by a laye o anspa en ma e ial o unknown hickness. Mos o en i is a laye o oil o he p ese a ion o me al p oduc s. This laye dis o s he measu ed alue due o he ligh e ac ion. In his wo k, a me hod o elimina ing his dis o ion based on he use o wo senso s is p oposed. Expe imen al e i ica ion o his p oposal is also p esen ed. Keywo ds: 3D ision, op ical dis ance measu emen , ac i e iangula ion, image p ocessing, anspa en laye , oil compensa ion. 1. INTRODUCTION Op ical non-con ac dis an measu ing echniques ha e ound widesp ead use in many a eas, o example in a ic, a chi ec u e, obo na iga ion, objec ecogni ion, o in indus y in he p oduc ion inspec ion (Kalo á and Lisz wan, 2006). Thei expansion was suppo ed no only by he g ea de elopmen o echnics (elec onics, op ics), bu also by he p og ess made in echniques o da a and image p ocessing. The ad an ages o op ical me hods a e ha hey can be e y accu a e and as and agains o he p inciples ha a e non- con ac and non-des uc i e. I is also easie o econ igu e he sys em o ano he dimension o ype o p oduc s. In s anda d p ojec i e imaging, one dimension (usually he dep h in o ma ion) om 3D scenes is los . Wi hou he use o a special echnique, i is no possible o de e mine his in o ma ion e oac i ely. Fo una ely, depending on he speci ic equi emen s, di e en echnical app oaches can be used o op ical dis ance measu emen (Be ko ic and Sha i , 2012). The mos used app oaches a e based on one o h ee basic p inciples: iangula ion, ime-o - ligh (ToF) o op ical in e e ome y (Schwa e e al., 1999). Among he mos impo an pa ame e s o selec ing he mos app op ia e me hod include he equi ed ange o measu ed dis ances (dimensions o measu ed objec and he wo king dis ance), esolu ion, measu ing ime, opology (conca i ies, p o usions, edges) and su ace p ope ies ( oughness, specula e lec ions) o he measu ed objec , p ope ies o su ounding ligh ing, size o measu ing sys em, possibili ies o calib a ion, and also cos s. The mos widely used echnique o op ical o m measu emen s is iangula ion. T iangles a e he basis o many measu emen echniques. The ollowing a ian s, which look g ea ly di e en , bu use same p inciple can be dis inguished: ac i e iangula ion echniques wi h di e en illumina ion, passi e iangula ion echniques on he basis o digi al pho og amme y and s e eoscopy, heodoli e measu ing sys ems, shape om shading echniques and ocus echniques. The ac i e iangula ion echnique is e y o en used in p ac ice due o i s obus ness and e iciency, bu i also has se e al limi a ions and disad an ages. In pa icula , his a icle ocuses on he limi a ions o using his me hod o objec s ha a e co e ed wi h a anspa en laye , such as p ese ing oil. 2. ACTIVE TRIANGULATION 2.1 P inciple The ac i e iangula ion echnique is based on a pho og amme ic econs uc ion o he measu ed objec by illumina ion i s su ace and con empo aneous scanning by a senso (mos ly PSD module o CCD o CMOS came a). The p inciple o his echnique is shown in Fig. 1. The ligh sou ce, he de ec o and he illumina ed pa o he measu ed objec o m a iangle. The join b be ween he ligh sou ce and he de ec o is called a iangula ion op ical basis. The ligh sou ce ay angle α is ixed whe eas he angle on he de ec o side β changes depending on he a iable dis ance z and i is de ined by an illumina ed poin on he came a chip, espec i ely by a b igh poin on a p oduced image. I he in es iga ed objec is si ua ed a he away om he came a and ligh sou ce, he angle β is bigge so he e lec ed ligh ay is p ojec ed o he pixel mo e up (acco ding o he T anspa en Laye Compensa ion a he Ac i e T iangula ion Sys ems I. Janako a*, S. Sedi a**, P. Benes*** Depa men o Con ol and Ins umen a ion, Facul y o Elec ical Enginee ing and Communica ion, B no Uni e si y o Technology, B no, Czech Republic *(+420 541 146 390, e-mail: janako a@ eec. u b .cz) **(+420 541 146 418, e-mail: sedi a@ eec. u b .cz) ***(+420 541 141 152, e-mail: benes@ eec. u b .cz) Abs ac : The pape deals wi h an ac i e iangula ion echnique o non-con ac op ical measu emen o 3D p ope ies. The basic ea u es o he me hod - p inciple, ad an ages and disad an ages - a e desc ibed i s . Bu he main pa o he pape is conce ned wi h he impossibili y o using he basic p inciple o he me hod o measu ed objec s, which a e co e ed by a laye o anspa en ma e ial o unknown hickness. Mos o en i is a laye o oil o he p ese a ion o me al p oduc s. This laye dis o s he measu ed alue due o he ligh e ac ion. In his wo k, a me hod o elimina ing his dis o ion based on he use o wo senso s is p oposed. Expe imen al e i ica ion o his p oposal is also p esen ed. Keywo ds: 3D ision, op ical dis ance measu emen , ac i e iangula ion, image p ocessing, anspa en laye , oil compensa ion. 1. INTRODUCTION Op ical non-con ac dis an measu ing echniques ha e ound widesp ead use in many a eas, o example in a ic, a chi ec u e, obo na iga ion, objec ecogni ion, o in indus y in he p oduc ion inspec ion (Kalo á and Lisz wan, 2006). Thei expansion was suppo ed no only by he g ea de elopmen o echnics (elec onics, op ics), bu also by he p og ess made in echniques o da a and image p ocessing. The ad an ages o op ical me hods a e ha hey can be e y accu a e and as and agains o he p inciples ha a e non- con ac and non-des uc i e. I is also easie o econ igu e he sys em o ano he dimension o ype o p oduc s. In s anda d p ojec i e imaging, one dimension (usually he dep h in o ma ion) om 3D scenes is los . Wi hou he use o a special echnique, i is no possible o de e mine his in o ma ion e oac i ely. Fo una ely, depending on he speci ic equi emen s, di e en echnical app oaches can be used o op ical dis ance measu emen (Be ko ic and Sha i , 2012). The mos used app oaches a e based on one o h ee basic p inciples: iangula ion, ime-o - ligh (ToF) o op ical in e e ome y (Schwa e e al., 1999). Among he mos impo an pa ame e s o selec ing he mos app op ia e me hod include he equi ed ange o measu ed dis ances (dimensions o measu ed objec and he wo king dis ance), esolu ion, measu ing ime, opology (conca i ies, p o usions, edges) and su ace p ope ies ( oughness, specula e lec ions) o he measu ed objec , p ope ies o su ounding ligh ing, size o measu ing sys em, possibili ies o calib a ion, and also cos s. The mos widely used echnique o op ical o m measu emen s is iangula ion. T iangles a e he basis o many measu emen echniques. The ollowing a ian s, which look g ea ly di e en , bu use same p inciple can be dis inguished: ac i e iangula ion echniques wi h di e en illumina ion, passi e iangula ion echniques on he basis o digi al pho og amme y and s e eoscopy, heodoli e measu ing sys ems, shape om shading echniques and ocus echniques. The ac i e iangula ion echnique is e y o en used in p ac ice due o i s obus ness and e iciency, bu i also has se e al limi a ions and disad an ages. In pa icula , his a icle ocuses on he limi a ions o using his me hod o objec s ha a e co e ed wi h a anspa en laye , such as p ese ing oil. 2. ACTIVE TRIANGULATION 2.1 P inciple The ac i e iangula ion echnique is based on a pho og amme ic econs uc ion o he measu ed objec by illumina ion i s su ace and con empo aneous scanning by a senso (mos ly PSD module o CCD o CMOS came a). The p inciple o his echnique is shown in Fig. 1. The ligh sou ce, he de ec o and he illumina ed pa o he measu ed objec o m a iangle. The join b be ween he ligh sou ce and he de ec o is called a iangula ion op ical basis. The ligh sou ce ay angle α is ixed whe eas he angle on he de ec o side β changes depending on he a iable dis ance z and i is de ined by an illumina ed poin on he came a chip, espec i ely by a b igh poin on a p oduced image. I he in es iga ed objec is si ua ed a he away om he came a and ligh sou ce, he angle β is bigge so he e lec ed ligh ay is p ojec ed o he pixel mo e up (acco ding o he I. Janako a e al. / IFAC Pape sOnLine 52-27 (2019) 508–513 509 simpli ied Fig. 1). In his way, he dis ance o he objec can be ob ained jus om he posi ion o he ligh poin in he image. Howe e , wi h he α angle o he han 90 °, i should be bo ne in mind ha when he objec 's dis ance changes, he x posi ion on he su ace being measu ed also changes. The ela ionship be ween he coo dina e in he image and he dis ance can be de e mined by calcula ion (based on he knowledge o he geome y and pa ame e s o he came a and lens) o due o calib a ion. Fig. 1. P inciple o he iangula ion me hod (1D a ian ) The measu emen unce ain y in z is in e sely p opo ional o bo h he came a baseline and he ocal leng h o he lens, bu di ec ly p opo ional o he squa e o he dis ance (Kalo á and Lisz wan, 2005). Un o una ely, and b canno be made as la ge as desi ed. The baseline is limi ed mainly by he mechanical cons uc ion (s abili y o he whole sys em dec eases as b inc eases), and by shadow e ec s (sel - occlusion p oblems inc ease wi h b) (Be aldin e al., 2003). The size o he ocal leng h is limi ed by he limi ed dimensions o he o e ed de ec o s. Mo eo e , wi h inc easing he de ec o 's ield o iew dec eases and hus he ange in he Z-axis also dec eases. 2.2 Va ian s Depending on he ligh sou ce used o ma k he objec , h ee a ian s can be dis inguished: a ligh poin , a ligh s ipe, and a s uc u ed ligh . The dimension o he used ligh de e mines he dimension and he numbe o ob ained poin s. When using he ligh poin , only one coo dina e ( ypically dis ance, dep h, o z coo dina e) o one poin is de e mined a a ime, he e o e his a ian is called 1D iangula ion. The ad an age o his op ion is ha a line came a wi h a usually highe ho izon al esolu ion and high line scan equency can be used. When he ligh s ipe (2D iangula ion) is used, wo coo dina es a e de e mined a once and he numbe o measu ed poin s depends on he came a's pixel esolu ion (a p o ile is measu ed). The ad an age o using s uc u ed ligh - 3D iangula ion (Geng, 2011) is ha he comple e 3D coo dina es o he whole objec can be de e mined in block ( he numbe o poin s depends on he used pa e n and he came a esolu ion; he dimensions o he measu ed pa o he objec a e de ined by he selec ed chip and lens and o e all geome y). I i is equi ed o speci y mo e coo dina es ( o 1D and 2D a ian s) o mo e poin s, i is necessa y o ensu e scanning (mo emen o he measu ing sys em o objec in one o wo axes). Con en ional ligh sou ces can be used o op ical iangula ion, bu lase sou ces ha e unique ad an ages o 3D imaging (Amann e al., 2001). Abo e all, i is high b igh ness, cohe ence and monoch oma ism, and low di e gence. 2.3 Ad an ages and disad an ages Ac i e iangula ion sys ems a e ela i ely simple, obus and e icien . The ad an age is ha hey can ope a e o e a wide ange o dis ances. Lase -based op ical displacemen senso s using a e y small spo which enables measu emen s on he e y small pa s. The 3D e sion can measu e an en i e objec in one ins an om one ame. The 2D a ian is o en used on p oduc ion lines, whe e scanning and measu emen o he whole objec a e ensu ed hanks o he ansla ional mo emen below he measu ing uni . The a ian wi h poin lase and line came a is e y as , wi h a sampling a e o 100 kHz commonly achie ed. High measu ing a es a e equi ed o he as mo ing a ge s o measu emen s on di icul su aces. Comme cial lase scanne s a e e y obus wi h compac dimensions. Despi e hei e y small dimensions, some se ies ha e a ully in eg a ed con olle . As a esul , simple, apid ins alla ion and wi ing a e possible. The senso s can be in eg a ed easily e en in o es ic ed ins alla ion space. The comp ehensi e solu ion enables easy measu emen con ol, synch oniza ion wi h o he elemen s as well as be ween se e al iangula ion senso s (e.g. di e en ial hickness measu emen ) and usually a clea con ol and e alua ion applica ion. The senso s can be also equipped wi h di e en ou pu s o ul il indus ial use equi emen s. The pi alls o ac i e iangula ion echniques a e gene ally o e alua e pa s o he objec ha a e no di ec ly isible by he came a o illumina ed by he ligh sou ce. Su ace opology and geome y o eal physical objec s can be qui e complex, wi h mul iple holes, conca i ies, p o usions and edges. P oblems also b ing su aces pe pendicula o he image plane and su aces pa allel o he ligh sou ce. The measu emen quali y is also in luenced by he su ace p ope ies o he measu ed objec . Essen ial a e especially su ace oughness, e lec ance, and colou . Howe e , oday's sys ems a e capable o measu ing e en complica ed su aces, such as shiny me allic ma e ials o con a iwise ubbe . The exposu e ime o he amoun o ligh p oduced by he lase is op imally ma ched o he e lec ion cha ac e is ics o he a ge su ace. New possibili ies also include he use o a blue lase (nex o mo e common ed). Due o i s sho e wa eleng h, i does no pene a e he a ge su ace, p ojec ing a small ligh spo on he su ace and he e o e p o iding s able and p ecise esul s. This echnology is p e e ably used wi h o ganic and (semi-) anspa en objec s, as well as o ed-ho glowing me als. Ano he p oblem, ha was encoun e ed when es ing he lase sys em o check he dimensions o p oduc s, can be caused by he hin laye o some anspa en ma e ial on he p oduc s, whe e he measu ed alues a e dis o ed due o he e ac ion o he ligh in ha laye . 510 I. Janako a e al. / IFAC Pape sOnLine 52-27 (2019) 508–513 3. PROBLEM DEFINITION The ask o he p oposed sys em was o measu e he pa ame e s o he pa icula me al pa s o he axial bea ings and, based on he measu emen s, o check whe he some pa s we en' con used. Indi idual ypes o bea ings di e in he combina ion o hei dimensions (heigh , inne and ou e diame e , aceway pa ame e s) e en in he o de o only a ew mic ome e s, so i was necessa y o ensu e e y accu a e measu emen s. Un o una ely, he con ol measu ing sys em had o be placed un il jus be o e assembling all pa s, whe e he pa s a e oil-p ese ed. Due o he me hod o p ese a ion by dipping and ee d ipping o he componen s in an unde ined posi ion, he laye hickness is no uni o m and canno be p ede e mined. Se e al app oaches we e conside ed o measu emen . One op ion was o use he 1D o 2D lase iangula ion sys em. Howe e , he p oblem is ha he pa ially anspa en laye o p ese a i e oil causes no only dis u bing ligh e lec ions om i s su ace and also educes he in ensi y o ecei ed ligh , bu abo e all, i causes a change in he di ec ion o he ligh beam a he in e ace be ween wo media wi h di e en e ac i e indices. I he lase beam passes om ambien ai o an op ically dense oil medium ( he e ac i e index o he oil is abou 1.5), he angle o e ac ion is less han he angle o incidence - he ay in he highe -index medium is close o he no mal. Respec i ely, when eco ding he ligh e lec ed om he me al su ace, he opposi e phenomenon is obse ed. Fo he sake o cla i y, he p oblem is shown in Fig. 2 in a simple and mo e a ou able si ua ion, whe e he lase beam is pe pendicula o he su ace ( he e o e he e is no double e ac ion) and pa allel p ojec ion is used. Fig. 2. The dis ance measu ing p oblem o componen s wi h he oil laye Poin A in Fig. 2 indica es he loca ion whe e he ligh beam would be p ojec ed i he e we e no oil laye s. Con e sely, poin B ep esen s he illumina ed spo on he chip a e e ac ion o he ligh in he uppe anspa en laye . Due o he ac ha he p ojec ion is shi ed on he chip, he w ong dis ance l B is de e mined agains he eal dis ance l o he me al su ace o he bea ing om he lase . The magni ude o he e o is di ec ly p opo ional o he angle be ween he came a's op ical axis and he no mal o he measu ed su ace α, as well as o he e ac i e index o he laye n 2 and o i s hickness . T igonome ic unc ions can be used o calcula e he e o ( o simplici y, a elecen ic lens wi h pa allel beams is conside ed, as in Fig. 2): α β g g e ⋅ −= , (1) whe e angle β is gi en by Snell’s law: βα sinsin 21 ⋅=⋅ nn , (2) Fo example, o he angle α = 50° and he oil laye ( n 2 = 1.5) wi h he hickness o only 0.1 mm, he e o is g ea e han 0.05 mm, so o he co ec dis inc ion o bea ing ypes is his e o e y signi ican . The hickness o he oil laye may a y in di e en pa s o he bea ing ing due o he su ace ension and unning down oil in o he bea ing aceway (see Fig. 2), and hus depends also on he size and shape o he ing. In addi ion, he oil hickness can be changed by u he manipula ion, o example by g ipping he ing in he hand. Howe e , due o he unknown ac ual oil hickness, i is no possible o de e mine he amoun o dis o ion, espec i ely enqui ed bea ing heigh , om only one measu emen . 4. SUGGESTED SOLUTION The p oposed solu ion o he p oblem desc ibed in he p e ious chap e is o use wo senso s ( wo came as) each wi h he di e en angle o he lase beam. The p inciple is shown in Fig. 3. Fig. 3. P inciple o he p oposed solu ion using wo senso s Each sepa a e measu ing uni , composed o he came a and he lase (whe e he lase can be common o bo h uni s) measu es, due o di e en iewing angle α i , he di e sely dis o ed coo dina es z ei ( i is he index o measu emen ) iiii iii i e ezz nn z +== ), ,,,( 21 α . (3) I. Janako a e al. / IFAC Pape sOnLine 52-27 (2019) 508–513 511 The medium n 1 , whe e he whole measu ing uni is loca ed, is su ounding ai so n 11 = n 12 = n 1 = 1 . The medium n 2 ep esen s he anspa en laye abo e he measu ed objec (in ou case oil, whe e n 2 is app oxima ely 1.5) and i is uni o m o bo h measu emen s ( n 21 = n 22 = n 2 ). In he nea neighbou hood o he measu emen , unknown hicknesses o he laye can also be conside ed iden ical ( 1 = 2 = ). And o cou se, equal is he second unknown in ou ask - he heigh o he objec abo e he pad z 1 = z 2 = z . I he angles α i and index n 2 a e known, wo equa ions o wo unknowns can be cons uc ed based on wo measu emen s and z and can be de e mined simul aneously. The ad an age is ha he same sys em can be used o ano he ype o ask wi h wo unknowns. Fo example, he laye e ac i e index o he unknown hickness can be de e mined o ice e sa. 5. EXPERIMENTAL VERIFICATION A labo a o y iangula ion wo kplace wi h wo came as was assembled o e i y he p oposed solu ion. The design was es ed on he es ask o measu ing he pa ame e s o axial bea ings. Fo he measu emen , he wo-dimensional a ian wi h he line lase was chosen o measu e he en i e bea ing p o ile a once. The a angemen o he indi idual componen s o he assembled expe imen al wo kplace is shown in he pho og aph (Fig. 4) and he ske ch (Fig.5). The bea ing was placed on a la backpla e wi h he aceway poin ing upwa ds and was pushed o wo chocks (diame e 6 mm and dis ance 25 mm). This ensu es p ecise posi ioning, cen e ing o he ing and, a he same ime, he ou e diame e o he ing can be de e mined om he size o inse ion o he ing be ween he s ops (p o ile posi ion wi hin he measu ed ield). The line lase was moun ed abo e he pad o shine pe pendicula o he pad, and he lase s ipe illumina ed he space exac ly be ween he s oppe s. The op ical plane o he lase hen passes h ough he symme y axis o he ing. The came as we e moun ed sepa a ely on he s ands and we e o ien ed so ha he lase ack e lec ed om he pad was a he bo om o he cap u ed images and was pa allel o he Y-axis o he images and, o cou se, o wa ch he a ea a he ing p o ile. Fig. 4. Pho og aph o he assembled expe imen al wo kplace Fig. 5. Schema ic ske ch o he a angemen o he indi idual componen s o he designed measu ing sys em Two iden ical CCD came as we e used (Imaging Sou ce DFK 41BU02 wi h 1/2" chip size and 1280x960 pixel esolu ion). A na owband il e was inse ed in on o each chip o il e ou ligh componen s o he han he wa eleng h o he lase used (650 nm). Bo h came as we e supplemen ed wi h he same lenses (VICO imaging MFA1-230-5M35 wi h 35 mm ocal leng h and 1:1.4 ape u e). A dis ance ing has always been inse ed be ween he came a and he lens o educe he wo king dis ance. The came a dis ance was adjus ed o ob ain he necessa y X-axis ange (app oxima ely 26 mm). The use o a classic ixed ocus lens (endocen ic) is no he mos sui able o measu emen asks like his. A elecen ic lens and/o a lens using he Scheimp lug p inciple o oblique plane sensing would be p e e able. Howe e , such wo iden ical lenses we e no a ailable o es ing. I is also possible o selec mo e sui able came as wi h la ge chip and esolu ion o eal applica ion. The angle be ween he op ical axis o he i s came a and he lase plane was app oxima ely 30° (α 1 = 30°) and o he second came a α 2 = 55°. These angles we e chosen as a comp omise be ween he desi ed ange and esolu ion in Z-axis, he quali y o he e lec ed ligh s ip in he cap u ed images, and a su icien di e ence be ween he wo angles o success ul compensa ion o he oil laye . The measu ing sys em o he assembled wo kplace had a pixel esolu ion in he X-axis o app oxima ely 20 µm and in he Z-axis o he i s came a 40 µm and o he second 24 µm. The con e sion ela ions be ween he image coo dina es and he eal coo dina e sys em in oduced o he measu ed objec can be de e mined by calcula ion, bu i is necessa y o know p ecisely all he equi ed inpu pa ame e s (e.g. pa ame e s o came as and lenses, o ien a ion o came as, e c.) and in case o some changes du ing use o measu ing sys em i is necessa y o measu e all a iables again and ecalcula e he ela ionships. O i is possible o de e mine he in e ela ionships o indi idual iangula ion sys ems (came a, lase , and measu ed objec ) by calib a ion. I a sui able au oma ic p ocedu e and solu ion o calib a ion a e designed, his app oach is mo e app op ia e because i allows a con inuous ecalib a ion o he en i e measu ing sys em a e e y change o e en p e en i ely (a sligh change in he ela ionship can also occu due o en i onmen al in luences, e.g. empe a u e). Calib a ion o expe imen al sys ems was 512 I. Janako a e al. / IFAC Pape sOnLine 52-27 (2019) 508–513 pe o med on se e al ings whose eal spa ial coo dina es we e sub ac ed om p e iously measu ed p o iles by ScanCon ol 2900-25/BL scanne . Mo e app op ia e, e en wi h espec o he planned ecalib a ion, would be o use a speci ically designed o his pu pose (sui able dimensions and dis ibu ion o calib a ion poin s) and p ecisely manu ac u ed calib a ion objec ha would bes co e he en i e equi ed space wi h he calib a ion poin s. Fo he se o poin s wi h known spa ial coo dina es (x, z) a e assigned co esponding coo dina es (u, ) in he images. Two (one o each came a) ans o ma ion ma ices (size 3x3) de e mined by he leas squa es me hod a e he esul o he calib a ion. Simila ly, he con e sion ela ionship be ween he oil hickness and he e o p oduced can be de e mined by calcula ion o calib a ion. Fo he same eason, howe e , hese ela ionships we e again de e mined by calib a ion. Also because he e ac i e index o he pa icula used oil was no exac ly known. Fo his pu pose, he oil- ee ings we e i s measu ed and hen he oil o unknown hickness was applied o hem and he di e ences in alues we e de e mined by e-measu emen . Based on se e al measu emen s, he cons an K ep esen ing he a e age e o a io o he second and he i s came a K = e 2 / e 1 was de e mined (a he cos o some inaccu acy in endocen ic lenses). The ad an age o his app oach o calib a ion is ha he e is no need o know he cu en oil hickness. Fo he pu pose o measu ing bea ing p o iles, undis o ed as well as dis o ed by oil laye , a p og am o sub-pixel lase line de ec ion and da a il e ing had o be c ea ed. An example o lase ack e alua ion is shown in Fig. 6. As can be seen om he p esen ed igu e, he quali y o lase ace acing is highly dependen on he su ace o he objec being measu ed. P oblems a e caused by une en su aces, gla e, less e lec i e and inclined su aced in he aceway, and shadows be ween he bea ing and base (in he case o elecen ic lens use, blind spo s and shadows should no be c ea ed). A e applying he oil, he lase ack, especially in he aceway, whe e he la ges amoun o oil ends o be, is less no iceable and mo e blu ed. The quali y o lase acking can be imp o ed by aking images wi h se e al di e en exposu e imes and selec ing he mos app op ia e image o each bea ing egion. Fig. 6. The esul o he lase ack de ec ion p og am A e lase ack de ec ion, he pixel posi ions o he line a e ans o med a spa ial coo dina es based on calib a ion da a o each came a. The ollowing igu e shows wo measu ed p o iles o he same ing wi hou an oil laye om he i s and he second came a. Ideally (especially pe ec line de ec ion and calib a ion), bo h p o iles should be he same a e ans o ma ion. Howe e , due o e.g. e lec ions, limi ed and unequal came a esolu ion, e c., he eal ob ained p o iles a e sligh ly di e en . The di e ences a e shown by he g een do s in Fig. 7. In his pa icula case, he a e age p o iles di e ence is 6.5 µm, he s anda d de ia ion is 12.7 µm. Fig. 7. P o ile measu ed by i s came a (blue) and second came a ( ed) and di e ence o alues (g een) A e applying he oil, as expec ed, he measu ed da a is de o med by he oil laye (ligh e ac ion). The measu ed p o iles o he same oil- ee (blue) and oiled ( ed) bea ing a e shown in he ollowing igu e. As you can see om he di e ence o alues (g een), he e o a he deepes poin o he aceway is o e 200 µm o he i s came a and nea ly 300 µm o he second (due o he la ge came a-lase angle). This co esponds o he oil hickness o app oxima ely 0.55 mm. Howe e , i should be no ed ha his oil hickness is un ealis ically high and se es only o p esen a ion. The usual oil hickness a e p ese a ion and d ipping in ope a ion is up o abou 100 µm. Fig. 8. Measu ed p o ile o he same bea ing wi hou oil (blue), a e oil applica ion ( ed) and di e ence (g een) When wo oil-coa ed ing p o iles a e measu ed wi h came as a di e en angles, he eal bea ing p o ile can be calcula ed based also on he de o med da a hanks o he con e sion ela ionships speci ied by calib a ion ( o each X-coo dina e, he Z-coo dina e can be de e mined wha would be wi hou oil). The calcula ion can be done using he o mula: 1 21 − − ⋅ = K zKz z ee , (4) I. Janako a e al. / IFAC Pape sOnLine 52-27 (2019) 508–513 513 The esul i g aphed in Fig. 9, whe ein he calcula ed oil laye compensa ion p o ile is shown in black. Fo he sake o cla i y, he g aph is supplemen ed by p o iles measu ed by bo h came as wi hou he oil laye (blue and ed wa e o ms as in Fig. 7) and by he di e ence be ween he compensa ed p o ile and he oil- ee p o ile om he i s came a (g een wa e o m). Al hough he dispe sion o he di e ence be ween he p o ile o he i s oil- ee came a and he compensa ed p o ile is la ge in his case, as shown by he la ge s anda d de ia ion alue o 52.8 µm, howe e , he a e age di e ence is only -2.7 µm. Fig. 9. Compensa ed p o ile (black) and di e ence (g een) om he p o ile wi hou oil om i s came a (blue) The oil laye , i no compensa ed, has a undamen al in luence on he de e mina ion o he basic bea ing pa ame e s - ing heigh and aceway adius, espec i ely aceway dep h. Sepa a e algo i hms we e p og ammed o de e mine hese pa ame e s. Fo example, he ing heigh is de e mined by app oxima ion o da a a he ing's op edges and a he basepla e by he s aigh lines. The da a in he aceway, on he o he hand, is in e laced wi h a ci cle. I he bea ing dimensions we e measu ed wi h only one iangula ion sys em, wi hou he possibili y o elimina ing he e ec o he laye , he measu ed bea ing heigh would be highe han he eali y and he aceway adius would also be la ge . Fig. 10 shows a de ail o p o ile wi h oil wi hou ( ed) and a e (black) compensa ion. The calcula ed aceway adii de e mined by i ing he aceway poin s wi h he ci cle a e indica ed by he same colou . The blue pa o he ci cle indica es he adius speci ied o he oil- ee bea ing. I can be seen ha while he compensa ed p o ile has a g ea e dispe sion o alues, he alues be e ollow he eal shape Fig. 10. Raceway adius de e mina ion - p o ile wi hou ( ed) and a e (black) compensa ion o he aceway. Howe e , he sho sec ion o he ci cle is no su icien o accu a ely de e mine he diame e o he aceway bu will be used o de e mine i s dep h and o he bea ing pa ame e s. 6. CONCLUSIONS The a icle deals wi h he undamen al limi a ion o he applica ion o he basic simple p inciple o he ac i e iangula ion me hod o objec s ha a e co e ed by some anspa en laye (e.g. p ese ing oil, lub ican , wa e ). Fo his eason, he inno a i e sys em o measu e 3D pa ame e s o objec s h ough his laye has been designed. The basic idea is o use wo coope a ing senso s each wi h he di e en angle o he lase . The ad an age is ha he same sys em can be used o ano he ype o ask wi h wo unknowns (e.g. he laye hickness o unknown e ac i e index o ice e sa). Al hough he mos app op ia e ha dwa e was no a ailable o he expe imen s, and e en he so wa e could no ye be esol ed a he le el o he de elopmen o a comme cial inished de ice, ne e heless he pe o med es s demons a e ha he p oposed p inciple is co ec and ha his p ocedu e is applicable o elimina e he anspa en laye . ACKNOWLEDGEMENT The comple ion o his pape was made possible by he g an TH02010830 – “Au oma ion, measu emen and moni o ing o assembly p ocesses” which is unded by Technology Agency o he Czech Republic - p og amme EPSILON and by he g an No. FEKT-S-17-4234 - „Indus y 4.0 in au oma ion and cybe ne ics” inancially suppo ed by he In e nal science und o B no Uni e si y o Technology. REFERENCES Amann, M.-Ch., Bosch, T., Lescu e, M., Myllylä, R. and Rioux, M. (2001). Lase Ranging: A C i ical Re iew o Unusual Techniques o Dis ance Measu emen . Op ical Enginee ing, Vol. 40(1), pp. 10-19. Be aldin, J.-A., Blais, F., Cou noye , L., Godin, G., Rioux, M. and Taylo , J. (2003). 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